CN105369307B - A kind of Dian Du mechanisms of lead frame - Google Patents
A kind of Dian Du mechanisms of lead frame Download PDFInfo
- Publication number
- CN105369307B CN105369307B CN201510894826.1A CN201510894826A CN105369307B CN 105369307 B CN105369307 B CN 105369307B CN 201510894826 A CN201510894826 A CN 201510894826A CN 105369307 B CN105369307 B CN 105369307B
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- China
- Prior art keywords
- lead frame
- torus
- rubber ring
- sealed rubber
- dian
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Abstract
The present invention discloses a kind of Dian Du mechanisms of lead frame, including torus, torus outer peripheral face is provided with least one annular groove and the location structure being engaged with lead frame, sealed rubber ring is embedded with annular groove, sealed rubber ring is provided with the electroplating ventilating hole being adapted with lead frame electroplating site, and torus corresponds to the electroplating ventilating hole on sealed rubber ring provided with radial direction through hole；Liftable press plate mechanism is provided with the upside of torus, the bottom of torus coordinates at least two support wheels, swaged lead framework makes lead frame be fitted with part sealed rubber ring when the press plate mechanism declines, and torus is rotated with support wheel when pulling lead frame；The centre of torus is provided with bubbler, and bubbler sprays electroplate liquid towards lead frame；Electrode is being provided with beside torus top；The present invention can be electroplated according to the local location set by lead frame, both reduce the manufacturing cost of lead frame, improve the total quality after lead frame is connected with chip again.
Description
Technical field
The present invention relates to electroplating device, the Dian Du mechanisms of especially a kind of lead frame.
Background technology
Chip carrier of the lead frame as integrated circuit, it is a kind of real by means of bonding material (spun gold, aluminium wire, copper wire)
The electrical connection of existing chip internal circuits exit and outer lead, the key structure part of electric loop is formed, it is served and outside
The function served as bridge of portion wire connection, it is required for use lead frame in most semiconductor integrated blocks, lead frame is electric
Important basic material in sub-information industry.
Existing lead frame and chip internal circuits exit coupling part be required for carrying out it is silver-plated, in order to weld.Such as
Shown in accompanying drawing 1 is a kind of top view of lead frame, and progress is silver-plated at 1a, 2a and the 3a of its needs in the accompanying drawings, traditional
Electroplating device and technique can only be silver-plated in the entire surface progress at 1a, 2a and 3a, but lead frame draws with chip internal circuits
The coupling part for going out end is the center section can at 1a, 2a and 3a；Entire surface at 1a, 2a and 3a is plated
Silver, not only increase the dosage of silver, improve the manufacturing cost of lead frame, while additional silver-plated part is unfavorable for lead frame
The overall tightness after chip is connected, can also reduce the quality of integral product.
The content of the invention
The technical problem to be solved in the present invention is to provide a kind of Dian Du mechanisms of lead frame, and it can be according to lead frame institute
The local location of setting is electroplated, and has both reduced the manufacturing cost of lead frame, is advantageous to improve lead frame and chip again
The quality of integral product after connection.
To reach above-mentioned purpose, the technical scheme is that：A kind of Dian Du mechanisms of lead frame, including torus,
Torus outer peripheral face is provided with least one annular groove and the location structure being engaged with lead frame, and fluid sealant is embedded with annular groove
Ring, sealed rubber ring are provided with the electroplating ventilating hole being adapted with lead frame electroplating site, and torus is corresponding provided with radial direction through hole
Electroplating ventilating hole on sealed rubber ring；Liftable press plate mechanism is provided with the upside of torus, the bottom of torus coordinates extremely
On few two support wheels, swaged lead framework makes lead frame be fitted with part sealed rubber ring when the press plate mechanism declines, and draws
Torus is set to be rotated with support wheel during dynamic lead frame；The centre of torus is provided with bubbler, and bubbler is towards lead frame
Spray electroplate liquid；Electrode is being provided with beside torus top.
Further improve, the sealed rubber ring is made up of the splicing of multiple sealing joint strips, is provided with below each sealing joint strip
More chimeric posts, torus are provided with multiple radial directions and are fitted together to through hole, and every chimeric post is fitted together to through hole through a radial direction.With
Convenient manufacture and assembling.
Further improve, the outer ledge of electroplating ventilating hole is provided with seal convexity on the sealed rubber ring.Further to improve
Sealing property.
It is preferred that the location structure includes being arranged on multiple locating dowels of torus outer peripheral face, lead frame is provided with multiple
Corresponding positioning hole is engaged with multiple locating dowels.
Further improve, the torus outer peripheral face is provided with two annular flanges, and torus passes through two annular flanges
It is engaged with four support wheels, each two support wheel is articulated in a support shaft, every support shaft and the axial phase of torus
It is parallel.
Further, the outer peripheral face of each support wheel is engaged provided with annular engagement groove with an annular flange.
It is preferred that the bubbler includes a body, body is provided with the arc surface corresponding with the torus inner surface, this
Body has inner chamber, and multiple fluid holes are distributed on the arc surface, and each fluid hole connects chamber body, and body connects a feed liquor
Pipe, feed tube connect with chamber body.The electroplate liquid that this bubbler sprays is more uniform.
It is preferred that it is being provided with electrode beside the both sides of torus top.To improve plating performance.
It is preferred that the press plate mechanism includes a lifting support, lifting support is driven equipped with two in the both sides on torus top
Wheel, lifting support are fitted with a tensioning wheel in torus, and two are equipped with belt, lifting support between driven pulley and tensioning wheel
During decline, part belt pressure is on the lead frames.This press plate mechanism mechanism belt can move together with lead frame, preferably protect
Protect lead frame.
