CN105376945A - Circuit board through hole automatic adjusting method and system - Google Patents
Circuit board through hole automatic adjusting method and system Download PDFInfo
- Publication number
- CN105376945A CN105376945A CN201510834187.XA CN201510834187A CN105376945A CN 105376945 A CN105376945 A CN 105376945A CN 201510834187 A CN201510834187 A CN 201510834187A CN 105376945 A CN105376945 A CN 105376945A
- Authority
- CN
- China
- Prior art keywords
- via hole
- circuit board
- alignment
- call
- volume production
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000013461 design Methods 0.000 claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 12
- 238000010923 batch production Methods 0.000 abstract 2
- 230000006870 function Effects 0.000 description 9
- 230000008569 process Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 210000003733 optic disk Anatomy 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000012163 sequencing technique Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
Abstract
The invention provides a circuit board through hole automatic adjusting method and system. The method comprises the following steps that electrical design rules are read, and the electrical design rules include batch production parameters of through holes; multiple through holes required to be arranged are selected on a circuit board; and a through hole alignment mode is invoked, and the multiple through holes are adjusted and arranged on the circuit board according to the through hole alignment mode and the batch production parameters of the through holes. According to the circuit board through hole automatic adjusting method, space utilization rate of the circuit board can be effectively enhanced, design quality of the circuit board can be enhanced and user demands can be met.
Description
Technical field
The present invention relates to electrical design technical field, particularly a kind of via hole automatic adjusting method of circuit board and system.
Background technology
At present, along with the develop rapidly of electron trade, people are more and more higher for the requirement of electronic product, and for smart mobile phone, require that smart mobile phone has more abundanter functions on the one hand, another conveniently requires that the weight and volume of smart mobile phone is not easily excessive.But, because function is more and more abundanter, cause the integrated level on the circuit board of electronic product inside more and more higher, because the integrated level on circuit board is higher, and the limited area of circuit board, therefore, how rational deployment seems particularly important with the space availability ratio promoting circuit board.
In correlation technique, normally manually carried out the design of circuit board by designer, as the position by multiple via hole, the distance between via hole and arrangement etc. manually adjust, and not only waste time and energy, and accuracy are not high, affect the designing quality of circuit board.
Summary of the invention
The present invention is intended to solve the problems of the technologies described above at least to a certain extent.
For this reason, one object of the present invention is the via hole automatic adjusting method proposing a kind of circuit board.The method effectively can promote the space availability ratio of circuit board, and improves the designing quality of circuit board, meets consumers' demand.
Another object of the present invention is the via hole automatic adjustment system proposing a kind of circuit board.
In order to achieve the above object, the embodiment of a first aspect of the present invention discloses a kind of via hole automatic adjusting method of circuit board, comprises the following steps: read electrical design rule, and wherein, described electrical design rule comprises the volume production parameter of via hole; Described circuit board is selected the multiple via holes needing to arrange; Call via hole alignment thereof, and according to the volume production parameter of described via hole alignment thereof and described via hole, described multiple via hole is adjusted and arranged on described circuit board.
According to the via hole automatic adjusting method of the circuit board of the embodiment of the present invention, can according to user's request simply, the rational deployment of multiple via hole on realizing circuit plate quickly and accurately, promote Consumer's Experience, and then when design circuit plate, the space availability ratio of effective lifting circuit board, and improve the designing quality of circuit board, meet consumers' demand.
In addition, the via hole automatic adjusting method of circuit board according to the above embodiment of the present invention can also have following additional technical characteristic:
In some instances, the volume production parameter of described via hole comprises: the minimum bore diameter of via hole, the minimum orifice ring of via hole, metal live width, intermetallic apart from and spacing between via hole and via hole in one or more.
In some instances, described via hole alignment thereof comprises: one or more in row alignment, column alignment and arbitrarily angled alignment thereof.
In some instances, described in call via hole alignment thereof, comprise further: receive user input call instruction, call corresponding via hole alignment thereof with the call instruction inputted according to user; Or call the via hole alignment thereof of acquiescence.
In some instances, the described volume production parameter according to via hole alignment thereof and described via hole adjusts described multiple via hole and arranges on described circuit board, comprises further: selection reference point from described multiple via hole; According to described datum mark, described multiple via hole is adjusted and arranged.
