JP5729366B2 - Electronic equipment - Google Patents

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Publication number
JP5729366B2
JP5729366B2 JP2012234980A JP2012234980A JP5729366B2 JP 5729366 B2 JP5729366 B2 JP 5729366B2 JP 2012234980 A JP2012234980 A JP 2012234980A JP 2012234980 A JP2012234980 A JP 2012234980A JP 5729366 B2 JP5729366 B2 JP 5729366B2
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Prior art keywords
housing
terminal
substrate
contact
electrode
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JP2012234980A
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JP2014086317A (en
Inventor
神谷　隆志
隆志 神谷
卓 飯田
卓 飯田
渡辺　裕司
裕司 渡辺
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Denso Corp
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Denso Corp
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Priority to JP2012234980A priority Critical patent/JP5729366B2/en
Priority to DE102013220543.0A priority patent/DE102013220543B4/en
Publication of JP2014086317A publication Critical patent/JP2014086317A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/061—Hermetically-sealed casings sealed by a gasket held between a removable cover and a body, e.g. O-ring, packing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/82—Coupling devices connected with low or zero insertion force
    • H01R12/83—Coupling devices connected with low or zero insertion force connected with pivoting of printed circuits or like after insertion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H01R13/506—Bases; Cases composed of different pieces assembled by snap action of the parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0039—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a tubular housing wherein the PCB is inserted longitudinally
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
    • H01R13/5202—Sealing means between parts of housing or between housing part and a wall, e.g. sealing rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/26—Connectors or connections adapted for particular applications for vehicles

Description

本発明は、両面に電極を有する基板と、基板を収容する筐体と、基板と外部機器とを電気的に接続するコネクタと、コネクタのハウジングと筺体との間に配置される防水部材と、を備える電子装置に関する。特に、基板の電極へコネクタの端子が接触することで、電極と端子が電気的に接続される電子装置に関するものである。   The present invention includes a substrate having electrodes on both sides, a housing that accommodates the substrate, a connector that electrically connects the substrate and an external device, a waterproof member that is disposed between the housing and the housing of the connector, The present invention relates to an electronic device comprising: In particular, the present invention relates to an electronic device in which an electrode and a terminal are electrically connected by contacting a terminal of a connector to an electrode of a substrate.

従来、両面に電極を有する基板と、基板を収容する筐体と、基板と外部機器とを電気的に接続するコネクタと、筐体とコネクタのハウジングとの間に配置される防水部材と、を備える電子装置が知られている。   Conventionally, a substrate having electrodes on both sides, a housing that accommodates the substrate, a connector that electrically connects the substrate and an external device, and a waterproof member that is disposed between the housing and the housing of the connector, Electronic devices are known.

一方、基板の電極とコネクタの端子との電気的な接続構造として、例えば特許文献１に示される接続構造が知られている。これによれば、端子のばね力（ばね変形による反力）により端子が電極に接触し、電極と端子が電気的に接続される。したがって、端子を電極にはんだ付けしなくとも良い。   On the other hand, as an electrical connection structure between an electrode on a substrate and a terminal of a connector, for example, a connection structure shown in Patent Document 1 is known. According to this, a terminal contacts an electrode with the spring force (reaction force by spring deformation) of a terminal, and an electrode and a terminal are electrically connected. Therefore, it is not necessary to solder the terminal to the electrode.

特開２００３−１７８８３４号公報JP 2003-178834 A

特許文献１に記載の接続構造では、基板をカードエッジコネクタに挿入する際、又は、カードエッジコネクタから基板を引き抜く際に、基板のエッジなどに端子の接点部が接触し、端子表面のメッキ層が剥がれるなど端子が損傷したり、変形したりする虞がある。また、剥がれたメッキ屑などにより短絡が生じる虞がある。すなわち、電気的な接続信頼性が低下する虞がある。   In the connection structure described in Patent Document 1, when the board is inserted into the card edge connector or when the board is pulled out from the card edge connector, the contact portion of the terminal comes into contact with the edge of the board, and the plated layer on the terminal surface The terminal may be damaged or deformed, such as peeling off. Moreover, there is a possibility that a short circuit may occur due to the plating scraps peeled off. That is, the electrical connection reliability may be reduced.

本発明は上記問題点に鑑み、コネクタのハウジングと筺体との間の水密を確保しつつ、接続信頼性の低下を抑制することのできる電子装置を提供することを目的とする。   In view of the above problems, an object of the present invention is to provide an electronic device capable of suppressing a decrease in connection reliability while ensuring watertightness between a housing and a housing of a connector.

上記目的を達成するために、開示された発明のひとつは、両面（２０ａ，２０ｂ）に電極（２１）を有する基板（２０）と、開口部（３１）を有し、基板（２０）を収容する袋形状の筐体（３０）と、合成樹脂材料を用いて形成されたハウジング（４１）と、導電材料を用いて形成されるとともにハウジング（４１）に保持され、ハウジング（４１）から基板（２０）が収容された筐体（３０）の内部空間（３２）に突出する基板接続部（４３）、及び、ハウジング（４１）から内部空間（３２）と反対の嵌合空間（５３）に突出する外部接続部（４４）を備える複数の端子（４２）と、有するコネクタ（４０）と、筐体（３０）とハウジング（４１）との間に配置され、筐体（３０）とハウジング（４１）との間から内部空間（３２）に水分が侵入するのを抑制する防水部材（７０）と、を備え、電極（２１）は、基板の一面（２０ａ）に配置された複数の第１電極（２１ａ）と、一面（２０ａ）と反対の裏面（２０ｂ）に配置された複数の第２電極（２１ｂ）と、を有し、複数の端子（４２）は、第１電極（２１ａ）に接触する複数の第１端子（４２ａ）と、第２電極（２１ｂ）に接触する複数の第２端子（４２ｂ）と、を有し、基板（２０）の両面（２０ａ，２０ｂ）において電極（２１）に端子（４２）が接触することで、電極（２１）と端子（４２）とが電気的に接続されるとともに、第１端子（４２ａ）と第２端子（４２ｂ）の間に基板（２０）が保持され、ハウジング（４１）は、少なくとも一部が筐体（３０）の内面（３０ａ）全周に沿って配置される筒状部（４８）と、該筒状部（４８）における内部空間（３２）側の端部から延設され、筐体（３０）に収容される延設部（４９）と、延設部（４９）の内面から突出する第１壁部（５０）と、を有する第１ハウジング部（４６）と、第１ハウジング部（４６）に対して基板（２０）の板厚方向に組み付けられ、第１ハウジング部（４６）とともにハウジング（４１）をなすものであって、組み付けた状態で延設部（４９）とともに筒状部（４８）に連なる筒をなし、筐体（３０）に収容される基部（５１）と、基部（５１）の内面から突出する第２壁部（５２）と、を有する第２ハウジング部（４７）と、を有し、第１壁部（５０）及び第２壁部（５２）により、内部空間（３２）と嵌合空間（５３）とが区画され、第１壁部（５０）に第１端子（４２ａ）が保持されるとともに、第２壁部（５２）に第２端子（４２ｂ）が保持されて、複数の端子（４２）の外部接続部（４４）が、ハウジング（４１）における嵌合空間（５３）側の共通の筒内に配置され、防水部材（７０）は、筒状部（４８）と筐体（３０）との間に介在されることを特徴とする。 In order to achieve the above object, one of the disclosed inventions includes a substrate (20) having electrodes (21) on both sides (20a, 20b), an opening (31), and accommodates the substrate (20). A bag-shaped housing (30), a housing (41) formed using a synthetic resin material, a conductive material, and held by the housing (41). 20) protrudes into the internal space (32) of the housing (30) in which the housing 20 is accommodated, and protrudes from the housing (41) into the fitting space (53) opposite to the internal space (32). A plurality of terminals (42) each having an external connection portion (44), a connector (40), a housing (30), and a housing (41) disposed between the housing (30) and the housing (41). ) To the internal space (32) And a waterproof member (70) that suppresses the intrusion, and the electrode (21) has a plurality of first electrodes (21a) disposed on one surface (20a) of the substrate and is opposite to the one surface (20a). A plurality of second electrodes (21b) disposed on the back surface (20b), and the plurality of terminals (42) includes a plurality of first terminals (42a) contacting the first electrode (21a), A plurality of second terminals (42b) in contact with the two electrodes (21b), and the terminals (42) are in contact with the electrodes (21) on both surfaces (20a, 20b) of the substrate (20), so that the electrodes (21) and the terminal (42) are electrically connected, the substrate (20) is held between the first terminal (42a) and the second terminal (42b), and the housing (41) has at least one The cylindrical portion (4) is disposed along the entire circumference of the inner surface (30a) of the housing (30). A) is extended from an end portion of the inner space (32) side of the cylindrical portion (48), and extended portion (49) which is accommodated in the housing (30), the inner surface of the extended portion (49) A first housing part (46) having a first wall part (50) projecting from the first housing part (46) and being assembled to the first housing part (46) in the plate thickness direction of the substrate (20). 46) together be one to name a housing (41), a tubular connecting to the tubular portion (48) together with the extended portion (49) in a state in which the assembled base portion accommodated in the housing (30) (51 ) And a second housing part (47) having a second wall part (52) protruding from the inner surface of the base part (51) , and the first wall part (50) and the second wall part (52). ) Divides the internal space (32) and the fitting space (53), and the first wall (50) has a first terminal (42). a) is held, the second wall (52) is held by the second terminal (42b) , and the external connection portions (44) of the plurality of terminals (42) are fitted in the housing (41). The waterproof member (70) is disposed in the common tube on the (53) side, and is interposed between the tubular portion (48) and the housing (30).

本発明では、ハウジング（４１）を第１ハウジング部（４６）と第２ハウジング部（４７）に分割し、板厚方向に組み付けることでハウジング（４１）をなす構造とした。また、第１ハウジング部（４６）に第１端子（４２ａ）を設け、第２ハウジング部（４７）に第２端子（４２ｂ）を設けたので、板厚方向に組み付けてハウジング（４１）を形成するとともに、板厚方向から、第１端子（４２ａ）を第１電極（２１ａ）に接触させ、第２端子（４２ｂ）を第２電極（２１ｂ）に接触させることができる。したがって、端子（４２）の損傷や変形などを抑制し、ひいては接続信頼性の低下を抑制することができる。また、第１ハウジング部（４６）は、袋形状をなす筐体（３０）の内面（３０ａ）と開口部（３１）の周方向全周にわたって対向する筒状部（４８）を有しており、筒状部（４８）と筐体（３０）の間に防水部材（７０）を介在させる。したがって、ハウジング（４１）と筐体（３０）との間の水密を確保することができる。 In the present invention, the housing (41) is divided into the first housing part (46) and the second housing part (47) and assembled in the plate thickness direction to form the housing (41). Further, since the first terminal (42a) is provided in the first housing part (46) and the second terminal (42b) is provided in the second housing part (47), the housing (41) is formed by assembling in the plate thickness direction. In addition, from the thickness direction, the first terminal (42a) can be brought into contact with the first electrode (21a), and the second terminal (42b) can be brought into contact with the second electrode (21b). Therefore, damage or deformation of the terminal (42) can be suppressed, and as a result, a decrease in connection reliability can be suppressed. The first housing part (46) has a cylindrical part (48) facing the inner surface (30a) of the bag-shaped housing (30) and the entire circumference in the circumferential direction of the opening part (31). The waterproof member (70) is interposed between the tubular portion (48) and the housing (30). Therefore, watertightness between the housing (41) and the housing (30) can be ensured.

開示された他の発明のひとつは、コネクタ（４０）が、少なくとも第１ハウジング部（４６）と第２ハウジング部（４７）を組み付ける前の状態で、第１ハウジング部（４６）及び第２ハウジング部（４７）の一方における所定位置に基板（２０）を保持する保持部（５７）を有することを特徴とする。これによれば、保持部（５７）により、第１ハウジング部（４６）及び第２ハウジング部（４７）の一方に基板（２０）を保持した状態で第１ハウジング部（４６）と第２ハウジング部（４７）を組み付けるため、ハウジング（４１）を形成しつつ、端子（４２）と電極（２１）との電気的な接続構造を形成しやすくなる。また、ハウジング（４１）に対する基板（２０）の位置精度を向上することができるため、端子（４２）が対応する電極（２１）に対してより確実に接触することとなり、これによっても接続信頼性の低下を抑制することができる。In another disclosed invention, the connector (40) is in a state before at least the first housing part (46) and the second housing part (47) are assembled, and the first housing part (46) and the second housing. It has the holding part (57) which hold | maintains a board | substrate (20) in the predetermined position in one side of a part (47), It is characterized by the above-mentioned. According to this, the first housing part (46) and the second housing with the holding part (57) holding the substrate (20) on one of the first housing part (46) and the second housing part (47). Since the portion (47) is assembled, it is easy to form an electrical connection structure between the terminal (42) and the electrode (21) while forming the housing (41). Moreover, since the positional accuracy of the board | substrate (20) with respect to a housing (41) can be improved, a terminal (42) will contact more reliably with respect to a corresponding electrode (21), and connection reliability also by this. Can be suppressed.

上記目的を達成するために、開示された他の発明のひとつは、両面（２０ａ，２０ｂ）に電極（２１）を有する基板（２０）と、開口部（３１）を有し、基板（２０）を収容する袋形状の筐体（３０）と、合成樹脂材料を用いて形成されたハウジング（４１）と、導電材料を用いて形成されるとともにハウジング（４１）に保持され、ハウジング（４１）から基板（２０）が収容された筐体（３０）の内部空間（３２）に突出する基板接続部（４３）、及び、ハウジング（４１）から内部空間（３２）と反対の外部（５３）に突出する外部接続部（４４）を備える複数の端子（４２）と、有するコネクタ（４０）と、筐体（３０）とハウジング（４１）との間に配置され、筐体（３０）とハウジング（４１）との間から内部空間（３２）に水分が侵入するのを抑制する防水部材（７０）と、を備え、電極（２１）は、基板の一面（２０ａ）に配置された複数の第１電極（２１ａ）と、一面（２０ａ）と反対の裏面（２０ｂ）に配置された複数の第２電極（２１ｂ）と、を有し、端子（４２）は、第１電極（２１ａ）に接触する複数の第１端子（４２ａ）と、第２電極（２１ｂ）に接触する複数の第２端子（４２ｂ）と、を有し、基板（２０）の両面（２０ａ，２０ｂ）において電極（２１）に端子（４２）が接触することで、電極（２１）と端子（４２）とが電気的に接続されるとともに、第１端子（４２ａ）と第２端子（４２ｂ）の間に前記基板（２０）が保持され、ハウジング（４１）は、少なくとも一部が筐体（３０）の内面（３０ａ）全周に沿って配置される筒状部（４８）と、該筒状部（４８）における内部空間（３２）側の端部から延設され、筐体（３０）に収容される延設部（４９）と、を有する第１ハウジング部（４６）と、第１ハウジング部（４６）に対して基板（２０）の板厚方向に組み付けられ、第１ハウジング部（４６）とともにハウジング（４１）をなす第２ハウジング部（４７）と、を有し、第１ハウジング部（４６）に第１端子（４２ａ）が保持されるとともに、第２ハウジング部（４７）に第２端子（４２ｂ）が保持されており、防水部材（７０）は、筒状部（４８）と筐体（３０）との間に介在され、コネクタ（４０）は、少なくとも第１ハウジング部（４６）と第２ハウジング部（４７）を組み付ける前の状態で、第１ハウジング部（４６）及び第２ハウジング部（４７）の一方における所定位置に基板（２０）を保持する保持部（５７）を有することを特徴とする。In order to achieve the above object, another disclosed invention includes a substrate (20) having electrodes (21) on both sides (20a, 20b), an opening (31), and a substrate (20). A bag-shaped housing (30) for housing the housing, a housing (41) formed using a synthetic resin material, and formed using a conductive material and held by the housing (41), from the housing (41) A board connection part (43) projecting into the internal space (32) of the housing (30) in which the board (20) is accommodated, and a housing (41) projecting to the outside (53) opposite to the internal space (32) A plurality of terminals (42) each having an external connection portion (44), a connector (40), a housing (30), and a housing (41) disposed between the housing (30) and the housing (41). ) To the internal space (32) And a waterproof member (70) that suppresses the intrusion, and the electrode (21) has a plurality of first electrodes (21a) disposed on one surface (20a) of the substrate and is opposite to the one surface (20a). A plurality of second electrodes (21b) disposed on the back surface (20b), and the terminal (42) has a plurality of first terminals (42a) in contact with the first electrode (21a) and a second electrode. A plurality of second terminals (42b) in contact with (21b), and the terminals (42) are in contact with the electrodes (21) on both surfaces (20a, 20b) of the substrate (20), whereby the electrodes (21 And the terminal (42) are electrically connected, the substrate (20) is held between the first terminal (42a) and the second terminal (42b), and the housing (41) is at least partially Is disposed along the entire inner surface (30a) of the casing (30). And a first housing part (46) having an extension part (49) extending from an end of the cylindrical part (48) on the inner space (32) side and housed in the housing (30). And a second housing part (47) assembled to the first housing part (46) in the thickness direction of the substrate (20) and forming the housing (41) together with the first housing part (46). The first housing part (46) holds the first terminal (42a), the second housing part (47) holds the second terminal (42b), and the waterproof member (70) is cylindrical. The connector (40) is interposed between the portion (48) and the housing (30), and the connector (40) is at least in a state before the first housing portion (46) and the second housing portion (47) are assembled. (46) and one of the second housing parts (47) And a holding portion (57) for holding the substrate (20) at a predetermined position.

