CN105377003A - Heat radiation composite board - Google Patents

Heat radiation composite board Download PDF

Info

Publication number
CN105377003A
CN105377003A CN201510891561.XA CN201510891561A CN105377003A CN 105377003 A CN105377003 A CN 105377003A CN 201510891561 A CN201510891561 A CN 201510891561A CN 105377003 A CN105377003 A CN 105377003A
Authority
CN
China
Prior art keywords
phenolic resin
carbon fiber
fiber layer
composite board
coated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510891561.XA
Other languages
Chinese (zh)
Inventor
刘浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TIANJIN BW POWER EQUIPMENT Co Ltd
Original Assignee
TIANJIN BW POWER EQUIPMENT Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TIANJIN BW POWER EQUIPMENT Co Ltd filed Critical TIANJIN BW POWER EQUIPMENT Co Ltd
Priority to CN201510891561.XA priority Critical patent/CN105377003A/en
Publication of CN105377003A publication Critical patent/CN105377003A/en
Pending legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)

Abstract

The invention discloses a heat radiation composite board. The composite board comprises a carbon fiber layer, a phenolic resin membrane and a silver-tungsten alloy substrate, wherein the phenolic resin membrane is coated on the silver-tungsten alloy substrate, the carbon fiber layer is coated on the phenolic resin membrane, and the thickness of the phenolic resin membrane is smaller than that of the carbon fiber layer. According to the technical scheme provided by the invention, a silver-tungsten alloy with good heat dissipation is taken as a basic material, and based on this, the two membrane materials with excellent performance, i.e., the carbon fiber layer and the phenolic resin membrane are coated, such that the overall heat dissipation performance of the composite board is remarkably improved, and at the same time, the structure is not too complex. Besides, the composite board is easy to machine and form, and housings of such devices as a generator, a motor and the like can be quite conveniently further machined by use of the composite board. The innovative technical improvement provided by the invention realizes an outstanding heat dissipation effect, at the same time, the cost is quite low and the realization is easy. Therefore, the application prospect is good.

Description

A kind of heat radiation composite plate
Technical field
The present invention relates to materials science field, be specifically related to a kind of heat radiation composite plate.
Background technology
Sheet material is basic material important in productive life, and the difference according to use occasion needs sheet material to have different performances.In mechanical device, usually need sheet material to have good heat dispersion, such as, larger device is produced for the heat such as generator, motor, if material heat dispersion is not good, easily affects result of use, even cause danger.The sheet material of single material still Shortcomings in radiating efficiency in prior art, and the heat radiation sheet material developing a kind of composite material will be expected to solve this problem.
Summary of the invention
The present invention is intended to the technological deficiency for prior art, provides a kind of heat radiation composite plate, to solve the technical problem that in prior art, sheet material radiating effect is not good.
For realizing above technical purpose, the present invention by the following technical solutions:
A kind of heat radiation composite plate, comprise carbon fiber layer, phenolic resin film, silver tungsten substrate, wherein phenolic resin film is coated on silver tungsten substrate, and carbon fiber layer is coated on phenolic resin film, and the thickness of described phenolic resin film is less than the thickness of carbon fiber layer.
As preferably, the conductive coefficient of carbon fiber layer is 1.2W/ (mK).
As preferably, the thickness of silver tungsten substrate is 50 ~ 80 times of carbon fiber layer and phenolic resins film thickness sum.
In above technical scheme, material based on the good silver tungsten of thermal diffusivity, be coated with the membrane material of carbon fiber layer and phenolic resin film two kinds of function admirables on this basis, composite plate integral heat sink performance is significantly promoted, structure can not be caused too complicated simultaneously.In addition, composite plate of the present invention is easy to machine-shaping, processes the shell of the device such as generator, motor further more for convenience with it.The present invention achieves outstanding radiating effect with the technological improvement of novelty, simultaneously cost lower, be easy to realize, therefore application prospect is good.
Accompanying drawing explanation
Fig. 1 is the structural representation of the embodiment of the present invention 1;
In figure:
1, carbon fiber layer 2, phenolic resin film 3, silver tungsten substrate
Embodiment
Below will be described in detail the specific embodiment of the present invention.In order to avoid too much unnecessary details, in the examples below to belonging to known structure or function will not be described in detail.The approximating language used in following examples can be used for quantitative expression, shows to allow quantity to have certain variation when not changing basic function.Apart from outside definition, technology used in following examples and scientific terminology have the identical meanings generally understood with those skilled in the art of the invention.
Embodiment 1
A kind of heat radiation composite plate, comprises carbon fiber layer 1, phenolic resin film 2, silver tungsten substrate 3, wherein phenolic resin film 2 is coated on silver tungsten substrate 3, and carbon fiber layer 1 is coated on phenolic resin film 2, and the thickness of described phenolic resin film 2 is less than the thickness of carbon fiber layer 1.
On the basis of above technical scheme, meet the following conditions:
The conductive coefficient of carbon fiber layer 1 is 1.2W/ (mK).
The thickness of silver tungsten substrate 3 is 50 ~ 80 times of carbon fiber layer 1 and phenolic resin film 2 thickness sum.
Embodiment 2
A kind of heat radiation composite plate, comprises carbon fiber layer 1, phenolic resin film 2, silver tungsten substrate 3, wherein phenolic resin film 2 is coated on silver tungsten substrate 3, and carbon fiber layer 1 is coated on phenolic resin film 2, and the thickness of described phenolic resin film 2 is less than the thickness of carbon fiber layer 1.
Above embodiments of the invention have been described in detail, but described content is only preferred embodiment of the present invention, not in order to limit the present invention.All make in application range of the present invention any amendment, equivalent to replace and improvement etc., all should be included within protection scope of the present invention.