The embodiment of second aspect present invention discloses a kind of via hole automatic adjustment system of circuit board, comprising: read module, and for reading electrical design rule, wherein, described electrical design rule comprises the volume production parameter of via hole; Select module, for selecting the multiple via holes needing to arrange on described circuit board; Calling module, for calling via hole alignment thereof; Adjusting module, for adjusting and arrange described multiple via hole according to the volume production parameter of described via hole alignment thereof and described via hole on described circuit board.
According to the via hole automatic adjustment system of the circuit board of the embodiment of the present invention, can according to user's request simply, the rational deployment of multiple via hole on realizing circuit plate quickly and accurately, promote Consumer's Experience, and then when design circuit plate, the space availability ratio of effective lifting circuit board, and improve the designing quality of circuit board, meet consumers' demand.
In addition, the via hole automatic adjustment system of circuit board according to the above embodiment of the present invention can also have following additional technical characteristic:
In some instances, the volume production parameter of described via hole comprises: the minimum bore diameter of via hole, the minimum orifice ring of via hole, metal live width, intermetallic apart from and spacing between via hole and via hole in one or more.
In some instances, described via hole alignment thereof comprises: one or more in row alignment, column alignment and arbitrarily angled alignment thereof.
In some instances, described calling module is used for: the call instruction receiving user's input, calls corresponding via hole alignment thereof with the call instruction inputted according to user; Or call the via hole alignment thereof of acquiescence.
In some instances, described adjusting module is used for: adjust according to the datum mark that user selects from multiple via hole described multiple via hole and arrange.
Additional aspect of the present invention and advantage will part provide in the following description, and part will become obvious from the following description, or be recognized by practice of the present invention.
Accompanying drawing explanation
Above-mentioned and/or additional aspect of the present invention and advantage will become obvious and easy understand from accompanying drawing below combining to the description of embodiment, wherein:
Fig. 1 is the flow chart of the via hole automatic adjusting method of circuit board according to an embodiment of the invention;
Fig. 2 A is the schematic diagram before the multiple via hole alignment selected in the via hole automatic adjusting method of circuit board according to an embodiment of the invention;
Fig. 2 B is the design sketch after the multiple via hole alignment shown in Fig. 2 A; And
Fig. 3 is the structured flowchart of the via hole automatic adjustment system of circuit board according to an embodiment of the invention.
Embodiment
Be described below in detail embodiments of the invention, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Being exemplary below by the embodiment be described with reference to the drawings, only for explaining the present invention, and can not limitation of the present invention being interpreted as.
Below in conjunction with accompanying drawing description according to the via hole automatic adjusting method of the circuit board of the embodiment of the present invention and system.
Fig. 1 is the flow chart of the via hole automatic adjusting method of circuit board according to an embodiment of the invention.As shown in Figure 1, the via hole automatic adjusting method of circuit board, comprises the steps: according to an embodiment of the invention
S101: read electrical design rule, wherein, electrical design rule comprises the volume production parameter of via hole.
Such as: write shell script in advance, the electrical design utilizing shell script to read in electric design automation system (that is: EDAElectronicDesignAutomation) is regular, and stores this electrical design rule.
Be understandable that, in circuit-board industry, electrical design rule has versatility, electrical design rule can upgrade according to the development of circuit-board industry, for now, and the volume production parameter of the via hole that electrical design rule comprises, mainly include but not limited to: the minimum bore diameter of via hole, the minimum orifice ring of via hole, metal live width, intermetallic apart from and spacing between via hole and via hole in one or more, wherein, via hole refers to: the metal plated holes VIA on circuit board, is called for short metal aperture.Such as: the minimum bore diameter of metal aperture is: 0.20mm, metal aperture minimum metal orifice ring is: 0.40mm, and metal live width is: 0.06mm, and intermetallic is apart from being: 0.06mm.
S102: select the multiple via holes needing to arrange on circuit boards.
Wherein, circuit board refers to printed circuit board (PrintedCircuitBoard is called for short PCB).