これによれば、上記したように、板厚方向に組み付けてハウジング（４１）を形成するとともに、板厚方向から、第１端子（４２ａ）を第１電極（２１ａ）に接触させ、第２端子（４２ｂ）を第２電極（２１ｂ）に接触させることができる。また、筒状部（４８）と筐体（３０）の間に防水部材（７０）を介在させるため、ハウジング（４１）と筐体（３０）との間の水密を確保することができる。さらに、保持部（５７）により、第１ハウジング部（４６）及び第２ハウジング部（４７）の一方に基板（２０）を保持した状態で第１ハウジング部（４６）と第２ハウジング部（４７）を組み付けるため、ハウジング（４１）を形成しつつ、端子（４２）と電極（２１）との電気的な接続構造を形成しやすくなる。また、ハウジング（４１）に対する基板（２０）の位置精度を向上することができるため、端子（４２）が対応する電極（２１）に対してより確実に接触することとなり、これによっても接続信頼性の低下を抑制することができる。According to this, as described above, the housing (41) is formed by assembling in the plate thickness direction, and from the plate thickness direction, the first terminal (42a) is brought into contact with the first electrode (21a) to thereby form the second terminal. (42b) can be brought into contact with the second electrode (21b). Moreover, since the waterproof member (70) is interposed between the cylindrical part (48) and the housing (30), watertightness between the housing (41) and the housing (30) can be ensured. Furthermore, the first housing part (46) and the second housing part (47) are held by the holding part (57) while the substrate (20) is held on one of the first housing part (46) and the second housing part (47). ), It is easy to form an electrical connection structure between the terminal (42) and the electrode (21) while forming the housing (41). Moreover, since the positional accuracy of the board | substrate (20) with respect to a housing (41) can be improved, a terminal (42) will contact more reliably with respect to a corresponding electrode (21), and connection reliability also by this. Can be suppressed.

開示された他の発明のひとつは、保持部（５７）は、第１ハウジング部（４６）及び第２ハウジング部（４７）の一方に設けられた係止部（５７ａ）と、該係止部（５７ａ）を有するハウジング部に保持された端子（４２）により構成されるとともに、端子（４２）のばね力により、係止部（５７ａ）と端子（４２）の間で基板（２０）を挟持し、第１ハウジング部（４６）と第２ハウジング部（４７）を組み付けた状態で、係止部（５７ａ）は、基板（２０）に対して離間されることを特徴とする。これによれば、端子（４２）のばね力を利用するため、ねじ締結や接着に較べて、保持部（５７）の構成を簡素化することができる。また、製造工程を簡素化することができる。また、第１ハウジング部（４６）と第２ハウジング部（４７）を組み付けた状態で、係止部（５７ａ）は基板（２０）に非接触となるため、第１端子（４２ａ）と第２端子（４２ｂ）で接圧（接触荷重）が異なるのを抑制することができる。これにより、接続信頼性の低下を抑制することができる。 In another disclosed invention, the holding portion (57) includes a locking portion (57a) provided on one of the first housing portion (46) and the second housing portion (47), and the locking portion. The terminal (42) is held by the housing part having (57a), and the substrate (20) is held between the locking part (57a) and the terminal (42) by the spring force of the terminal (42). In the state where the first housing part (46) and the second housing part (47) are assembled, the locking part (57a) is separated from the substrate (20) . According to this, since the spring force of the terminal (42) is used, the configuration of the holding portion (57) can be simplified as compared with screw fastening or adhesion. In addition, the manufacturing process can be simplified. In addition, in the state where the first housing part (46) and the second housing part (47) are assembled, the locking part (57a) is not in contact with the substrate (20), so the first terminal (42a) and the second terminal It is possible to suppress a difference in contact pressure (contact load) between the terminals (42b). Thereby, the fall of connection reliability can be suppressed.

開示された他の発明のひとつは、第１ハウジング部（４６）と第２ハウジング部（４７）との分割面（４６ａ，４７ａ）は、全周で隙間なく合わさり、ハウジング（４１）は、内部空間（３２）を蓋することを特徴とする。これによれば、ハウジング（４１）の分割構造を採用しながらも、外部コネクタが接続される前の状態において、内部空間（３２）に異物が侵入するのを抑制することができる。 One of the other inventions disclosed is that the dividing surfaces (46a, 47a) of the first housing part (46) and the second housing part (47) are joined together without any gaps on the entire circumference, and the housing (41) The space (32) is covered. According to this, while adopting the divided structure of the housing (41), it is possible to prevent foreign matter from entering the internal space (32) in a state before the external connector is connected.

開示された他の発明のひとつは、基板接続部（４３）が、電極（２１）に接触する接点部（４３ａ）と、該接点部（４３ａ）よりも先端側の部分である先端部（４３ｂ）と、端子（４２）におけるハウジング（４１）に保持された圧入部（４５）と接点部（４３ａ）とを繋ぐ繋ぎ部（４３ｃ）と、を有し、複数の端子（４２）は、板厚方向に直交する第１方向に沿って配置されており、接点部（４３ａ）は、板厚方向及び第１方向の両方向に直交する第２方向において、圧入部（４５）と異なる位置とされるとともに、板厚方向において、圧入部（４５）よりも基板（２０）に近い位置とされ、繋ぎ部（４３ｃ）の接点部（４３ａ）から少なくとも一部と基板（２０）の一面（２０ａ）又は裏面（２０ｂ）とのなす角は鋭角とされ、先端部（４３ｂ）は、少なくとも第１ハウジング部（４６）と第２ハウジング部（４７）を組み付ける前の状態で、保持されているハウジング部に対して離間することを特徴とする。これによれば、組み付け前の状態で先端部（４３ｂ）がフリーであるため、組み付けにより基板接続部（４３）が板厚方向に撓むと、接点部（４３ａ）は基板（２０）の表面に接触しつつ第２方向へスライドする。したがって、接点部（４３ａ）及び電極（２１）表面をワイピングし、表面の酸化物層を除去することができる。One of the other disclosed inventions is that the board connecting portion (43) has a contact portion (43a) in contact with the electrode (21) and a tip portion (43b) that is a portion on the tip side of the contact portion (43a). ) And a connecting portion (43c) that connects the press-fitting portion (45) held by the housing (41) in the terminal (42) and the contact portion (43a), and the plurality of terminals (42) The contact portion (43a) is disposed along a first direction orthogonal to the thickness direction, and the contact portion (43a) is located at a position different from the press-fit portion (45) in the second direction orthogonal to both the plate thickness direction and the first direction. In addition, in the plate thickness direction, the position is closer to the substrate (20) than the press-fitting portion (45), and at least part of the contact portion (43a) of the connecting portion (43c) and one surface (20a) of the substrate (20). Alternatively, the angle formed with the back surface (20b) is an acute angle, and the tip ( 3b), characterized in that spaced in a state before assembling at least a first housing portion (46) and the second housing portion (47), the housing portion being held. According to this, since the tip part (43b) is free in the state before assembly, when the board connection part (43) is bent in the plate thickness direction by assembly, the contact part (43a) is placed on the surface of the board (20). Slide in the second direction while touching. Therefore, the contact portion (43a) and the surface of the electrode (21) can be wiped and the oxide layer on the surface can be removed.

上記目的を達成するために、開示された他の発明のひとつは、両面（２０ａ，２０ｂ）に電極（２１）を有する基板（２０）と、開口部（３１）を有し、基板（２０）を収容する袋形状の筐体（３０）と、合成樹脂材料を用いて形成されたハウジング（４１）と、導電材料を用いて形成されるとともにハウジング（４１）に保持され、ハウジング（４１）から基板（２０）が収容された筐体（３０）の内部空間（３２）に突出する基板接続部（４３）、及び、ハウジング（４１）から内部空間（３２）と反対の外部（５３）に突出する外部接続部（４４）を備える複数の端子（４２）と、有するコネクタ（４０）と、筐体（３０）とハウジング（４１）との間に配置され、筐体（３０）とハウジング（４１）との間から内部空間（３２）に水分が侵入するのを抑制する防水部材（７０）と、を備え、電極（２１）は、基板の一面（２０ａ）に配置された複数の第１電極（２１ａ）と、一面（２０ａ）と反対の裏面（２０ｂ）に配置された複数の第２電極（２１ｂ）と、を有し、端子（４２）は、第１電極（２１ａ）に接触する複数の第１端子（４２ａ）と、第２電極（２１ｂ）に接触する複数の第２端子（４２ｂ）と、を有し、基板（２０）の両面（２０ａ，２０ｂ）において電極（２１）に端子（４２）が接触することで、電極（２１）と端子（４２）とが電気的に接続されるとともに、第１端子（４２ａ）と第２端子（４２ｂ）の間に前記基板（２０）が保持され、ハウジング（４１）は、少なくとも一部が筐体（３０）の内面（３０ａ）全周に沿って配置される筒状部（４８）と、該筒状部（４８）における内部空間（３２）側の端部から延設され、筐体（３０）に収容される延設部（４９）と、を有する第１ハウジング部（４６）と、第１ハウジング部（４６）に対して基板（２０）の板厚方向に組み付けられ、第１ハウジング部（４６）とともにハウジング（４１）をなす第２ハウジング部（４７）と、を有し、第１ハウジング部（４６）に第１端子（４２ａ）が保持されるとともに、第２ハウジング部（４７）に第２端子（４２ｂ）が保持されており、防水部材（７０）は、筒状部（４８）と筐体（３０）との間に介在され、筐体（３０）は、開口部（３１）から所定範囲の部分であり、開口面積の大きい拡径部（３３）と、該拡径部（３３）よりも開口面積の小さい縮径部（３４）と、拡径部（３３）と縮径部（３４）を繋ぐテーパ部（３５）と、を有し、第１ハウジング部（４６）と第２ハウジング部（４７）は、それぞれテーパ部（３５）に接触して組み付けられることを特徴とする。In order to achieve the above object, another disclosed invention includes a substrate (20) having electrodes (21) on both sides (20a, 20b), an opening (31), and a substrate (20). A bag-shaped housing (30) for housing the housing, a housing (41) formed using a synthetic resin material, and formed using a conductive material and held by the housing (41), from the housing (41) A board connection part (43) projecting into the internal space (32) of the housing (30) in which the board (20) is accommodated, and a housing (41) projecting to the outside (53) opposite to the internal space (32) A plurality of terminals (42) each having an external connection portion (44), a connector (40), a housing (30), and a housing (41) disposed between the housing (30) and the housing (41). ) To the internal space (32) And a waterproof member (70) that suppresses the intrusion, and the electrode (21) has a plurality of first electrodes (21a) disposed on one surface (20a) of the substrate and is opposite to the one surface (20a). A plurality of second electrodes (21b) disposed on the back surface (20b), and the terminal (42) has a plurality of first terminals (42a) in contact with the first electrode (21a) and a second electrode. A plurality of second terminals (42b) in contact with (21b), and the terminals (42) are in contact with the electrodes (21) on both surfaces (20a, 20b) of the substrate (20), whereby the electrodes (21 And the terminal (42) are electrically connected, the substrate (20) is held between the first terminal (42a) and the second terminal (42b), and the housing (41) is at least partially Is disposed along the entire inner surface (30a) of the casing (30). And a first housing part (46) having an extension part (49) extending from an end of the cylindrical part (48) on the inner space (32) side and housed in the housing (30). And a second housing part (47) assembled to the first housing part (46) in the thickness direction of the substrate (20) and forming the housing (41) together with the first housing part (46). The first housing part (46) holds the first terminal (42a), the second housing part (47) holds the second terminal (42b), and the waterproof member (70) is cylindrical. Interposed between the portion (48) and the housing (30), and the housing (30) is a portion within a predetermined range from the opening (31), and has a large-diameter portion (33) having a large opening area, A reduced diameter portion (34) having a smaller opening area than the enlarged diameter portion (33), and the enlarged diameter portion (33) and the reduced diameter. A taper part (35) connecting the parts (34), and the first housing part (46) and the second housing part (47) are assembled in contact with the taper part (35), respectively. To do.

これによれば、上記したように、板厚方向に組み付けてハウジング（４１）を形成するとともに、板厚方向から、第１端子（４２ａ）を第１電極（２１ａ）に接触させ、第２端子（４２ｂ）を第２電極（２１ｂ）に接触させることができる。また、筒状部（４８）と筐体（３０）の間に防水部材（７０）を介在させるため、ハウジング（４１）と筐体（３０）との間の水密を確保することができる。さらには、筐体（３０）を利用した第１ハウジング部（４６）と第２ハウジング部（４７）の組み付け構造を採用しても、別部品を不要とすることができるので、構成を簡素化することができる。 According to this, as described above, the housing (41) is formed by assembling in the plate thickness direction, and from the plate thickness direction, the first terminal (42a) is brought into contact with the first electrode (21a) to thereby form the second terminal. (42b) can be brought into contact with the second electrode (21b). Moreover, since the waterproof member (70) is interposed between the cylindrical part (48) and the housing (30), watertightness between the housing (41) and the housing (30) can be ensured. Furthermore, even if the assembly structure of the first housing part (46) and the second housing part (47) using the housing (30) is adopted, a separate part can be dispensed with, thus simplifying the configuration. can do.

第１実施形態に係る電子装置の概略構成を示す断面図である。It is sectional drawing which shows schematic structure of the electronic device which concerns on 1st Embodiment. 電子装置のうち、コネクタと基板を示す斜視図である。図１は図２のI-I線に相当する断面である。It is a perspective view which shows a connector and a board | substrate among electronic devices. FIG. 1 is a cross-sectional view corresponding to the line II in FIG. コネクタを示す斜視図である。It is a perspective view which shows a connector. コネクタのうち、第１端子を含む第１ハウジング部を示す斜視図である。It is a perspective view which shows the 1st housing part containing a 1st terminal among connectors. 端子の接点部とスナップフィットの形成位置との関係を示す図である。It is a figure which shows the relationship between the contact part of a terminal, and the formation position of snap fit. 電子装置の製造方法を示す断面図であり、コネクタ組み付け工程を示す。It is sectional drawing which shows the manufacturing method of an electronic device, and shows a connector assembly | attachment process. 電子装置の製造方法を示す断面図であり、筐体組み付け工程を示す。It is sectional drawing which shows the manufacturing method of an electronic device, and shows a housing | casing assembly | attachment process. コネクタ組み付け工程において、ワイピングを説明する図である。It is a figure explaining wiping in a connector assembly process. コネクタ組み付け工程において、ワイピングを説明する図である。It is a figure explaining wiping in a connector assembly process. 第１変形例を示す断面図である。It is sectional drawing which shows a 1st modification. 第２実施形態に係る電子装置において、基板が第１ハウジング部に保持された状態を示す斜視図である。FIG. 11 is a perspective view showing a state where a substrate is held by a first housing part in an electronic device according to a second embodiment. 図１１に破線で示すXII領域を拡大した図である。It is the figure which expanded the XII area | region shown with a broken line in FIG. 基板の保持状態を示す断面図である。It is sectional drawing which shows the holding | maintenance state of a board | substrate. コネクタ組み付け工程が完了した状態を示す断面図である。It is sectional drawing which shows the state which the connector assembly process was completed. 第２変形例を示す断面図である。It is sectional drawing which shows a 2nd modification. 第３実施形態に係る電子装置の概略構成を示す断面図である。It is sectional drawing which shows schematic structure of the electronic device which concerns on 3rd Embodiment. 図１６に破線で示すXVII領域を拡大した図である。It is the figure which expanded the XVII area | region shown with a broken line in FIG. 第４実施形態に係る電子装置において、電極に対する接点部の位置を示す平面図である。In the electronic device which concerns on 4th Embodiment, it is a top view which shows the position of the contact part with respect to an electrode. 図１８のXIX-XIX線に沿う断面図である。It is sectional drawing which follows the XIX-XIX line | wire of FIG. 図１８のXX-XX線に沿う断面図である。It is sectional drawing which follows the XX-XX line of FIG. 第３変形例を示す平面図である。It is a top view which shows a 3rd modification. 第５実施形態に係る電子装置うち、第２ハウジング部を示す斜視図である。It is a perspective view which shows the 2nd housing part among the electronic devices which concern on 5th Embodiment. 図２２に破線で示すXXIII領域を拡大した図である。It is the figure which expanded the XXIII area | region shown with a broken line in FIG. 端子の構造を示す図であり、（ａ）はばね部なし、（ｂ）はばね部ありの場合を示している。It is a figure which shows the structure of a terminal, (a) does not have a spring part, (b) has shown the case with a spring part. 端子の配置を示す断面図である。It is sectional drawing which shows arrangement | positioning of a terminal. 第４変形例において、コネクタ組み付け前の状態を示す断面図である。In a 4th modification, it is sectional drawing which shows the state before a connector assembly | attachment. 第４変形例において、コネクタ組み付け後の状態を示す断面図である。In a 4th modification, it is sectional drawing which shows the state after connector assembly | attachment. 第４変形例において、端子による接触荷重の経時的変化を示す図である。In a 4th modification, it is a figure which shows the time-dependent change of the contact load by a terminal.

