CN105385412A - Grinding fluid, grinding fluid preparation process and grinding fluid using and adding method - Google Patents

Grinding fluid, grinding fluid preparation process and grinding fluid using and adding method Download PDF

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Publication number
CN105385412A
CN105385412A CN201510667713.8A CN201510667713A CN105385412A CN 105385412 A CN105385412 A CN 105385412A CN 201510667713 A CN201510667713 A CN 201510667713A CN 105385412 A CN105385412 A CN 105385412A
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CN
China
Prior art keywords
lapping liquid
lapping
grinding fluid
stirrer
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510667713.8A
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Chinese (zh)
Inventor
莫宗均
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhuhai Dongjin Quartz Technology Co Ltd
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Zhuhai Dongjin Quartz Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Zhuhai Dongjin Quartz Technology Co Ltd filed Critical Zhuhai Dongjin Quartz Technology Co Ltd
Priority to CN201510667713.8A priority Critical patent/CN105385412A/en
Publication of CN105385412A publication Critical patent/CN105385412A/en
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents

Abstract

The present invention discloses grinding fluid, a grinding fluid preparation process and a grinding fluid using and adding method. A formula of the grinding fluid comprises the following components in percentage by weight: 72% of water, 25.6% of green silicon carbide and 2.4% of anti-rust grinding oil. According to the grinding fluid preparation process, the components are mixed and stirred for 6 hours and then are filtered to obtain a product; and the grinding fluid using and adding method is mainly used for detecting the specific gravity value of sand liquid and adding new grinding fluid; and after 10 days, the grinding fluid is changed into new grinding fluid thoroughly. The grinding fluid disclosed by the present invention has the advantages of good grinding effect, low cost, no harm to health of workers, good quality of the machined product, simplicity in preparation and easiness in use.

