CN105376945B - The via automatic adjusting method and system of circuit board - Google Patents
The via automatic adjusting method and system of circuit board Download PDFInfo
- Publication number
- CN105376945B CN105376945B CN201510834187.XA CN201510834187A CN105376945B CN 105376945 B CN105376945 B CN 105376945B CN 201510834187 A CN201510834187 A CN 201510834187A CN 105376945 B CN105376945 B CN 105376945B
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- Prior art keywords
- alignment
- circuit board
- volume production
- production parameter
- calling
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- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000013461 design Methods 0.000 claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 claims abstract description 28
- 239000002184 metal Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 230000006870 function Effects 0.000 description 10
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 210000003733 optic disk Anatomy 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
Abstract
The present invention proposes a kind of the via automatic adjusting method and system of circuit board, wherein, this method comprises the following steps：Electrical design rule is read, wherein, the electrical design rule includes the volume production parameter of via；Selection needs the multiple vias arranged on the circuit board；Via alignment thereof is called, and the multiple via is adjusted and arranged on the circuit board according to the via alignment thereof and the volume production parameter of the via.The via automatic adjusting method of the circuit board of the present invention can effectively lift the space availability ratio of circuit board, and improve the designing quality of circuit board, meet user's request.
Description
Technical field
The present invention relates to electrical design technical field, the via automatic adjusting method of more particularly to a kind of circuit board and it is
System.
Background technology
At present, with the rapid development of electronics industry, requirement more and more higher of the people for electronic product, with smart mobile phone
Exemplified by, on the one hand require that smart mobile phone has more more rich functions, another weight and volume for conveniently requiring smart mobile phone
It is not easy excessive.However, because function is increasingly abundanter, cause the integrated level more and more higher on the circuit board inside electronic product,
Because the integrated level on circuit board is higher, and the limited area of circuit board, therefore, how rational deployment is to lift the sky of circuit board
Between utilization rate be particularly important.
In correlation technique, the design of circuit board is typically carried out manually by designer, such as by the position of multiple vias, mistake
Distance and arrangement between hole etc. are manually adjusted, and are not only wasted time and energy, and accuracy is not high, influence the design of circuit board
Quality.
The content of the invention
It is contemplated that at least solves above-mentioned technical problem to a certain extent.
Therefore, it is an object of the present invention to propose a kind of via automatic adjusting method of circuit board.This method can
The effectively space availability ratio of lifting circuit board, and the designing quality of circuit board is improved, meet user's request.
It is another object of the present invention to the via automatic adjustment system for proposing a kind of circuit board.
In order to achieve the above object, the embodiment of the first aspect of the present invention discloses a kind of via of circuit board and adjusted automatically
Adjusting method, comprise the following steps：Electrical design rule is read, wherein, the electrical design rule includes the volume production parameter of via；
Selection needs the multiple vias arranged on the circuit board；Via alignment thereof is called, and according to the via alignment thereof
The multiple via is adjusted and arranged on the circuit board with the volume production parameter of the via.
The via automatic adjusting method of circuit board according to embodiments of the present invention, can it is simple according to user's request, quick,
The rational deployment of multiple vias on circuit board is realized exactly, lifts Consumer's Experience, and then when designing circuit board, effectively lifting
The space availability ratio of circuit board, and the designing quality of circuit board is improved, meet user's request.
In addition, the via automatic adjusting method of circuit board according to the above embodiment of the present invention can also have following add
Technical characteristic：
In some instances, the volume production parameter of the via includes：The minimum bore diameter of via, the minimum aperture of via
One or more of spacing between ring, metal line width, metal spacing and via and via.
In some instances, the via alignment thereof includes：In row alignment, column alignment and any angle alignment thereof
It is one or more.
In some instances, the calling via alignment thereof, further comprises：The call instruction of user's input is received,
Corresponding via alignment thereof is called with the call instruction inputted according to user；Or call the via alignment thereof of acquiescence.
In some instances, it is described right on the circuit board according to via alignment thereof and the volume production parameter of the via
The multiple via is adjusted and arranged, and further comprises：Datum mark is selected from the multiple via；According to the benchmark
Point is adjusted and arranged to the multiple via.