以下、本発明の実施の形態を、図面を参照して説明する。なお、以下に示す各実施形態において、共通乃至関連する要素には同一の符号を付与するものとする。また、基板の板厚方向を単に板厚方向と示す。また、板厚方向に直交する方向のうち、端子又は電極の配列方向、換言すれば、基板の矩形を規定する一辺方向を、第１方向と示す。また、板厚方向及び第１方向の両方向に直交する方向、換言すればコネクタに対する外部コネクタの嵌合方向を、第２方向と示す。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, common or related elements are given the same reference numerals. The thickness direction of the substrate is simply referred to as the thickness direction. Further, among the directions orthogonal to the plate thickness direction, the arrangement direction of the terminals or electrodes, in other words, the one side direction defining the rectangle of the substrate is referred to as a first direction. The direction orthogonal to both the plate thickness direction and the first direction, in other words, the fitting direction of the external connector with respect to the connector is referred to as the second direction.

（第１実施形態）
図１に示すように、電子装置１０は、要部として、基板２０と、筺体３０と、コネクタ４０と、防水部材７０と、を備えている。そして、この電子装置１０は、例えば車両のエンジンを制御する防水型の電子制御装置（ＥＣＵ）として構成されている。この電子装置１０には、外部コネクタ１００として、車両側のメス型コネクタが接続される。 (First embodiment)
As shown in FIG. 1, the electronic device 10 includes a substrate 20, a housing 30, a connector 40, and a waterproof member 70 as main parts. The electronic device 10 is configured as a waterproof electronic control unit (ECU) that controls a vehicle engine, for example. A vehicle-type female connector is connected to the electronic device 10 as the external connector 100.

外部コネクタ１００は、合成樹脂材料を用いて形成されたハウジング１０１を有する。ハウジング１０１のうち、コネクタ４０側の前面１０１ａには、後述するコネクタ４０の端子４２が挿入される孔１０２が開口している。孔１０２には端子４２と電気的に接続されるコンタクト１０３が配置され、このコンタクト１０３には、ワイヤーハーネス１０４が電気的に接続されている。一方、ハウジング１０１の側面１０１ｂには、防水部材１０５として、例えばゴム製のリングが嵌め込まれており、この防水部材１０５により、ハウジング１０１と後述するコネクタ４０のハウジング４１との間の、水密を確保することができる。詳しくは、後述する第１ハウジング部４６の筒状部４８との間で水密を確保する。また、ハウジング１０１の後面１０１ｃには、溝部１０６が形成されており、ワイヤーハーネス１０４は孔１０２から溝部１０６を通じて、外部に引き出されている。溝部１０６には、例えばゴム製の防水部材１０７が配置されており、この防水部材１０７によって孔１０２から水分等が侵入するのを防ぐことができる。防水部材１０７上には蓋部１０８が配置され、これにより防水部材１０７は所定位置に保持されている。   The external connector 100 has a housing 101 formed using a synthetic resin material. In the housing 101, a front surface 101 a on the connector 40 side has a hole 102 into which a terminal 42 of the connector 40 described later is inserted. A contact 103 electrically connected to the terminal 42 is disposed in the hole 102, and a wire harness 104 is electrically connected to the contact 103. On the other hand, a rubber ring, for example, is fitted as a waterproofing member 105 on the side surface 101b of the housing 101, and the waterproofing member 105 ensures watertightness between the housing 101 and a housing 41 of the connector 40 described later. can do. Specifically, watertightness is ensured between the cylindrical portion 48 of the first housing portion 46 described later. Further, a groove 106 is formed on the rear surface 101 c of the housing 101, and the wire harness 104 is drawn out from the hole 102 through the groove 106. For example, a rubber waterproof member 107 is disposed in the groove portion 106, and the waterproof member 107 can prevent moisture and the like from entering the hole 102. A lid portion 108 is disposed on the waterproof member 107, whereby the waterproof member 107 is held at a predetermined position.

先ず、図１〜図５を用いて、電子装置１０の構造について説明する。   First, the structure of the electronic device 10 will be described with reference to FIGS.

基板２０は、樹脂などの絶縁材料からなる基材に、銅箔などからなる配線を多層に配置してなり、配線の一部として、板厚方向における両面２０ａ，２０ｂに電極２１を有している。この電極２１はランドとも言う。このため、片面電極構造の基板２０に較べて、コネクタ４０との電気的な接続経路を効率的に増やすことができる。基板２０において、異なる層の配線は、図示しないビアホール等によって電気的に接続されている。また、基板２０には、マイコン、パワートランジスタ、抵抗、コンデンサ等の図示しない電子部品が実装され、これら電子部品と配線によって回路が形成されている。   The substrate 20 is formed by arranging wirings made of copper foil or the like in a multilayer on a base material made of an insulating material such as a resin, and has electrodes 21 on both surfaces 20a and 20b in the plate thickness direction as part of the wiring. Yes. This electrode 21 is also called a land. For this reason, compared with the board | substrate 20 of a single-sided electrode structure, the electrical connection path | route with the connector 40 can be increased efficiently. In the substrate 20, wirings of different layers are electrically connected by via holes (not shown) or the like. Further, electronic components (not shown) such as a microcomputer, a power transistor, a resistor, and a capacitor are mounted on the substrate 20, and a circuit is formed by these electronic components and wiring.

電極２１は、基板２０の一面２０ａに配置された複数の第１電極２１ａと、一面２０ａと反対の裏面２０ｂに配置された複数の第２電極２１ｂを有する。各電極２１ａ，２１ｂは、第１方向に沿って配列されている。また、板厚方向に直交する平面形状が矩形の基板２０に対し、第２方向における一方の端部近傍である縁部２２に形成されている。また、第２方向において、第１電極２１ａと第２電極２１ｂは、ほぼ同じ位置に形成されている。第１電極２１ａ及び第２電極２１ｂは、第２方向において複数列配置させることもできるが、本実施形態では、ともに１列の配置となっている。   The electrode 21 includes a plurality of first electrodes 21a disposed on the one surface 20a of the substrate 20 and a plurality of second electrodes 21b disposed on the back surface 20b opposite to the one surface 20a. Each electrode 21a, 21b is arranged along the first direction. In addition, the planar shape perpendicular to the plate thickness direction is formed on the edge portion 22 in the vicinity of one end portion in the second direction with respect to the rectangular substrate 20. In the second direction, the first electrode 21a and the second electrode 21b are formed at substantially the same position. The first electrode 21a and the second electrode 21b can be arranged in a plurality of rows in the second direction, but in this embodiment, both are arranged in one row.

筺体３０は、袋形状をなしており、第２方向における一端側に開口部３１を有している。この筐体３０には、基板２０が収容されるとともに、コネクタ４０の少なくとも一部も収容される。この筺体３０は、ＰＰＳやＰＢＴなどの合成樹脂材料や、アルミニウム等の金属材料を用いて形成される。筺体３０は、１つの部材のみからなっても良いし、複数の部材を組み合わせて形成されるものでも良い。本実施形態では、樹脂を用いて形成された１つの部材によって筺体３０が構成されており、第２方向に直交する断面の形状が略矩形となっている。すなわち、開口形状も略矩形となっている。また、図示しないが、筺体３０の開口部３１付近には、コネクタ４０との嵌合部が設けられている。   The housing 30 has a bag shape and has an opening 31 on one end side in the second direction. The housing 30 accommodates the substrate 20 and also accommodates at least a part of the connector 40. The housing 30 is formed using a synthetic resin material such as PPS or PBT, or a metal material such as aluminum. The housing 30 may consist of only one member, or may be formed by combining a plurality of members. In this embodiment, the housing 30 is comprised by one member formed using resin, and the shape of the cross section orthogonal to a 2nd direction is a substantially rectangular shape. That is, the opening shape is also substantially rectangular. Although not shown, a fitting portion with the connector 40 is provided near the opening 31 of the housing 30.

コネクタ４０は、ＰＰＳやＰＢＴなどの合成樹脂材料を用いて形成されたハウジング４１と、導電材料を用いて形成されるとともにハウジング４１に保持された複数の端子４２と、を有する。端子４２の材料としては、導電性が良好な金属材料、例えばりん青銅をニッケルメッキで被覆し、さらに金メッキで被覆してなるものを採用することができる。   The connector 40 includes a housing 41 formed using a synthetic resin material such as PPS or PBT, and a plurality of terminals 42 formed using a conductive material and held by the housing 41. As the material of the terminal 42, a metal material having good conductivity, such as phosphor bronze coated with nickel plating and further coated with gold plating can be employed.

端子４２は、第１電極２１ａに接触する複数の第１端子４２ａと、第２電極２１ｂに接触する複数の第２端子４２ｂと、を有している。各端子４２（４２ａ，４２ｂ）は導電材料を曲げ加工してなり、ハウジング４１から基板２０が収容された筐体３０の内部空間３２に突出する基板接続部４３と、ハウジング４１から内部空間３２と反対の嵌合空間５３に突出する外部接続部４４と、を有している。さらに、端子４２ａ，４２ｂは、ハウジング４１の図示しない孔に圧入固定された圧入部４５を有している。外部接続部４４は、外部コネクタ１００がコネクタ４０に嵌合された状態で、コンタクト１０３と電気的に接続される。   The terminal 42 includes a plurality of first terminals 42a that are in contact with the first electrode 21a and a plurality of second terminals 42b that are in contact with the second electrode 21b. Each terminal 42 (42 a, 42 b) is formed by bending a conductive material, and a board connection portion 43 that protrudes from the housing 41 into the internal space 32 of the housing 30 in which the board 20 is accommodated. And an external connection portion 44 protruding into the opposite fitting space 53. Furthermore, the terminals 42 a and 42 b have a press-fit portion 45 that is press-fit and fixed in a hole (not shown) of the housing 41. The external connection portion 44 is electrically connected to the contact 103 in a state where the external connector 100 is fitted to the connector 40.

基板接続部４３は、図５に示すように、電極２１（２１ａ，２１ｂ）に接触する接点部４３ａと、該接点部４３ａよりも先端側の部分である先端部４３ｂと、圧入部４５と接点部４３ａとを繋ぐ繋ぎ部４３ｃと、を有している。本実施形態では、端子４２のうち、外部接続部４４、圧入部４５、及び基板接続部４３における繋ぎ部４３ｃの一部が、一体的に一直線状とされ、この一直線状の部分は、基板２０の一面２０ａと略平行に配置される。また、基板接続部４３の残りの部分、すなわち繋ぎ部４３ｃの大部分、接点部４３ａ、及び先端部４３ｂは、略Ｌ字状をなしている。   As shown in FIG. 5, the board connecting part 43 includes a contact part 43a that contacts the electrode 21 (21a, 21b), a tip part 43b that is a part on the tip side of the contact part 43a, a press-fit part 45, and a contact point. A connecting portion 43c that connects the portion 43a. In the present embodiment, a part of the connection portion 43 c in the external connection portion 44, the press-fit portion 45, and the substrate connection portion 43 in the terminal 42 is integrally formed in a straight line, and this straight portion is the substrate 20. Is disposed substantially parallel to one surface 20a. Further, the remaining part of the substrate connecting part 43, that is, most of the connecting part 43c, the contact part 43a, and the tip part 43b are substantially L-shaped.

接点部４３ａは、第２方向において圧入部４５と異なる位置とされるとともに、板厚方向において、圧入部４５よりも基板２０に近い位置とされている。また、先端部４３ｂは、第２方向において接点部４３ａから離れるほど、板厚方向において基板２０から離れるようなテーパ形状をなしている。また、繋ぎ部４３ｃは、接点部４３ａから少なくとも一部と基板２０の一面２０ａ又は裏面２０ｂとのなす角が鋭角となっている。本実施形態では、繋ぎ部４３ｃのうち、略Ｌ字状をなす部分が、基板２０の一面２０ａ又は裏面２０ｂとの間で鋭角をなす。換言すれば、Ｌ字状部分の繋ぎ部側端部が、鈍角をもって上記した一直線状部分の一端に連結されている。   The contact portion 43a is located at a position different from the press-fit portion 45 in the second direction, and is located closer to the substrate 20 than the press-fit portion 45 in the plate thickness direction. Further, the distal end portion 43b has a taper shape such that the farther from the contact portion 43a in the second direction, the farther from the substrate 20 in the plate thickness direction. Further, the connecting portion 43c has an acute angle formed by at least a part of the contact portion 43a and the one surface 20a or the back surface 20b of the substrate 20. In the present embodiment, the substantially L-shaped portion of the connecting portion 43 c forms an acute angle with the one surface 20 a or the back surface 20 b of the substrate 20. In other words, the connecting portion side end portion of the L-shaped portion is connected to one end of the straight portion described above with an obtuse angle.

また、後述する第１ハウジング部４６と第２ハウジング部４７の組み付け前後のいずれにおいても、先端部４３ｂはハウジング４１に接触しないように設けられている。このように、先端部４３ｂは自由端となっており、基板接続部４３は、ばね性を有している。このような端子４２によれば、弾性変形した状態で、第１電極２１ａに第１端子４２ａの接点部４３ａが接触し、第２電極２１ｂに第２端子４２ｂの接点部４３ａが接触する。したがって、対応する電極２１と端子４２が電気的に接続されるとともに、基板２０の両面側に位置する端子４２ａ，４２ｂの弾性変形による反力（付勢力）により、基板２０が保持（固定）される。本実施形態では、第１端子４２ａと第２端子４２ｂの構成がほぼ同一であるため、板厚方向において、第１端子４２ａにおけるハウジング４１の保持部分と第２端子４２ｂにおけるハウジング４１の保持部分のほぼ中心位置に、基板２０を保持することができる。このように、はんだ付けすることなく、端子４２が電極２１と電気的に接続される。   Further, the tip end portion 43 b is provided so as not to contact the housing 41 before and after assembly of the first housing portion 46 and the second housing portion 47 described later. Thus, the front end portion 43b is a free end, and the board connecting portion 43 has a spring property. According to such a terminal 42, in a state of being elastically deformed, the contact portion 43a of the first terminal 42a contacts the first electrode 21a, and the contact portion 43a of the second terminal 42b contacts the second electrode 21b. Therefore, the corresponding electrode 21 and the terminal 42 are electrically connected, and the substrate 20 is held (fixed) by the reaction force (biasing force) due to the elastic deformation of the terminals 42 a and 42 b located on both sides of the substrate 20. The In the present embodiment, since the configurations of the first terminal 42a and the second terminal 42b are substantially the same, the holding portion of the housing 41 in the first terminal 42a and the holding portion of the housing 41 in the second terminal 42b in the plate thickness direction. The substrate 20 can be held at a substantially central position. Thus, the terminal 42 is electrically connected to the electrode 21 without soldering.

ハウジング４１は、板厚方向に分割された２つのハウジング部４６，４７からなる。板厚方向において、主として一面２０ａ側に配置される第１ハウジング部４６と、主として裏面２０ｂ側に配置される第２ハウジング部４７は、互いに組み付けた状態で、それぞれの分割面４６ａ，４７ａが全周でほぼ隙間なく合わさる。これにより、ハウジング４１は、筺体３０に収容された状態で、筐体３０の内部空間３２に異物が侵入しないように蓋をする。   The housing 41 includes two housing portions 46 and 47 divided in the plate thickness direction. In the plate thickness direction, the first housing portion 46 disposed mainly on the one surface 20a side and the second housing portion 47 disposed mainly on the back surface 20b side are assembled to each other, and the respective divided surfaces 46a and 47a are all in the assembled state. Fit around the circumference with almost no gap. As a result, the housing 41 covers the internal space 32 of the housing 30 so that no foreign matter enters the housing 41 while being accommodated in the housing 30.

