CN105390425A - Device for cleaning to-be-tinned copper belt surface with soldering flux - Google Patents
Device for cleaning to-be-tinned copper belt surface with soldering flux Download PDFInfo
- Publication number
- CN105390425A CN105390425A CN201510933041.0A CN201510933041A CN105390425A CN 105390425 A CN105390425 A CN 105390425A CN 201510933041 A CN201510933041 A CN 201510933041A CN 105390425 A CN105390425 A CN 105390425A
- Authority
- CN
- China
- Prior art keywords
- scaling powder
- coated
- copper strips
- soldering flux
- accumulator tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 48
- 239000010949 copper Substances 0.000 title claims abstract description 48
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 47
- 238000004140 cleaning Methods 0.000 title claims abstract description 7
- 230000004907 flux Effects 0.000 title abstract 11
- 238000005476 soldering Methods 0.000 title abstract 11
- 239000007788 liquid Substances 0.000 claims abstract description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 29
- 238000003860 storage Methods 0.000 claims abstract description 8
- 239000000843 powder Substances 0.000 claims description 117
- 238000007654 immersion Methods 0.000 claims description 30
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 27
- 239000010797 grey water Substances 0.000 claims description 4
- 210000000988 bone and bone Anatomy 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 11
- 230000008595 infiltration Effects 0.000 abstract 1
- 238000001764 infiltration Methods 0.000 abstract 1
- 238000011084 recovery Methods 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 19
- 238000000034 method Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 150000001879 copper Chemical class 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000006424 Flood reaction Methods 0.000 description 1
- 241001149930 Protura <class> Species 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003517 fume Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
- H01L31/188—Apparatus specially adapted for automatic interconnection of solar cells in a module
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Electromagnetism (AREA)
- Life Sciences & Earth Sciences (AREA)
- Powder Metallurgy (AREA)
Abstract
The invention discloses a device for cleaning a to-be-tinned copper belt surface with a soldering flux. The device comprises a copper belt infiltration tank, a soldering flux overflow tank, a soldering flux storage and recovery tank, a water pump, a liquid remover and a compressed air source. Through a structural design of the components, an original small tank device which accommodates the soldering flux and cleans a to-be-tinned copper belt is replaced with a soldering flux circulating system disclosed by the invention, so that the conditions that the soldering flux splashes and excessive soldering flux enters a tin liquid to pollute the environment and to the employee health are avoided; the soldering flux does not need to be added frequently; the poor tinning condition due to the fact that the to-be-tinned copper belt surface is not cleaned thoroughly due to absence of the soldering flux is avoided; and a series of problems in the device for cleaning the to-be-tinned copper belt surface with the soldering flux on existing equipment are solved.
Description
Technical field
The present invention relates to the device that a kind of scaling powder carrys out clean tin copper strip surface to be coated, belong to and produce photovoltaic interconnecting strip apparatus field used.
Background technology
Current various countries all development new forms of energy, solar energy power generating belongs to new energy field, equipment used primarily of solar photovoltaic cell panel, photovoltaic junction box, photovoltaic bracket, the composition such as inverter or energy storage device.Wherein, solar photovoltaic cell panel is by glass, EVA, cell piece, photovoltaic interconnecting strip, busbar, backboard lamination composition, multi-disc welding of battery film is concatenated into a string battery strings by photovoltaic interconnecting strip, is transmitted to busbar for the small area analysis collected on cell piece, multi-string battery string couples together and draws and is connected with the terminal in photovoltaic junction box by busbar, and Main Function is that carrying high currents is on the terminal in photovoltaic junction box.Existing production photovoltaic interconnecting strip technique is the fine copper wire that thick copper lines wire drawing becomes appropriate size, then the copper strips of respective width thickness is rolled into, then come the dirty of clean copper strip surface and oxide layer with scaling powder, be finally coated with tin take-up again, be namely made into package interconnecting strip.
