CN105390289A - Anti-vibration electronic element device - Google Patents
Anti-vibration electronic element device Download PDFInfo
- Publication number
- CN105390289A CN105390289A CN201510553921.5A CN201510553921A CN105390289A CN 105390289 A CN105390289 A CN 105390289A CN 201510553921 A CN201510553921 A CN 201510553921A CN 105390289 A CN105390289 A CN 105390289A
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- hole
- electronic component
- collar
- wire
- fixed
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- 239000003990 capacitor Substances 0.000 claims description 15
- 238000001125 extrusion Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 8
- 239000013536 elastomeric material Substances 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract 2
- 238000004804 winding Methods 0.000 description 10
- 239000007767 bonding agent Substances 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 238000005266 casting Methods 0.000 description 2
- 239000007799 cork Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 230000036316 preload Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 240000004859 Gamochaeta purpurea Species 0.000 description 1
- 206010044565 Tremor Diseases 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 230000003902 lesion Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/04—Mountings specially adapted for mounting on a chassis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10583—Cylindrically shaped component; Fixing means therefore
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10651—Component having two leads, e.g. resistor, capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10962—Component not directly connected to the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2045—Protection against vibrations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/70—Energy storage systems for electromobility, e.g. batteries
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
- Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
Abstract
The invention proposes an electronic element device (10), having an electronic component (12), having an element substrate (14) and at least one connecting wire (32), and extending from a side (23) of the element substrate (14). The electronic component device also has a contact fork (36) for electrically conducting the connecting wire (32) on the support plate (16) and a lantern ring (38) having a through-hole (40), in which the connected conductor (32) is accommodated. The electronic element device (10) is characterized in particular in that the lantern ring (38) is disposed between the contact fork (36) and an element base (16), the outer circumference of the connecting wire (32) is much smaller than the circumference of the through hole (40), and the connecting wire (32) is securely fixed in the through-hole (40) by using stationary object (42). It can be favorably ensured that the connecting wire (32) can be fixed without internal mechanical clamping in the element (12), thereby improving the overall vibration resistance of the element (12).
Description
Technical field
The present invention relates to a kind of electronic component device for vibrationproof ground assembling electronic element, especially electrolytic capacitor.
Background technology
Under electronic component is often in the mechanical load of increase, such as, due in motor vehicle or the vibration in other electromechanical assembly and/or vibration.Adversely may affect element useful life thus.
This particularly relates to electrolytic capacitor, they electrically connect and such as use in suppression interference assembly as suppression interference capacitors device on circuit board of being everlasting, conductor plate and/or punch grid, such as in the d.c. motor (BLDC motor) of brushless, inside gearbox controller, inside the electrical steering of motor vehicle or inside other electronic circuit.
Many electronic components are cast at least in part to ensure enough vibration resistances and/or are bonded in inside casting material in principle.But this is along with the production cost for material of casting, bonding agent and/or corresponding hardening process increased.
Especially electrolytic capacitor usually can not be cast completely, because this element may produce gas at run duration, such as hydrogen, it wants to overflow from element, because otherwise the part of the overvoltage produced potentially possibility lesion element.
By the known sealing for components and parts of DE102011004142A1, gas can from components and parts out.Sealing has sealing gasket, have thin-walled, can the position of diffusion gas.
Summary of the invention
Embodiments of the invention can advantageously realize, provide one reliably, firmly and can machinery carrying electronic component device, it has electronic component, especially electrolytic capacitor.
Advise a kind of electronic component device according to a first aspect of the present invention, it has an electronic component, and have element body and at least one connection wire, it stretches out from the side of element body.This electronic component device also has a contact fork, connects wire at support plate for electrically connecting, and the collar that has a through hole, holds and connect wire inside through hole.Especially be according to the feature of electronic component device of the present invention, the described collar is arranged between contact fork with element body, and the excircle of described connection wire is much smaller than the circumference of through hole.In addition described connection wire utilizes fixed body position reliably to fix inside through hole.