Claims (3)

1. a heat radiation composite plate, it is characterized in that comprising carbon fiber layer (1), phenolic resin film (2), silver tungsten substrate (3), wherein phenolic resin film (2) is coated on silver tungsten substrate (3), carbon fiber layer (1) is coated on phenolic resin film (2), and the thickness of described phenolic resin film (2) is less than the thickness of carbon fiber layer (1).
2. heat radiation composite plate according to claim 1, is characterized in that the conductive coefficient of carbon fiber layer (1) is 1.2W/ (mK).
3. heat radiation composite plate according to claim 1, is characterized in that the thickness of silver tungsten substrate (3) is 50 ~ 80 times of carbon fiber layer (1) and phenolic resin film (2) thickness sum.
CN201510891561.XA 2015-12-07 2015-12-07 Heat radiation composite board Pending CN105377003A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510891561.XA CN105377003A (en) 2015-12-07 2015-12-07 Heat radiation composite board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510891561.XA CN105377003A (en) 2015-12-07 2015-12-07 Heat radiation composite board

Publications (1)

Publication Number Publication Date
CN105377003A true CN105377003A (en) 2016-03-02

Family

ID=55378675

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510891561.XA Pending CN105377003A (en) 2015-12-07 2015-12-07 Heat radiation composite board

Country Status (1)

Country Link
CN (1) CN105377003A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201188727Y (en) * 2008-04-25 2009-01-28 廖德南 Shell with waterproof and shielding functions
US20120118615A1 (en) * 2010-11-11 2012-05-17 Samsung Electro-Mechanics Co., Ltd. Metal clad laminate, method of manufacturing the same, and heat-radiating substrate
CN202565640U (en) * 2011-12-30 2012-11-28 深圳市爱诺菲科技有限公司 Heat radiation electromagnetic wave absorption paster
CN202911224U (en) * 2012-07-26 2013-05-01 苏州沛德导热材料有限公司 Graphite composite metallic material

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201188727Y (en) * 2008-04-25 2009-01-28 廖德南 Shell with waterproof and shielding functions
US20120118615A1 (en) * 2010-11-11 2012-05-17 Samsung Electro-Mechanics Co., Ltd. Metal clad laminate, method of manufacturing the same, and heat-radiating substrate
CN202565640U (en) * 2011-12-30 2012-11-28 深圳市爱诺菲科技有限公司 Heat radiation electromagnetic wave absorption paster
CN202911224U (en) * 2012-07-26 2013-05-01 苏州沛德导热材料有限公司 Graphite composite metallic material

Similar Documents

Publication Publication Date Title
CN203353019U (en) Graphene metal cooling fin and electronic product cooling structure
CN204981729U (en) High -efficient thermal film who contains thermal conductive adhesive
US9769964B2 (en) Heat discharging sheet and display device including the same
US10945331B2 (en) Mobile display device
CN208200824U (en) A kind of graphene Heat dissipation adhesive tape with buffering effect
US20150205334A1 (en) Heat dissipation assembly and portable electronic device employing same
CN204362488U (en) Compound fin
CN103625029A (en) Graphene heat-conducting device
CN102555321A (en) High heat dissipation membrane of laminated diamond coating and manufacturing method of high heat dissipation membrane
CN206217267U (en) A kind of Graphene Copper Foil diaphragm
CN102555340A (en) High heat dissipation membrane composite structure and manufacturing method thereof
CN205902315U (en) Compound graphite radiating sheet
CN201726633U (en) Hollow laminar type cooling plate unit structure
CN203590662U (en) Electronic component cooling device
CN203110435U (en) Graphite copper foil composite membrane
CN104619147B (en) A kind of electronic equipment
CN205033658U (en) Compound heat conduction membrane of graphite alkene
CN202702725U (en) Insulation graphite sheet
CN105377003A (en) Heat radiation composite board
CN205364688U (en) Heat conduction graphite piece
US20170202104A1 (en) Carbon-coated copper foil for heat dissipation
CN209794770U (en) Low-melting-point alloy composite heat conduction material
CN215222884U (en) Graphite radiating fin for electronic product
CN203559004U (en) Novel graphite tape
CN209159070U (en) A kind of heat conduction and heat radiation film

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20160302