第１ハウジング部４６は、筒状部４８と延設部４９と、を有する。筒状部４８は、その少なくとも一部が、袋形状をなす筐体３０の内面３０ａと開口部３１の周方向全周にわたって対向する。換言すれば、筐体３０の開口部３１周辺における内面３０ａの周形状に対応して筒状に設けられている。図４に示すように、本実施形態では、筒状部４８が略矩形の筒形状をなし、筒状部４８における第１方向の中央付近に、板厚方向に延びて筒を二分する仕切部４８ａが設けられている。すなわち、外部コネクタ１００との接続口が２ポートとなっている。   The first housing part 46 includes a cylindrical part 48 and an extending part 49. At least a part of the cylindrical portion 48 faces the inner surface 30 a of the bag-shaped housing 30 over the entire circumference in the circumferential direction of the opening 31. In other words, it is provided in a cylindrical shape corresponding to the circumferential shape of the inner surface 30 a around the opening 31 of the housing 30. As shown in FIG. 4, in the present embodiment, the cylindrical portion 48 has a substantially rectangular cylindrical shape, and extends in the thickness direction near the center of the cylindrical portion 48 in the first direction to bisect the cylinder. 48a is provided. That is, the connection port with the external connector 100 has 2 ports.

延設部４９は、筒状部４８における内部空間３２側の端部から延設されており、その全てが筺体３０に収容される。すなわち、第２方向において、延設部４９は筒状部４８よりも筐体３０の奥側に配置される。また、第２ハウジング部４７は、その全てが筺体３０に収容される。本実施形態では、ハウジング４１が、筒状部４８だけでなく、筒状部４８よりも内部空間側にも筒を有し、この筒を板厚方向に直交する面で２分割した一方が延設部４９、他方が第２ハウジング部４７となっている。このため、延設部４９は、図４に示すように、第２方向に直交する断面形状が略コの字状となっている。   The extending portion 49 extends from the end portion on the inner space 32 side of the cylindrical portion 48, and all of the extending portion 49 is accommodated in the housing 30. That is, in the second direction, the extending portion 49 is disposed on the back side of the housing 30 with respect to the tubular portion 48. Further, the second housing portion 47 is entirely accommodated in the housing 30. In the present embodiment, the housing 41 has a tube not only in the tubular portion 48 but also in the inner space side of the tubular portion 48, and one of the two divided by a plane orthogonal to the plate thickness direction extends. The installation portion 49 and the other are the second housing portion 47. For this reason, as shown in FIG. 4, the extending portion 49 has a substantially U-shaped cross section perpendicular to the second direction.

また、第１ハウジング部４６は、延設部４９の内面から突出する第１壁部５０を有している。第１壁部５０は、その板厚方向が第２方向と略一致しており、この第１壁部５０には、圧入により第１端子４２ａが保持されている。なお、本実施形態では、上記した仕切部４８ａによる２ポートに対応して、第１方向に並んで配置された２つの第１壁部５０を有し、それぞれに第１端子４２ａが保持されている。また、延設部４９が、第２方向において第１壁部５０よりも内部空間３２側に延設されており、この延設された部分を庇部４９ａと示す。   The first housing portion 46 has a first wall portion 50 that protrudes from the inner surface of the extending portion 49. The plate thickness direction of the first wall portion 50 substantially coincides with the second direction, and the first terminal 42a is held in the first wall portion 50 by press-fitting. In addition, in this embodiment, it has the two 1st wall parts 50 arrange | positioned along with the 1st direction corresponding to 2 ports by the above-mentioned partition part 48a, and the 1st terminal 42a is hold | maintained at each. Yes. Further, the extending portion 49 extends in the second direction toward the internal space 32 from the first wall portion 50, and this extended portion is referred to as a flange portion 49a.

一方、第２ハウジング部４７も、延設部４９同様、図３に示すように、第２方向に直交する断面形状が略コの字状をなす基部５１を有している。この基部５１は、第１ハウジング部４６と第２ハウジング部４７を組み付けた状態で、延設部４９とともに筒をなす。   On the other hand, as shown in FIG. 3, the second housing portion 47 also has a base portion 51 having a substantially U-shaped cross section perpendicular to the second direction, as shown in FIG. 3. The base 51 forms a cylinder together with the extending portion 49 in a state where the first housing portion 46 and the second housing portion 47 are assembled.

また、第２ハウジング部４７は、コの字をなす基部５１の底部内面から突出する第２壁部５２を有している。第２壁部５２は、その板厚方向が第２方向と略一致しており、この第２壁部５２には、圧入により第２端子４２ｂが保持されている。また、第２壁部５２は、第２方向において第１壁部５０と同じ位置に設けられている。第１壁部５０の先端面と第２壁部５２の先端面は、上記した分割面４６ａ，４７ａの一部であり、第１ハウジング部４６と第２ハウジング部４７を組み付けた状態で、ほぼ隙間なく合わさる。そして、コネクタ４０が筺体３０に収容された状態で、壁部５０，５２よりも筺体３０の奥側が内部空間３２とされ、壁部５０，５２よりも開口部３１側が、外部コネクタ１００が嵌合される嵌合空間５３となる。このように、壁部５０，５２は、内部空間３２と嵌合空間５３とを区画する。   The second housing portion 47 has a second wall portion 52 that protrudes from the inner surface of the bottom portion of the base portion 51 that forms a U-shape. The thickness direction of the second wall portion 52 substantially coincides with the second direction, and the second terminal 42b is held in the second wall portion 52 by press-fitting. Further, the second wall portion 52 is provided at the same position as the first wall portion 50 in the second direction. The front end surface of the first wall portion 50 and the front end surface of the second wall portion 52 are a part of the above-described split surfaces 46a and 47a, and in a state where the first housing portion 46 and the second housing portion 47 are assembled, Fit together without any gaps. In the state in which the connector 40 is accommodated in the housing 30, the inner space 32 is formed on the inner side of the housing 30 with respect to the walls 50 and 52, and the external connector 100 is fitted on the opening 31 side of the walls 50 and 52. The fitting space 53 is formed. Thus, the wall parts 50 and 52 partition the internal space 32 and the fitting space 53.

なお、本実施形態では、上記した仕切部４８ａによる２ポートに対応して、第１方向に並んで配置された２つの第２壁部５２を有し、それぞれに第２端子４２ｂが保持されている。また、基部５１が、第２方向において第２壁部５２よりも内部空間３２側に延設されており、この延設された部分を庇部５１ａと示す。   In addition, in this embodiment, it has the 2nd 2nd wall part 52 arrange | positioned along with the 1st direction corresponding to 2 ports by the above-mentioned partition part 48a, and the 2nd terminal 42b is hold | maintained at each. Yes. Further, the base 51 extends in the second direction toward the internal space 32 with respect to the second wall 52, and this extended portion is referred to as a flange 51a.

このように構成されるハウジング４１は、第１ハウジング部４６と第２ハウジング部４７との固定部としてスナップフィット５４を有している。このスナップフィット５４は、図３に示すように、板厚方向に延び、先端に係止爪を有する凸部５５と、凸部５５の係止爪が嵌る凹部５６よりなる。凸部５５は第２ハウジング部４７の基部５１及び庇部５１ａに設けられ、凹部５６は第１ハウジング部４６の延設部４９及び庇部４９ａに設けられている。そして、凸部５５の係止爪を、材料の弾性を利用して凹部５６に嵌め込むことで、第１ハウジング部４６と第２ハウジング部４７が組み付けられ、ハウジング４１が形成される。   The housing 41 configured as described above has a snap fit 54 as a fixing portion between the first housing portion 46 and the second housing portion 47. As shown in FIG. 3, the snap fit 54 includes a convex portion 55 that extends in the thickness direction and has a locking claw at the tip, and a concave portion 56 into which the locking claw of the convex portion 55 fits. The convex portion 55 is provided on the base portion 51 and the flange portion 51 a of the second housing portion 47, and the concave portion 56 is provided on the extending portion 49 and the flange portion 49 a of the first housing portion 46. And the 1st housing part 46 and the 2nd housing part 47 are assembled | attached by fitting the latching claw of the convex part 55 in the recessed part 56 using the elasticity of material, and the housing 41 is formed.

このスナップフィット５４は、図２〜図４に示すように、第１方向において、複数箇所に設けられている。具体的には、第１方向における両端と中央２箇所の計４箇所に設けられている。換言すれば、２つの第１壁部５０（第２壁部５２）に対して、それぞれの両端に設けられている。また、両端のスナップフィット５４は、図５に示すように、第２方向において、電極２１の形成範囲を跨ぐように設けられている。   As shown in FIGS. 2 to 4, the snap fits 54 are provided at a plurality of locations in the first direction. Specifically, it is provided in a total of four places, both ends in the first direction and two places in the center. In other words, the two first wall portions 50 (second wall portions 52) are provided at both ends. Further, as shown in FIG. 5, the snap fits 54 at both ends are provided so as to straddle the formation range of the electrode 21 in the second direction.

防水部材７０は、例えばシリコンゴムからなり、ハウジング４１のうち、筒状部４８の外周面に沿って環状に設けられている。このため、筺体３０にハウジング４１が収容されると、防水部材７０により、筺体３０の内面３０ａとハウジング４１の外周面との隙間から、筺体３０の内部空間３２に水分等が侵入するのを防ぐことができる。また、図示しないが、ハウジング４１の外周面には、筺体３０との嵌合部が設けられている。   The waterproof member 70 is made of, for example, silicon rubber, and is provided in an annular shape along the outer peripheral surface of the tubular portion 48 in the housing 41. For this reason, when the housing 41 is accommodated in the housing 30, the waterproof member 70 prevents moisture and the like from entering the internal space 32 of the housing 30 from the gap between the inner surface 30 a of the housing 30 and the outer peripheral surface of the housing 41. be able to. Although not shown, a fitting portion with the housing 30 is provided on the outer peripheral surface of the housing 41.

次に、図６及び図７を用いて、上記した電子装置１０の製造方法について説明する。   Next, a method for manufacturing the electronic device 10 will be described with reference to FIGS.

先ず、図６に示すようにコネクタ４０を組み付ける。このとき、基板２０も保持される。板厚方向において、第１ハウジング部４６、基板２０、及び、第２ハウジング部４７の順に配置し、互いに接触しない位置で、第１方向及び第２方向の位置合わせする。具体的には、第１端子４２ａの接点部４３ａが対応する第１電極２１ａにオーバーラップし、第２端子４２ｂの接点部４３ａが、対応する第２電極２１ｂにオーバーラップするようにする。そして、この位置合わせ状態で、第１ハウジング部４６と第２ハウジング部４７とを板厚方向において近づけ、スナップフィット５４により固定する。これにより、ハウジング４１、ひいてはコネクタ４０が形成されるとともに、端子４２ａ，４２ｂ間に基板２０が保持される。   First, the connector 40 is assembled as shown in FIG. At this time, the substrate 20 is also held. In the plate thickness direction, the first housing part 46, the substrate 20, and the second housing part 47 are arranged in this order, and are aligned in the first direction and the second direction at positions that do not contact each other. Specifically, the contact part 43a of the first terminal 42a overlaps with the corresponding first electrode 21a, and the contact part 43a of the second terminal 42b overlaps with the corresponding second electrode 21b. Then, in this alignment state, the first housing portion 46 and the second housing portion 47 are brought close to each other in the plate thickness direction and fixed by the snap fit 54. Thereby, the housing 41 and the connector 40 are formed, and the substrate 20 is held between the terminals 42a and 42b.

次に、図７に示すように基板２０及びコネクタ４０を筺体３０に収容する。すなわち、電子装置１０を組み付ける。基板２０を先頭として、基板２０及びコネクタ４０を筺体３０内に挿入する。そして、図示しない嵌合部同士が嵌合することで、コネクタ４０が筺体３０に固定される。この状態で、筒状部４８に配置された防水部材７０により、筐体３０の内面３０ａとハウジング４１の外面は水密となる。以上により、図１に示す電子装置１０が形成される。   Next, as shown in FIG. 7, the substrate 20 and the connector 40 are accommodated in the housing 30. That is, the electronic device 10 is assembled. The board 20 and the connector 40 are inserted into the housing 30 with the board 20 as the head. And the connector 40 is fixed to the housing 30 by the fitting parts which are not shown in figure fitting. In this state, the inner surface 30a of the housing 30 and the outer surface of the housing 41 are watertight by the waterproof member 70 disposed in the cylindrical portion 48. Thus, the electronic device 10 shown in FIG. 1 is formed.

次に、本実施形態に係る電子装置１０の特徴部分について、その作用効果を説明する。   Next, the effect of the characteristic part of the electronic device 10 according to the present embodiment will be described.

本実施形態では、ハウジング４１を第１ハウジング部４６と第２ハウジング部４７に分割し、これらハウジング部４６，４７を板厚方向に組み付けることでハウジング４１をなす構造とした。また、第１ハウジング部４６に第１端子４２ａを設け、第２ハウジング部４７に第２端子４２ｂを設けたので、板厚方向に組み付けてハウジング４１を形成する際に、板厚方向から、第１端子４２ａを第１電極２１ａに接触させ、第２端子４２ｂを第２電極２１ｂに接触させることができる。このため、端子４２を電極２１に接触させる際に、例えば基板２０のエッジに端子４２の接点部４３ａが接触しない。したがって、端子４２の損傷や変形などを抑制し、ひいては接続信頼性の低下を抑制することができる。   In the present embodiment, the housing 41 is divided into a first housing portion 46 and a second housing portion 47, and the housing 41 is assembled by assembling these housing portions 46 and 47 in the plate thickness direction. In addition, since the first terminal 42a is provided in the first housing portion 46 and the second terminal 42b is provided in the second housing portion 47, when the housing 41 is formed by assembling in the plate thickness direction, One terminal 42a can be brought into contact with the first electrode 21a, and the second terminal 42b can be brought into contact with the second electrode 21b. For this reason, when the terminal 42 is brought into contact with the electrode 21, for example, the contact portion 43 a of the terminal 42 does not contact the edge of the substrate 20. Accordingly, it is possible to suppress damage and deformation of the terminal 42 and to suppress a decrease in connection reliability.

また、第１ハウジング部４６は、袋形状をなす筐体３０の内面３０ａと開口部３１の周方向全周にわたって対向する筒状部４８を有しており、この筒状部４８と筐体３０の間に防水部材７０が配置される。したがって、ハウジング４１と筺体３０との間の水密を確保することができる。なお、第１ハウジング部４６が筒状部４８を有さず、第１ハウジング部４６と第２ハウジング部４７が板厚方向において完全に２分割された構造とすると、防水部材７０は、第１ハウジング部４６と第２ハウジング部４７の分割面４６ａ，４７ａを跨いで配置されることとなる。このため、筐体３０とコネクタ４０のハウジング４１との防水以外に、コネクタ４０の分割面４６ａ，４７ａの防水も必要となる。したがって、本実施形態のほうが容易に防水性を確保することができる。   Further, the first housing portion 46 includes a cylindrical portion 48 that is opposed to the inner surface 30 a of the bag-shaped housing 30 and the entire circumference of the opening 31 in the circumferential direction. A waterproof member 70 is disposed between the two. Therefore, watertightness between the housing 41 and the housing 30 can be ensured. If the first housing part 46 does not have the cylindrical part 48 and the first housing part 46 and the second housing part 47 are completely divided into two in the plate thickness direction, the waterproof member 70 is the first member. The housing 46 and the second housing 47 are disposed across the dividing surfaces 46a and 47a. For this reason, in addition to waterproofing of the housing 30 and the housing 41 of the connector 40, waterproofing of the split surfaces 46a and 47a of the connector 40 is also required. Therefore, the waterproof property can be easily secured in the present embodiment.