Specifically, according to the design needs of circuit board, choose the multiple via holes on circuit board in a certain region, as shown in Figure 2 A, show 6 via holes in a region on a certain printed circuit board chosen, and as shown in Figure 2 A, these 6 via holes are not yet arranged, that is: 6 via holes are in the state before alignment, and irregularity.
S103: call via hole alignment thereof, and on circuit boards according to the volume production parameter of via hole alignment thereof and via hole multiple via hole is adjusted and arranged.
When calling via hole alignment thereof, can by writing shell script in advance, Automatically invoked is stored in advance in the alignment thereof in electric design automation system EDA, be understandable that, according to the design needs of circuit board in circuit-board industry, via hole alignment thereof includes but not limited to: one or more in row alignment, column alignment and arbitrarily angled alignment thereof, wherein, arbitrarily angled alignment thereof such as comprises: miter angle alignment, 135 degree angles are alignd, 225 degree of angle alignment, 315 degree of angle alignment etc.
After calling corresponding alignment thereof, the multiple via holes selected can be arranged according to the alignment thereof called, and the specification of each via hole, the spacing etc. between via hole and via hole can adjust according to the volume production parameter of above-mentioned via hole, thus design the printed circuit board meeting user's needs, high-quality high standard.
Specifically, call via hole alignment thereof, comprising: the call instruction receiving user's input, call corresponding via hole alignment thereof with the call instruction inputted according to user; Or call the via hole alignment thereof of acquiescence.That is, via hole alignment thereof can be selected according to the demand of user.
Such as: user inputs call instruction, call instruction comprises the via hole alignment thereof that user selects, as user's selection is the via hole alignment thereof alignd in 315 degree of angles, then after receiving this call instruction, mode according to 315 degree of angle alignment arranges, certainly, after arrangement completes above-mentioned multiple via holes, if user is unsatisfied with, also via hole alignment thereof can be changed by the mode again inputting call instruction.Such as: when user is unsatisfied to the via hole after arrangement time, again call instruction can be inputted by input equipment, to change the alignment thereof etc. of multiple via hole, till user is satisfied, wherein, input equipment is but is not limited to: the sensor of keyboard, mouse, touch-screen and specific function.
In addition, can when user select via hole alignment thereof yet, call the via hole alignment thereof of acquiescence, in one embodiment of the invention, the via hole alignment thereof of acquiescence can be one in above-mentioned multiple via hole alignment thereof, also can be the via hole alignment thereof called last time, such as: the via hole alignment thereof called last time is row alignment, then the via hole alignment thereof of this acquiescence called be the mode of row alignment.
Further, after calling out via hole alignment thereof, just can automatically on circuit boards according to the volume production parameter of via hole alignment thereof and via hole multiple via hole be adjusted and be arranged, specifically, can in the following way multiple via hole be adjusted and be arranged, comprise: selection reference point from multiple via hole; According to datum mark, multiple via hole is adjusted and arranged.That is, with the via hole of in multiple via hole for datum mark, remaining multiple via hole is relative to this datum mark, arrange according to corresponding via hole alignment thereof, and according to the volume production parameter of via hole carry out the size of via hole, via hole and via pitch from etc. adjustment, thus realize via hole autoplacement on circuit boards.As shown in Figure 2 B, for 6 via holes shown in Fig. 2 A to arrange in the mode of row alignment after design sketch.
According to the via hole automatic adjusting method of the circuit board of the embodiment of the present invention, can according to user's request simply, the rational deployment of multiple via hole on realizing circuit plate quickly and accurately, promote Consumer's Experience, and then when design circuit plate, the space availability ratio of effective lifting circuit board, and improve the designing quality of circuit board, meet consumers' demand.
As shown in Figure 3, in further example of the present invention, also disclose a kind of via hole automatic adjustment system 300 of circuit board, comprising: read module 310, selection module 320, calling module 330 and adjusting module 340.
Wherein, read module 310 is for reading electrical design rule, and wherein, electrical design rule comprises the volume production parameter of via hole.Select module 320 for selecting the multiple via holes needing to arrange on circuit boards.Calling module 330 is for calling via hole alignment thereof.Adjusting module 340 is for adjusting and arrange multiple via hole according to the volume production parameter of via hole alignment thereof and via hole on circuit boards.