Description

The use addition means of lapping liquid, lapping liquid preparation technology and lapping liquid
Technical field
The present invention relates to quartz wafer Technology field, particularly relate to the use addition means of lapping liquid, lapping liquid preparation technology and lapping liquid.
Background technology
The proportioning of the lapping liquid of current production plant according to: SiC(3000#): water: NaNO 2: (HOCH 2cH 2) 3n=30kg:90L:0.5kg:0.5L, by the use in more than 6 hours of the abundant churning time of agitation vat; Lapping liquid is changed and is once used 72 ~ 84 hours; Grinding operation work Long contact time lapping liquid, the NaNO in lapping liquid 2certain negative interaction is had to human body; 72 ~ 84 hours replacement cycles of lapping liquid are all changed, and find in process of production, along with (the HOCH in process period longer sand liquid 2cH 2) 3n volatilizees thereupon, causes the inadequate sand liquid of the suspension of lapping liquid easily to precipitate; The lapping liquid processing product of first 20 hours of new preparation is found by following the tracks of related data, bigger than normal through measuring scattered error value, and processing is better than the scattered error of section processing At All Other Times at the product scattered error of 20 ~ 60 hour this time period, processing increased in the process period of 60 ~ 84 hour this time period thereupon, efficiency step-down, and the scattered error value of product increases gradually; Found by the test under microscope product appearances of 100 times, processing in first 20 hours variant with the product surface roughness of process for latter 72 hours, the surface processed for first 20 hours is more coarse, and the surface of 72 hours post-treatment is thinner; Aberration is produced again different by corrosion latter two wafer surface.Current quartz wafer production and processing technology is ripe, stable gradually, and along with Market competition, enterprises only has and reduces costs by all means, improves state of the art, improves the quality of products, just can obtain market, obtain better market.The wafer processed with 60 ~ 84H that 0 ~ 20H processes by the wafer before research and development, after corroding, watch outward appearance, there is heterochromatic problem in wafer surface, after research and development by the wafer behind the 2nd day and processing in the 10th day by seeing that outward appearance finds no heterochromatic problem after corrosion.
Summary of the invention
Technical problem to be solved by this invention overcomes the deficiencies in the prior art, provides the use addition means of lapping liquid, lapping liquid preparation technology and lapping liquid, have grinding effect good, cost is low, do not injure the healthy of staff, product to be processed quality is good, configures simple and easy to use.
The technical solution adopted in the present invention is:
Lapping liquid, is characterized in that, the weight part ratio of described lapping liquid formula is: water 72%, green silicon carbide 25.6% and antirust lapping oil 2.4%.
Further, described lapping liquid formula is: water is 90L, and green silicon carbide is 32KG and antirust lapping oil 3L.
Lapping liquid preparation technology, it comprises the following steps:
A1, open the bung of stirrer, in the bucket of stirrer, add the water of 90L;
A2, startup stirrer, and the mixing speed of stirrer is adjusted between 147 revs/min-153 revs/min;
A3, the green silicon carbide of 32KG slowly to be poured in the bucket of stirrer;
A4, the antirust lapping oil of 3L slowly to be poured in the bucket of stirrer, make water, green silicon carbide and the abundant mix and blend of antirust lapping oil;
Water, green silicon carbide and antirust lapping oil are fully stirred 6 hours by A5, stirrer, obtain work in-process;
A6, work in-process are obtained lapping liquid finished product after 320 object filter screen filtration.
As preferably, described in described lapping liquid preparation technology, the environment for use temperature of stirrer controls between 18 DEG C-28 DEG C.
As preferably, in described lapping liquid preparation technology, the husky liquor ratio weight values scope control of lapping liquid finished product is between 1.1-1.3.
The use addition means of lapping liquid, it comprises the following steps:
The lapping liquid of B1, the new preparation of taking-up, is added to shredder for grinding work by lapping liquid;
B2, after lapping liquid time in shredder exceeds 17-23 hour, i.e. the used lapping liquid of a desirable part, utilize proportion instrument to take out lapping liquid carry out sand liquor ratio weight values measure;
If the result of gained measured by the lapping liquid that B3 takes out is sand liquor ratio weight values when exceeding 1.1-1.3 scope, adds in the bucket of shredder and there is no used lapping liquid 1KG/ time;
B4, when in shredder lapping liquid use duration reach 10 days time, grinding machine for grinding liquid is all replaced.
The invention has the beneficial effects as follows: have grinding effect good, cost is low, do not injure the healthy of staff, product to be processed quality is good, configures simple and easy to use.
Accompanying drawing explanation
Fig. 1 is the process step schematic diagram of lapping liquid preparation technology of the present invention;
Fig. 2 is the use step schematic diagram of the use addition means of lapping liquid of the present invention.
Embodiment
As depicted in figs. 1 and 2, lapping liquid of the present invention, is characterized in that, the weight part ratio of described lapping liquid is: water 72%, green silicon carbide 25.6% and antirust lapping oil 2.4%.
Further, described lapping liquid formula is: water is 90L, and green silicon carbide is 32KG and antirust lapping oil 3L.
Lapping liquid preparation technology, it comprises the following steps:
A1, open the bung of stirrer, in the bucket of stirrer, add the water of 90L;
A2, startup stirrer, and the mixing speed of stirrer is adjusted between 147 revs/min-153 revs/min;
A3, the green silicon carbide of 32KG slowly to be poured in the bucket of stirrer;
A4, the antirust lapping oil of 3L slowly to be poured in the bucket of stirrer, make water, green silicon carbide and the abundant mix and blend of antirust lapping oil;
Water, green silicon carbide and antirust lapping oil are fully stirred 6 hours by A5, stirrer, obtain work in-process;
A6, work in-process are obtained lapping liquid finished product after 320 object filter screen filtration.
As preferably, described in described lapping liquid preparation technology, the environment for use temperature of stirrer controls between 18 DEG C-28 DEG C.
As preferably, in described lapping liquid preparation technology, the husky liquor ratio weight values scope control of lapping liquid finished product is between 1.1-1.3.
The use addition means of lapping liquid, it comprises the following steps:
The lapping liquid of B1, the new preparation of taking-up, is added to shredder for grinding work by lapping liquid;
B2, after lapping liquid time in shredder exceeds 17-23 hour, i.e. the used lapping liquid of a desirable part, utilize proportion instrument to take out lapping liquid carry out sand liquor ratio weight values measure;
If the result of gained measured by the lapping liquid that B3 takes out is sand liquor ratio weight values when exceeding 1.1-1.3 scope, adds in the bucket of shredder and there is no used lapping liquid 1KG/ time;
B4, when in shredder lapping liquid use duration reach 10 days time, grinding machine for grinding liquid is all replaced.
The rear project of research and development relates to attrition process and carries out in an all-round way, and abrasive sand use cost declines to a great extent, and the good article rate of product is guaranteed 97.5 ~ 98.5%.Antirust lapping oil is used to substitute NaNO by the formula changing lapping liquid 2(HOCH 2cH 2) 3n, human contact uses clean water to antirust lapping liquid, can not form harm; The proportioning of lapping liquid: SiC(3000#): water: antirust lapping liquid=32kg:90L:3L.
Interpolation and the replacement cycle of lapping liquid are improved to: new preparation sand liquid uses after 20 ± 3 hours, the specific gravity value (1.1 ~ 1.3) measuring sand liquid is taked to manage, confirm once before each class, the more glutinous specific gravity value of sand liquid long processing time sand liquid is larger, need to add new lapping liquid 1kg/ time, lapping liquid total amount is no more than the warning line in sand bucket, uses and is all changed once by sand liquid for 10 days; The management adding sand method and specific gravity value by improving midway effectively improves the problem that product scattered error is bigger than normal and the rear product surface of corrosion is heterochromatic;
Research and develop the output that forward and backward employee processes every day identical, process 20,000 wafers every day, before research and development, average every day uses abrasive sand 1.71kg, and after research and development, average every day uses abrasive sand 1.34kg; After research and development, lapping liquid each employee every day uses the abrasive sand of 21.5% less; The wafer processed with 60 ~ 84H that 0 ~ 20H processes by the wafer before research and development, after corroding, watch outward appearance, there is heterochromatic problem in wafer surface, after research and development by the wafer behind the 2nd day and processing in the 10th day by seeing that outward appearance finds no heterochromatic problem after corrosion.Lapping liquid proportioning before research and development and addition means, average every day, everyone used abrasive sand 1.71kg, conforming product rate after processing: 96.2%; After adopting research and development, everyone uses abrasive sand less processes average every day: 21.5%, and can effectively reduce supplementary product onsumption cost, conforming product rate can improve 2.92%, and after corrosion, the heterochromatic problem of wafer surface is resolved; Use lapping oil also improves the problem of Sodium Nitrite to human body negative interaction after instead of Sodium Nitrite and trolamine.
The invention has the beneficial effects as follows: have grinding effect good, cost is low, do not injure the healthy of staff, product to be processed quality is good, configures simple and easy to use.