また、第１ハウジング部４６と第２ハウジング部４７との分割面４６ａ，４７ａは、全周でほぼ隙間なく合わさり、ハウジング４１は、内部空間３２を蓋するように配置される。このため、ハウジング４１の分割構造を採用しながらも、外部コネクタ１００が接続される前の状態において、電子装置１０の内部空間３２に異物が侵入するのを抑制することができる。しかしながら、分割面４６ａ，４７ａを全周でほぼ隙間なく合わせることは必須ではない。外部コネクタ１００がコネクタ４０に嵌合すると、外部コネクタ１００の防水部材１０５により、筒状部４８とハウジング１０１の間に水密が形成される。したがって、分割面４６ａ，４７ａに隙間があっても、外部コネクタ１００が嵌合した状態では、内部空間３２を防水空間とすることができる。   Further, the dividing surfaces 46 a and 47 a of the first housing part 46 and the second housing part 47 are joined together with almost no gap on the entire circumference, and the housing 41 is arranged so as to cover the internal space 32. For this reason, while adopting the divided structure of the housing 41, it is possible to prevent foreign matter from entering the internal space 32 of the electronic device 10 in a state before the external connector 100 is connected. However, it is not essential that the divided surfaces 46a and 47a are aligned with almost no gap on the entire circumference. When the external connector 100 is fitted to the connector 40, watertightness is formed between the tubular portion 48 and the housing 101 by the waterproof member 105 of the external connector 100. Therefore, even if there is a gap between the split surfaces 46a and 47a, the internal space 32 can be a waterproof space when the external connector 100 is fitted.

また、基板接続部４３が、接点部４３ａと先端部４３ｂと繋ぎ部４３ｃを有し、接点部４３ａは、第２方向において、圧入部４５と異なる位置とされるとともに、板厚方向において、圧入部４５よりも基板２０に近い位置とされている。また、繋ぎ部４３ｃの接点部４３ａから少なくとも一部と基板２０の一面２０ａ又は裏面２０ｂとのなす角は鋭角とされている。そして、先端部４３ｂは、少なくとも第１ハウジング部４６と第２ハウジング部４７を組み付ける前の状態で、保持されているハウジング部４６，４７に対して離間している。このように、組み付け前の状態で先端部４３ｂがフリーであるため、図８に示すように、組み付けにより基板接続部４３が板厚方向に撓むと、接点部４３ａは基板２０（第２電極２１ｂ）の表面に接触しつつ第２方向へスライドする。したがって、接点部４３ａ及び第２電極２１ｂ表面をワイピングし、表面の酸化物層を除去することができる。なお、図８の破線が、接点部４３ａが対応する第２電極２１ｂに接触した組み付け初期を示し、実線が、組み付けにより基板接続部４３が板厚方向に撓んだ状態を示している。図８では、第２端子４２ｂと第２電極２１ｂのみを示しているが、第１端子４２ａと第１電極２１ａについても同様である。   The board connecting portion 43 includes a contact portion 43a, a tip portion 43b, and a connecting portion 43c. The contact portion 43a is positioned differently from the press-fit portion 45 in the second direction, and is press-fit in the plate thickness direction. The position is closer to the substrate 20 than the portion 45. Further, an angle formed by at least a part of the contact portion 43a of the connecting portion 43c and the one surface 20a or the back surface 20b of the substrate 20 is an acute angle. And the front-end | tip part 43b is spaced apart with respect to the housing parts 46 and 47 hold | maintained in the state before assembling the 1st housing part 46 and the 2nd housing part 47 at least. Thus, since the tip end portion 43b is free in the state before assembly, as shown in FIG. 8, when the substrate connection portion 43 is bent in the plate thickness direction by assembly, the contact portion 43a is connected to the substrate 20 (second electrode 21b). ) And slide in the second direction. Therefore, the surface of the contact portion 43a and the second electrode 21b can be wiped, and the oxide layer on the surface can be removed. The broken line in FIG. 8 shows the initial assembly when the contact portion 43a contacts the corresponding second electrode 21b, and the solid line shows the state where the board connecting portion 43 is bent in the plate thickness direction by the assembly. FIG. 8 shows only the second terminal 42b and the second electrode 21b, but the same applies to the first terminal 42a and the first electrode 21a.

さらに本実施形態では、基板接続部４３が折り返し形状を有しており、接点部４３ａが弧状となっている。したがって、図９に示すように、基板接続部４３は、組み付けにより板厚方向に撓むとともに少なからず回転運動し、弧状部分において接点部４３ａが変位する。図９で示す破線は、回転運動する前の接点部４３ａの位置を示している。この回転運動によっても、ワイピングすることができる。   Further, in the present embodiment, the board connecting portion 43 has a folded shape, and the contact portion 43a has an arc shape. Therefore, as shown in FIG. 9, the board connecting portion 43 is bent in the plate thickness direction by the assembly and is not less rotated, and the contact portion 43 a is displaced in the arc-shaped portion. The broken line shown in FIG. 9 indicates the position of the contact portion 43a before rotating. Wiping can also be performed by this rotational movement.

また、第１ハウジング部４６と第２ハウジング部４７とは、スナップフィット５４により組み付けられる。ねじ締結や接着固定に較べて、別部品不要であり、構成を簡素化することができる。また、製造工程も簡素化できる。しかしながら、スナップフィット５４以外の組み付け方法も採用することができる。例えば上記のようにねじ締結により、板厚方向において第１ハウジング部４６を第２ハウジング部４７に組み付けても良い。また、接着剤により、板厚方向において第１ハウジング部４６を第２ハウジング部４７に組み付けても良い。   Further, the first housing part 46 and the second housing part 47 are assembled by a snap fit 54. Compared to screw fastening and adhesive fixing, no separate parts are required, and the configuration can be simplified. In addition, the manufacturing process can be simplified. However, assembly methods other than the snap fit 54 can also be employed. For example, the first housing portion 46 may be assembled to the second housing portion 47 in the plate thickness direction by screw fastening as described above. Further, the first housing portion 46 may be assembled to the second housing portion 47 in the plate thickness direction with an adhesive.

（第１変形例）
上記実施形態では、第１ハウジング部４６及び第２ハウジング部４７が、それぞれ庇部４９ａ，５１ａを有する例を示した。しかしながら、図１０に示すように、第１ハウジング部４６及び第２ハウジング部４７が、それぞれ庇部４９ａ，５１ａを有さない構成としても良い。さらには、第１ハウジング部４６及び第２ハウジング部４７の一方が庇部を有し、他方が庇部を有さない構成としても良い。 (First modification)
In the said embodiment, the 1st housing part 46 and the 2nd housing part 47 showed the example which has the collar parts 49a and 51a, respectively. However, as shown in FIG. 10, the first housing portion 46 and the second housing portion 47 may not have the flange portions 49a and 51a, respectively. Further, one of the first housing part 46 and the second housing part 47 may have a collar part and the other may not have a collar part.

（第２実施形態）
本実施形態において、上記実施形態に示した電子装置１０と共通する部分についての説明は割愛する。 (Second Embodiment)
In the present embodiment, the description of the parts common to the electronic device 10 shown in the above embodiment is omitted.

本実施形態の特徴は、コネクタ４０が、少なくとも第１ハウジング部４６と第２ハウジング部４７を組み付ける前の状態で、第１ハウジング部４６及び第２ハウジング部４７の一方における所定位置に基板２０を保持する保持部５７を有することにある。それ以外の点は、第１実施形態と同じである。   The feature of this embodiment is that the connector 20 is placed at a predetermined position in one of the first housing part 46 and the second housing part 47 at least before the first housing part 46 and the second housing part 47 are assembled. It has the holding part 57 to hold. Other points are the same as in the first embodiment.

本実施形態では、図１１〜図１３に示すように、保持部５７が、第１ハウジング部４６に設けられた係止部５７ａと、第１ハウジング部４６に保持された第１端子４２ａにより構成されている。   In the present embodiment, as shown in FIGS. 11 to 13, the holding portion 57 is configured by a locking portion 57 a provided in the first housing portion 46 and a first terminal 42 a held in the first housing portion 46. Has been.

係止部５７ａは、第１ハウジング部４６の一部として構成されており、第１方向において、電極２１の形成範囲よりも外側において基板２０を保持するように設けられている。また、係止部５７ａは、庇部４９ａを含む延設部４９から、板厚方向において第１壁部５０と同方向に突出しており、弾性変形可能に設けられている。係止部５７ａにおける基板２０の裏面２０ｂに接触する部分は、板厚方向において第１端子４２ａの接点部４３ａよりも延設部４９から離れた位置となっている。そして、第１端子４２ａにおける基板接続部４３のばね力により、係止部５７ａと第１端子４２ａの間で基板２０を挟持することで、第１ハウジング部４６に基板２０が保持される。基板２０の保持位置は、第１端子４２ａと第２端子４２ｂのばね力の釣り合い位置よりも、板厚方向において延設部４９から離れた位置となっている。   The locking portion 57a is configured as a part of the first housing portion 46, and is provided so as to hold the substrate 20 outside the formation range of the electrode 21 in the first direction. The locking portion 57a protrudes from the extending portion 49 including the flange portion 49a in the same direction as the first wall portion 50 in the plate thickness direction, and is provided so as to be elastically deformable. The portion of the locking portion 57a that contacts the back surface 20b of the substrate 20 is located farther from the extending portion 49 than the contact portion 43a of the first terminal 42a in the thickness direction. The substrate 20 is held by the first housing portion 46 by sandwiching the substrate 20 between the locking portion 57a and the first terminal 42a by the spring force of the substrate connecting portion 43 in the first terminal 42a. The holding position of the board | substrate 20 is a position away from the extending part 49 in the plate | board thickness direction rather than the balance position of the spring force of the 1st terminal 42a and the 2nd terminal 42b.

なお、基板２０の保持は、第１ハウジング部４６と第２ハウジング部４７の組み付けの前に実行される。基板２０を係止部５７ａと第１端子４２ａで挟む際には、基板２０が第１端子４２ａに接触しないように基板２０を斜めにしながら係止部５７ａに係止させる。このとき係止部５７ａを弾性変形させながら基板２０を係止させ、その状態で係止部分を支点として基板２０を回転させ、第１電極２１ａを第１端子４２ａの接点部４３ａに接触させる。これにより、基板２０のエッジに第１端子４２ａの接点部４３ａを接触させることなく、基板２０を保持することができる。   The holding of the substrate 20 is performed before the first housing portion 46 and the second housing portion 47 are assembled. When the board | substrate 20 is pinched | interposed by the latching | locking part 57a and the 1st terminal 42a, the board | substrate 20 is latched to the latching | locking part 57a, slanting so that the board | substrate 20 may not contact the 1st terminal 42a. At this time, the substrate 20 is locked while elastically deforming the locking portion 57a. In this state, the substrate 20 is rotated with the locking portion as a fulcrum, and the first electrode 21a is brought into contact with the contact portion 43a of the first terminal 42a. Thereby, the board | substrate 20 can be hold | maintained, without making the contact part 43a of the 1st terminal 42a contact the edge of the board | substrate 20. FIG.

また、基板２０が第１ハウジング部４６に保持された状態で、第１ハウジング部４６と第２ハウジング部４７を組み付ける。この組み付け状態では、図１４に示すように、第１端子４２ａと第２端子４２ｂにより基板２０が保持される。第１実施形態同様、第１端子４２ａと第２端子４２ｂの構成はほぼ同じであり、基板２０は板厚方向において第１端子４２ａと第２端子４２ｂのばね力が釣り合う位置まで変位する。これにより、基板２０は延設部４９に近づき、係止部５７ａが基板２０に対して離間される。このように、第１ハウジング部４６と第２ハウジング部４７を組み付けた状態では、端子４２ａ，４２ｂにより基板２０が保持され、保持部５７による保持は解除される。   Further, the first housing portion 46 and the second housing portion 47 are assembled in a state where the substrate 20 is held by the first housing portion 46. In this assembled state, as shown in FIG. 14, the substrate 20 is held by the first terminal 42a and the second terminal 42b. As in the first embodiment, the configurations of the first terminal 42a and the second terminal 42b are substantially the same, and the substrate 20 is displaced to a position where the spring forces of the first terminal 42a and the second terminal 42b are balanced in the plate thickness direction. Thereby, the board | substrate 20 approaches the extending part 49, and the latching | locking part 57a is spaced apart with respect to the board | substrate 20. As shown in FIG. Thus, in the state where the first housing portion 46 and the second housing portion 47 are assembled, the substrate 20 is held by the terminals 42a and 42b, and the holding by the holding portion 57 is released.

このように本実施形態では、保持部５７により基板２０を保持した状態で、第１ハウジング部４６と第２ハウジング部４７を組み付けるため、保持しない場合に較べて、ハウジング４１を形成しつつ端子４２と電極２１との電気的な接続構造を形成しやすい。また、ハウジング４１に対する基板２０の位置精度を向上することができる。このため、端子４２が対応する電極２１に対してより確実に接触することとなり、これによっても接続信頼性の低下を抑制することができる。   As described above, in the present embodiment, the first housing portion 46 and the second housing portion 47 are assembled in a state where the substrate 20 is held by the holding portion 57. It is easy to form an electrical connection structure between the electrode 21 and the electrode 21. Further, the positional accuracy of the substrate 20 with respect to the housing 41 can be improved. For this reason, the terminal 42 comes into contact with the corresponding electrode 21 more reliably, and this can also suppress a decrease in connection reliability.

特に本実施形態では、端子４２のばね力を利用して基板２０を保持するため、ねじ締結や接着に較べて、保持部５７の構成を簡素化することができる。また、製造工程を簡素化することができる。   In particular, in this embodiment, since the board | substrate 20 is hold | maintained using the spring force of the terminal 42, the structure of the holding | maintenance part 57 can be simplified compared with screw fastening or adhesion | attachment. In addition, the manufacturing process can be simplified.

また、第１ハウジング部４６と第２ハウジング部４７を組み付けた状態で、係止部５７ａは基板２０に非接触となるため、第１端子４２ａと第２端子４２ｂで接圧（接触荷重）が異なるのを抑制することができる。これにより、接続信頼性の低下を抑制することができる。   Further, in the state where the first housing portion 46 and the second housing portion 47 are assembled, the locking portion 57a is not in contact with the substrate 20, so that contact pressure (contact load) is applied between the first terminal 42a and the second terminal 42b. The difference can be suppressed. Thereby, the fall of connection reliability can be suppressed.

なお、保持部５７は、第１ハウジング部４６及び第２ハウジング部４７のいずれか一方に設けられれば良い。したがって、第２ハウジング部４７に設けられても良い。また、保持部５７の構成も、係止部５７ａと端子４２による挟持に限定されるものではない。ねじ締結や接着により、例えば第１ハウジング部４６に保持しても良い。この場合、保持部５７によって基板２０の位置が決定することとなる。   Note that the holding portion 57 may be provided on either the first housing portion 46 or the second housing portion 47. Accordingly, the second housing part 47 may be provided. Further, the configuration of the holding portion 57 is not limited to the clamping by the locking portion 57 a and the terminal 42. For example, the first housing portion 46 may be held by screw fastening or adhesion. In this case, the position of the substrate 20 is determined by the holding unit 57.

（第２変形例）
上記実施形態では、第１ハウジング部４６が、その一部として係止部５７ａを有する例を示した。しかしながら、第１ハウジング部４６に金属部材を保持させ、この金属部材を係止部としても良い。例えば図１５に示す例では、電気的な接続機能を提供しないダミー端子を、係止部５７ｂとしている。図１５において、第１壁部５０は、板厚方向において、第１端子４２ａと第２端子４２ｂの釣り合う位置よりも上方に突出している。係止部５７ｂは端子４２と同一材料を用いて形成されており、基板２０の裏面２０ｂに係止する。そして、第１端子４２ａのばね力により、係止部５７ｂと第１端子４２ａの間で基板２０が挟持される。この場合も、基板２０の保持位置は、第１端子４２ａと第２端子４２ｂのばね力の釣り合い位置よりも、板厚方向において延設部４９から離れた位置となっている。そして、上記実施形態同様、第１ハウジング部４６と第２ハウジング部４７を組み付けた状態で、端子４２ａ，４２ｂにより基板２０が保持され、保持部５７による保持は解除される。 (Second modification)
In the said embodiment, the 1st housing part 46 showed the example which has the latching | locking part 57a as a part. However, a metal member may be held in the first housing portion 46, and this metal member may be used as a locking portion. For example, in the example shown in FIG. 15, a dummy terminal that does not provide an electrical connection function is used as the locking portion 57b. In FIG. 15, the first wall portion 50 protrudes above the position where the first terminal 42 a and the second terminal 42 b are balanced in the plate thickness direction. The locking portion 57 b is formed using the same material as the terminal 42 and locks to the back surface 20 b of the substrate 20. And the board | substrate 20 is clamped between the latching | locking part 57b and the 1st terminal 42a with the spring force of the 1st terminal 42a. Also in this case, the holding position of the board | substrate 20 is a position away from the extending part 49 in the plate | board thickness direction rather than the balance position of the spring force of the 1st terminal 42a and the 2nd terminal 42b. As in the above embodiment, the substrate 20 is held by the terminals 42a and 42b and the holding by the holding portion 57 is released in a state where the first housing portion 46 and the second housing portion 47 are assembled.