Wherein, the volume production parameter of via hole includes but not limited to: the minimum bore diameter of via hole, the minimum orifice ring of via hole, metal live width, intermetallic apart from and spacing between via hole and via hole in one or more.
Via hole alignment thereof includes but not limited to: one or more in row alignment, column alignment and arbitrarily angled alignment thereof.
In one embodiment of the invention, calling module 330 for: receive user input call instruction, call corresponding via hole alignment thereof with the call instruction inputted according to user; Or call the via hole alignment thereof of acquiescence.
In one embodiment of the invention, adjusting module 340 for: according to the datum mark that user selects from multiple via hole, multiple via hole is adjusted and is arranged.
According to the via hole automatic adjustment system of the circuit board of the embodiment of the present invention, can according to user's request simply, the rational deployment of multiple via hole on realizing circuit plate quickly and accurately, promote Consumer's Experience, and then when design circuit plate, the space availability ratio of effective lifting circuit board, and improve the designing quality of circuit board, meet consumers' demand.
It should be noted that, the specific implementation of the specific implementation of via hole automatic adjustment system of the circuit board of the embodiment of the present invention and the via hole automatic adjusting method of the circuit board of the embodiment of the present invention is similar, specifically referring to the description of method part, in order to reduce redundancy, not repeating herein.
Describe and can be understood in flow chart or in this any process otherwise described or method, represent and comprise one or more for realizing the module of the code of the executable instruction of the step of specific logical function or process, fragment or part, and the scope of the preferred embodiment of the present invention comprises other realization, wherein can not according to order that is shown or that discuss, comprise according to involved function by the mode while of basic or by contrary order, carry out n-back test, this should understand by embodiments of the invention person of ordinary skill in the field.
In flow charts represent or in this logic otherwise described and/or step, such as, the sequencing list of the executable instruction for realizing logic function can be considered to, may be embodied in any computer-readable medium, for instruction execution system, device or equipment (as computer based system, comprise the system of processor or other can from instruction execution system, device or equipment instruction fetch and perform the system of instruction) use, or to use in conjunction with these instruction execution systems, device or equipment.With regard to this specification, " computer-readable medium " can be anyly can to comprise, store, communicate, propagate or transmission procedure for instruction execution system, device or equipment or the device that uses in conjunction with these instruction execution systems, device or equipment.The example more specifically (non-exhaustive list) of computer-readable medium comprises following: the electrical connection section (electronic installation) with one or more wiring, portable computer diskette box (magnetic device), random access memory (RAM), read-only memory (ROM), erasablely edit read-only memory (EPROM or flash memory), fiber device, and portable optic disk read-only memory (CDROM).In addition, computer-readable medium can be even paper or other suitable media that can print described program thereon, because can such as by carrying out optical scanner to paper or other media, then carry out editing, decipher or carry out process with other suitable methods if desired and electronically obtain described program, be then stored in computer storage.
Those skilled in the art are appreciated that realizing all or part of step that above-described embodiment method carries is that the hardware that can carry out instruction relevant by program completes, described program can be stored in a kind of computer-readable recording medium, this program perform time, step comprising embodiment of the method one or a combination set of.
In addition, each functional unit in each embodiment of the present invention can be integrated in a processing module, also can be that the independent physics of unit exists, also can be integrated in a module by two or more unit.Above-mentioned integrated module both can adopt the form of hardware to realize, and the form of software function module also can be adopted to realize.If described integrated module using the form of software function module realize and as independently production marketing or use time, also can be stored in a computer read/write memory medium.
The above-mentioned storage medium mentioned can be read-only memory, disk or CD etc.
In the description of this specification, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with this embodiment or example are contained at least one embodiment of the present invention or example.In this manual, identical embodiment or example are not necessarily referred to the schematic representation of above-mentioned term.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.
Although illustrate and describe embodiments of the invention, those having ordinary skill in the art will appreciate that: can carry out multiple change, amendment, replacement and modification to these embodiments when not departing from principle of the present invention and aim, scope of the present invention is by claim and equivalency thereof.