By arranging that according to the present invention the collar can ensure with between element body and by being fixedly connected with wire at contact fork inside through hole, described connection wire is at least from element body until the collar can not have mechanical prestress, extracts from element body also referred to as mean stress.Between connection wire and parts, electrical contact can not provided with there is no mechanical prestress element body is inner thus, make electrical contact reliably can bear dynamic load, such as, vibrate and/or tremble thus.Therefore can advantageously maximally utilize and/or improve the vibration resistance of element.In addition with in order to cast at least in part from dynamic load and/or bonding element electronic component device compared with can reduce production cost.
Also can be conveniently used in appearance design according to electronic component device of the present invention and easily as inside additional combination of process steps to processing.The described collar and at the connection fixed body of wire inside through hole can be combined by component manufacturer completely and/or complete.These parts also self can be completed by the user of component manufacturer, without the need to changing outward appearance and/or the instrument of element.The described collar and fixed body also can be combined to inside electronic component device afterwards or from combine as appearance element.
Design for the embodiment of the present invention especially can be considered as based on thought described below and understanding.Electrolytic capacitor is usually fixed on bonding agent bed and/or is fixed in the cast material on support plate and electrically connects on the contact fork of punch grid, such as, by hot stack or electric resistance welding.Electrolytic capacitor mostly has and is arranged on inside element body and with the winding of electrolyte-impregnated and film, and film and so-called blade (Paddle-Tabs) such as utilize to be riveted or be engaged (interlocking) and electrically connect.Sometimes inaccurately centering is pitched with the contact of punch grid because possible assembling and/or component error connect wire.Contact if present to pitch and connected by hot stack and/or electric resistance welding and therefore made connection wire fix to clamp and/or weld and be electrically connected, then the contact that this connection wire can pass through more mechanical rigid is pitched and is forced to new position.Because this is the partial elastic deformation connecting wire, the prestressing force of machinery or mean stress can act on and connect on wire.If electrolytic capacitor is in operation and is in vibration and/or vibration now, then dynamic vibration load can act on electrolytic capacitor.Because the static mechanical prestress existed inside material and/or on electrically connecting position or contact causes electrical contact or the electronic component mechanical failure when vibrational loading significantly.Such as do not have the element of preload can bear 200m/s with not damaging
2vibrational loading.If but under element has been in static preload, then dynamic load to be superimposed upon on static load and element may lose efficacy.These relations can represent in strength theory in so-called Haigh figure.Accordingly, when vibrational loading acts in system, the vibration resistance of system declines fast with the mean stress level being greater than zero.Therefore, when system is positioned at mechanical stress state, when namely mechanical mean stress is zero, vibration resistance can be maximum.
Such as can realize in electrolytic capacitor by being fixed on inside through hole according to the guiding of the through hole through collar connection wire of the present invention and its, connect the possible distortion of wire by with contact the connection of pitching can not direct into blade always, therefore they can be in the state of mechanical stress and therefore especially can make the riveted joint of blade and winding film or be engaged not lose efficacy, because do not realize dynamic vibration load with can having mean stress load on winding.
According to embodiments of the invention, it is stifled that described element has plug, inside the hole that it is contained in element body at least in part and it has pilot hole, connects wire through its guiding.The circumference of said pilot hole in plug is stifled is less than the circumference of through hole in the collar.Sizable through hole circumference especially can simplify processing because connect wire can easily and without the need to auxiliary tools through the collar guiding.
According to embodiments of the invention, the described collar is made up of elastomeric material.Such as the described collar is made up of cork and/or elastomer.Can advantageously make thus collar profile adapt to neatly in electronic component device for structure space.
According to embodiments of the invention, described electronic component has at least two and connects wire, and they are stretched from the same side of element body respectively, and the described collar has two through holes, holds one respectively wherein and connects wire.By holding the short circuit connecting wire and such as can avoid connecting between wire at two respectively.
