CN105408676B - Light-source circuit unit and the light-emitting device including the light-source circuit unit - Google Patents
Light-source circuit unit and the light-emitting device including the light-source circuit unit Download PDFInfo
- Publication number
- CN105408676B CN105408676B CN201480042242.5A CN201480042242A CN105408676B CN 105408676 B CN105408676 B CN 105408676B CN 201480042242 A CN201480042242 A CN 201480042242A CN 105408676 B CN105408676 B CN 105408676B
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- Prior art keywords
- light
- substrate
- pcb
- circuit unit
- light source
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0085—Means for removing heat created by the light source from the package
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0086—Positioning aspects
- G02B6/0091—Positioning aspects of the light source relative to the light guide
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Planar Illumination Modules (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The present invention relates to light-source circuit unit and the light-emitting device including the light-source circuit unit, the light-source circuit unit can prevent occurring in the case that substrate from bending at kink due to the defects of circuit damage causes, and can improve the elongated of device and radiating by forming bending type metal substrate on the upper surface of printed circuit board (PCB).The light-source circuit unit includes：Substrate, the substrate include first with least one opening part and second from first bending；Form the printed circuit board (PCB) on a surface of substrate；And light source component, the light source component is mounted on a printed circuit and the light source component is inserted into opening portion, with towards another surface emitting light of substrate.
Description
Technical field
Embodiments of the invention are related to light-emitting device, and more particularly, to light-source circuit unit and including the light
The light-emitting device of source circuit unit, the light-source circuit unit and the light-emitting device including the light-source circuit unit are configured to
So that bending type metal substrate formed on the upper surface of printed circuit board (PCB), therefore can prevent when bending substrate occur by
The defects of circuit damage at kink causes, and elongated device can be realized.
Background technology
With the development of electronic equipment industry, the light-emitting device including LED, PDP, AMOLED etc. has been developed, and
It also have been developed the image device including the light-emitting device, computer, mobile communication terminal etc..
Using being provided with light source and electrically connect the printed circuit of the electronic unit of light source etc. in light-emitting device
Plate.Specifically, bending type substrate can be used so that the side of light guide plate is incided from the light of light source component transmitting.
However, when manufacturing bending type substrate, cause the printed circuit board (PCB) on substrate may be in kink by bending
It is damaged, that is to say, that insulating barrier or conductive pattern may be extruded or may be torn.Therefore, because such damage, meeting
There is the problem of electric defect or open defect (foreign matter occur).
In addition, heat can cause light guide plate to expand as caused by light source component so that light source component and the light guide plate after expansion
Contact.Therefore, because such contact, there is also the impaired problem of light source component.
The content of the invention
[technical problem]
The present invention is had been devised by order to solve the above problems, and it is an object of the invention to provide a kind of circuit of light sources list
Member and the light-emitting device including the light-source circuit unit, the light-source circuit unit and the hair including the light-source circuit unit
Electro-optical device is configured so that the metal substrate with light source jack is arranged on the upper of the printed circuit board (PCB) including the first kink
On surface so that bending type metal substrate is arranged in based on the position of light guide plate between light guide plate and printed circuit board (PCB), therefore
It can prevent defect occur due to the circuit damage at kink when substrate is bent；It can prevent to be damaged and caused by circuit
Electric defect or open defect；It can prevent from causing light source component to be damaged by the expansion of light guide plate；And it can realize thin
Long device.
[solution to problem]
In order to solve these problems, according to an aspect of the present invention, light source cell can include：At least one light source；
Printed circuit board (PCB), the printed circuit board (PCB) include the first kink and install light source using the printed circuit board (PCB)；And formed
Metal substrate on the upper surface of printed circuit board (PCB).In other words, light-source circuit unit can include：Substrate, the substrate have
First including at least one opening part, and second from first bending；Print on a surface of substrate
Printed circuit board；And light source component, the light source component are mounted to printed circuit board (PCB) and are inserted into opening portion, light source
Element launches light to the opposite side of substrate.
According to the light-source circuit unit of the present embodiment, printed circuit board (PCB) can include：Pad portion, the pad portion are formed as at one
From the first bending extension on direction, and light source component is installed using the pad portion；And concatenation portion, the concatenation portion are formed as
Extend on other direction from the first kink, and the concatenation portion has and is used for the concatenation cloth of electric signal transmission to light source component
Line.