The embodiment of second aspect of the present invention discloses a kind of via automatic adjustment system of circuit board, including：Read mould
Block, for reading electrical design rule, wherein, the electrical design rule includes the volume production parameter of via；Selecting module, it is used for
Selection needs the multiple vias arranged on the circuit board；Calling module, for calling via alignment thereof；Adjusting module,
For being carried out according to the volume production parameter of the via alignment thereof and the via on the circuit board to the multiple via
Adjustment and arrangement.
The via automatic adjustment system of circuit board according to embodiments of the present invention, can it is simple according to user's request, quick,
The rational deployment of multiple vias on circuit board is realized exactly, lifts Consumer's Experience, and then when designing circuit board, effectively lifting
The space availability ratio of circuit board, and the designing quality of circuit board is improved, meet user's request.
In addition, the via automatic adjustment system of circuit board according to the above embodiment of the present invention can also have following add
Technical characteristic：
In some instances, the volume production parameter of the via includes：The minimum bore diameter of via, the minimum aperture of via
One or more of spacing between ring, metal line width, metal spacing and via and via.
In some instances, the via alignment thereof includes：In row alignment, column alignment and any angle alignment thereof
It is one or more.
In some instances, the calling module is used for：The call instruction of user's input is received, with what is inputted according to user
Corresponding via alignment thereof is called in call instruction；Or call the via alignment thereof of acquiescence.
In some instances, the adjusting module is used for：The datum mark selected according to user from multiple vias is to described
Multiple vias are adjusted and arranged.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
Obtain substantially, or recognized by the practice of the present invention.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention will become in the description from combination accompanying drawings below to embodiment
Substantially and it is readily appreciated that, wherein：
Fig. 1 is the flow chart of the via automatic adjusting method of circuit board according to an embodiment of the invention；
Fig. 2A is the multiple vias selected in the via automatic adjusting method of circuit board according to an embodiment of the invention
Schematic diagram before alignment；
Fig. 2 B are the design sketch after multiple vias alignment shown in Fig. 2A；And
Fig. 3 is the structured flowchart of the via automatic adjustment system of circuit board according to an embodiment of the invention.
Embodiment
Embodiments of the invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning to end
Same or similar label represents same or similar element or the element with same or like function.Below with reference to attached
The embodiment of figure description is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.
The via automatic adjusting method and system of circuit board according to embodiments of the present invention are described below in conjunction with accompanying drawing.
Fig. 1 is the flow chart of the via automatic adjusting method of circuit board according to an embodiment of the invention.Such as Fig. 1 institutes
Show, the via automatic adjusting method of circuit board according to an embodiment of the invention, comprise the following steps：
S101：Electrical design rule is read, wherein, electrical design rule includes the volume production parameter of via.
Such as：Shell script is write in advance, electronic design automation system is read (i.e. using shell script：EDA
Electronic Design Automation) in electrical design rule, and store the electrical design rule.
It is understood that in circuit-board industry, electrical design rule has versatility, and electrical design rule can basis
The development of circuit-board industry and update, for now, the volume production parameter for the via that electrical design rule includes, mainly include
But it is not limited to：Between the minimum bore diameter of via, the minimum orifice ring of via, metal line width, metal spacing and via and via
One or more of spacing, wherein, via refers to：Metal plated holes VIA on circuit board, abbreviation metal aperture.Such as：Metal
The minimum bore diameter in hole is：0.20mm, metal aperture minimum metal orifice ring are：0.40mm, metal wire are a width of：0.06mm, metal
Spacing is：0.06mm.
S102：Selection needs the multiple vias arranged on circuit boards.
Wherein, circuit board refers to printed circuit board (Printed Circuit Board, abbreviation PCB).
Specifically, according to the design needs of circuit board, multiple vias in a certain region, such as Fig. 2A on circuit board are chosen
It is shown, 6 vias in a region on a certain printed circuit board chosen are shown, and as shown in Figure 2 A, this 6 vias
Not yet arrange, i.e.,：The state that 6 vias are in before alignment, and it is irregular.
S103：Via alignment thereof is called, and it is right on circuit boards according to the volume production parameter of via alignment thereof and via
Multiple vias are adjusted and arranged.