Claims (10)
1. a via hole automatic adjusting method for circuit board, is characterized in that, comprise the following steps:
Reading electrical design rule, wherein, described electrical design rule comprises the volume production parameter of via hole;
Described circuit board is selected the multiple via holes needing to arrange;
Call via hole alignment thereof, and according to the volume production parameter of described via hole alignment thereof and described via hole, described multiple via hole is adjusted and arranged on described circuit board.
2. the via hole automatic adjusting method of circuit board according to claim 1, is characterized in that, the volume production parameter of described via hole comprises:
The minimum bore diameter of via hole, the minimum orifice ring of via hole, metal live width, intermetallic apart from and spacing between via hole and via hole in one or more.
3. the via hole automatic adjusting method of circuit board according to claim 1, is characterized in that, described via hole alignment thereof comprises:
One or more in row alignment, column alignment and arbitrarily angled alignment thereof.
4. the via hole automatic adjusting method of circuit board according to claim 1, is characterized in that, described in call via hole alignment thereof, comprise further:
Receive the call instruction of user's input, call corresponding via hole alignment thereof with the call instruction inputted according to user; Or
Call the via hole alignment thereof of acquiescence.
5. the via hole automatic adjusting method of the circuit board according to any one of claim 1-4, it is characterized in that, the described volume production parameter according to via hole alignment thereof and described via hole adjusts described multiple via hole and arranges on described circuit board, comprises further:
Selection reference point from described multiple via hole;
According to described datum mark, described multiple via hole is adjusted and arranged.
6. a via hole automatic adjustment system for circuit board, is characterized in that, comprising:
Read module, for reading electrical design rule, wherein, described electrical design rule comprises the volume production parameter of via hole;
Select module, for selecting the multiple via holes needing to arrange on described circuit board;
Calling module, for calling via hole alignment thereof;
Adjusting module, for adjusting and arrange described multiple via hole according to the volume production parameter of described via hole alignment thereof and described via hole on described circuit board.
7. the via hole automatic adjustment system of circuit board according to claim 6, is characterized in that, the volume production parameter of described via hole comprises:
The minimum bore diameter of via hole, the minimum orifice ring of via hole, metal live width, intermetallic apart from and spacing between via hole and via hole in one or more.
8. the via hole automatic adjustment system of circuit board according to claim 6, is characterized in that, described via hole alignment thereof comprises:
One or more in row alignment, column alignment and arbitrarily angled alignment thereof.
9. the via hole automatic adjustment system of circuit board according to claim 6, is characterized in that, described calling module is used for:
Receive the call instruction of user's input, call corresponding via hole alignment thereof with the call instruction inputted according to user; Or
Call the via hole alignment thereof of acquiescence.
10. the via hole automatic adjustment system of the circuit board according to any one of claim 6-9, is characterized in that, described adjusting module is used for:
According to the datum mark that user selects from multiple via hole, described multiple via hole is adjusted and arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510834187.XA CN105376945B (en) | 2015-11-25 | 2015-11-25 | The via automatic adjusting method and system of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510834187.XA CN105376945B (en) | 2015-11-25 | 2015-11-25 | The via automatic adjusting method and system of circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105376945A true CN105376945A (en) | 2016-03-02 |
| CN105376945B CN105376945B (en) | 2018-03-16 |
Family
ID=55378622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510834187.XA Expired - Fee Related CN105376945B (en) | 2015-11-25 | 2015-11-25 | The via automatic adjusting method and system of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105376945B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105956239A (en) * | 2016-04-25 | 2016-09-21 | 惠州Tcl移动通信有限公司 | Automatic alignment method and system of components in circuit design |
| CN106061101A (en) * | 2016-06-28 | 2016-10-26 | 广东欧珀移动通信有限公司 | Signal line protection method and apparatus, printed circuit board, and mobile terminal |