According to the light-source circuit unit of the present embodiment, metal substrate can include the second kink and light source jack, its
In middle light source component insertion light source jack.
According to the light-source circuit unit of the present embodiment, metal substrate can include selected from Al, Cu, Ag, Au, Cr, Mo, Mg and
At least one of Ni materials.
According to the light-source circuit unit of the present embodiment, the first kink can match each other with the second kink.
According to the light-source circuit unit of the present embodiment, the height of light source jack can be bigger than the thickness of light source component.
According to the light-source circuit unit of the present embodiment, printed circuit board (PCB) can be flexible print wiring board.
In addition, according to another aspect of the present invention, light-emitting device can include：Circuit of light sources as described above；And
Light guide plate, the light guide plate are used to guide the light launched from the light source of light-source circuit unit.In other words, light-emitting device can include：
Light-source circuit unit；And light guide plate, the substrate of light-source circuit unit is attached to the light guide plate, and the light guide plate is arranged on light
On the light-emitting area of the light source component of source circuit unit, light that the light-guide plate guides are launched from light source component.In this case,
Light-source circuit unit can include：Substrate, the substrate have include first of at least one opening part and from first
Second of bending；Printed circuit board (PCB) on a surface of substrate；And light source component, the light source component are mounted to print
Printed circuit board and it is inserted into opening portion, light source component launches light to the opposite side of substrate.
[beneficial effect of invention]
According to some embodiments of the present invention, because being formed with the metal substrate of light source jack in printed circuit board (PCB)
On upper surface, so can prevent that printed circuit board (PCB) is damaged at kink when substrate is bent, and can be by preventing
Due to light guide plate expansion and caused by contact protect light source.Furthermore it is possible to improve the elongated of light-source circuit unit and radiating
Characteristic.
Brief description of the drawings
Fig. 1 is the figure for the schematic structure for showing light-source circuit unit according to an embodiment of the invention；
Fig. 2 is the perspective view for showing the shape of the substrate of Fig. 1 light-source circuit unit before substrate is bent；
Fig. 3 is the decomposition diagram of Fig. 1 light-source circuit unit；
Fig. 4 is the front view of the modified example for the light-source circuit unit for showing Fig. 1；
Fig. 5 is the sectional view of light-emitting device according to another embodiment of the present invention；And
Fig. 6 is the plan of Fig. 5 light-emitting device.
Embodiment
Hereinafter, will be described with reference to the accompanying drawings one of ordinary skill in the art can easily implement it is of the invention
Embodiment.The construction shown in embodiment and accompanying drawing in specification is provided as the preferred embodiments of the present invention, and
It should be appreciated that there may be the various equivalent embodiments that can be replaced and the embodiment of modification when submitting.Separately
Outside, when being related to the operation principle of the preferred embodiments of the present invention, when known function or function can make subject of the present invention
When not knowing, these known functions or function will be omitted from description of the invention.Limited in view of the function of the present invention
Following term, and should partly understand the implication of each term by judging the whole of this specification, and pass through phase
Same reference has the element of identity function and operation to provide in accompanying drawing.
Embodiments of the invention are related to light-source circuit unit and the light-emitting device including the light-source circuit unit.The present invention
Embodiment aim to provide following structures：In the structure shown here, the metal substrate with light source jack is formed in printed circuit board (PCB)
On upper surface so that can be prevented when substrate is bent due to being lacked caused by the damage of printed circuit board (PCB) at kink
Fall into, and the flexibility and heat dissipation characteristics of device can be improved.
Fig. 1 is the figure for the schematic structure for showing light-source circuit unit according to an embodiment of the invention.
Reference picture 1, included according to the light-source circuit unit of the present invention：At least one light source component 200；Printed circuit board (PCB)
100, light source component 200 is attached to printed circuit board (PCB) 100, and printed circuit board (PCB) 100 has the first kink 130；And set
Put the bending type metal substrate 300 on the upper surface of printed circuit board (PCB) 100.
Preferably, light source component 200 is to include the light emitting diode with small power consumption and excellent durability etc.
Semiconductor light source.However, light source component can be arbitrary lamp, such as Halogen lamp LED, discharge lamp etc., and light source component can be with
Be attached to printed circuit board (PCB) 100 by the pad portion described afterwards, thus to the side-emitted light of light guide plate.