（第３実施形態）
本実施形態において、上記実施形態に示した電子装置１０と共通する部分についての説明は割愛する。 (Third embodiment)
In the present embodiment, the description of the parts common to the electronic device 10 shown in the above embodiment is omitted.

本実施形態の特徴は、図１６及び図１７に示すように、筐体３０が、開口部３１から所定範囲の部分であり、第２方向に直交する開口面積の大きい拡径部３３と、該拡径部３３よりも開口面積の小さい縮径部３４と、拡径部３３と縮径部３４を繋ぐテーパ部３５と、を有している。テーパ部３５は、第２方向においてその開口面積が連続的に変化しており、拡径部３３側から縮径部３４側に向けて開口面積が減少している。そして、第１ハウジング部４６と第２ハウジング部４７は、それぞれテーパ部３５に接触することで、組み付けられるようになっていることにある。なお、それ以外の点は、第１実施形態とほぼ同じである。   As shown in FIGS. 16 and 17, the feature of the present embodiment is that the casing 30 is a portion within a predetermined range from the opening 31, and the diameter-enlarged portion 33 having a large opening area orthogonal to the second direction, It has a reduced diameter portion 34 having an opening area smaller than that of the enlarged diameter portion 33, and a tapered portion 35 connecting the enlarged diameter portion 33 and the reduced diameter portion 34. The opening area of the tapered portion 35 continuously changes in the second direction, and the opening area decreases from the enlarged diameter portion 33 side toward the reduced diameter portion 34 side. The first housing part 46 and the second housing part 47 are to be assembled by contacting the tapered part 35. The other points are almost the same as in the first embodiment.

本実施形態では、図２２及び図２３に示すように、第１ハウジング部４６の延設部４９のうち、筒状部４８と反対の端部における外面側の角部もテーパ部５８となっている。また、第２ハウジング部４７の基部５１のうち、筒状部４８と反対の端部における外面側の角部もテーパ部５８となっている。ハウジング４１において、これらテーパ部５８を有する部分の外形は、筒状部４８に近いほど大きく、筒状部４８から離れるほど小さくなっている。また、テーパ部５８は、筐体３０のテーパ部３５とほぼ同じ傾きを有している。   In the present embodiment, as shown in FIGS. 22 and 23, the corner portion on the outer surface side at the end opposite to the tubular portion 48 of the extended portion 49 of the first housing portion 46 also becomes the tapered portion 58. Yes. Further, the corner portion on the outer surface side at the end portion opposite to the tubular portion 48 of the base portion 51 of the second housing portion 47 is also a tapered portion 58. In the housing 41, the outer shape of the portion having the tapered portion 58 is larger as it is closer to the cylindrical portion 48 and is smaller as it is farther from the cylindrical portion 48. Further, the tapered portion 58 has substantially the same inclination as the tapered portion 35 of the housing 30.

なお、図１６に示す符号５９は、凸部である。第１ハウジング部４６と第２ハウジング部４７を組み付けた状態で、ハウジング４１は、板厚方向におけるほぼ中心部分に、嵌合空間５３側に突出する凸部５９を有する。この凸部５９は、第１ハウジング部４６の第１壁部５０の一部と、第２ハウジング部４７の第２壁部５２の一部により構成される。凸部５９の裏側は第１ハウジング部４６の前面５０ａ及び第２ハウジング部４７の前面５２ａに開口する凹みになっており、この凹みに基板２０の端部が挿入配置される。また、端子４２（４２ａ，４２ｂ）は、第１壁部５０及び第２壁部５２の前面５０ａ，５２ａに形成された図示しない溝に圧入されている。すなわち、圧入部４５が、前面５０ａ，５２ａに位置する。そして、基板接続部４３は前面５０ａ，５２ａ側から上記した凸部５９裏側の凹みに配置されている。   In addition, the code | symbol 59 shown in FIG. 16 is a convex part. In a state where the first housing portion 46 and the second housing portion 47 are assembled, the housing 41 has a convex portion 59 protruding toward the fitting space 53 at a substantially central portion in the plate thickness direction. The convex portion 59 includes a part of the first wall portion 50 of the first housing portion 46 and a portion of the second wall portion 52 of the second housing portion 47. The back side of the convex portion 59 is a recess opening in the front surface 50a of the first housing portion 46 and the front surface 52a of the second housing portion 47, and the end portion of the substrate 20 is inserted and disposed in this recess. The terminals 42 (42a, 42b) are press-fitted into grooves (not shown) formed on the front surfaces 50a, 52a of the first wall portion 50 and the second wall portion 52. That is, the press-fit portion 45 is located on the front surfaces 50a and 52a. And the board | substrate connection part 43 is arrange | positioned from the front surface 50a, 52a side to the above-mentioned dent of the convex part 59 back side.

このように構成される電子装置１０では、第１端子４２ａが基板２０の第１電極２１ａに接触し、第２端子４２ｂが第２電極２１ｂに接触するように、第１ハウジング部４６、第２ハウジング部４７、及び基板２０を位置決めする。このとき、図示しない治具を、凸部５９を構成する第１ハウジング部４６側の側面５９ａと第２ハウジング部４７側の側面５９ｂに接触させて板厚方向に挟み、ハウジング４１を保持する。そして、この位置決め状態で、第２方向において筐体３０の内部に基板２０側からコネクタ４０を挿入する。すると、コネクタ４０のテーパ部５８の外面が筐体３０のテーパ部３５の内面に接触する。さらに筐体３０の奥側にコネクタ４０を押し込むと、図１７に実線矢印で例示するように、各ハウジング部４６，４７に対して筐体３０から押さえつける力が作用する。これにより、第１ハウジング部４６と第２ハウジング部４７とは、板厚方向において筐体３０により挟持される形となり、第１ハウジング部４６に第２ハウジング部４７が組み付けられる。また、第１ハウジング部４６と第２ハウジング部４７の組み付けにより、端子４２が対応する電極２１にしっかり接触し、端子４２と電極２１が電気的に接続される。また、第１端子４２ａと第２端子４２ｂのばね力により、基板２０が保持される。   In the electronic device 10 configured in this way, the first housing portion 46, the second terminal 42a are in contact with the first electrode 21a of the substrate 20 and the second terminal 42b is in contact with the second electrode 21b. The housing part 47 and the substrate 20 are positioned. At this time, a jig (not shown) is brought into contact with the side surface 59 a on the first housing portion 46 side and the side surface 59 b on the second housing portion 47 side that constitute the convex portion 59, and is sandwiched in the plate thickness direction to hold the housing 41. In this positioning state, the connector 40 is inserted into the housing 30 from the board 20 side in the second direction. Then, the outer surface of the tapered portion 58 of the connector 40 comes into contact with the inner surface of the tapered portion 35 of the housing 30. Further, when the connector 40 is pushed into the back side of the housing 30, a force pressing from the housing 30 acts on each of the housing portions 46 and 47 as illustrated by solid line arrows in FIG. 17. Thereby, the first housing part 46 and the second housing part 47 are sandwiched by the housing 30 in the plate thickness direction, and the second housing part 47 is assembled to the first housing part 46. Further, by assembling the first housing part 46 and the second housing part 47, the terminal 42 firmly contacts the corresponding electrode 21, and the terminal 42 and the electrode 21 are electrically connected. Moreover, the board | substrate 20 is hold | maintained with the spring force of the 1st terminal 42a and the 2nd terminal 42b.

このように、筐体３０を利用した第１ハウジング部４６と第２ハウジング部４７の組み付け構造を採用しても、別部品を不要とすることができるので、構成を簡素化することができる。   Thus, even if the assembly structure of the first housing part 46 and the second housing part 47 using the housing 30 is adopted, a separate part can be dispensed with, so that the configuration can be simplified.

なお、上記実施形態では、筐体３０にテーパ部３５を設けるとともに、ハウジング４１にもテーパ部５８を設ける例を示したが、ハウジング４１がテーパ部５８を有さず、筐体３０のみがテーパ部３５を有する構成としても良い。   In the above embodiment, the taper portion 35 is provided on the housing 30 and the taper portion 58 is also provided on the housing 41. However, the housing 41 does not have the taper portion 58, and only the housing 30 is tapered. A configuration having the portion 35 may be adopted.

（第４実施形態）
本実施形態において、上記実施形態に示した電子装置１０と共通する部分についての説明は割愛する。 (Fourth embodiment)
In the present embodiment, the description of the parts common to the electronic device 10 shown in the above embodiment is omitted.

本実施形態の特徴は、第１端子４２ａの接点部４３ａは、第２方向において複数列とされ、第２端子４２ｂの接点部４３ａは、第２方向において第１端子と同数の複数列とされることにある。それ以外の点は、第１実施形態と同じである。   The feature of this embodiment is that the contact portions 43a of the first terminals 42a are in a plurality of rows in the second direction, and the contact portions 43a of the second terminals 42b are in the same number of rows as the first terminals in the second direction. There is to be. Other points are the same as in the first embodiment.

図１８〜図２０に示す例では、第１端子４２ａ及び第２端子４２ｂともに、第２方向において基板２０の端部に近い第１接点部４３ａ１と、第２接点部４３ａ２の２列配置となっている。具体的には、電極２１を第２方向において長い形状とし、第１接点部４３ａ１と第２接点部４３ａ２で接触位置をずらした。また、第１方向において、第１接点部４３ａ１と第２接点部４３ａ２を交互に設けた。   In the example shown in FIGS. 18 to 20, both the first terminal 42 a and the second terminal 42 b are arranged in two rows of the first contact portion 43 a 1 and the second contact portion 43 a 2 that are close to the end portion of the substrate 20 in the second direction. ing. Specifically, the electrode 21 has a long shape in the second direction, and the contact position is shifted between the first contact portion 43a1 and the second contact portion 43a2. In the first direction, the first contact portions 43a1 and the second contact portions 43a2 are alternately provided.

第２方向において接点部４３ａを１列とすると、第１ハウジング部４６と第２ハウジング部４７の組み付け時に第２方向の位置ずれが生じると、第１端子４２ａと第２端子４２ｂの接点部４３ａも第２方向で位置がずれるため、回転モーメントが発生する。これに対し、本実施形態に示すように接点部４３ａを第２方向において複数列とする、すなわち接点部４３ａにより押さえられる基板２０の幅を広くすると、回転モーメントを低減することができる。なお、接点部４３ａの配置は２列に限定されるものではなく、３列以上としても良い。   When the contact portions 43a are arranged in a row in the second direction, when the first housing portion 46 and the second housing portion 47 are assembled in the second direction, a contact portion 43a between the first terminal 42a and the second terminal 42b is generated. Since the position is shifted in the second direction, a rotational moment is generated. On the other hand, as shown in this embodiment, when the contact portions 43a are arranged in a plurality of rows in the second direction, that is, when the width of the substrate 20 pressed by the contact portions 43a is widened, the rotational moment can be reduced. In addition, arrangement | positioning of the contact part 43a is not limited to 2 rows, It is good also as 3 or more rows.

（第３変形例）
上記実施形態では、電極２１は第２方向において１列配置である例を示した。しかしながら、例えば図２１に示すように、電極２１を複数例（例えば２列）とし、これにより、接点部４３ａを、第１接点部４３ａ１と第２接点部４３ａ２の２列配置としても良い。 (Third Modification)
In the above embodiment, an example in which the electrodes 21 are arranged in one row in the second direction has been described. However, as shown in FIG. 21, for example, the electrodes 21 may be a plurality of examples (for example, two rows), and the contact portions 43a may be arranged in two rows of the first contact portions 43a1 and the second contact portions 43a2.

（第５実施形態）
本実施形態において、上記実施形態に示した電子装置１０と共通する部分についての説明は割愛する。 (Fifth embodiment)
In the present embodiment, the description of the parts common to the electronic device 10 shown in the above embodiment is omitted.

本実施形態の特徴は、第１ハウジング部４６及び第２ハウジング部４７は、板厚方向における筐体３０との対向部分にばね部６０をそれぞれ有している。そして、ばね部６０は、板厚方向に弾性変形しつつ筐体３０の内面３０ａにそれぞれ接触することにある。それ以外の点は、第１実施形態と同じである。   The feature of this embodiment is that the first housing portion 46 and the second housing portion 47 each have a spring portion 60 at a portion facing the housing 30 in the plate thickness direction. The spring portion 60 is in contact with the inner surface 30a of the housing 30 while being elastically deformed in the plate thickness direction. Other points are the same as in the first embodiment.

図２２及び図２３では、第２ハウジング部４７を例示している。ばね部６０は、第２ハウジング部４７の一部として、基部５１における第２壁部５２の突出面と反対の面、すなわち上面５１ｂに設けられている。また、ばね部６０は板厚方向に弾性変形可能に設けられており、複数のばね部６０が、第１方向に沿って配列されている。複数のばね部６０の形成範囲は、端子４２の配列範囲とほぼ一致している。なお、図示しないが、第１ハウジング部４６の延設部４９にも同様にばね部６０が形成されている。   22 and 23 illustrate the second housing part 47. The spring portion 60 is provided as a part of the second housing portion 47 on the surface of the base portion 51 opposite to the protruding surface of the second wall portion 52, that is, the upper surface 51b. Moreover, the spring part 60 is provided in the plate | board thickness direction so that elastic deformation is possible, and the some spring part 60 is arranged along the 1st direction. The formation range of the plurality of spring portions 60 substantially matches the arrangement range of the terminals 42. Although not shown, a spring portion 60 is similarly formed on the extending portion 49 of the first housing portion 46.

このような構成を採用すると、ハウジング４１のばね部６０によって、端子４２のばね力を補うことができる。すなわち、端子４２のばね力を小さくすることができるので、基板接続部４３の長さ（ばね長）を短くし、体格を小型化することができる。図２４（ａ）はばね部６０を有さない従来の端子４２を示し、図２４（ｂ）は本実施形態の端子４２を示している。したがって、圧入部４５よりも接点部４３ａ側が基板接続部４３である。このように、本実施形態によれば、端子４２の基板接続部４３を短くすることができる。   When such a configuration is employed, the spring force of the terminal 42 can be supplemented by the spring portion 60 of the housing 41. That is, since the spring force of the terminal 42 can be reduced, the length (spring length) of the board connecting portion 43 can be shortened, and the size can be reduced. FIG. 24A shows a conventional terminal 42 that does not have the spring portion 60, and FIG. 24B shows the terminal 42 of the present embodiment. Therefore, the contact portion 43 a side from the press-fit portion 45 is the substrate connection portion 43. Thus, according to the present embodiment, the board connecting portion 43 of the terminal 42 can be shortened.

例えば、図２４（ｂ）に示すように、基板接続部４３の先端に接触部４３ｄを設け、図２５に示すように、第１ハウジング部４６と第２ハウジング部４７を組み付ける前の状態で、接触部４３ｄが第２ハウジング部４７の受け面６１に接触する構成としても良い。この場合、端子４２は、圧入部４５と接触部４３ｄによって板厚方向への変位が制限され、組み付け時には、基板接続部４３のうち、接点部４３ａを含む一部分がわずかに撓む程度である。このため、ばね部６０が接圧の殆どを担うこととなる。なお、図２５では、第２ハウジング部４７側を例示するが、第１ハウジング部４６においても同様である。   For example, as shown in FIG. 24 (b), a contact portion 43d is provided at the tip of the substrate connecting portion 43, and as shown in FIG. 25, the first housing portion 46 and the second housing portion 47 are in a state before being assembled. The contact portion 43 d may be configured to contact the receiving surface 61 of the second housing portion 47. In this case, the displacement of the terminal 42 in the plate thickness direction is limited by the press-fit portion 45 and the contact portion 43d, and at the time of assembly, only a part of the board connection portion 43 including the contact portion 43a is bent slightly. For this reason, the spring part 60 will bear most of the contact pressure. FIG. 25 illustrates the second housing portion 47 side, but the same applies to the first housing portion 46.

また、ばね部６０を有さない構成では、経時的な応力緩和により、端子４２の接圧が低下するのを抑制するために、端子４２の材料として高価なもの、具体的には応力緩和しにくい耐熱用銅合金を採用している。これに対し、本実施形態では、ばね部６０によって経時的な応力緩和による接圧の低下を抑制することができるため、端子４２を従来よりも安い材料を用いて形成することができる。   Further, in the configuration without the spring portion 60, in order to suppress a decrease in contact pressure of the terminal 42 due to stress relaxation over time, an expensive material as the terminal 42, specifically, stress relaxation is performed. Uses heat-resistant copper alloy. On the other hand, in this embodiment, since the spring portion 60 can suppress a decrease in contact pressure due to stress relaxation over time, the terminal 42 can be formed using a material cheaper than the conventional one.

