CN105400477A - Conductive adhesive for high-power LED - Google Patents
Conductive adhesive for high-power LED Download PDFInfo
- Publication number
- CN105400477A CN105400477A CN201510990986.6A CN201510990986A CN105400477A CN 105400477 A CN105400477 A CN 105400477A CN 201510990986 A CN201510990986 A CN 201510990986A CN 105400477 A CN105400477 A CN 105400477A
- Authority
- CN
- China
- Prior art keywords
- parts
- power led
- byk
- conductive resin
- great power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to a conductive adhesive for high-power LED, and belongs to the technical field of electronic materials. The conductive adhesive comprises the following components in percentage by weight: 70 to 75% of nano silver-aluminum powder, 10 to 15% of epoxy resin, 2 to 5% of succinic anhydride, 4 to 6% of polydimethylsiloxane, 0.2 to 0.6% of antifoaming agent, and 3 to 8% of curing agent. The conductive adhesive has the advantages that silver-aluminum powder in the formula can be well dispersed, and thus the prepared conductive adhesive has the advantages of low resistivity, high thermal conductivity, and excellent bonding performance.
Description
Technical field
The present invention relates to a kind of great power LED conductive resin, belong to technical field of electronic materials.
Background technology
Photodiode (LED) is a kind of can be the semi-conductor of visible ray by electric energy conversion, there is the advantages such as volume is little, energy-conserving and environment-protective, long service life, be widely used in the fields such as display screen, traffic signal display light source, automotive industry lamp, backlight, lighting source.LED conductive resin, is the connection for LED chip and base material, can realizes the function of heat conduction and conduction simultaneously.
The developing direction of LED industry is the high-power future development towards high brightness, super brightness, thus conductive resin is had higher requirement: 1) great power LED is to the thermal diffusivity of conductive resin, traditional heat-conducting glue thermal conductivity is lower than 10W/mK, and the cooling requirements of high light large power LED chip is higher than 20W/mK; 2) develop suitable curing system, make conductive resin can at room temperature long-time storage, avoid high transportation cost and storage cost; 3) stability of contact resistance and the reliability of electric property.
Therefore, low, that thermal conductivity is high, adhesive property the is good great power LED conductive resin of resistivity is developed day by day urgent.
Summary of the invention
The object of the present invention is to provide a kind of great power LED conductive resin, effectively solve the thermal diffusivity problem after high-power LED chip long term operation.
The technical scheme realizing object of the present invention is: a kind of great power LED conductive resin, by mass percentage, comprising: nanometer silver aluminium powder 70% ~ 75%, epoxy resin 10% ~ 15%, Succinic anhydried 2 ~ 5%, polydimethylsiloxane 4% ~ 6%, defoamer 0.2% ~ 0.6%, solidifying agent 3% ~ 8%.。
Preferably, nanometer silver aluminium powder of the present invention is made up of the raw material of following weight part: nano-silver powder 100 parts, aluminium nitride 5 ~ 10 parts, nano zine oxide 30 ~ 50 parts, aluminium powder 40 ~ 60 parts, Union carbide A-162 10 ~ 15 parts, butanone 5 ~ 10 parts; Each raw material is mixed, carries out drying after grinding evenly, be then transferred in calcining furnace, roasting 2 ~ 3 hours at 600 ~ 700 DEG C, be i.e. obtained nanometer silver aluminium powder.
Preferred further, solidifying agent of the present invention is the one in Dyhard RU 100, imidazolium compounds and derivative thereof, organic acid hydrazides, trimeric cyanamide and derivative.
Defoamer of the present invention is the one in BYK-051, BYK-052, BYK-053, BYK-055, BYK-057 or BYK-555.
Nano-silver powder median size of the present invention is 60 ~ 200nm, and described nano zine oxide median size is 50 ~ 100nm.
Technological merit of the present invention is: the silver-colored aluminium powder in conductive resin formula of the present invention has good dispersion stabilization, the advantage that obtained conductive resin resistivity is low, thermal conductivity is high, adhesive property is good.
Embodiment
Below in conjunction with embodiment, the present invention will be further described.
embodiment 1
Take nanometer silver aluminium powder 70 grams, epoxy resin 15 grams, Succinic anhydried 5 grams, polydimethylsiloxane 4 grams, defoamer 0.2 gram, 5.8 grams, solidifying agent.