Printed circuit board (PCB) 100 as bending type printed circuit board (PCB) can include：Pad portion, the pad portion are formed as in first party
Extend upwards from the first kink 130, and light source component 200 is attached to the pad portion；And concatenation portion, the concatenation portion are formed as
Extend in a second direction from the first kink, and the concatenation portion has the concatenation by electric signal transmission to light source component 200
Wiring.That is, printed circuit board (PCB) 100 can include：Pad portion, light source component 200 are attached to the pad portion；And concatenation portion,
The concatenation portion has the concatenation wiring based on the first kink 130.
In this case, printed circuit board (PCB) 100 can be wherein using the flexibility coat copper plate with flexible and ductility
(FCCL) flexible print wiring board.
Formed with metal substrate 300 on the upper surface of printed circuit board (PCB) 100, and metal substrate 300 is curved including second
Folding part 330 and light source jack 350, wherein light source component 200 are inserted in light source jack 350.In the present embodiment, benefit from
Wherein light source component 200 is inserted into the structure in light source jack 350, can prevent from causing light source first by the expansion of light guide plate
Part 200 is damaged.
The second kink 330 formed at metal substrate 300 is with forming the first kink at printed circuit board (PCB) 100
130 matchings.That is, metal substrate 300 is arranged on the upper surface of printed circuit board (PCB) 100 so that metal substrate passes through base
Bent at a predetermined angle in the first kink 130 of printed circuit board (PCB) 100 corresponding with pad portion and concatenation portion.In other words,
Based on the second kink 330, metal substrate 300 bends and is then arranged on the upper table on the upper surface in pad portion and concatenation portion
On face.The bending angle of metal substrate 300 can be equal to the bending angle of printed circuit board (PCB) 100.
Metal substrate 300 can be included in metal Al, Cu, Ag, Au, Cr, Mo, Mg and Ni with high heat conductance
At least one material.Because use such metal with high heat conductance, it is possible to make by light via metal substrate 300
Thermal capacitance caused by source element, which is changed places, to be distributed, enabling improves heat dissipation characteristics.
Bending hole 360 is could be formed with metal substrate 300.Bending hole 360 can be bent into metal substrate 300
Prevent metal substrate 300 from distorting in the case of L-shaped.
According to the present embodiment, metal substrate 300 is arranged on the upper surface of printed circuit board (PCB), and forms the first kink
130 make it possible to prevent the wiring of insulating barrier or printed circuit board (PCB) to be damaged, such as are torn or are extruded, and can also prevent
Only cause electric defect or abnormal appearance occur due to damage.
Fig. 2 is the perspective view for showing the shape of the substrate of Fig. 1 light-source circuit unit before substrate is bent.
Reference picture 2, before metal substrate bending, there is flat shape according to the light-source circuit unit of the present embodiment.
That is, light-source circuit unit includes metal substrate 300, metal substrate 300 enables light source component 200 to be arranged on printing
On the upper surface of circuit board 100, and metal substrate 300 is arranged on the upper surface of printed circuit board (PCB) 100 so that light source component
200 are inserted into opening portion, i.e., in light source jack 350.
According to the present embodiment, in the following cases, printed circuit can be prevented at the first kink or the second kink
Plate 100 is damaged：Bend metal substrate 300 L-shaped so as to be located in bending mechanism on the upper surface of metal substrate 300
Pressure is applied to bending mechanism under state so that bending hole 360 intersects extension from a direction.In this case, printing
In the case that printed circuit board 100 is flexible print wiring board, printed circuit board (PCB) 100 can be more efficiently prevented from and be damaged.
Fig. 3 is the decomposition diagram of Fig. 1 light-source circuit unit.
Reference picture 3, in the light-source circuit unit according to the present embodiment, metal substrate 300 is arranged on printed circuit board (PCB) 100
Upper surface on and bend.Extend in a first direction first 301 of metal substrate has the first length L1, and metal
Extend in a second direction second 302 of substrate has the second length L2.
