CN105369307A - Spot plating mechanism for lead frame - Google Patents
Spot plating mechanism for lead frame Download PDFInfo
- Publication number
- CN105369307A CN105369307A CN201510894826.1A CN201510894826A CN105369307A CN 105369307 A CN105369307 A CN 105369307A CN 201510894826 A CN201510894826 A CN 201510894826A CN 105369307 A CN105369307 A CN 105369307A
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- Prior art keywords
- lead frame
- torus
- dian
- rubber ring
- hole
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Abstract
The invention discloses a spot plating mechanism for a lead frame, which comprises a circular ring body, wherein at least one ring-shaped groove and a positioning structure matched with the lead frame are arranged on the outer peripheral surface of the circular ring body; a sealing rubber ring is embedded in the ring-shaped groove; electroplating through holes matched with electroplating positions on the lead frame are formed in the sealing rubber ring; radial through holes corresponding to the electroplating through holes of the sealing rubber ring are formed in the circular ring body; a liftable pressing plate mechanism is arranged on the upper side of the circular ring body; the lower part of the circular ring body is matched with at least two support wheels; when falling, the pressing plate mechanism squeezes the lead frame to enable the lead frame to be jointed with the part sealing rubber ring, and when the lead frame is pulled, the circular ring body and the support wheels rotate; a liquid sprayer is arranged in the middle of the circular ring body and sprays electroplating liquid to the lead frame; and electrodes are arranged beside the upper part of the circular ring body. The spot plating mechanism can perform electroplating according to set local positions on the lead frame, thereby not only reducing the manufacturing cost of the lead frame, but also improving the overall quality of the lead frame connected with a chip.
Description
Technical field
The present invention relates to electroplating device, especially a kind of Dian Du mechanism of lead frame.
Background technology
Lead frame is as the chip carrier of unicircuit, it is a kind of electrical connection realizing chip internal circuits leading-out end and outer lead by means of bonding material (spun gold, aluminium wire, copper wire), form the key structure part of electric loop, it serves the function served as bridge be connected with outer lead, all need in the semiconductor integrated block of the overwhelming majority to use lead frame, lead frame is base mateiral important in electronics and information industry.
Existing lead frame and chip internal circuits leading-out end connection portion all need to carry out silver-plated, so that welding.As shown in Figure 1 be a kind of vertical view of lead frame, it needs 1a, 2a and 3a place in the accompanying drawings to carry out silver-plated, traditional electroplating device and technique can only be carried out silver-plated in the whole face at 1a, 2a and 3a place, but to be the middle portion at 1a, 2a and 3a place just passable in the connection portion of lead frame and chip internal circuits leading-out end; Carry out silver-plated in the whole face at 1a, 2a and 3a place, not only increase the consumption of silver, improve the manufacturing cost of lead frame, simultaneously additional silver-plated part be unfavorable for lead frame connect chip after overall tightness, also can reduce the quality of integral product.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of Dian Du mechanism of lead frame, it can be electroplated by the local location set by lead frame, both reduce the manufacturing cost of lead frame, be conducive to again raising lead frame is connected rear integral product quality with chip.
For achieving the above object, technical scheme of the present invention is: a kind of Dian Du mechanism of lead frame, comprise torus, the locating structure that torus periphery is provided with at least one ring groove and matches with lead frame, ring groove is embedded with sealed rubber ring, sealed rubber ring is provided with the electroplating ventilating hole adapted with lead frame electroplating site, and torus is provided with the electroplating ventilating hole on the corresponding sealed rubber ring of radial direction through hole; Toric upside is provided with liftable press plate mechanism, toric bottom is engaged at least two supporting-point roller, when this press plate mechanism declines, swaged lead framework makes lead frame and position sealed rubber ring fit, and pulls during lead frame and torus and supporting-point roller are rotated; Toric centre is provided with bubbler, and bubbler sprays electroplate liquid towards lead frame; Side, torus top is being provided with electrode.
Further improvement, described sealed rubber ring is spliced by multiple joint strip and forms, and be provided with many chimeric posts below each joint strip, torus is provided with multiple radial direction and is fitted together to through hole, and every root is fitted together to post and is fitted together to through hole through a described radial direction.Manufacture and assembling to facilitate.
Further improvement, on described sealed rubber ring, the outer ledge of electroplating ventilating hole is provided with seal convexity.To improve sealing property further.
Preferred described locating structure comprises the multiple locating dowels being arranged on torus periphery, and the pilot hole that lead frame is provided with multiple correspondence matches with multiple locating dowel.