Current scaling powder come the dirty of clean copper strip surface and oxide layer be enter to be equipped with a small amount of scaling powder by copper strips pilot by four guide wheels copper strips immersion slot in implement, this copper strips immersion slot is very little, the scaling powder of about dress about 2L, wherein two guide wheels are immersed in scaling powder, highly identical, clean for copper strips is pressed in scaling powder, two other guide wheel plays importing and derivative ac-tion, when equipment runs, four guide wheels rotate with the reach of copper strips, copper strips speed of advancement about 100 ms/min, be immersed in the guide wheel in scaling powder and derive guide wheel rotation and take up scaling powder splashing, cause frame by heavy corrosion, need to put a larger container below this copper strips immersion slot and reclaim the scaling powder sputtered, this container is outside exposed, scaling powder volatilization is very fast, cause the scaling powder concentration in space, workshop higher, penetrating odor is strong, serious environment pollution, affect employee healthy, meet high temperature naked light time more serious and catch fire.Also have much unnecessary scaling powder to enter in tin liquor along with copper strips, produce a large amount of Xi Pao and combustion fumes, and tin liquor surface debris is a lot, serious environment pollution, affects enterprise employee health.The copper strips immersion slot of dress scaling powder is less, generally will add a scaling powder at a hours, if employee forgets interpolation, then the interconnecting strip made can be bad and defective due to the clean clean appearance painting tin of copper strip surface, need do over again.
Summary of the invention
For solve guide wheel rotate take up scaling powder splash and cause frame to be corroded, unnecessary scaling powder enters tin liquor along with copper strips and do not add scaling powder in time and cause being coated with tin bad and underproof problem, the invention provides a kind of device carrying out clean tin copper strip surface to be coated with scaling powder newly.
Technical scheme of the present invention is:
Scaling powder carrys out a device for clean tin copper strip surface to be coated, comprises copper strips immersion slot, scaling powder overflow launder, scaling powder storage accumulator tank, water pump, liquid knockout and compressed air gas source; Described copper strips immersion slot and liquid knockout are placed in described scaling powder overflow launder, and the position that described copper strips immersion slot is relative with scaling powder overflow launder two ends is provided with two for wearing the aperture of tin copper strips to be coated, and four apertures are on same level line; Described liquid knockout is connected with described compressed air gas source, and tin copper strips to be coated is aimed in its gas outlet; Described scaling powder overflow launder is arranged on more described scaling powder and stores the high position of accumulator tank, the top storing accumulator tank by water pipe and described scaling powder bottom it is connected, and is overflowed to by copper strips immersion slot in scaling powder overflow launder and is recovered to the liquid knockout scaling powder blown in scaling powder overflow launder in scaling powder storage accumulator tank; Described scaling powder is stored accumulator tank and is connected with described water pump by water pipe with described copper strips immersion slot, and described scaling powder stores accumulator tank and is used for storing and reclaiming scaling powder, and described water pump is used for scaling powder to pump in copper strips immersion slot.
Described scaling powder stores the water pipe connecing bottom accumulator tank and store scaling powder in accumulator tank or cleaning sullage for scaling powder of draining, and water pipe is connected to valve.
The valve for adjustable pressure size is provided with between described liquid knockout and described compressed air gas source.
Be provided with between described water pump and described copper strips immersion slot for regulating scaling powder uninterrupted valve.
Described scaling powder overflow launder top is provided with lid, and lid is provided with handle.
Described liquid knockout cuts terminal by the gentle flow resistance of source of the gas splicing ear and forms; Described air-flow is stopped terminal and is comprised the cylinder and a circular cone stage body that connect, and centre is provided with through hole, and described circular cone stage body bottom surface connects with described cylinder and has identical radius, and described cylinder is provided with external screw thread; Described source of the gas splicing ear is provided with a cavity matched with described cylinder and circular cone stage body and centre is same is provided with through hole, be provided with the internal thread matched with described external screw thread in cavity, described source of the gas splicing ear is provided with the part of the described frustum of a cone mates interface be connected with compressed air gas source.
