CN105376955A - Method for efficiently tearing film off circuit face after V-CUT of mirror surface aluminum COB board - Google Patents
Method for efficiently tearing film off circuit face after V-CUT of mirror surface aluminum COB board Download PDFInfo
- Publication number
- CN105376955A CN105376955A CN201510964620.1A CN201510964620A CN105376955A CN 105376955 A CN105376955 A CN 105376955A CN 201510964620 A CN201510964620 A CN 201510964620A CN 105376955 A CN105376955 A CN 105376955A
- Authority
- CN
- China
- Prior art keywords
- cut
- diaphragm
- mirror surface
- high viscosity
- specular aluminium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0228—Cutting, sawing, milling or shearing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1383—Temporary protective insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/304—Protecting a component during manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to a method for efficiently tearing a film off a circuit face after V-CUT of a mirror surface aluminum COB board. The method comprises the following steps: (1) pasting a low-viscosity colorless transparent protection film onto the circuit face of the mirror surface aluminum COB board to protect a mirror surface, (2) performing normal V-cut in two directions on the mirror surface aluminum COB board by using a V-cut machine, (3) pasting a high-viscosity protection film onto the circuit face of the mirror surface aluminum COB board after the V-cut, and (4) tearing off the high-viscosity protection film of the mirror surface aluminum COB board, wherein, at the moment, under the viscosity effect of the high-viscosity protection film, dust, aluminum scraps and the low-viscosity colorless transparent protection film, which are located under the high-viscosity protection film, are together torn off. The method greatly improves film tearing efficiency and guarantees production quality.
Description
Technical field
The invention belongs to printed wiring board manufacture technology field, be specifically related to the method for the efficient dyestripping of circuit surface after a kind of specular aluminium COB plate V-CUT.
Background technology
Along with the development of electron trade, the style of COB product gets more and more, and various Design modelling is also not quite similar.Specular aluminium COB product is exactly wherein a kind of, due to the characteristic of specular aluminium product, as easy as rolling off a logly in machining process to make dirty, wipes presbyopic glasses face, therefore in machining process, generally all can paste layer protecting film to protect minute surface at circuit surface.V-CUT utilizes V-CUT machine to carry out V to substrate to cut, and carves " V " shape groove onboard by processing request, is convenient to after client mounts components and parts, plate be broken into two with one's hands.Some jigsaw designs only need V to cut a direction, and the jigsaw also had needs V to cut both direction, if cut both direction at circuit surface V after specular aluminium pad pasting, will certainly increase the difficulty of dyestripping.Generally there are two kinds of methods in major part producer when solving a technique difficult problem, first method: V cuts the artificial PCS one by one of rear utilization and manually removes, the method efficiency is too slow, and points minute surface of also very easily making dirty in dyestripping process, causes minute surface to pollute (finger-marks); Second method: first V cuts a direction, tears circuit surface diaphragm, after paste layer protecting film again, then V cuts another direction, tears circuit surface diaphragm again after V has cut; The method need tear twice film, and in dyestripping process, the aluminium bits that V cuts and ink dust are easy to drop on minute surface, cause minute surface to pollute.
Summary of the invention
For the deficiency of above-mentioned prior art, the object of the present invention is to provide the method for the efficient dyestripping of circuit surface after a kind of specular aluminium COB plate V-CUT, be intended to solve specular aluminium COB plate V in prior art and cut the slow problem of rear dyestripping efficiency.
Object of the present invention is achieved by the following technical programs:
After specular aluminium COB plate V-CUT, a method for the efficient dyestripping of circuit surface, comprises the steps:
(1) one deck low viscous water white transparency diaphragm protection minute surface is pasted at the circuit surface of specular aluminium COB plate;
(2) V cutting mill is used to cut both direction to the normal V of specular aluminium COB plate;
(3) V pastes one deck high viscosity diaphragm at the circuit surface of specular aluminium COB plate after cutting again;
(4) tear the high viscosity diaphragm on specular aluminium COB printed line road surface, now, under the viscosity effect of high viscosity diaphragm, be positioned at the dust under high viscosity diaphragm, aluminium bits and described low viscous water white transparency diaphragm and be together torn.
Further, the color of described high viscosity diaphragm is green or dark brown.
Further, the pad pasting work of described low viscous water white transparency diaphragm and high viscosity diaphragm all manually laminator come.
Compared with prior art, tool of the present invention has the following advantages:
The present invention adopts and first pastes one deck low viscosity water white transparency diaphragm at circuit surface; rear normal V cuts (both direction); one deck high viscosity diaphragm is pasted at circuit surface again after V has cut; utilize the full-bodied advantage of diaphragm dust below, aluminium bits and low viscosity diaphragm to be torn together, substantially increase dyestripping efficiency and ensure that product quality.