Further improvement, described torus periphery is provided with two annular flange flange, and torus is matched with four supporting-point roller by two annular flange flange, and every two supporting-point roller are articulated on a back shaft, and every root back shaft parallels with toric axis.
Further again, the periphery of each supporting-point roller is provided with annular engagement groove and matches with a described annular flange flange.
Preferred described bubbler comprises a body, and body is provided with the arc surface corresponding with described torus internal surface, and body has inner chamber, described arc surface distributes multiple fluid hole, each fluid hole is communicated with chamber body, and body connects a liquid-inlet pipe, and liquid-inlet pipe is communicated with chamber body.The electroplate liquid of this bubbler ejection is more even.
Preferably be provided with electrode near side, both sides, torus top.To improve plating performance.
Preferred described press plate mechanism comprises a lifting support, lifting support is equipped with two follow-up pulleys in the both sides on torus top, and lifting support is equipped with a tightening pulley on torus, and two are equipped with belt between follow-up pulley and tightening pulley, when lifting support declines, part belt pressure on the lead frames.This press plate mechanism mechanism belt can move together with lead frame, better protects lead frame.
Improve further, the upper articulation of described lifting support is at the middle part of a support bar, and one end of support bar is hinged on a permanent seat again, and the other end of support bar connects balancing weight.Just can adjust the snap-in force of belt to lead frame, suitable snap-in force by the weight adjusting balancing weight, can prevent lead frame and belt from occurring relative movement, further protection lead frame and belt.
The present invention is sprayed on the position that lead frame need electroplate because electroplate liquid that bubbler ejects is through the radial direction through hole on torus and the electroplating ventilating hole on sealed rubber ring, other position of lead frame does not reach electroplate liquid, plating area is only the cross-sectional area of electroplating ventilating hole on sealed rubber ring, realizes some plating effect; The shape of electroplating ventilating hole, position and cross-sectional area on the Position Design sealed rubber ring so just need be able to electroplated according to lead frame, after on sealed rubber ring, the shape of electroplating ventilating hole, position and cross-sectional area are determined, the electroplating surface sum shape on lead frame just can be determined.Therefore the present invention can electroplate by the local location set by lead frame, avoid the unnecessary waste of plated metal, both the manufacturing cost of lead frame had been reduced, the sealing property of many plating some effects chips can be prevented again, be conducive to raising lead frame is connected rear integral product quality with chip.
Accompanying drawing explanation
Fig. 1 is a kind of vertical view of lead frame;
Fig. 2 is stereographic map of the present invention;
Fig. 3 is front view of the present invention;
Fig. 4 is torus stereographic map;
Fig. 5 is torus front view;
Fig. 6 is the A-A sectional view of Fig. 5;
Fig. 7 is sealed rubber ring stereographic map;
Fig. 8 is single joint strip stereographic map;
Fig. 9 is bubbler stereographic map.
Embodiment
Below in conjunction with accompanying drawing and concrete embodiment, the present invention is described in further detail.
Shown in Fig. 1 to Fig. 9, a kind of Dian Du mechanism of lead frame, comprise a torus 1, torus 1 is made up of plastic cement, the locating structure that torus 1 periphery is provided with four ring grooves 11 and matches with lead frame 100, described locating structure comprises the multiple locating dowels 12 being arranged on torus 1 periphery, and the pilot hole 4a that lead frame 100 is provided with multiple correspondence matches with multiple locating dowel 12.
Each ring groove 11 is embedded with a sealed rubber ring 2, sealed rubber ring 2 is provided with the electroplating ventilating hole 21 adapted with lead frame 100 electroplating site, and torus 1 is provided with the electroplating ventilating hole 21 on the corresponding sealed rubber ring 2 of radial direction through hole 13;
For convenience of manufacturing and assembling, described sealed rubber ring 2 is spliced by multiple joint strip 20 and forms, many chimeric posts 22 are provided with below each joint strip 20, torus 1 is provided with multiple radial direction and is fitted together to through hole 14, every root is fitted together to post 22 and is fitted together to through hole 14 through a described radial direction, the middle part that every root is fitted together to post 22 is also provided with annular projection 221, departs from torus 1 to prevent joint strip 20.
For improving sealing effectiveness further, on described sealed rubber ring 2, the outer ledge of electroplating ventilating hole 21 is provided with seal convexity 211; Sealing adhesive tape 20 selects silica gel to make.
The upside of torus 1 is provided with liftable press plate mechanism 3, the bottom of torus 1 is engaged on four supporting-point roller 4, torus 1 periphery is provided with two annular flange flange 15, torus 1 is matched with four supporting-point roller 4 by two annular flange flange 15, and the periphery of each supporting-point roller 4 is provided with annular engagement groove 41 and matches with a described annular flange flange 15; Every two supporting-point roller 4 are articulated on a back shaft 5, and every root back shaft 5 parallels with the axis of torus 1.