Described scaling powder overflow launder inside is provided with baffle plate, baffle plate is provided with slot, described liquid knockout is fixed on this slot by fixed head, and liquid knockout height can, along the length direction up-down adjustment of this slot, make its interior bone corresponding with the aperture height being installed with tin copper strips to be coated.
Device of the present invention in use, flux-free splashes and unnecessary scaling powder enters tin liquor and contaminated environment, affect enterprise employee health, also frequently scaling powder need not be added, tin copper strip surface to be coated not clean clean appearance is caused to be coated with the bad situation of tin without because lack scaling powder, use procedure is stablized, and solves the device series of problems current equipment carrying out clean tin copper strip surface to be coated with scaling powder.
Accompanying drawing explanation
Fig. 1 is overall structure schematic diagram of the present invention.
Fig. 2 is the schematic diagram (not comprising lid) loading onto copper strips immersion slot, liquid knockout, water pipe, tracheae and copper strips in scaling powder overflow launder.
Fig. 3 is the structural representation that scaling powder stores accumulator tank.
Fig. 4 is the structural representation of scaling powder overflow launder.
Fig. 5 is the structural representation of copper strips immersion slot.
Fig. 6 is the structural representation of liquid knockout.
Fig. 7 is the structural representation of the air-flow obstruction terminal of liquid knockout.
Fig. 8 is the profile of the source of the gas splicing ear of liquid knockout.
Fig. 9 is the structural representation of liquid knockout fixed head.
Embodiment
Present pre-ferred embodiments is provided, to describe technical scheme of the present invention in detail below in conjunction with accompanying drawing.
Embodiment:
As shown in Fig. 1 ~ 9, scaling powder of the present invention carrys out the device of clean tin copper strip surface to be coated, comprises copper strips immersion slot 100, scaling powder overflow launder 200, scaling powder storage accumulator tank 300, water pump 400, liquid knockout 500 and compressed air gas source (not shown in FIG.); Copper strips immersion slot 100 and liquid knockout 500 are placed in scaling powder overflow launder 200, the position that copper strips immersion slot 100 is relative with scaling powder overflow launder 200 two ends is provided with two for wearing the aperture 101,102,201 and 202 of tin copper strips to be coated, and four apertures are on same level line; Scaling powder overflow launder top is provided with lid 220, and lid is provided with handle 221; Liquid knockout 500 is connected with compressed air gas source, and tin copper strips 600 to be coated is aimed in its gas outlet; Scaling powder overflow launder 200 is arranged on and stores the high position of accumulator tank 300 compared with scaling powder, be connected with the top that scaling powder stores accumulator tank by water pipe 203 bottom it, copper strips immersion slot 100 is overflowed in scaling powder overflow launder 200 and be recovered to liquid knockout 500 scaling powder blown in scaling powder overflow launder 200 in scaling powder storage accumulator tank 300, scaling powder stores the water pipe 302 connecing bottom accumulator tank 300 and store scaling powder in accumulator tank or cleaning sullage for scaling powder of draining, and water pipe is connected to valve 303; Scaling powder is stored accumulator tank 300 and is connected with water pump 400 by water pipe 301 with copper strips immersion slot 100, and water pump 400 is for pumping into scaling powder in copper strips immersion slot 100.Be provided with between water pump 400 and copper strips immersion slot 100 for regulating scaling powder uninterrupted valve 401.