According to another embodiment of the present invention, the described collar has the stifled position of plug, and inside the perforate that it is contained in element body at least in part, wherein said connection wire is through the pilot hole guiding at the stifled position of plug.In addition, the described collar has fixed position, arranges through hole wherein and utilize fixed body to locate reliably to be fixedly connected with wire.Said plug blocks up position and fixed position and can form one or many bodies.This structure example of the described collar, as being favourable in being equipped with again, being blocked up because such as remove the plug be arranged on inside element body and can pass through to replace according to the additional function with the stifled collar at position of plug and the fixed position on element body of the present invention.Also this collar the additional fixed body for the collar can be removed thus, because can be fixed on element body by block part.
According to embodiments of the invention, the longitudinal length of described fixed position is greater than the longitudinal length at the stifled position of plug.Advantageously can ensureing thus, cancellation can enter into fixed position until its transition to block part acts on the moment of flexure bending stress in other words connected on wire from connecting wire completely, it may owing to connecting wire and contacting the contact of pitching and produce.The longitudinal length of fixed position such as at least can have the value doubling and connect diameter of wire, and what wherein can be parallel to connection wire moves towards measurement longitudinal length.
According to embodiments of the invention, the fixed body of described connection wire is provided by deformation device, and this deformation device is designed to, and the collar and/or through hole cross section is out of shape like this by the extruding collar, connection wire is located and reliably clampingly fixes inside through hole.By the distortion of the whole collar, compared with only thru-hole distortion, the processing technology of electronic component device can be simplified.
According to embodiments of the invention, the described collar is cylindrically formed, and the wherein said collar can be out of shape by deformation device diametrically.The collar that Rotational Symmetry is formed also can simplified processing process, because the collar can assemble in multiple orientation.
According to embodiments of the invention, the described collar is cylindrically formed, wherein said deformation device be made up of extrusion ring and the described collar along an excircle around.Deformation device also can simplify processing and/or be equipped with as the expansion structure of extrusion ring, such as, because can perform assembling by instrument common on market.
According to embodiments of the invention, the fixed body of described connection wire, by providing with fixed substance spray through hole, makes connection conductor material be fixed in locking manner inside through hole thus.Described fixed substance can be such as bonding agent, paint or cast material.
According to embodiments of the invention, the fixed body of described connection wire is provided by pin parts, and it can be inserted into inside through hole, is fixed on inside through hole with making the force closure of connection wire thus.Described pin parts such as can conically be formed, and taper end can be inserted into thus inside through hole and to connect wire to be clampingly fixed on inside through hole by pin ends thicker compared with taper end.Arbitrary cross section can be had as circular, ellipse, polygon or other cross section at these pin parts.
According to embodiments of the invention, described electronic component is electrolytic capacitor.Described electrolytic capacitor such as can have element body and is arranged on inside element body and is furnished with the winding of film.Electrolytic capacitor can also have plug ventilative at least partly and block up, and it can inside the perforate that end is contained in element body, and wherein connecting wire can be connected with winding thin-film electro by one end.
Point out, describe attainable feature and advantage more of the present invention with reference to different embodiments here.Professional recognizes, described feature can be combined by the mode be applicable to, adaptive or replacing, for realizing other embodiments of the invention.
Accompanying drawing explanation
Below with reference to the accompanying drawings describe embodiments of the invention, wherein accompanying drawing and explanation are not considered as limiting the present invention.
Figure 1A, 1B and 1C illustrate the end view of the electronic component device according to embodiments of the invention, the vertical view of profile and front view.
Fig. 1 D and 1E illustrates a collar and a deformation device of the electronic component device of Figure 1A to 1C.
Fig. 2 illustrates the electronic component device according to another embodiment of the present invention.
Fig. 3 A and 3B illustrates a part for the electronic component device according to other embodiment of the present invention respectively.
Accompanying drawing is only signal and is not actual proportions.Identical Reference numeral represents feature that is identical or identical function in the accompanying drawings.