, can be by writing shell script in advance when calling via alignment thereof, automatic call is stored in advance in electricity
Alignment thereof in sub- design automation system EDA, it is to be understood that according to the design need of circuit board in circuit-board industry
Will, via alignment thereof includes but is not limited to：One or more of row alignment, column alignment and any angle alignment thereof, its
In, any angle alignment thereof for example including：45 degree of angle alignment, 135 degree of angles are alignd, 225 degree of angles are alignd, 315 degree of angles are alignd etc..
After calling arrives corresponding alignment thereof, multiple vias of selection can be carried out according to the alignment thereof of calling
Arrangement, and spacing between the specification of each via, via and via etc. can be carried out according to the volume production parameter of above-mentioned via
Adjustment, so as to design meet user's needs, high quality high standard printed circuit board.
Specifically, via alignment thereof is called, including：The call instruction of user's input is received, to be inputted according to user
Call instruction call corresponding via alignment thereof；Or call the via alignment thereof of acquiescence.That is, via aligns
Mode can be selected according to the demand of user.
Such as：User inputs call instruction, and call instruction includes the via alignment thereof of user's selection, as user selects
For the via alignment thereof of 315 degree of angle alignment, then after the call instruction is received, the mode alignd according to 315 degree of angles is to upper
The multiple vias stated are arranged, certainly,, can also be by inputting tune again if user is unsatisfied with after arrangement is completed
Via alignment thereof is changed with the mode of order.Such as：, can be by defeated when via after user is to arrangement is unsatisfied
Enter equipment and input call instruction again, to change alignment thereof of multiple vias etc., untill user is satisfied with, wherein, input
Equipment is but is not limited to：Keyboard, mouse, the sensor etc. of touch-screen and specific function.
In addition it is also possible to when user does not select via alignment thereof, the via alignment thereof of acquiescence is called, in this hair
In bright one embodiment, the via alignment thereof of acquiescence can be one in above-mentioned multiple via alignment thereofs, also may be used
Be last time call via alignment thereof, such as：The via alignment thereof that last time calls is alignd for row, then this is called silent
The mode that the via alignment thereof recognized is alignd for row.
Further, can be with automatically according to via alignment thereof and via after via alignment thereof is called out
Volume production parameter multiple vias are adjusted and arranged on circuit boards, specifically, can be in the following way to multiple
Via is adjusted and arranged, including：Datum mark is selected from multiple vias；Multiple vias are adjusted according to datum mark and
Arrangement.That is, the point on the basis of a via in multiple vias, remaining multiple vias are pressed relative to the datum mark
Arranged according to corresponding via alignment thereof, and carried out according to the volume production parameter of via between size, via and the via of via
The adjustment of distance etc., so as to realize the autoplacement of via on circuit boards.As shown in Figure 2 B, it is 6 vias shown in Fig. 2A
Design sketch after being arranged in a manner of row aligns.
The via automatic adjusting method of circuit board according to embodiments of the present invention, can it is simple according to user's request, quick,
The rational deployment of multiple vias on circuit board is realized exactly, lifts Consumer's Experience, and then when designing circuit board, effectively lifting
The space availability ratio of circuit board, and the designing quality of circuit board is improved, meet user's request.
As shown in figure 3, in the further example of the present invention, a kind of via automatic adjustment system of circuit board is also disclosed
300, including：Read module 310, selecting module 320, calling module 330 and adjusting module 340.
Wherein, read module 310 is used to read electrical design rule, wherein, electrical design rule includes the volume production of via
Parameter.Selecting module 320 is used for multiple vias that selection on circuit boards needs to arrange.Calling module 330 is used to call via
Alignment thereof.Adjusting module 340 is used for according to via alignment thereof and the volume production parameter of via on circuit boards to multiple vias
It is adjusted and arranges.
Wherein, the volume production parameter of via includes but is not limited to：The minimum bore diameter of via, minimum orifice ring, the gold of via
One or more of spacing between category line width, metal spacing and via and via.
Via alignment thereof includes but is not limited to：One or more in row alignment, column alignment and any angle alignment thereof
It is individual.
In one embodiment of the invention, calling module 330 is used for：The call instruction of user's input is received, with basis
Corresponding via alignment thereof is called in the call instruction of user's input；Or call the via alignment thereof of acquiescence.