Liquid knockout 500 cuts terminal 520 by the gentle flow resistance of source of the gas splicing ear 510 and forms; Air-flow is stopped terminal and is comprised cylinder 521 and the circular cone stage body 522 connected, and centre is provided with through hole 523, and circular cone stage body bottom surface connects with cylinder and has identical radius, and cylinder is provided with external screw thread 5210; Source of the gas splicing ear 510 is provided with one with the cavity 511 that cylinder 521 and circular cone stage body 522 match and centre is same is provided with through hole 512, be provided with the internal thread 513 matched with external screw thread in cavity, source of the gas splicing ear be provided with the interface 514 be connected with compressed air gas source with the part of frustum of a cone mates.This interface 514 connects compressed air gas source by tracheae 515, tracheae 515 is provided with the valve (not shown in FIG.) for adjustable pressure size, compressed air is passed into carry out the size of adjustable pressure with this valve after, compressed air is flowed out to conehead one end, this end is towards copper strips immersion slot, blown to by unnecessary scaling powder in scaling powder overflow launder, the other end almost non-compressed air flows out; One is also provided with for the fixing externally threaded cylinder 516 of band bottom source of the gas splicing ear 510.
Scaling powder overflow launder 200 inside is provided with baffle plate 210, baffle plate is provided with slot 211, liquid knockout is fixed on this slot by fixed head 530, fixed head 530 is provided with screw 531, screw 531 matches with the externally threaded cylinder 516 of band, liquid knockout height is made along the length direction up-down adjustment of this slot, thus to make liquid knockout interior bone 523,512 highly corresponding with the aperture 101,102 being installed with tin copper strips to be coated.
Before start, first put on tin copper strips 600 to be coated, after confirmation can be started shooting, open compressed air gas source again, and adjusting size is to correct position, start water pump 400, scaling powder stores scaling powder in accumulator tank 300 with regard to pump in copper strips immersion slot 100, when the scaling powder in copper strips immersion slot 100 floods tin copper strips 600 to be coated, scaling powder wears the aperture 101 of tin copper strips 600 to be coated from two of copper strips immersion slot side, overflowing in 102 flows in scaling powder overflow launder 200, water pipe 203 again by storing accumulator tank 300 top bottom connection scaling powder overflow launder 200 with scaling powder is back to scaling powder and stores in accumulator tank 300, the system that a composition scaling powder recycles up and down.
In the present embodiment, scaling powder stores accumulator tank 300 approximately dress 40L scaling powder, by handle 304, hinge 305, tegillum 306 forms interpolation scaling powder entrance, mentions handle 304 and can open tegillum 306, seal at the tegillum 306 that closes after interpolation, substantially 4 day time added once, recycle January how after, accumulator tank 300 is stored to scaling powder and cleans, by the water pipe 302 bottom scaling powder storage accumulator tank 300 and valve 303, cleaning sullage is discharged, then add new scaling powder.
This device in use, flux-free splashes and unnecessary scaling powder enters tin liquor and contaminated environment, affect enterprise employee health, also frequently scaling powder need not be added, tin copper strip surface to be coated not clean clean appearance is caused to be coated with the bad situation of tin without because lack scaling powder, this device use procedure is stablized, and solves the device series of problems current equipment carrying out clean tin copper strip surface to be coated with scaling powder.
More than show and describe general principle of the present invention, principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and specification just illustrates principle of the present invention; the present invention also has various changes and modifications without departing from the spirit and scope of the present invention, and these changes and improvements all fall in the claimed scope of the invention.
Claims (6)
1. carry out a device for clean tin copper strip surface to be coated with scaling powder, it is characterized in that, comprise copper strips immersion slot, scaling powder overflow launder, scaling powder storage accumulator tank, water pump, liquid knockout and compressed air gas source; Described copper strips immersion slot and liquid knockout are placed in described scaling powder overflow launder, and the position that described copper strips immersion slot is relative with scaling powder overflow launder two ends is provided with two for wearing the aperture of tin copper strips to be coated, and four apertures are on same level line; Described liquid knockout is connected with described compressed air gas source, and tin copper strips to be coated is aimed in its gas outlet; Described scaling powder overflow launder is arranged on more described scaling powder and stores the high position of accumulator tank, the top storing accumulator tank by water pipe and described scaling powder bottom it is connected, and is overflowed to by copper strips immersion slot in scaling powder overflow launder and is recovered to the liquid knockout scaling powder blown in scaling powder overflow launder in scaling powder storage accumulator tank; Described scaling powder is stored accumulator tank and is connected with described water pump by water pipe with described copper strips immersion slot, and described scaling powder stores accumulator tank and is used for storing and reclaiming scaling powder, and described water pump is used for scaling powder to pump in copper strips immersion slot.