When this press plate mechanism 3 declines, swaged lead framework 100 makes lead frame 100 and position sealed rubber ring 2 fit, and pulls during lead frame 100 and torus 1 and supporting-point roller 4 are relatively rotated.
Described press plate mechanism 3 comprises a lifting support 31, lifting support 31 is equipped with two follow-up pulleys 32 in the both sides on torus 1 top, lifting support 31 is equipped with a tightening pulley 33 on torus 1, the axis of two follow-up pulleys 32 and tightening pulley 33 parallels with the axis of torus 1, between two follow-up pulleys 32 and tightening pulley 33, belt 34 is housed, when lifting support 31 declines, part belt 34 is pressed on lead frame 100 and lead frame 100 and position sealed rubber ring 2 is fitted;
Tightening pulley 33 is contained on an adjustable shelf 35, and adjustable shelf 35 is provided with a screw rod 351 and is through on lifting support 31, just can be adjusted the position of tightening pulley 33 by the adjustment nut be engaged on screw rod 351, thus the tension force of adjustment belt 34.
The upper articulation of described lifting support 31 is at the middle part of a support bar 6; one end of support bar 6 is hinged on a permanent seat 7; the other end of support bar 6 connects balancing weight 8; the snap-in force of belt 34 pairs of lead frames 100 just can be adjusted by the weight adjusting balancing weight 8; suitable snap-in force; can prevent lead frame 100 and belt 34 from occurring relative movement, better protection lead frame 100 and belt 34.
The centre of torus 1 is provided with bubbler 9, and bubbler 9 sprays electroplate liquid towards lead frame 100; Described bubbler 9 comprises a body 91, body 91 is provided with the arc surface 911 corresponding with described torus 1 internal surface, body 91 has inner chamber, described arc surface 911 distributes multiple fluid hole 912, each fluid hole 912 is communicated with body 91 inner chamber, body 91 connects a liquid-inlet pipe 92, liquid-inlet pipe 92 and body 91 inner space; Liquid-inlet pipe 92 is communicated with plating liquid pump again; Arc surface 911 on described body 91 and the minimum spacing between described torus 1 internal surface are preferably 5-15mm.
Electrode 10 is being provided with near side, both sides, torus 1 top.
The working process of the present embodiment is: see Fig. 3, first installs lead frame 100, makes lead frame 100 be provided with the pilot hole 4a of multiple correspondence and matches with the multiple locating dowels 12 on torus 1; Then press plate mechanism 3 is put down, part belt 34 is just pressed on lead frame 100, make lead frame 100 need electroplate below fit with position sealed rubber ring 2, electroplating ventilating hole 21 on sealed rubber ring 2, with regard to the electroplating site of corresponding lead frame 100, then starts plating liquid pump and inputs electroplate liquid from liquid-inlet pipe 92; Electroplate liquid just penetrates from multiple fluid hole 912 and is sprayed on the position that lead frame 100 need electroplate through the radial direction through hole 13 torus 1 and the electroplating ventilating hole 21 on sealed rubber ring 2, again by the galvanic action that electrode 10 provides, the local location just need be able to electroplated at lead frame 100 plates required metal as silver etc.; Pull lead frame 100, the frictional force produced by the pressure of belt 34 simultaneously, just drive torus 1 rotate and make belt 34 itself do cyclic motion, realize circulation electroplating activity; Again by controlling movement velocity and the size of current of lead frame 100, the thickness electroplated just can be controlled.
Below be only the present invention's preferred embodiment, those skilled in the art makes by claim the protection domain that equivalent change all falls into this case.
Claims (10)
1. the Dian Du mechanism of a lead frame, it is characterized in that: comprise torus, the locating structure that torus periphery is provided with at least one ring groove and matches with lead frame, ring groove is embedded with sealed rubber ring, sealed rubber ring is provided with the electroplating ventilating hole adapted with lead frame electroplating site, and torus is provided with the electroplating ventilating hole on the corresponding sealed rubber ring of radial direction through hole;
Toric upside is provided with liftable press plate mechanism, toric bottom is engaged at least two supporting-point roller, when this press plate mechanism declines, swaged lead framework makes lead frame and position sealed rubber ring fit, and pulls during lead frame and torus and supporting-point roller are rotated;
Toric centre is provided with bubbler, and bubbler sprays electroplate liquid towards lead frame; Side, torus top is being provided with electrode.