Claims (6)

1. lapping liquid, is characterized in that, the weight part ratio of described lapping liquid is: water 72%, green silicon carbide 25.6% and antirust lapping oil 2.4%.
2. lapping liquid according to claim 1, is characterized in that: water is 90L, and green silicon carbide is 32KG and antirust lapping oil 3L.
3. lapping liquid preparation technology, is characterized in that comprising the following steps:
A1, open the bung of stirrer, in the bucket of stirrer, add the water of 90L;
A2, startup stirrer, and the mixing speed of stirrer is adjusted between 147 revs/min-153 revs/min;
A3, the green silicon carbide of 32KG slowly to be poured in the bucket of stirrer;
A4, the antirust lapping oil of 3L slowly to be poured in the bucket of stirrer, make water, green silicon carbide and the abundant mix and blend of antirust lapping oil;
Water, green silicon carbide and antirust lapping oil are fully stirred 6 hours by A5, stirrer, obtain work in-process;
A6, work in-process are obtained lapping liquid finished product after 320 object filter screen filtration.
4. lapping liquid preparation technology according to claim 3, is characterized in that: the environment for use temperature of described stirrer controls between 18 DEG C-28 DEG C.
5. lapping liquid preparation technology according to claim 3, is characterized in that: the husky liquor ratio weight values scope control of lapping liquid finished product is between 1.1-1.3.
6. the use addition means of lapping liquid, is characterized in that comprising the following steps:
The lapping liquid of B1, the new preparation of taking-up, is added to shredder for grinding work by lapping liquid;
B2, after lapping liquid time in shredder exceeds 17-23 hour, i.e. the used lapping liquid of a desirable part, utilize proportion instrument to take out lapping liquid carry out sand liquor ratio weight values measure;
If the result of gained measured by the lapping liquid that B3 takes out is sand liquor ratio weight values when exceeding 1.1-1.3 scope, adds in the bucket of shredder and there is no used lapping liquid 1KG/ time;
B4, when in shredder lapping liquid use duration reach 10 days time, grinding machine for grinding liquid is all replaced.
CN201510667713.8A 2015-10-16 2015-10-16 Grinding fluid, grinding fluid preparation process and grinding fluid using and adding method Pending CN105385412A (en)