In this case, printed circuit board (PCB) 100 includes：Light source component 200, light source component 200, which is attached to, is arranged in print
The installation pad of first 101 on the upper face of printed circuit board；And connecting wiring 112, connecting wiring 112 will install pad with
Concatenation wiring 151 is connected to each other.A part for connecting wiring 112 and concatenation wiring 151 are arranged on and are arranged in printed circuit board (PCB)
Corresponding to second 102 in 100 lower surface in concatenation portion.
According to the metal substrate 300 of the present embodiment, because the LED encapsulation piece as light source component 200 can pass through setting
Into not outstanding replacement obstacle in a second direction, so light-source circuit unit can be implemented with narrow width.In addition, because
The lower portion of metal substrate 300 can be arranged in for the concatenation wiring 151 of printed circuit board (PCB) 100, it is possible to which realization has
The light-source circuit unit of slim-lined construction.
Fig. 4 is the front view of the modified example for the light-source circuit unit for showing Fig. 1.
Reference picture 4, included according to the light-source circuit unit of the present embodiment：Substrate 300, substrate 300 have first and
From second of first bending, first includes the first opening portion 350 corresponding with light source jack and the second opening portion
350a；Printed circuit board (PCB) on a surface (corresponding with lower surface) of substrate 300；And light source component 200, light source component
200 are mounted to printed circuit board (PCB) 100 and light source component 200 is inserted into the first opening portion and the second opening portion,
Light source component launches light to the opposite side of substrate 300.In this case, substrate 300 refers to metal substrate.
Substrate 300 has the second opening portion 350a, and plurality of light source component 200a, 200b are inserted in second and opened together
Oral area divides in 350a.Second opening portion 350a size is different from the size of the first opening portion 350.In the present embodiment,
The size of second opening portion is bigger than the size of the first opening portion 350.Therefore, according to the present embodiment, the size of opening portion
It can be changed according to the size or length of light-source circuit unit.
Fig. 5 is the sectional view of light-emitting device according to another embodiment of the present invention, and Fig. 6 is Fig. 5 light-emitting device
Plan.Fig. 6 can be corresponding with the sectional view that A-A ' along Fig. 5 light-emitting device is intercepted.
Reference picture 5 and Fig. 6, the light-emitting device according to the present embodiment, light guide plate can be formed by setting light guide plate 400
400 are used to guide the light from the light source component transmitting of Fig. 1 light-source circuit unit.
Light source jack 350 is formed at the metal substrate 300 being arranged on the upper surface of printed circuit board (PCB) 100, and light source is inserted
Light source component 200 of the hole 350 inserted with the pad portion 110 for being attached to printed circuit board (PCB) 100.The height D of light source jack 350 can be with shape
As bigger than the thickness T of light source component 200.
It is similar with the present embodiment, in the case where light source component 200 is mounted to the pad portion 110 of printed circuit board (PCB) 100,
That is pad portion on the upper surface of printed circuit board (PCB) 100 is mounted to the side of light guide plate 400 in light source component 200
In the case of launching light, expand light guide plate 400 due to the heat as caused by light source component 200.In consideration of it, because light source component
200 contact with the light guide plate 400 after expansion, so while the contact may damage light source component 200.
In order to prevent causing light source component 200 to damage due to such expansion of light guide plate 400, with light source component
200 opening positions spaced apart could be formed with obstacle.However, the manufacture and separation processing due to separating obstacle can be caused
Increase caused by cost increase the problem of.
Therefore, instead of being provided as the separation obstacle of add ons, in the present embodiment, there is light source jack 350
Metal substrate 300 is arranged on the upper surface of printed circuit board (PCB) 100 so that the height D-shaped of light source jack 350 turns into than light source member
The thickness T of part 200 is big.Therefore, it is possible to prevent from causing light source component 200 to be damaged due to the expansion of light guide plate 400.
In addition, as described above, it can prevent from insulating at the kink 130 of printed circuit board (PCB) 100 when substrate 300 is bent
Layer or wiring are damaged.In addition, because using the material with high conductivity in metal substrate, it is special that radiating can be improved
Property, and because obstacle is not used, cost can be reduced and light-source circuit unit can be relatively thin.
In order to strengthen heat dissipation characteristics, in light source component 200 and the wherein light source jack 350 inserted with light source component 200
At least a portion between inwall can be filled with heat-conducting filler 352.Heat-conducting filler 352 causes light source component 200 and gold
Category substrate 300 can not contact each other within a predetermined distance, and also enable from heat caused by light source component 200 easily
It is transferred to metal substrate 300.