2. scaling powder according to claim 1 carrys out the device of clean tin copper strip surface to be coated, it is characterized in that, scaling powder stores the water pipe connecing bottom accumulator tank and store scaling powder in accumulator tank or cleaning sullage for scaling powder of draining, and water pipe is connected to valve.
3. scaling powder according to claim 1 carrys out the device of clean tin copper strip surface to be coated, it is characterized in that, is provided with the valve for adjustable pressure size between described liquid knockout and described compressed air gas source.
4. scaling powder according to claim 1 carrys out the device of clean tin copper strip surface to be coated, it is characterized in that, is provided with for regulating scaling powder uninterrupted valve between described water pump and described scaling powder overflow launder.
5. scaling powder according to claim 1 carrys out the device of clean tin copper strip surface to be coated, it is characterized in that, described liquid knockout cuts terminal by the gentle flow resistance of source of the gas splicing ear and forms; Described air-flow is stopped terminal and is comprised the cylinder and a circular cone stage body that connect, and centre is provided with through hole, and described circular cone stage body bottom surface connects with described cylinder and has identical radius, and described cylinder is provided with external screw thread; Described source of the gas splicing ear is provided with a cavity matched with described cylinder and circular cone stage body and centre is same is provided with through hole, be provided with the internal thread matched with described external screw thread in cavity, described source of the gas splicing ear is provided with the part of the described frustum of a cone mates interface be connected with compressed air gas source.
6. scaling powder according to claim 1 carrys out the device of clean tin copper strip surface to be coated, it is characterized in that, described scaling powder overflow launder inside is provided with baffle plate, baffle plate is provided with slot, described liquid knockout is fixed on this slot by fixed head, liquid knockout height can, along the length direction up-down adjustment of this slot, make its interior bone corresponding with the aperture height being installed with tin copper strips to be coated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510933041.0A CN105390425A (en) | 2015-12-15 | 2015-12-15 | Device for cleaning to-be-tinned copper belt surface with soldering flux |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510933041.0A CN105390425A (en) | 2015-12-15 | 2015-12-15 | Device for cleaning to-be-tinned copper belt surface with soldering flux |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105390425A true CN105390425A (en) | 2016-03-09 |
Family
ID=55422566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510933041.0A Pending CN105390425A (en) | 2015-12-15 | 2015-12-15 | Device for cleaning to-be-tinned copper belt surface with soldering flux |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105390425A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110281644A (en) * | 2019-07-16 | 2019-09-27 | 上海芳辉印刷有限公司 | A kind of tag printing device and its printing technology |
| CN112666071A (en) * | 2021-01-22 | 2021-04-16 | 成都建工装饰装修有限公司 | Fine decoration design system based on BIM three-dimensional visualization technology |
-
2015
- 2015-12-15 CN CN201510933041.0A patent/CN105390425A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110281644A (en) * | 2019-07-16 | 2019-09-27 | 上海芳辉印刷有限公司 | A kind of tag printing device and its printing technology |
| CN110281644B (en) * | 2019-07-16 | 2021-06-29 | 上海芳辉印刷有限公司 | Label printing equipment and printing process thereof |
| CN112666071A (en) * | 2021-01-22 | 2021-04-16 | 成都建工装饰装修有限公司 | Fine decoration design system based on BIM three-dimensional visualization technology |
| CN112666071B (en) * | 2021-01-22 | 2023-08-29 | 成都建工装饰装修有限公司 | Finishing design system based on BIM three-dimensional visualization technology |
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Application publication date: 20160309 |