| CN106304618A (en) * | 2016-08-30 | 2017-01-04 | 张家港康得新光电材料有限公司 | Circuit board fit area and the alignment method of conductive adhesive layer |
| CN109548298A (en) * | 2019-01-03 | 2019-03-29 | 郑州云海信息技术有限公司 | A kind of PCB design figure edit methods and relevant apparatus based on IC chip |
| CN117709291A (en) * | 2024-02-06 | 2024-03-15 | 三微电子科技(苏州)有限公司 | Automatic generation method of radio frequency via hole surrounding hole based on EDA software |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040065019A (en) * | 2003-01-13 | 2004-07-21 | 신태명 | Apparatus for manufacturing high precision jig using closed loop control |
-
2015
- 2015-11-25 CN CN201510834187.XA patent/CN105376945B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040065019A (en) * | 2003-01-13 | 2004-07-21 | 신태명 | Apparatus for manufacturing high precision jig using closed loop control |
Non-Patent Citations (1)
| Title |
|---|
| DEARGDS（EDA365特邀版主）: "《[原创SKILL]VIA对齐功能》", 30 December 2009 * |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105956239A (en) * | 2016-04-25 | 2016-09-21 | 惠州Tcl移动通信有限公司 | Automatic alignment method and system of components in circuit design |
| CN106061101A (en) * | 2016-06-28 | 2016-10-26 | 广东欧珀移动通信有限公司 | Signal line protection method and apparatus, printed circuit board, and mobile terminal |
| CN106061101B (en) * | 2016-06-28 | 2018-09-18 | 广东欧珀移动通信有限公司 | Signal wire guard method, device, printed circuit board and terminal device |
| CN106304618A (en) * | 2016-08-30 | 2017-01-04 | 张家港康得新光电材料有限公司 | Circuit board fit area and the alignment method of conductive adhesive layer |
| CN109548298A (en) * | 2019-01-03 | 2019-03-29 | 郑州云海信息技术有限公司 | A kind of PCB design figure edit methods and relevant apparatus based on IC chip |
| CN109548298B (en) * | 2019-01-03 | 2021-06-29 | 郑州云海信息技术有限公司 | PCB design drawing editing method based on IC chip and related device |
| CN117709291A (en) * | 2024-02-06 | 2024-03-15 | 三微电子科技(苏州)有限公司 | Automatic generation method of radio frequency via hole surrounding hole based on EDA software |
| CN117709291B (en) * | 2024-02-06 | 2024-04-16 | 三微电子科技(苏州)有限公司 | Automatic generation method of radio frequency via hole surrounding hole based on EDA software |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105376945B (en) | 2018-03-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105376945A (en) | Circuit board through hole automatic adjusting method and system | |
| JP5219928B2 (en) | Editing apparatus, editing method, and program | |
| US20130198708A1 (en) | Placement and Area Adjustment for Hierarchical Groups in Printed Circuit Board Design | |
| US20130055190A1 (en) | Computing device and method for checking design of printed circuit board layout file | |
| CN111936966A (en) | Design system for creating graphical content | |
| CN104133676A (en) | Function execution method and function execution device based on scripts | |
| CN110363854A (en) | Circular formwork dividing method, device, computer equipment and storage medium | |
| CN110532559B (en) | Rule processing method and device | |
| CN112235949A (en) | Method, device and equipment for digging differential via hole in printed circuit board design | |
| JP2012008883A (en) | Editing device, and layout editing method and program in editing device | |
| US20140310674A1 (en) | System and method for checking signal transmission line | |
| EP2410487A1 (en) | Method for automatically modifying a graphics feature to comply with a resolution limit | |
| CN104850668A (en) | Method and apparatus for computer aided design | |
| JP2006074224A5 (en) | ||
| JP4659549B2 (en) | Design information generation program, design information generation apparatus, and design information generation method | |
| KR101586983B1 (en) | Drilling path optimization method | |
| CN107391853B (en) | PCB packaging design method and device | |
| CN111259620A (en) | Method, system, equipment and medium for inspecting blind buried hole in PCB | |
| US8255866B2 (en) | Computing device and method for checking distances between transmission lines and anti-pads arranged on printed circuit board | |
| KR102401345B1 (en) | Method for writing contents for a plurality of writers based on user account information and Apparatus thereof | |
| JP2007286919A (en) | Component interference check system, component interference check method, and component interference check program | |
| US7562317B2 (en) | Multitasking circuit layout diagram silkscreen text handling method and system | |
| CN105956239A (en) | Automatic alignment method and system of components in circuit design | |
| JP4670482B2 (en) | Process flow diagram creation support system and method | |
| JP2008217227A (en) | Clearance check control device in printed board design cad and its method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523859 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180316 |