In addition, can be found out from the printed circuit board (PCB) 100 as shown in Fig. 5, according to the printed circuit board (PCB) 100 of the present embodiment
Including：Pad 111 is installed, light source component 200 is attached to installation pad 111；Concatenation wiring 151, concatenation wiring 151 provide electric signal
To light source component 200；And connecting wiring 112, connecting wiring 112 will be installed pad 111 and be connected with concatenation wiring 151.This
In the case of, on the surface of installation pad 111, on the surface of the connecting wiring 112 and surface of concatenation wiring 151 is respectively formed over
There are insulating barrier 111a, insulating barrier 112a and insulating barrier 151a, enabling prevent by the conductive of the grade of substrate 300
Short circuit occurs for element.
According to the present embodiment, installation pad 111 is arranged in pad portion 110, and is concatenated wiring 151 and be arranged on concatenation portion 150
On so that light-source circuit unit can have slim-lined construction.
As previously described, in the specific descriptions of the present invention, it has been described that detailed exemplary reality of the invention
Apply example, it is clear that in the case of without departing from the spirit or scope of the present invention, those skilled in the art can make modification and become
Change.It is the explanation of the present invention it is understood, therefore, that foregoing, and should not be construed as limited to disclosed specific reality
Apply example, and the modification to the disclosed embodiments and other embodiment be intended to be included in scope of the following claims and
In its equivalent scope.
[description of reference]
100：Printed circuit board (PCB)
110：Pad portion
111：Installation pad
112：Connecting wiring
130：First kink
150：Concatenation portion
151：Concatenation wiring
200：Light source component
300：Metal substrate
330：Second kink
350：Light source jack
400：Light guide plate
Claims (20)
1. a kind of light-source circuit unit, including：
Printed circuit board (PCB), the printed circuit board (PCB) have the first kink；
Substrate, the substrate are arranged on the upper surface of the printed circuit board (PCB) and have the second kink；And
Light source component, the light source component be mounted to the printed circuit board (PCB) and phase from the light source component to the substrate
Offside launches light；
Wherein, the printed circuit board (PCB) includes：Pad portion, the pad portion are formed as from the first kink extending simultaneously in a first direction
And the light source component is attached to the pad portion；And concatenation portion, the concatenation portion are formed as curved from first in a second direction
Folding part extends and the concatenation portion has the concatenation wiring of electric signal transmission to light source component；
Wherein, the substrate includes：First, described first is formed as from the second kink extending in a first direction；With
And second, described second is formed as from the second kink extending in a second direction；
Wherein, described first is arranged on the upper surface in the pad portion and has at least one opening part, the light source
Element is inserted into the opening portion；And
Wherein, described second is arranged on the upper surface in the concatenation portion.
2. light-source circuit unit according to claim 1, wherein, the substrate is made up of metal material.
3. light-source circuit unit according to claim 1, wherein, the printed circuit board (PCB) is flexible print wiring board.
4. light-source circuit unit according to claim 1, wherein, the printed circuit board (PCB) also includes：Insulating supporting member,
The pad portion and connecting wiring are supported using the insulating supporting member.
5. light-source circuit unit according to claim 1, wherein, include the thickness of described first of the opening portion
More than the thickness of the light source component.
6. light-source circuit unit according to claim 5, wherein, at least one LED is accommodated in the opening portion
Element.
7. light-source circuit unit according to claim 1, wherein, the substrate described first with described second it
Between kink in there is bending hole.
8. light-source circuit unit according to claim 1, wherein, the substrate include with high heat conductance selected from Al,
At least one of Cu, Ag, Au, Cr, Mo, Mg and Ni material.
9. light-source circuit unit according to claim 1, it is additionally included in the wiring of the printed circuit board (PCB) and the substrate
Between insulating barrier.
10. light-source circuit unit according to claim 1, wherein, the light source component does not contact with the substrate.
11. light-source circuit unit according to claim 10, in addition to insert between the substrate and the light source component
Gap in filler.
12. light-source circuit unit according to claim 11, wherein, the filler is Heat Conduction Material.