In one embodiment of the invention, adjusting module 340 is used for：The benchmark selected according to user from multiple vias
Point-to-points individual via is adjusted and arranged.
The via automatic adjustment system of circuit board according to embodiments of the present invention, can it is simple according to user's request, quick,
The rational deployment of multiple vias on circuit board is realized exactly, lifts Consumer's Experience, and then when designing circuit board, effectively lifting
The space availability ratio of circuit board, and the designing quality of circuit board is improved, meet user's request.
It should be noted that the specific implementation of the via automatic adjustment system of the circuit board of the embodiment of the present invention and sheet
The specific implementation of the via automatic adjusting method of the circuit board of inventive embodiments is similar, specifically refers to retouching for method part
State, in order to reduce redundancy, do not repeat herein.
Any process or method described otherwise above description in flow chart or herein is construed as, and represents to include
Module, fragment or the portion of the code of the executable instruction of one or more the step of being used to realize specific logical function or process
Point, and the scope of the preferred embodiment of the present invention includes other realization, wherein can not press shown or discuss suitable
Sequence, including according to involved function by it is basic simultaneously in the way of or in the opposite order, carry out perform function, this should be of the invention
Embodiment person of ordinary skill in the field understood.
Expression or logic and/or step described otherwise above herein in flow charts, for example, being considered use
In the order list for the executable instruction for realizing logic function, may be embodied in any computer-readable medium, for
Instruction execution system, device or equipment (such as computer based system including the system of processor or other can be held from instruction
The system of row system, device or equipment instruction fetch and execute instruction) use, or combine these instruction execution systems, device or set
It is standby and use.For the purpose of this specification, " computer-readable medium " can any can be included, store, communicate, propagate or pass
Defeated program is for instruction execution system, device or equipment or the dress used with reference to these instruction execution systems, device or equipment
Put.The more specifically example (non-exhaustive list) of computer-readable medium includes following：Electricity with one or more wiring
Connecting portion (electronic installation), portable computer diskette box (magnetic device), random access memory (RAM), read-only storage
(ROM), erasable edit read-only storage (EPROM or flash memory), fiber device, and portable optic disk is read-only deposits
Reservoir (CDROM).In addition, computer-readable medium, which can even is that, to print the paper of described program thereon or other are suitable
Medium, because can then enter edlin, interpretation or if necessary with it for example by carrying out optical scanner to paper or other media
His suitable method is handled electronically to obtain described program, is then stored in computer storage.
Those skilled in the art are appreciated that to realize all or part of step that above-described embodiment method carries
Suddenly it is that by program the hardware of correlation can be instructed to complete, described program can be stored in a kind of computer-readable storage medium
In matter, the program upon execution, including one or a combination set of the step of embodiment of the method.
In addition, each functional unit in each embodiment of the present invention can be integrated in a processing module, can also
That unit is individually physically present, can also two or more units be integrated in a module.Above-mentioned integrated mould
Block can both be realized in the form of hardware, can also be realized in the form of software function module.The integrated module is such as
Fruit is realized in the form of software function module and as independent production marketing or in use, can also be stored in a computer
In read/write memory medium.
Storage medium mentioned above can be read-only storage, disk or CD etc..
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or the spy for combining the embodiment or example description
Point is contained at least one embodiment or example of the present invention.In this manual, to the schematic representation of above-mentioned term not
Necessarily refer to identical embodiment or example.Moreover, specific features, structure, material or the feature of description can be any
One or more embodiments or example in combine in an appropriate manner.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that：Not
In the case of departing from the principle and objective of the present invention a variety of change, modification, replacement and modification can be carried out to these embodiments, this
The scope of invention is by claim and its equivalent limits.
Claims (8)
1. the via automatic adjusting method of a kind of circuit board, it is characterised in that comprise the following steps：
Electrical design rule is read, wherein, the electrical design rule includes the volume production parameter of via, wherein, the via
Volume production parameter includes：The minimum bore diameter of via, the minimum orifice ring of via, metal line width, metal spacing and via and mistake
One or more of spacing between hole；
Selection needs the multiple vias arranged on the circuit board；
Via alignment thereof is called, and according to the via alignment thereof and the volume production parameter of the via on the circuit board
The multiple via is adjusted and arranged, wherein, after calling to the corresponding via alignment thereof, to selection
The multiple via is arranged according to the via alignment thereof of calling, and according to the volume production parameter of the via to every
Spacing between the specification of individual via, via and via is adjusted.