Embodiment
Figure 1A, 1B and 1C illustrate the electronic component device 10 according to the embodiment of the present invention respectively.In figure ia end view is shown, the vertical view of profile is shown in fig. ib, in fig. 1 c front view is shown.Fig. 1 D and 1E illustrates the collar 38 and the deformation device 44 of the electronic component device 10 of Figure 1A to 1C.
Electronic component device 10 has electronic component 12, and it has columniform element body 14 substantially.Element 12 can be such as electrolytic capacitor.
Element body 14 is arranged on support plate 16, arranges the fixture 18 being used for retaining element matrix 14 thereon.In this fixture 18, there are two opposed clamping flanges (clamping arc) 20, element body 14 is set betwixt and they can on the opposed clamp shape ground, part surface place of two of the shell surface of element body 14 at least in part circuit card element body 14. clamp flange 20 and can have grab respectively and lean the stop surface on element body shell surface, element body 14 can be secured to inside fixture 18 and can machinery is fixing in all three spatial directions thus.Additionally by bonding 22, element body 14 can be fixed on support plate 16.
Electronic component 12 also has plug stifled 24 on end face 23, inside the perforate 26 that it is contained in element body 14 at least in part, and can clampingly be fixed by the contraction flow region 27 of element body 14 at least in part.
In element body 14 inside, the winding 28 being furnished with electrolyte and conductive film is set.Can be fixed on inside element body 14 at this winding 28 or not have floating ground to be regularly arranged on inside this element body.
The film of winding 28 and/or winding 28 electrically connects with two terminals 30.Terminal 30 often such as can be riveted with winding 28 also referred to as " blade ", to be engaged and/or other form electrically connects, such as soldering, welding, bonding.
One end of terminal 30 is arranged respectively and connects wire 32, it is each passed through the pilot hole 34 formed in plug stifled 24 and guides.Therefore connect the longitudinal length direction that wire 32 is parallel to element body on the end face 23 of element body 14 to stretch from element body.
In addition electronic component device 10 has two contact forks 36, and they are substantially orthogonal to support plate 16 in parallel to each other and stretch out.Contact fork 36 can be such as a part for circuit board and/or punch grid.Contact fork 36 electrically connects respectively and connects wire 32.One can be held inside housing for this reason between every two forks of contact fork 36 and connect wire 32, and such as by hot stack, welding, soldering and/or bonding be connected wire and be electrically connected.
The longitudinal length direction of element body 14 arranges the collar 38 at the outer surface of element body 14 end face or plug stifled 24 with contacting between fork 36.The collar 38 can cylindrically be formed, and wherein the bottom surface of the collar 38 can be less than or greater than the bottom surface of element body 14 and/or plug stifled 24.The collar 38 can be made up of elastomeric material, such as cork, elastomer and/or foam.
The collar 38 substantially cylindrical ground forms and has two through holes 40, and they can be parallel to each other and be parallel to the longitudinal length direction setting of element body 14.Guide respectively through through hole 40 and hold and connect wire 32.The through hole 40 of the collar 38 can be arranged with the pilot hole 34 of plug stifled 24 respectively alignedly, and being thus connected wire 32 can not bending or bending ground and/or guide through the collar 38 point-blank.Through hole 40 can have the cross section be shaped arbitrarily, such as circle, quadrangle, triangle, trapezoidal or polygon.
The circumference of pilot hole 34 is greater than at the circumference of this through hole 40.The circumference of through hole 40 is also much larger than the excircle connecting wire 32.As such as known in Fig. 1 D and seeing.Be thus connected wire 32 can stably guide through the pilot hole 34 of plug stifled 24 and/or fix, and the collar 38 can not damage the such as bending and/or bending of connection wire 32 ground, is inserted into connects on wire 32 when assembling electronic element device 10.Can design size or sizing like this at the circumference of this through hole 40 and/or diameter and/or cross section, make connection wire 32 can be contactless and/or without frictionally through through hole 40.The circumference of such as through hole 40 can be greater than with at least 5%, preferably at least 15% the excircle connecting wire 32.