13. a kind of light-emitting device, including：
Light-source circuit unit；And
Light guide plate, the substrate of the light-source circuit unit are mounted to the light guide plate, and the light guide plate be arranged on it is described
On the light-emitting area of the light source component of light-source circuit unit, wherein, the light-guide plate guides launch light from the light source component,
Wherein, the light-source circuit unit includes：
Printed circuit board (PCB), the printed circuit board (PCB) have the first kink；
The substrate, it is arranged on the upper surface of the printed circuit board (PCB) and there is the second kink；And
Light source component, the light source component be mounted to the printed circuit board (PCB) and phase from the light source component to the substrate
Offside launches light；
Wherein, the printed circuit board (PCB) includes：Pad portion, the pad portion are formed as from the first kink extending simultaneously in a first direction
And the light source component is attached to the pad portion；And concatenation portion, the concatenation portion are formed as curved from first in a second direction
Folding part extends and the concatenation portion has the concatenation wiring of electric signal transmission to light source component；
Wherein, the substrate includes：First, described first is formed as from the second kink extending in a first direction；With
And second, described second is formed as from the second kink extending in a second direction；
Wherein, described first is arranged on the upper surface in the pad portion and has at least one opening part, the light source
Element is inserted into the opening portion；And
Wherein, described second is arranged on the upper surface in the concatenation portion.
14. light-emitting device according to claim 13, wherein, the substrate is made up of metal material, and the printing
Circuit board is flexible print wiring board.
15. light-emitting device according to claim 14, wherein, the printed circuit board (PCB) also includes：Insulating supporting member, adopt
The pad portion and connecting wiring are supported with the insulating supporting member.
16. light-emitting device according to claim 13, wherein, including the thickness of described first of the opening portion is big
In the thickness of the light source component, and at least one LED element is accommodated in the opening portion.
17. light-emitting device according to claim 13, wherein, the substrate is at described first and described between second
Kink in there is bending hole.
18. light-emitting device according to claim 13, wherein, the substrate include with high heat conductance selected from Al, Cu,
At least one of Ag, Au, Cr, Mo, Mg and Ni material.
19. light-emitting device according to claim 13, be additionally included in the printed circuit board (PCB) wiring and the substrate it
Between insulating barrier.
20. light-emitting device according to claim 13, in addition between inserting between the substrate and the light source component
Heat-conducting filler in gap.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020130074643A KR102087865B1 (en) | 2013-06-27 | 2013-06-27 | Light source circuit unit and lighting device comprising the same |
| KR10-2013-0074643 | 2013-06-27 | ||
| PCT/KR2014/005117 WO2014208907A1 (en) | 2013-06-27 | 2014-06-11 | Light source circuit unit and lighting device comprising same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105408676A CN105408676A (en) | 2016-03-16 |
| CN105408676B true CN105408676B (en) | 2017-11-14 |
Family
ID=52142194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480042242.5A Active CN105408676B (en) | 2013-06-27 | 2014-06-11 | Light-source circuit unit and the light-emitting device including the light-source circuit unit |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US10191206B2 (en) |
| KR (1) | KR102087865B1 (en) |
| CN (1) | CN105408676B (en) |
| WO (1) | WO2014208907A1 (en) |
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| RU2660376C1 (en) * | 2017-06-23 | 2018-07-10 | Юрий Борисович Соколов | Flat lighting device with side lighting |
| CN109212710B (en) * | 2017-06-29 | 2021-01-15 | 台湾东电化股份有限公司 | Lens driving system and circuit module thereof |
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| CN111405743B (en) * | 2019-01-03 | 2023-09-05 | 新科实业有限公司 | Suspension assembly of optical image stabilizer |
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-
2013
- 2013-06-27 KR KR1020130074643A patent/KR102087865B1/en active IP Right Grant
-
2014
- 2014-06-11 WO PCT/KR2014/005117 patent/WO2014208907A1/en active Application Filing
- 2014-06-11 CN CN201480042242.5A patent/CN105408676B/en active Active
- 2014-06-11 US US14/901,028 patent/US10191206B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20170003441A1 (en) | 2017-01-05 |
| US10191206B2 (en) | 2019-01-29 |
| CN105408676A (en) | 2016-03-16 |
| KR102087865B1 (en) | 2020-03-12 |
| KR20150001427A (en) | 2015-01-06 |
| WO2014208907A1 (en) | 2014-12-31 |
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