2. the via automatic adjusting method of circuit board according to claim 1, it is characterised in that the via alignment thereof
Including：
One or more of row alignment, column alignment and any angle alignment thereof.
3. the via automatic adjusting method of circuit board according to claim 1, it is characterised in that the calling via alignment
Mode, further comprise：
The call instruction of user's input is received, corresponding via alignment thereof is called with the call instruction inputted according to user；Or
Person
Call the via alignment thereof of acquiescence.
4. the via automatic adjusting method of the circuit board according to claim any one of 1-3, it is characterised in that the basis
Via alignment thereof and the volume production parameter of the via are adjusted and arranged to the multiple via on the circuit board, enter
One step includes：
Datum mark is selected from the multiple via；
The multiple via is adjusted and arranged according to the datum mark.
A kind of 5. via automatic adjustment system of circuit board, it is characterised in that including：
Read module, for reading electrical design rule, wherein, the electrical design rule includes the volume production parameter of via, its
In, the volume production parameter of the via includes：The minimum bore diameter of via, the minimum orifice ring of via, metal line width, metal spacing
And one or more of spacing between via and via；
Selecting module, for multiple vias that selection needs are arranged on the circuit board；
Calling module, for calling via alignment thereof；
Adjusting module, for according to the volume production parameter of the via alignment thereof and the via on the circuit board to described
Multiple vias are adjusted and arranged, wherein, after calling to the corresponding via alignment thereof, to the described more of selection
Individual via is arranged according to the via alignment thereof of calling, and according to the volume production parameter of the via to each via
Specification, the spacing between via and via is adjusted.
6. the via automatic adjustment system of circuit board according to claim 5, it is characterised in that the via alignment thereof
Including：
One or more of row alignment, column alignment and any angle alignment thereof.
7. the via automatic adjustment system of circuit board according to claim 5, it is characterised in that the calling module is used
In：
The call instruction of user's input is received, corresponding via alignment thereof is called with the call instruction inputted according to user；Or
Person
Call the via alignment thereof of acquiescence.
8. the via automatic adjustment system of the circuit board according to claim any one of 5-7, it is characterised in that the adjustment
Module is used for：
The multiple via is adjusted and arranged according to the datum mark that user selects from multiple vias.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510834187.XA CN105376945B (en) | 2015-11-25 | 2015-11-25 | The via automatic adjusting method and system of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510834187.XA CN105376945B (en) | 2015-11-25 | 2015-11-25 | The via automatic adjusting method and system of circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN105376945A CN105376945A (en) | 2016-03-02 |
| CN105376945B true CN105376945B (en) | 2018-03-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510834187.XA Expired - Fee Related CN105376945B (en) | 2015-11-25 | 2015-11-25 | The via automatic adjusting method and system of circuit board |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105956239A (en) * | 2016-04-25 | 2016-09-21 | 惠州Tcl移动通信有限公司 | Automatic alignment method and system of components in circuit design |
| CN106061101B (en) * | 2016-06-28 | 2018-09-18 | 广东欧珀移动通信有限公司 | Signal wire guard method, device, printed circuit board and terminal device |
| CN106304618A (en) * | 2016-08-30 | 2017-01-04 | 张家港康得新光电材料有限公司 | Circuit board fit area and the alignment method of conductive adhesive layer |
| CN109548298B (en) * | 2019-01-03 | 2021-06-29 | 郑州云海信息技术有限公司 | PCB design drawing editing method based on IC chip and related device |
| CN117709291B (en) * | 2024-02-06 | 2024-04-16 | 三微电子科技(苏州)有限公司 | Automatic generation method of radio frequency via hole surrounding hole based on EDA software |
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| KR100509451B1 (en) * | 2003-01-13 | 2005-08-22 | 신태명 | Apparatus for manufacturing high precision jig using closed loop control |
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Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523859 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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