（第４変形例）
ハウジング４１がばね部６０を有する構成において、第２端子４２ｂの接触部４３ｄが、組み付け前の状態で、すでに第２ハウジング部４７の受け面６１に接触する例を示した。この場合、上記したように、基板接続部４３は、接点部４３ａを含む一部分が、板厚方向においてわずかに撓む程度であり、図８及び図９に示したようなワイピングの効果を望めない。したがって、ばね部６０を有する構成においても、図２６に示すように、第１ハウジング部４６と第２ハウジング部４７の組み付け前の状態で、第２端子４２ｂの接点部４３ａ及び先端部４３ｂが、第２ハウジング部４７に接触しない構成とすると良い。このようにすると、図８及び図９に示したように、第１ハウジング部４６と第２ハウジング部４７の組み付け時に、ワイピングすることができる。なお、図２７では、第１ハウジング部４６と第２ハウジング部４７の組み付けた状態で、第２端子４２ｂの接触部４３ｄが第２ハウジング部４７の受け面６１に接触している。図２７に示す破線は、図２６に示す接点部４３ａの位置を示している。このような構成では、図２８に示すように、コネクタ組み付け時、すなわち第１ハウジング部４６と第２ハウジング部４７の組み付け時に、板厚方向において端子４２が弾性変形し、端子４２によっても所定の接圧（接触加重）を確保することができる。また、筐体３０を組み付ける際に、第１方向に並設された複数のばね部６０が、板厚方向に弾性変形するため、ばね部６０によって接圧を大きく稼ぐことができる。換言すれば、端子４２のばね力はワイピングできる分とし、ワイピング完了後は、ばね部６０で接圧を確保することができる。 (Fourth modification)
In the configuration in which the housing 41 has the spring portion 60, the example in which the contact portion 43d of the second terminal 42b is already in contact with the receiving surface 61 of the second housing portion 47 in a state before assembly is shown. In this case, as described above, the substrate connecting portion 43 is such that a part including the contact portion 43a is slightly bent in the thickness direction, and the wiping effect as shown in FIGS. 8 and 9 cannot be expected. . Therefore, even in the configuration having the spring part 60, as shown in FIG. 26, the contact part 43a and the tip part 43b of the second terminal 42b are in the state before the first housing part 46 and the second housing part 47 are assembled. A configuration that does not contact the second housing portion 47 is preferable. If it does in this way, as shown in FIG.8 and FIG.9, at the time of the assembly | attachment of the 1st housing part 46 and the 2nd housing part 47, it can wipe. In FIG. 27, the contact portion 43 d of the second terminal 42 b is in contact with the receiving surface 61 of the second housing portion 47 in a state where the first housing portion 46 and the second housing portion 47 are assembled. The broken line shown in FIG. 27 indicates the position of the contact part 43a shown in FIG. In such a configuration, as shown in FIG. 28, when the connector is assembled, that is, when the first housing portion 46 and the second housing portion 47 are assembled, the terminal 42 is elastically deformed in the plate thickness direction, and the terminal 42 also has a predetermined amount. Contact pressure (contact load) can be secured. Further, when the housing 30 is assembled, the plurality of spring portions 60 arranged in parallel in the first direction are elastically deformed in the plate thickness direction, so that the contact pressure can be greatly increased by the spring portions 60. In other words, the spring force of the terminal 42 is set to an amount that can be wiped, and the contact pressure can be secured by the spring portion 60 after the wiping is completed.

なお、図２７では、第１ハウジング部４６と第２ハウジング部４７の組み付け時に、第２端子４２ｂの接触部４３ｄが第２ハウジング部４７の受け面６１に接触する例を示したが、第１実施形態などで示したように、組み付け後も接点部４３ａ及び先端部４３ｂが第２ハウジング部４７に接触しない構成としても良い。また、上記例では、第２ハウジング部４７側を示したが、第１ハウジング部４６においても同様である。   27 shows an example in which the contact portion 43d of the second terminal 42b contacts the receiving surface 61 of the second housing portion 47 when the first housing portion 46 and the second housing portion 47 are assembled. As shown in the embodiment, the contact portion 43a and the tip portion 43b may not contact the second housing portion 47 even after assembly. In the above example, the second housing portion 47 side is shown, but the same applies to the first housing portion 46.

以上、本発明の好ましい実施形態について説明したが、本発明は上述した実施形態になんら制限されることなく、本発明の主旨を逸脱しない範囲において、種々変形して実施することが可能である。   The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

１０・・・電子装置、２０・・・基板、２０ａ・・・一面、２０ｂ・・・裏面、２１・・・電極、２１ａ・・・第１電極、２１ｂ・・・第２電極、２２・・・縁部、３０・・・筺体、３０ａ・・・内面、３１・・・開口部、３２・・・内部空間、３３・・・拡径部、３４・・・縮径部、３５・・・テーパ部、４０・・・コネクタ、４１・・・ハウジング、４２・・・端子、４２ａ・・・第１端子、４２ｂ・・・第２端子、４３・・・基板接続部、４３ａ・・・接点部、４３ａ１・・・第１接点部、４３ａ２・・・第２接点部、４３ｂ・・・先端部、４３ｃ・・・繋ぎ部、４３ｄ・・・接触部、４４・・・外部接続部、４５・・・圧入部、４６・・・第１ハウジング部、４７・・・第２ハウジング部、４６ａ，４７ａ・・・分割面、４８・・・筒状部、４８ａ・・・仕切部、４９・・・延設部、４９ａ・・・庇部、５０・・・第１壁部、５０ａ・・・前面、５１・・・基部、５１ａ・・・庇部、５１ｂ・・・上面、５２・・・第２壁部、５２ａ・・・前面、５３・・・嵌合空間、５４・・・スナップフィット、５５・・・凸部、５６・・・凹部、５７・・・保持部、５７ａ，５７ｂ・・・係止部、５８・・・テーパ部、５９・・・凸部、５９ａ，５９ｂ・・・側面、６０・・・ばね部、６１・・・受け面、７０・・・防水部材、１００・・・外部コネクタ、１０１・・・ハウジング、１０１ａ・・・前面、１０１ｂ・・・側面、１０１ｃ・・・後面、１０２・・・孔、１０３・・・コンタクト、１０４・・・ワイヤーハーネス、１０５，１０７・・・防水部材、１０６・・・溝部、１０８・・・蓋部、 DESCRIPTION OF SYMBOLS 10 ... Electronic device, 20 ... Substrate, 20a ... One side, 20b ... Back side, 21 ... Electrode, 21a ... First electrode, 21b ... Second electrode, 22 ... -Edge part, 30 ... Housing, 30a ... Inner surface, 31 ... Opening part, 32 ... Inner space, 33 ... Expanded diameter part, 34 ... Reduced diameter part, 35 ... Tapered part, 40 ... connector, 41 ... housing, 42 ... terminal, 42a ... first terminal, 42b ... second terminal, 43 ... substrate connection part, 43a ... contact Part, 43a1 ... first contact part, 43a2 ... second contact part, 43b ... tip part, 43c ... connecting part, 43d ... contact part, 44 ... external connection part, 45 ... Press-fit part, 46 ... First housing part, 47 ... Second housing part, 46a, 47a ... Dividing surface, 48 ... 48a ... partitioning part, 49 ... extension part, 49a ... collar part, 50 ... first wall part, 50a ... front face, 51 ... base part, 51a ... The collar part, 51b ... upper surface, 52 ... second wall part, 52a ... front surface, 53 ... fitting space, 54 ... snap fit, 55 ... convex part, 56 ... Recessed portion 57... Holding portion 57 a and 57 b. Locking portion 58. Tapered portion 59. Convex portion 59 a and 59 b Side surface 60. Spring portion 61. ..Receiving surface, 70: waterproof member, 100: external connector, 101: housing, 101a ... front surface, 101b ... side surface, 101c ... rear surface, 102 ... hole, 103 ... Contact, 104 ... Wire harness, 105,107 ... Waterproof member, 106 ... Groove, 1 8 ... the lid,

Claims (13)