2. the Dian Du mechanism of a kind of lead frame according to claim 1, it is characterized in that: described sealed rubber ring is spliced by multiple joint strip and forms, many chimeric posts are provided with below each joint strip, torus is provided with multiple radial direction and is fitted together to through hole, and every root is fitted together to post and is fitted together to through hole through a described radial direction.
3. the Dian Du mechanism of a kind of lead frame according to claim 1, is characterized in that: on described sealed rubber ring, the outer ledge of electroplating ventilating hole is provided with seal convexity.
4. the Dian Du mechanism of a kind of lead frame according to claim 1, is characterized in that: described locating structure comprises the multiple locating dowels being arranged on torus periphery, and the pilot hole that lead frame is provided with multiple correspondence matches with multiple locating dowel.
5. the Dian Du mechanism of a kind of lead frame according to claim 1, it is characterized in that: described torus periphery is provided with two annular flange flange, torus is matched with four supporting-point roller by two annular flange flange, every two supporting-point roller are articulated on a back shaft, and every root back shaft parallels with toric axis.
6. the Dian Du mechanism of a kind of lead frame according to claim 5, is characterized in that: the periphery of each supporting-point roller is provided with annular engagement groove and matches with a described annular flange flange.
7. the Dian Du mechanism of a kind of lead frame according to claim 1, it is characterized in that: described bubbler comprises a body, body is provided with the arc surface corresponding with described torus internal surface, body has inner chamber, described arc surface distributes multiple fluid hole, each fluid hole is communicated with chamber body, and body connects a liquid-inlet pipe, and liquid-inlet pipe is communicated with chamber body.
8. the Dian Du mechanism of a kind of lead frame according to claim 1, is characterized in that: be provided with electrode near side, both sides, torus top.
9. the Dian Du mechanism of a kind of lead frame according to any one of claim 1 to 8, it is characterized in that: described press plate mechanism comprises a lifting support, lifting support is equipped with two follow-up pulleys in the both sides on torus top, lifting support is equipped with a tightening pulley on torus, two are equipped with belt between follow-up pulley and tightening pulley, when lifting support declines, part belt pressure on the lead frames.
10. the Dian Du mechanism of a kind of lead frame according to claim 9, is characterized in that: the upper articulation of described lifting support is at the middle part of a support bar, and one end of support bar is hinged on a permanent seat, and the other end of support bar connects balancing weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510894826.1A CN105369307B (en) | 2015-12-08 | 2015-12-08 | A kind of Dian Du mechanisms of lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510894826.1A CN105369307B (en) | 2015-12-08 | 2015-12-08 | A kind of Dian Du mechanisms of lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105369307A true CN105369307A (en) | 2016-03-02 |
| CN105369307B CN105369307B (en) | 2017-12-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510894826.1A Expired - Fee Related CN105369307B (en) | 2015-12-08 | 2015-12-08 | A kind of Dian Du mechanisms of lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105369307B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101514466A (en) * | 2008-11-17 | 2009-08-26 | 郑建国 | Selective plating device |
| CN201485521U (en) * | 2009-08-14 | 2010-05-26 | 宁波华龙电子股份有限公司 | Continuous electroplating device for lead frame of integrated circuit |
| EP2444528A3 (en) * | 2010-10-19 | 2013-05-22 | SCHOTT Solar AG | Method and device for galvanising substrates and solar cells |
| CN203487256U (en) * | 2013-10-12 | 2014-03-19 | 普瑞迅金属表面处理（苏州）有限公司 | Spot plating wheel |
| CN205329183U (en) * | 2015-12-08 | 2016-06-22 | 厦门冠通电子科技有限公司 | Point of lead frame plates mechanism |
-
2015
- 2015-12-08 CN CN201510894826.1A patent/CN105369307B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101514466A (en) * | 2008-11-17 | 2009-08-26 | 郑建国 | Selective plating device |
| CN201485521U (en) * | 2009-08-14 | 2010-05-26 | 宁波华龙电子股份有限公司 | Continuous electroplating device for lead frame of integrated circuit |
| EP2444528A3 (en) * | 2010-10-19 | 2013-05-22 | SCHOTT Solar AG | Method and device for galvanising substrates and solar cells |
| CN203487256U (en) * | 2013-10-12 | 2014-03-19 | 普瑞迅金属表面处理（苏州）有限公司 | Spot plating wheel |
| CN205329183U (en) * | 2015-12-08 | 2016-06-22 | 厦门冠通电子科技有限公司 | Point of lead frame plates mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105369307B (en) | 2017-12-05 |
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Granted publication date: 20171205 Termination date: 20211208 |
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| CF01 | Termination of patent right due to non-payment of annual fee |