Electronic component device 10 also has fixed body 42, utilizes its connection wire 32 to locate respectively and is reliably fixed on inside through hole 40.Thered is provided by deformation device 44 in the embodiment of fixed body 42 shown in Figure 1A to 1E, it is designed to, make the collar 38 He ./or the cross section of through hole 40 be out of shape like this by the extruding collar 38, make connection wire 32 locate reliably inside through hole 40 clampingly and/or force closure ground and/or fix at least partly positive.Deformation device 44 has extrusion ring 46 for this reason, it along the excircle of the collar 38 shell surface around the collar 38, as seen in Fig. 1 D and 1E.Shown in Fig. 1 D at extrusion ring 46 in order to be fixedly connected with extrusion ring 46 before wire 32 extrusion process and the collar 38, illustrate in fig. ie after corresponding extrusion process.Find out by accompanying drawing is clear, by the shell surface that is orthogonal to the collar 38 diametrically be orthogonal to be connected wire 32 longitudinal length side upwardly extrusion ring 46 cross section of through hole 40 is changed like this, be fixedly connected with wire with making it possible to force closure.
The assembling of electronic component device 10 can be performed as described below.In a first step the collar 38 and extrusion ring 46 are enclosed within and are connected on wire 32 and extrusion ring 46 can be out of shape.Element 12 can be inserted and/or is clamped on inside fixture 18 in a further step.Can selectively before this bonding agent 22 being coated on support plate 16, being especially additionally mechanically anchored in inside fixture 18 for making element 12.The adhesion substance of bonding agent 22 also can retaining collar 38 together, can advantageously prevent the collar 38 from sliding thus.If element 12 is assemblied on support plate 16, then can realize in a further step in contact fork 36 and the electrical connection be connected between wire 32.Contact fork 36 or its fork such as can push up and be pressed onto together and utilize hot stack and/or electric resistance welding and be connected wire 32 and fix and connect.The position of contact fork 36 can be spliced at this quite soft connection wire 32, make them can carry and/or bend in side thus.Act on the mean stress that the moment of flexure connected on wire 32 may produce machinery thus, that as above explains in detail is such.But 42 can make this mean stress can only until connect wire 32 and enter into the collar 38 and act on the collar 38 side of contact fork 36 by arrange according to the collar 38 of the present invention and connect fixing of wire 32, such as, and it is inner to be no longer delivered to element 12, on terminal 30.Especially terminal 30 can be made thus there is no mechanical stress, the vibration resistance of electronic component device 10 can be improved thus.
Fig. 2 illustrates the electronic component device 10 according to another embodiment of the present invention.If do not described in addition, this electronic component device 10 can have the feature identical with the electronic component device of Figure 1A to 1C.
The collar 38 has the stifled position 24a of plug and fixed position 25 in the embodiment shown in Figure 2.The stifled position 24a of plug and fixed position 25 can be formed integratedly at this.The stifled position 24a of plug is contained in inside the hole 26 of element body 14 at least in part, can save the plug stifled 24 shown in Figure 1A to 1C thus.
Pilot hole 34 is formed, it and through hole 40 centering formed in fixed position 25 in the stifled position 24a of plug.The circumference of pilot hole 34 can be greater than the circumference of through hole 40 at this.If it is enough stable to be connected wire 32 by pilot hole 34 and the connection wire 32. of through hole 40 difference guide element 12, the circumference of through hole 40 in fixed position 25 also as one man can be formed with the circumference of pilot hole 34.
The longitudinal length of the stifled position 24a of plug or length L1, it can be parallel to the longitudinal length direction of element body 14 and be parallel to the bearing of trend measurement connecting wire 32, longitudinal length or the length L2 of fixed position 25 can be less than, such as length L2 can than length L1 little at least 10%, and preferably at least 30%.In addition L2 can have the value at least doubling and connect wire 32 diameter.Can ensure thus, acting on the moment of flexure connected on wire 32 can eliminate when entering plug and blocking up position 24a.