Embodiment
Below in conjunction with embodiment, the present invention is described in further detail.
After specular aluminium COB plate V-CUT, a method for the efficient dyestripping of circuit surface, comprises the steps:
(1) one deck low viscous water white transparency diaphragm protection minute surface is pasted at the circuit surface of specular aluminium COB plate;
(2) V cutting mill is used to cut both direction to the normal V of specular aluminium COB plate;
(3) V pastes one deck high viscosity diaphragm at the circuit surface of specular aluminium COB plate after cutting again;
(4) tear the high viscosity diaphragm on specular aluminium COB printed line road surface, now, under the viscosity effect of high viscosity diaphragm, be positioned at the dust under high viscosity diaphragm, aluminium bits and described low viscous water white transparency diaphragm and be together torn.
Preferably, the color of described high viscosity diaphragm is green or dark brown.
Preferably, the pad pasting work of described low viscous water white transparency diaphragm and high viscosity diaphragm all manually laminator come.
As described above, be only preferred embodiment of the present invention, when not limiting scope of the invention process with this, the simple equivalence namely generally done according to the present patent application the scope of the claims and invention description content changes and modifies, and all still remains within the scope of the patent.
Claims (3)
1. the method for the efficient dyestripping of circuit surface after specular aluminium COB plate V-CUT, is characterized in that, comprise the steps:
(1) one deck low viscous water white transparency diaphragm protection minute surface is pasted at the circuit surface of specular aluminium COB plate;
(2) V cutting mill is used to cut both direction to the normal V of specular aluminium COB plate;
(3) V pastes one deck high viscosity diaphragm at the circuit surface of specular aluminium COB plate after cutting again;
(4) tear the high viscosity diaphragm on specular aluminium COB printed line road surface, now, under the viscosity effect of high viscosity diaphragm, be positioned at the dust under high viscosity diaphragm, aluminium bits and described low viscous water white transparency diaphragm and be together torn.
2. a kind of method of the efficient dyestripping of circuit surface after specular aluminium COB plate V-CUT according to claim 1, is characterized in that: the color of described high viscosity diaphragm is for green or dark brown.
3. a kind of method of the efficient dyestripping of circuit surface after specular aluminium COB plate V-CUT according to claim 1, is characterized in that: the pad pasting work of described low viscous water white transparency diaphragm and high viscosity diaphragm all manually laminator has come.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510964620.1A CN105376955B (en) | 2015-12-18 | 2015-12-18 | A kind of method of the efficient dyestripping of circuit surface after specular aluminium COB plates V-CUT |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510964620.1A CN105376955B (en) | 2015-12-18 | 2015-12-18 | A kind of method of the efficient dyestripping of circuit surface after specular aluminium COB plates V-CUT |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105376955A true CN105376955A (en) | 2016-03-02 |
| CN105376955B CN105376955B (en) | 2018-10-02 |
Family
ID=55378632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510964620.1A Active CN105376955B (en) | 2015-12-18 | 2015-12-18 | A kind of method of the efficient dyestripping of circuit surface after specular aluminium COB plates V-CUT |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105376955B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112687781A (en) * | 2020-12-22 | 2021-04-20 | 珠海市沃德科技有限公司 | Processing method of LED mirror lamp panel for COB packaging |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120002018A (en) * | 2010-06-30 | 2012-01-05 | (주)인터플렉스 | Method of manufacturing printed circuit board |
| CN102416726A (en) * | 2011-08-22 | 2012-04-18 | 厦门华联电子有限公司 | Production process of single-layer mirror-surface light transmitting panel |
| CN202705226U (en) * | 2012-08-17 | 2013-01-30 | 江西联创电子有限公司 | Improved functional sheet glass cutting format |
-
2015
- 2015-12-18 CN CN201510964620.1A patent/CN105376955B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20120002018A (en) * | 2010-06-30 | 2012-01-05 | (주)인터플렉스 | Method of manufacturing printed circuit board |
| CN102416726A (en) * | 2011-08-22 | 2012-04-18 | 厦门华联电子有限公司 | Production process of single-layer mirror-surface light transmitting panel |
| CN202705226U (en) * | 2012-08-17 | 2013-01-30 | 江西联创电子有限公司 | Improved functional sheet glass cutting format |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112687781A (en) * | 2020-12-22 | 2021-04-20 | 珠海市沃德科技有限公司 | Processing method of LED mirror lamp panel for COB packaging |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105376955B (en) | 2018-10-02 |
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