Wherein, described nanometer silver aluminium powder is made up of the raw material of following weight part: median size is 60nm nano-silver powder 100 parts, aluminium nitride 10 parts, median size are 80nm nano zine oxide 30 parts, aluminium powder 40 parts, Union carbide A-162 15 parts, butanone 8 parts; Each raw material is mixed, carries out drying after grinding evenly, be then transferred in calcining furnace, roasting 3 hours at 600 DEG C, be i.e. obtained nanometer silver aluminium powder.
embodiment 2
Take nanometer silver aluminium powder 75 grams, epoxy resin 10 grams, Succinic anhydried 2 grams, polydimethylsiloxane 4.6 grams, defoamer 0.4 gram, 8 grams, solidifying agent.
Wherein, described nanometer silver aluminium powder is made up of the raw material of following weight part: median size is 60nm nano-silver powder 100 parts, aluminium nitride 8 parts, median size are 50nm nano zine oxide 50 parts, aluminium powder 60 parts, Union carbide A-162 12 parts, butanone 10 parts; Each raw material is mixed, carries out drying after grinding evenly, be then transferred in calcining furnace, roasting 2.5 hours at 650 DEG C, be i.e. obtained nanometer silver aluminium powder.
embodiment 3
Take nanometer silver aluminium powder 73 grams, epoxy resin 13 grams, Succinic anhydried 4.4 grams, polydimethylsiloxane 6 grams, defoamer 0.6 gram, 3 grams, solidifying agent.
Wherein, described nanometer silver aluminium powder is made up of the raw material of following weight part: median size is 100nm nano-silver powder 100 parts, aluminium nitride 5 parts, median size are 100nm nano zine oxide 30 parts, aluminium powder 50 parts, Union carbide A-162 10 parts, butanone 5 parts; Each raw material is mixed, carries out drying after grinding evenly, be then transferred in calcining furnace, roasting 2 hours at 700 DEG C, be i.e. obtained nanometer silver aluminium powder.
In above-described embodiment 1 ~ 3, described solidifying agent all can be selected from the one in Dyhard RU 100, imidazolium compounds and derivative thereof, organic acid hydrazides, trimeric cyanamide and derivative, and described defoamer is selected from the one in BYK-051, BYK-052, BYK-053, BYK-055, BYK-057 or BYK-555.
Conductive resin obtained by embodiment 1 ~ 3 is carried out to the test of performance, volume specific resistance about 10
-5~ 10
-4Ω cm, thermal conductivity is about 24.0W/mK, and viscosity is about 48000mPa.s.
Meanwhile, carry out the test of viscosity after the conductive resin room temperature obtained by embodiment 1 ~ 3 is placed 3 months, viscosity is about 48200mPa.s, can find out that obtained conductive resin has good viscosity stability.
Claims (6)
1. a great power LED conductive resin, it is characterized in that: by mass percentage, comprising: nanometer silver aluminium powder 70% ~ 75%, epoxy resin 10% ~ 15%, Succinic anhydried 2 ~ 5%, polydimethylsiloxane 4% ~ 6%, defoamer 0.2% ~ 0.6%, solidifying agent 3% ~ 8%.
2. a kind of great power LED conductive resin according to claim 1, is characterized in that: described nanometer silver aluminium powder is made up of the raw material of following weight part: nano-silver powder 100 parts, aluminium nitride 5 ~ 10 parts, nano zine oxide 30 ~ 50 parts, aluminium powder 40 ~ 60 parts, Union carbide A-162 10 ~ 15 parts, butanone 5 ~ 10 parts; Each raw material is mixed, carries out drying after grinding evenly, be then transferred in calcining furnace, roasting 2 ~ 3 hours at 600 ~ 700 DEG C, be i.e. obtained nanometer silver aluminium powder.
3. a kind of great power LED conductive resin according to claim 1, is characterized in that: described solidifying agent is the one in Dyhard RU 100, imidazolium compounds and derivative thereof, organic acid hydrazides, trimeric cyanamide and derivative.
4. a kind of great power LED conductive resin according to claim 1, is characterized in that: described defoamer is the one in BYK-051, BYK-052, BYK-053, BYK-055, BYK-057 or BYK-555.
5. a kind of great power LED conductive resin according to claim 2, is characterized in that: described nano-silver powder median size is 60 ~ 200nm.