Fig. 3 A and 3B illustrates a part for the electronic component device 10 according to the other embodiment of the present invention respectively.
In an illustrated embodiment by providing fixed body 42 with the through hole 40 of fixed substance cast 48 in the fixed position 25 of the collar 38.Fixed substance can be such as bonding agent, paint or cast material, makes connection wire 32 material be fixed in locking manner inside through hole 40 thus.
In the embodiment as shown in fig. 3 a, the circumferential weld that fixed substance is such as consisted of through hole 40 around connection wire 32 cast joins inside through hole 40 from the outer face of the collar 38.It is contemplated that alternatively or additionally, insert inside pin parts to through hole 40, be fixed on inside through hole 40 with making connection wire 32 position reliable grip thus.
Unlike this, the stifled position 24a of adjacent plug is provided with cast passage 50 inside fixed position 25 in the embodiment shown in figure 3b, and it substantially can be orthogonal to the longitudinal length direction connecting wire 32 and extend, and it can be connected with through hole 40.Through hole 40 can completely and reliably be poured into a mould by spraying into fixed substance by cast passage 50 or is full of thus.Also multiple cast passage like this can be provided with inside fixed position and/or the stifled position 24a of plug.
Finally will point out, term is not as " having ", " comprising " etc. got rid of other parts and term such as " " is not got rid of many.In addition will point out, the feature described by referring to above-described embodiment also can use with the further feature of other above-described embodiment in combination.Reference numeral is not considered as restriction in the claims.
Claims (12)
1. an electronic component device (10), has:
One electronic component (12), has element body (14) and at least one connection wire (32), and it stretches out from the side (23) of element body (14);
One contact fork (36), connects wire (32) in support plate (16) for electrically connecting; With
One collar (38), has through hole (40), holds wherein and connects wire (32), it is characterized in that,
The described collar (38) is arranged between contact fork (36) and element body (16),
The excircle of described connection wire (32) is much smaller than the circumference of through hole (40)
Fixed body (42) position is utilized reliably to fix with described connection wire (32) in through hole (40) the inside.
2. electronic component device (10) as claimed in claim 1, wherein, described electronic component (12) has plug stifled (24), it is contained in the inside, hole (26) of element body (14) at least in part and it has pilot hole (34), wire (32) is connected through its guiding, wherein, the circumference of described pilot hole (34) in plug stifled (24) is less than the circumference of through hole (40) in the collar (38).
3. electronic component device (10) as claimed in claim 1 or 2, wherein, the described collar (38) is made up of elastomeric material.
4. the electronic component device (10) according to any one of the claims, wherein, described electronic component (12) has at least two and connects wire (32), they are stretched from the same side of element body (14) (23) respectively, and the described collar (38) has two through holes (40), hold respectively wherein and connect wire (32).
5. the electronic component device (10) according to any one of the claims, wherein, the described collar (38) has the stifled position (24a) of plug, it is contained in perforate (26) the inside of element body (14) at least in part, wherein said connection wire (32) is through pilot hole (34) guiding at the stifled position (24a) of plug, and wherein, the described collar (38) has fixed position (25), arranges through hole (40) wherein and utilize fixed body (42) to locate reliably to be fixedly connected with wire (32).
6. electronic component device (10) as claimed in claim 5, wherein, the longitudinal length of described fixed position (25) is greater than the longitudinal length at the stifled position (24a) of plug.
7. the electronic component device (10) according to any one of the claims, wherein, the fixed body (42) of described connection wire (32) is provided by deformation device (44), this deformation device is designed to, the collar (38) and/or through hole (40) cross section are out of shape like this by the extruding collar (38), connection wire (32) are located and reliably clampingly fixes in through hole (40) the inside.