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Application Number Priority Date Filing Date Title
CN201510667713.8A CN105385412A (en) 2015-10-16 2015-10-16 Grinding fluid, grinding fluid preparation process and grinding fluid using and adding method

Publications (1)

Publication Number Publication Date
CN105385412A true CN105385412A (en) 2016-03-09

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105798778A (en) * 2016-05-09 2016-07-27 惠晶显示科技(苏州)有限公司 Grinding powder recycling method for displaying glass plane grinding
CN108165177A (en) * 2017-12-20 2018-06-15 重庆超硅半导体有限公司 A kind of semi-conductor silicon chip lapping liquid stability control method
CN111944431A (en) * 2020-07-22 2020-11-17 威科赛乐微电子股份有限公司 Wafer grinding oil and preparation method thereof

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WO2002051955A1 (en) * 2000-12-26 2002-07-04 Advanced Micro Devices, Inc. Prevention of precipitation defects on copper interconnects during cmp by use of solutions containing organic compounds with silica adsorption and copper corrosion inhibiting properties
CN101302404A (en) * 2008-07-01 2008-11-12 上海大学 Preparation of nano-cerium oxide composite abrasive grain polishing solution
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CN102311718A (en) * 2011-04-26 2012-01-11 东莞市安美润滑科技有限公司 Aqueous grinding fluid applied to super precision grinding of hard and brittle materials and application method thereof
CN104130714A (en) * 2014-07-01 2014-11-05 蚌埠市高华电子有限公司 Abrasive-containing mixed polishing solution for metals and preparation method thereof

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Publication number Priority date Publication date Assignee Title
WO2002051955A1 (en) * 2000-12-26 2002-07-04 Advanced Micro Devices, Inc. Prevention of precipitation defects on copper interconnects during cmp by use of solutions containing organic compounds with silica adsorption and copper corrosion inhibiting properties
CN101302404A (en) * 2008-07-01 2008-11-12 上海大学 Preparation of nano-cerium oxide composite abrasive grain polishing solution
CN101979450A (en) * 2009-11-05 2011-02-23 北京天科合达蓝光半导体有限公司 Grinding liquid and preparation method thereof and grinding method using grinding liquid
CN102311718A (en) * 2011-04-26 2012-01-11 东莞市安美润滑科技有限公司 Aqueous grinding fluid applied to super precision grinding of hard and brittle materials and application method thereof
CN104130714A (en) * 2014-07-01 2014-11-05 蚌埠市高华电子有限公司 Abrasive-containing mixed polishing solution for metals and preparation method thereof

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105798778A (en) * 2016-05-09 2016-07-27 惠晶显示科技(苏州)有限公司 Grinding powder recycling method for displaying glass plane grinding
CN108165177A (en) * 2017-12-20 2018-06-15 重庆超硅半导体有限公司 A kind of semi-conductor silicon chip lapping liquid stability control method
CN108165177B (en) * 2017-12-20 2020-09-22 重庆超硅半导体有限公司 Stability control method for semiconductor silicon wafer grinding fluid
CN111944431A (en) * 2020-07-22 2020-11-17 威科赛乐微电子股份有限公司 Wafer grinding oil and preparation method thereof

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