両面（２０ａ，２０ｂ）に電極（２１）を有する基板（２０）と、
開口部（３１）を有し、前記基板（２０）を収容する袋形状の筐体（３０）と、
合成樹脂材料を用いて形成されたハウジング（４１）と、導電材料を用いて形成されるとともに前記ハウジング（４１）に保持され、前記ハウジング（４１）から前記基板（２０）が収容された前記筐体（３０）の内部空間（３２）に突出する基板接続部（４３）、及び、前記ハウジング（４１）から前記内部空間（３２）と反対の嵌合空間（５３）に突出する外部接続部（４４）を備える複数の端子（４２）と、有するコネクタ（４０）と、
前記筐体（３０）と前記ハウジング（４１）との間に配置され、前記筐体（３０）と前記ハウジング（４１）との間から前記内部空間（３２）に水分が侵入するのを抑制する防水部材（７０）と、を備え、
前記電極（２１）は、前記基板の一面（２０ａ）に配置された複数の第１電極（２１ａ）と、前記一面（２０ａ）と反対の裏面（２０ｂ）に配置された複数の第２電極（２１ｂ）と、を有し、
複数の前記端子（４２）は、前記第１電極（２１ａ）に接触する複数の第１端子（４２ａ）と、前記第２電極（２１ｂ）に接触する複数の第２端子（４２ｂ）と、を有し、
前記基板（２０）の両面（２０ａ，２０ｂ）において前記電極（２１）に前記端子（４２）が接触することで、前記電極（２１）と前記端子（４２）とが電気的に接続されるとともに、前記第１端子（４２ａ）と前記第２端子（４２ｂ）の間に前記基板（２０）が保持され、
前記ハウジング（４１）は、少なくとも一部が前記筐体（３０）の内面（３０ａ）全周に沿って配置される筒状部（４８）と、該筒状部（４８）における前記内部空間（３２）側の端部から延設され、前記筐体（３０）に収容される延設部（４９）と、前記延設部（４９）の内面から突出する第１壁部（５０）と、を有する第１ハウジング部（４６）と、前記第１ハウジング部（４６）に対して前記基板（２０）の板厚方向に組み付けられ、前記第１ハウジング部（４６）とともに前記ハウジング（４１）をなすものであって、組み付けた状態で前記延設部（４９）とともに前記筒状部（４８）に連なる筒をなし、前記筐体（３０）に収容される基部（５１）と、前記基部（５１）の内面から突出する第２壁部（５２）と、を有する第２ハウジング部（４７）と、を有し、
前記第１壁部（５０）及び前記第２壁部（５２）により、前記内部空間（３２）と前記嵌合空間（５３）とが区画され、
前記第１壁部（５０）に前記第１端子（４２ａ）が保持されるとともに、前記第２壁部（５２）に前記第２端子（４２ｂ）が保持されて、複数の前記端子（４２）の外部接続部（４４）が、前記ハウジング（４１）における前記嵌合空間（５３）側の共通の筒内に配置され、
前記防水部材（７０）は、前記筒状部（４８）と前記筐体（３０）との間に介在されることを特徴とする電子装置。 A substrate (20) having electrodes (21) on both sides (20a, 20b);
A bag-shaped housing (30) having an opening (31) and accommodating the substrate (20);
A housing (41) formed using a synthetic resin material, and the housing formed using a conductive material and held in the housing (41), in which the substrate (20) is accommodated from the housing (41). A board connecting part (43) protruding into the internal space (32) of the body (30) and an external connecting part (53) protruding from the housing (41) into the fitting space (53) opposite to the internal space (32) 44) a plurality of terminals (42) having a connector (40);
It arrange | positions between the said housing | casing (30) and the said housing (41), and suppresses that a water | moisture content penetrate | invades into the said internal space (32) from between the said housing | casing (30) and the said housing (41). A waterproof member (70),
The electrode (21) includes a plurality of first electrodes (21a) disposed on one surface (20a) of the substrate and a plurality of second electrodes (20b) disposed on the back surface (20b) opposite to the one surface (20a). 21b)
The plurality of terminals (42) include a plurality of first terminals (42a) in contact with the first electrode (21a) and a plurality of second terminals (42b) in contact with the second electrode (21b). Have
When the terminal (42) is in contact with the electrode (21) on both surfaces (20a, 20b) of the substrate (20), the electrode (21) and the terminal (42) are electrically connected. The substrate (20) is held between the first terminal (42a) and the second terminal (42b),
The housing (41) includes at least a part of the cylindrical part (48) disposed along the entire circumference of the inner surface (30a) of the housing (30), and the internal space in the cylindrical part (48) ( 32) an extended portion (49) extending from the end on the side and housed in the housing (30), a first wall portion (50) protruding from the inner surface of the extended portion (49), A first housing part (46) having the following structure: assembled to the first housing part (46) in the thickness direction of the substrate (20), and the housing (41) together with the first housing part (46). be one to name, a tubular continuous with the tubular portion (48) wherein with extended portion (49) in a state where the assembled, a base (51) which is accommodated in the housing (30), said base second wall portion projecting from the inner surface (51) and (52), second Howe having A ring portion (47), a
The internal space (32) and the fitting space (53) are partitioned by the first wall portion (50) and the second wall portion (52),
The first terminal (42a) is held on the first wall (50) , and the second terminal (42b) is held on the second wall (52 ). Are disposed in a common cylinder on the side of the fitting space (53) in the housing (41),
The electronic device according to claim 1, wherein the waterproof member (70) is interposed between the tubular portion (48) and the housing (30). 前記コネクタ（４０）は、少なくとも前記第１ハウジング部（４６）と前記第２ハウジング部（４７）を組み付ける前の状態で、前記第１ハウジング部（４６）及び前記第２ハウジング部（４７）の一方における所定位置に前記基板（２０）を保持する保持部（５７）を有することを特徴とする請求項１に記載の電子装置。   The connector (40) has at least the first housing part (46) and the second housing part (47) in a state before assembling the first housing part (46) and the second housing part (47). The electronic device according to claim 1, further comprising a holding portion (57) that holds the substrate (20) at a predetermined position on one side. 両面（２０ａ，２０ｂ）に電極（２１）を有する基板（２０）と、
開口部（３１）を有し、前記基板（２０）を収容する袋形状の筐体（３０）と、
合成樹脂材料を用いて形成されたハウジング（４１）と、導電材料を用いて形成されるとともに前記ハウジング（４１）に保持され、前記ハウジング（４１）から前記基板（２０）が収容された前記筐体（３０）の内部空間（３２）に突出する基板接続部（４３）、及び、前記ハウジング（４１）から前記内部空間（３２）と反対の外部（５３）に突出する外部接続部（４４）を備える複数の端子（４２）と、有するコネクタ（４０）と、
前記筐体（３０）と前記ハウジング（４１）との間に配置され、前記筐体（３０）と前記ハウジング（４１）との間から前記内部空間（３２）に水分が侵入するのを抑制する防水部材（７０）と、を備え、
前記電極（２１）は、前記基板の一面（２０ａ）に配置された複数の第１電極（２１ａ）と、前記一面（２０ａ）と反対の裏面（２０ｂ）に配置された複数の第２電極（２１ｂ）と、を有し、
前記端子（４２）は、前記第１電極（２１ａ）に接触する複数の第１端子（４２ａ）と、前記第２電極（２１ｂ）に接触する複数の第２端子（４２ｂ）と、を有し、
前記基板（２０）の両面（２０ａ，２０ｂ）において前記電極（２１）に前記端子（４２）が接触することで、前記電極（２１）と前記端子（４２）とが電気的に接続されるとともに、前記第１端子（４２ａ）と前記第２端子（４２ｂ）の間に前記基板（２０）が保持され、
前記ハウジング（４１）は、少なくとも一部が前記筐体（３０）の内面（３０ａ）全周に沿って配置される筒状部（４８）と、該筒状部（４８）における前記内部空間（３２）側の端部から延設され、前記筐体（３０）に収容される延設部（４９）と、を有する第１ハウジング部（４６）と、前記第１ハウジング部（４６）に対して前記基板（２０）の板厚方向に組み付けられ、前記第１ハウジング部（４６）とともに前記ハウジング（４１）をなす第２ハウジング部（４７）と、を有し、
前記第１ハウジング部（４６）に前記第１端子（４２ａ）が保持されるとともに、前記第２ハウジング部（４７）に前記第２端子（４２ｂ）が保持されており、
前記防水部材（７０）は、前記筒状部（４８）と前記筐体（３０）との間に介在され、
前記コネクタ（４０）は、少なくとも前記第１ハウジング部（４６）と前記第２ハウジング部（４７）を組み付ける前の状態で、前記第１ハウジング部（４６）及び前記第２ハウジング部（４７）の一方における所定位置に前記基板（２０）を保持する保持部（５７）を有することを特徴とする電子装置。 A substrate (20) having electrodes (21) on both sides (20a, 20b);
A bag-shaped housing (30) having an opening (31) and accommodating the substrate (20);
A housing (41) formed using a synthetic resin material, and the housing formed using a conductive material and held in the housing (41), in which the substrate (20) is accommodated from the housing (41). A board connection part (43) protruding into the internal space (32) of the body (30) and an external connection part (44) protruding from the housing (41) to the outside (53) opposite to the internal space (32). A plurality of terminals (42) comprising: a connector (40) comprising:
It arrange | positions between the said housing | casing (30) and the said housing (41), and suppresses that a water | moisture content penetrate | invades into the said internal space (32) from between the said housing | casing (30) and the said housing (41). A waterproof member (70),
The electrode (21) includes a plurality of first electrodes (21a) disposed on one surface (20a) of the substrate and a plurality of second electrodes (20b) disposed on the back surface (20b) opposite to the one surface (20a). 21b)
The terminal (42) has a plurality of first terminals (42a) in contact with the first electrode (21a) and a plurality of second terminals (42b) in contact with the second electrode (21b). ,
When the terminal (42) is in contact with the electrode (21) on both surfaces (20a, 20b) of the substrate (20), the electrode (21) and the terminal (42) are electrically connected. The substrate (20) is held between the first terminal (42a) and the second terminal (42b),
The housing (41) includes at least a part of the cylindrical part (48) disposed along the entire circumference of the inner surface (30a) of the housing (30), and the internal space ( 32) a first housing part (46) having an extension part (49) that extends from the end on the side and is accommodated in the housing (30), and the first housing part (46) A second housing part (47) assembled in the thickness direction of the substrate (20) and forming the housing (41) together with the first housing part (46),
The first terminal (42a) is held by the first housing part (46), and the second terminal (42b) is held by the second housing part (47),
The waterproof member (70) is interposed between the tubular portion (48) and the housing (30) ,
The connector (40) has at least the first housing part (46) and the second housing part (47) in a state before assembling the first housing part (46) and the second housing part (47). electronic device according to claim Rukoto that having a holding portion (57) for holding the substrate (20) in position on one. 前記保持部（５７）は、前記第１ハウジング部（４６）及び前記第２ハウジング部（４７）の一方に設けられた係止部（５７ａ）と、該係止部（５７ａ）を有する前記ハウジング部に保持された前記端子（４２）により構成されるとともに、前記端子（４２）のばね力により、前記係止部（５７ａ）と前記端子（４２）の間で前記基板（２０）を挟持し、
前記第１ハウジング部（４６）と前記第２ハウジング部（４７）を組み付けた状態で、前記係止部（５７ａ）は、前記基板（２０）に対して離間されることを特徴とする請求項２又は請求項３に記載の電子装置。 The holding portion (57) includes a locking portion (57a) provided on one of the first housing portion (46) and the second housing portion (47), and the housing having the locking portion (57a). The substrate (20) is held between the locking portion (57a) and the terminal (42) by the spring force of the terminal (42). ,
Wherein in a first state in which the assembled housing unit and the second housing portion (46) to (47), the locking portion (57a) is claim, characterized in that it is spaced the relative substrate (20) The electronic device according to claim 2 or claim 3 . 前記第１ハウジング部（４６）と前記第２ハウジング部（４７）との分割面（４６ａ，４７ａ）は、全周で隙間なく合わさり、
前記ハウジング（４１）は、前記内部空間（３２）を蓋することを特徴とする請求項１〜４いずれか１項に記載の電子装置。 The dividing surfaces (46a, 47a) of the first housing part (46) and the second housing part (47) are joined together without any gaps on the entire circumference,
The electronic device according to claim 1 , wherein the housing (41) covers the internal space (32). 前記基板接続部（４３）は、前記電極（２１）に接触する接点部（４３ａ）と、該接点部（４３ａ）よりも先端側の部分である先端部（４３ｂ）と、前記端子（４２）におけるハウジング（４１）に保持された圧入部（４５）と前記接点部（４３ａ）とを繋ぐ繋ぎ部（４３ｃ）と、を有し、
複数の前記端子（４２）は、前記板厚方向に直交する第１方向に沿って配置されており、
前記接点部（４３ａ）は、前記板厚方向及び前記第１方向の両方向に直交する第２方向において、前記圧入部（４５）と異なる位置とされるとともに、前記板厚方向において、前記圧入部（４５）よりも前記基板（２０）に近い位置とされ、
前記繋ぎ部（４３ｃ）の前記接点部（４３ａ）から少なくとも一部と前記基板（２０）の一面（２０ａ）又は裏面（２０ｂ）とのなす角は鋭角とされ、
前記先端部（４３ｂ）は、少なくとも前記第１ハウジング部（４６）と前記第２ハウジング部（４７）を組み付ける前の状態で、保持されている前記ハウジング部に対して離間することを特徴とする請求項１〜５いずれか１項に記載の電子装置。 The board connection part (43) includes a contact part (43a) that contacts the electrode (21), a tip part (43b) that is a part on the tip side of the contact part (43a), and the terminal (42). A press-fitting part (45) held in the housing (41) and a connecting part (43c) connecting the contact part (43a),
The plurality of terminals (42) are arranged along a first direction orthogonal to the plate thickness direction,
The contact portion (43a) is located at a position different from the press-fit portion (45) in a second direction perpendicular to both the plate thickness direction and the first direction, and the press-fit portion in the plate thickness direction. It is a position closer to the substrate (20) than (45),
An angle formed by at least a part of the connecting portion (43c) from the contact portion (43a) and one surface (20a) or the back surface (20b) of the substrate (20) is an acute angle,
The tip portion (43b) is separated from the held housing portion at least before the first housing portion (46) and the second housing portion (47) are assembled. The electronic device according to claim 1 . 前記第１ハウジング部（４６）と前記第２ハウジング部（４７）とは、スナップフィット（５４）により組み付けられることを特徴とする請求項１〜６いずれか１項に記載の電子装置。 The electronic device according to any one of claims 1 to 6, wherein the first housing part (46) and the second housing part (47) are assembled by a snap fit (54). 前記筐体（３０）は、前記開口部（３１）から所定範囲の部分であり、開口面積の大きい拡径部（３３）と、該拡径部（３３）よりも開口面積の小さい縮径部（３４）と、前記拡径部（３３）と前記縮径部（３４）を繋ぐテーパ部（３５）と、を有し、
前記第１ハウジング部（４６）と前記第２ハウジング部（４７）は、それぞれ前記テーパ部（３５）に接触して組み付けられることを特徴とする請求項１〜６いずれか１項に記載の電子装置。 The housing (30) is a portion within a predetermined range from the opening (31), and has a large diameter portion (33) having a large opening area and a reduced diameter portion having a smaller opening area than the large diameter portion (33). (34) and a tapered portion (35) connecting the enlarged diameter portion (33) and the reduced diameter portion (34),
The electron according to any one of claims 1 to 6, wherein the first housing part (46) and the second housing part (47) are assembled in contact with the tapered part (35), respectively. apparatus. 両面（２０ａ，２０ｂ）に電極（２１）を有する基板（２０）と、
開口部（３１）を有し、前記基板（２０）を収容する袋形状の筐体（３０）と、
合成樹脂材料を用いて形成されたハウジング（４１）と、導電材料を用いて形成されるとともに前記ハウジング（４１）に保持され、前記ハウジング（４１）から前記基板（２０）が収容された前記筐体（３０）の内部空間（３２）に突出する基板接続部（４３）、及び、前記ハウジング（４１）から前記内部空間（３２）と反対の外部（５３）に突出する外部接続部（４４）を備える複数の端子（４２）と、有するコネクタ（４０）と、
前記筐体（３０）と前記ハウジング（４１）との間に配置され、前記筐体（３０）と前記ハウジング（４１）との間から前記内部空間（３２）に水分が侵入するのを抑制する防水部材（７０）と、を備え、
前記電極（２１）は、前記基板の一面（２０ａ）に配置された複数の第１電極（２１ａ）と、前記一面（２０ａ）と反対の裏面（２０ｂ）に配置された複数の第２電極（２１ｂ）と、を有し、
前記端子（４２）は、前記第１電極（２１ａ）に接触する複数の第１端子（４２ａ）と、前記第２電極（２１ｂ）に接触する複数の第２端子（４２ｂ）と、を有し、
前記基板（２０）の両面（２０ａ，２０ｂ）において前記電極（２１）に前記端子（４２）が接触することで、前記電極（２１）と前記端子（４２）とが電気的に接続されるとともに、前記第１端子（４２ａ）と前記第２端子（４２ｂ）の間に前記基板（２０）が保持され、
前記ハウジング（４１）は、少なくとも一部が前記筐体（３０）の内面（３０ａ）全周に沿って配置される筒状部（４８）と、該筒状部（４８）における前記内部空間（３２）側の端部から延設され、前記筐体（３０）に収容される延設部（４９）と、を有する第１ハウジング部（４６）と、前記第１ハウジング部（４６）に対して前記基板（２０）の板厚方向に組み付けられ、前記第１ハウジング部（４６）とともに前記ハウジング（４１）をなす第２ハウジング部（４７）と、を有し、
前記第１ハウジング部（４６）に前記第１端子（４２ａ）が保持されるとともに、前記第２ハウジング部（４７）に前記第２端子（４２ｂ）が保持されており、
前記防水部材（７０）は、前記筒状部（４８）と前記筐体（３０）との間に介在され、
前記筐体（３０）は、前記開口部（３１）から所定範囲の部分であり、開口面積の大きい拡径部（３３）と、該拡径部（３３）よりも開口面積の小さい縮径部（３４）と、前記拡径部（３３）と前記縮径部（３４）を繋ぐテーパ部（３５）と、を有し、
前記第１ハウジング部（４６）と前記第２ハウジング部（４７）は、それぞれ前記テーパ部（３５）に接触して組み付けられることを特徴とする電子装置。 A substrate (20) having electrodes (21) on both sides (20a, 20b);
A bag-shaped housing (30) having an opening (31) and accommodating the substrate (20);
A housing (41) formed using a synthetic resin material, and the housing formed using a conductive material and held in the housing (41), in which the substrate (20) is accommodated from the housing (41). A board connection part (43) protruding into the internal space (32) of the body (30) and an external connection part (44) protruding from the housing (41) to the outside (53) opposite to the internal space (32). A plurality of terminals (42) comprising: a connector (40) comprising:
It arrange | positions between the said housing | casing (30) and the said housing (41), and suppresses that a water | moisture content penetrate | invades into the said internal space (32) from between the said housing | casing (30) and the said housing (41). A waterproof member (70),
The electrode (21) includes a plurality of first electrodes (21a) disposed on one surface (20a) of the substrate and a plurality of second electrodes (20b) disposed on the back surface (20b) opposite to the one surface (20a). 21b)
The terminal (42) has a plurality of first terminals (42a) in contact with the first electrode (21a) and a plurality of second terminals (42b) in contact with the second electrode (21b). ,
When the terminal (42) is in contact with the electrode (21) on both surfaces (20a, 20b) of the substrate (20), the electrode (21) and the terminal (42) are electrically connected. The substrate (20) is held between the first terminal (42a) and the second terminal (42b),
The housing (41) includes at least a part of the cylindrical part (48) disposed along the entire circumference of the inner surface (30a) of the housing (30), and the internal space in the cylindrical part (48) ( 32) a first housing part (46) having an extension part (49) that extends from the end on the side and is accommodated in the housing (30), and the first housing part (46) A second housing part (47) assembled in the thickness direction of the substrate (20) and forming the housing (41) together with the first housing part (46),
The first terminal (42a) is held by the first housing part (46), and the second terminal (42b) is held by the second housing part (47),
The waterproof member (70) is interposed between the tubular portion (48) and the housing (30) ,
The housing (30) is a portion within a predetermined range from the opening (31), and has a large diameter portion (33) having a large opening area and a reduced diameter portion having a smaller opening area than the large diameter portion (33). (34) and a tapered portion (35) connecting the enlarged diameter portion (33) and the reduced diameter portion (34),
Wherein said first housing part (46) the second housing part (47) is an electronic device according to claim Rukoto assembled in contact with each of said tapered portion (35). 前記第１ハウジング部（４６）と前記第２ハウジング部（４７）との分割面（４６ａ，４７ａ）は、全周で隙間なく合わさり、
前記ハウジング（４１）は、前記内部空間（３２）を蓋することを特徴とする請求項９に記載の電子装置。 The dividing surfaces (46a, 47a) of the first housing part (46) and the second housing part (47) are joined together without any gaps on the entire circumference,
10. The electronic device according to claim 9 , wherein the housing (41) covers the internal space (32). 前記基板接続部（４３）は、前記電極（２１）に接触する接点部（４３ａ）と、該接点部（４３ａ）よりも先端側の部分である先端部（４３ｂ）と、前記端子（４２）におけるハウジング（４１）に保持された圧入部（４５）と前記接点部（４３ａ）とを繋ぐ繋ぎ部（４３ｃ）と、を有し、
複数の前記端子（４２）は、前記板厚方向に直交する第１方向に沿って配置されており、
前記接点部（４３ａ）は、前記板厚方向及び前記第１方向の両方向に直交する第２方向において、前記圧入部（４５）と異なる位置とされるとともに、前記板厚方向において、前記圧入部（４５）よりも前記基板（２０）に近い位置とされ、
前記繋ぎ部（４３ｃ）の前記接点部（４３ａ）から少なくとも一部と前記基板（２０）の一面（２０ａ）又は裏面（２０ｂ）とのなす角は鋭角とされ、
前記先端部（４３ｂ）は、少なくとも前記第１ハウジング部（４６）と前記第２ハウジング部（４７）を組み付ける前の状態で、保持されている前記ハウジング部に対して離間することを特徴とする請求項９又は請求項１０に記載の電子装置。 The board connection part (43) includes a contact part (43a) that contacts the electrode (21), a tip part (43b) that is a part on the tip side of the contact part (43a), and the terminal (42). A press-fitting part (45) held in the housing (41) and a connecting part (43c) connecting the contact part (43a),
The plurality of terminals (42) are arranged along a first direction orthogonal to the plate thickness direction,
The contact portion (43a) is located at a position different from the press-fit portion (45) in a second direction perpendicular to both the plate thickness direction and the first direction, and the press-fit portion in the plate thickness direction. It is a position closer to the substrate (20) than (45),
An angle formed by at least a part of the connecting portion (43c) from the contact portion (43a) and one surface (20a) or the back surface (20b) of the substrate (20) is an acute angle,
The tip portion (43b) is separated from the held housing portion at least before the first housing portion (46) and the second housing portion (47) are assembled. The electronic device according to claim 9 or 10 . 複数の前記第１端子（４２ａ）及び複数の前記第２端子（４２ｂ）は、それぞれ前記板厚方向に直交する第１方向に沿って配置され、
前記第１端子（４２ａ）の接点部（４３ａ）は、前記板厚方向及び前記第１方向の両方向に直交する第２方向において複数列とされ、
前記第２端子（４２ｂ）の接点部（４３ａ）は、前記第２方向において前記第１端子と同数の複数列とされることを特徴とする請求項１〜１１いずれか１項に記載の電子装置。 The plurality of first terminals (42a) and the plurality of second terminals (42b) are respectively disposed along a first direction orthogonal to the plate thickness direction,
The contact portions (43a) of the first terminal (42a) are arranged in a plurality of rows in a second direction orthogonal to both the plate thickness direction and the first direction,
12. The electron according to claim 1 , wherein the contact portions (43 a) of the second terminal (42 b) are arranged in a plurality of rows of the same number as the first terminal in the second direction. apparatus. 前記第１ハウジング部（４６）及び前記第２ハウジング部（４７）は、前記板厚方向における前記筐体（３０）との対向部分にばね部（６０）をそれぞれ有し、
前記ばね部（６０）は、前記板厚方向に弾性変形しつつ前記筐体（３０）の内面（３０ａ）にそれぞれ接触することを特徴とする請求項１〜１２いずれか１項に記載の電子装置。 The first housing part (46) and the second housing part (47) each have a spring part (60) at a portion facing the housing (30) in the plate thickness direction,
The electron according to any one of claims 1 to 12, wherein the spring portion (60) contacts the inner surface (30a) of the housing (30) while being elastically deformed in the plate thickness direction. apparatus.
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JPH09237662A (en) * 1996-02-29 1997-09-09 Matsushita Electric Works Ltd Terminal device
JP2003178834A (en) 2001-12-12 2003-06-27 Sumitomo Wiring Syst Ltd Card edge connector
JP4223525B2 (en) * 2005-10-27 2009-02-12 山一電機株式会社 Plug connector
JP4948574B2 (en) 2009-07-24 2012-06-06 株式会社デンソー Card edge connector and assembly method thereof

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DE102013220543B4 (en) 2022-09-29
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