8. electronic component device (10) as claimed in claim 7, wherein, the described collar (38) is cylindrically formed, and the wherein said collar (38) can pass through deformation device (44) distortion diametrically.
9. as claimed in claim 7 or 8 electronic component device (10), wherein, the described collar (38) is cylindrically formed, and wherein said deformation device (44) be made up of extrusion ring (46) and the described collar (38) along excircle around.
10. the electronic component device (10) according to any one of the claims, wherein, the fixed body (42) of described connection wire (32), by providing with fixed substance spray (48) through hole (40), makes connection wire (32) material be fixed on through hole (40) the inside in locking manner thus.
11. electronic component devices (10) according to any one of the claims, wherein, the fixed body (42) of described connection wire (32) is provided by pin parts, and it can be inserted into through hole (40) the inside, is fixed on through hole (40) the inside with making connection wire (32) force closure thus.
12. electronic component devices (10) according to any one of the claims, wherein, described electronic component (12) is electrolytic capacitor.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102014217573.9A DE102014217573A1 (en) | 2014-09-03 | 2014-09-03 | Vibration-proof electronic component assembly |
| DE102014217573.9 | 2014-09-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105390289A true CN105390289A (en) | 2016-03-09 |
| CN105390289B CN105390289B (en) | 2019-10-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510553921.5A Active CN105390289B (en) | 2014-09-03 | 2015-09-02 | The electronic component device of antivibration |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105390289B (en) |
| DE (1) | DE102014217573A1 (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001307957A (en) * | 2000-04-25 | 2001-11-02 | Elna Co Ltd | Surface mounting type solid electrolytic capacitor and manufacturing method |
| CN1617271A (en) * | 2003-11-14 | 2005-05-18 | 三星电机株式会社 | Solid electrolytic capacitor and manufacturing method thereof |
| CN101345135A (en) * | 2007-07-12 | 2009-01-14 | 四川东盛电子科技有限公司 | Liquid tantalum electrolytic capacitor and manufacturing method thereof |
| CN101350253A (en) * | 2008-09-17 | 2009-01-21 | 中国振华（集团）新云电子元器件有限责任公司 | Solid electrolyte capacitor with ultra-low equivalent series resistance and manufacturing method thereof |
| CN103377830A (en) * | 2012-04-11 | 2013-10-30 | Avx公司 | Solid electrolytic capacitor with enhanced mechanical stability under extreme conditions |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011004142A1 (en) | 2011-02-15 | 2012-08-16 | Robert Bosch Gmbh | Gas sealing structure for electronic component of e.g. stepped automatic transmission of vehicle, has thin walled gasket which is provided at front end and provided with gas diffusion region |
-
2014
- 2014-09-03 DE DE102014217573.9A patent/DE102014217573A1/en not_active Withdrawn
-
2015
- 2015-09-02 CN CN201510553921.5A patent/CN105390289B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001307957A (en) * | 2000-04-25 | 2001-11-02 | Elna Co Ltd | Surface mounting type solid electrolytic capacitor and manufacturing method |
| CN1617271A (en) * | 2003-11-14 | 2005-05-18 | 三星电机株式会社 | Solid electrolytic capacitor and manufacturing method thereof |
| CN101345135A (en) * | 2007-07-12 | 2009-01-14 | 四川东盛电子科技有限公司 | Liquid tantalum electrolytic capacitor and manufacturing method thereof |
| CN101350253A (en) * | 2008-09-17 | 2009-01-21 | 中国振华（集团）新云电子元器件有限责任公司 | Solid electrolyte capacitor with ultra-low equivalent series resistance and manufacturing method thereof |
| CN103377830A (en) * | 2012-04-11 | 2013-10-30 | Avx公司 | Solid electrolytic capacitor with enhanced mechanical stability under extreme conditions |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102014217573A1 (en) | 2016-03-03 |
| CN105390289B (en) | 2019-10-25 |
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