6. a kind of great power LED conductive resin according to claim 2, is characterized in that: described nano zine oxide median size is 50 ~ 100nm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510990986.6A CN105400477A (en) | 2015-12-24 | 2015-12-24 | Conductive adhesive for high-power LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510990986.6A CN105400477A (en) | 2015-12-24 | 2015-12-24 | Conductive adhesive for high-power LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105400477A true CN105400477A (en) | 2016-03-16 |
Family
ID=55466248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510990986.6A Pending CN105400477A (en) | 2015-12-24 | 2015-12-24 | Conductive adhesive for high-power LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105400477A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102174306A (en) * | 2011-01-26 | 2011-09-07 | 烟台德邦电子材料有限公司 | Conductive adhesive for LED (light emitting diode) packaging and preparation method of conductive adhesive |
| CN104263303A (en) * | 2014-10-13 | 2015-01-07 | 中国科学院理化技术研究所 | Flexible conductive adhesive capable of being used in direct coating manner and preparation method of flexible conductive adhesive |
| CN104910588A (en) * | 2014-03-12 | 2015-09-16 | 江苏麒祥高新材料有限公司 | Preparation method of high-heat conduction epoxy material containing nano-silver wires |
-
2015
- 2015-12-24 CN CN201510990986.6A patent/CN105400477A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102174306A (en) * | 2011-01-26 | 2011-09-07 | 烟台德邦电子材料有限公司 | Conductive adhesive for LED (light emitting diode) packaging and preparation method of conductive adhesive |
| CN104910588A (en) * | 2014-03-12 | 2015-09-16 | 江苏麒祥高新材料有限公司 | Preparation method of high-heat conduction epoxy material containing nano-silver wires |
| CN104263303A (en) * | 2014-10-13 | 2015-01-07 | 中国科学院理化技术研究所 | Flexible conductive adhesive capable of being used in direct coating manner and preparation method of flexible conductive adhesive |
Non-Patent Citations (1)
| Title |
|---|
| 李红强: "《胶粘原理、技术及应用》", 31 January 2014, 华南理工大学出版社 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105419672A (en) | Preparation method of high-heat-dissipation electric-conductive glue used for high-power LED | |
| CN105514066B (en) | A kind of compound infrared radiation heat-conducting film of graphene and preparation method thereof | |
| CN108192576B (en) | Liquid metal thermal interface material and preparation method and application thereof | |
| CN107974232B (en) | LED chip insulating heat-conducting die bond adhesive and preparation method thereof | |
| CN102013281A (en) | Conductive silver adhesive for high-power LED | |
| CN104031600A (en) | Insulating heat-conducting metal-to-metal adhesive and manufacturing method thereof | |
| CN102504741A (en) | High-heat conductivity and electric conductivity die bonding adhesive for carbon nano tube-filled high-power light-emitting diode (LED) | |
| CN102838958B (en) | Preparation method of silver colloid for LED (Light Emitting Diode) with high thermal conductivity | |
| CN103409041A (en) | Application of flexible thermal conductive insulation adhesive on LED (Light Emitting Diode) heat dissipation substrate | |
| CN104023505A (en) | Method for preparing high thermal conductivity graphite film | |
| CN108795354A (en) | A kind of heat conduction modified epoxide resin adhesive and preparation method | |
| CN104031388A (en) | Phenyl siloxane rubber nanometer composite material and preparation method thereof | |
| Mou et al. | Enhanced heat dissipation of high-power light-emitting diodes by Cu nanoparticle paste | |
| CN104497477A (en) | Heat conductive composite material and preparation method thereof | |
| CN105368330A (en) | Alpha-cyanoacrylate heat-conducting glue and preparation method thereof | |
| CN106893540A (en) | A kind of high-temperature Resistance Adhesives | |
| CN104210182A (en) | High heat conduction copper-clad plate for LED backlight, glue solution, preparation method of copper-clad plate, and preparation method of glue solution | |
| CN104559884B (en) | A kind of polymeric adhesion material | |
| CN105462533A (en) | Conductive silver adhesive for high-power LED package and preparation method thereof | |
| US20190309197A1 (en) | Thermal adhesive containing tetrapod zinc oxide and alumina nanofiber | |
| WO2019037564A1 (en) | Non-metal composite nano heat dissipation material and preparation method therefor | |
| CN101761903A (en) | Cooling structure for LED lamp | |
| CN105400477A (en) | Conductive adhesive for high-power LED | |
| CN106634654A (en) | Adhesive film with radiant heat dissipation function for LED (Light Emitting Diode) and preparation method of adhesive film | |
| CN101597430A (en) | A kind of preparation method of filled-type thermally conductive silicone rubber composite material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160316 |