Further improve, the upper articulation of the lifting support is cut with scissors in the middle part of a support bar, one end of support bar
It is connected in a fixed seat, the other end connection balancing weight of support bar.Belt can just be adjusted by the weight for adjusting balancing weight
To the thrust of lead frame, suitable thrust, it can prevent lead frame from relative motion occur with belt, further protection is drawn
Wire frame and belt.
The present invention is through on the radial direction through hole and sealed rubber ring on torus due to the electroplate liquid that bubbler ejects
Electroplating ventilating hole is sprayed on the position that lead frame need to be electroplated, and the other positions of lead frame do not reach electroplate liquid, electroplate area
The cross-sectional area of electroplating ventilating hole only on sealed rubber ring, realize point plating effect；It is able to need to thus be electroplated according to lead frame
The shape of electroplating ventilating hole, position and cross-sectional area on Position Design sealed rubber ring, the shape of electroplating ventilating hole, position on sealed rubber ring
After being determined with cross-sectional area, plating area and shape on lead frame just can determine that.Therefore the present invention can be according to lead frame
Set local location is electroplated, and is avoided the unnecessary waste of plating metal, had both been reduced the manufacturing cost of lead frame,
And can prevents more plated parts from influenceing the sealing property of chip, is advantageous to improve integral product after lead frame is connected with chip
Quality.
Brief description of the drawings
Fig. 1 is a kind of top view of lead frame；
Fig. 2 is stereogram of the present invention；
Fig. 3 is front view of the present invention；
Fig. 4 is torus stereogram；
Fig. 5 is torus front view；
Fig. 6 is Fig. 5 A-A sectional views；
Fig. 7 is sealed rubber ring stereogram；
Fig. 8 is single sealing joint strip stereogram；
Fig. 9 is bubbler stereogram.
Embodiment
The present invention is described in further detail with specific embodiment below in conjunction with the accompanying drawings.
Shown in Fig. 1 to Fig. 9, a kind of Dian Du mechanisms of lead frame, including a torus 1, torus 1 is by plastic cement system
Into the outer peripheral face of torus 1 is provided with four annular grooves 11 and the location structure being engaged with lead frame 100, the location structure
Multiple locating dowels 12 including being arranged on the outer peripheral face of torus 1, lead frame 100 be provided with it is multiple corresponding to positioning hole 4a with it is more
Individual locating dowel 12 is engaged.
A sealed rubber ring 2 is embedded with each annular groove 11, sealed rubber ring 2 is provided with and the electroplating site of lead frame 100
Adaptable electroplating ventilating hole 21, torus 1 are provided with the electroplating ventilating hole 21 on the corresponding sealed rubber ring 2 of radial direction through hole 13；
For convenience of manufacturing and assembling, the sealed rubber ring 2 is made up of the splicing of multiple sealing joint strips 20, each sealing joint strip 20
Below be provided with more chimeric posts 22, torus 1 is provided with multiple radial directions and is fitted together to through hole 14, and every chimeric post 22 passes through an institute
State radially chimeric through hole 14, the middle part of every chimeric post 22 and be additionally provided with annular projection 221, to prevent sealing joint strip 20 from departing from annulus
Body 1.
Further to improve sealing effectiveness, the outer ledge of electroplating ventilating hole 21 is provided with seal convexity on the sealed rubber ring 2
211；The sealing joint strip 20 is made from silica gel.
The upside of torus 1 is provided with liftable press plate mechanism 3, and the bottom of torus 1 coordinates in four support wheels 4
On, the outer peripheral face of torus 1 is provided with two annular flanges 15, and torus 1 passes through two annular flanges 15 and four phases of support wheel 4
Coordinate, the outer peripheral face of each support wheel 4 is engaged provided with annular engagement groove 41 with an annular flange 15；Each two supports
Wheel 4 is articulated in a support shaft 5, and every support shaft 5 is parallel with the axial direction of torus 1.
Swaged lead framework 100 makes lead frame 100 be fitted with part sealed rubber ring 2 when the press plate mechanism 3 declines, and draws
Torus 1 is set to be relatively rotated with support wheel 4 during dynamic lead frame 100.
The press plate mechanism 3 includes a lifting support 31, lifting support 31 the both sides on the top of torus 1 equipped with two from
Driving wheel 32, lifting support 31 are fitted with a tensioning wheel 33 in torus 1, the axis of two driven pulleys 32 and tensioning wheel 33 with
The axis of torus 1 is parallel, and belt 34 is housed between two driven pulleys 32 and tensioning wheel 33, when lifting support 31 declines, portion
Dividing belt 34 to be pressed on lead frame 100 makes lead frame 100 be fitted with part sealed rubber ring 2；
On an adjustable shelf 35, adjustable shelf 35 is through on lifting support 31 tensioning wheel 33 provided with a screw rod 351, is passed through
Adjustment coordinates nut on screw rod 351 with regard to that can adjust the position of tensioning wheel 33, so as to adjust the tension force of belt 34.
The upper articulation of the lifting support 31 is hinged on one admittedly in the middle part of a support bar 6, one end of support bar 6
In reservation 7, the other end connection balancing weight 8 of support bar 6, the weight by adjusting balancing weight 8 can just adjust belt 34 to drawing
The thrust of wire frame 100, suitable thrust, it can prevent lead frame 100 from relative motion occur with belt 34, preferably protection
Lead frame 100 and belt 34.
The centre of torus 1 is provided with bubbler 9, and bubbler 9 sprays electroplate liquid towards lead frame 100；The bubbler 9
Including a body 91, body 91 is provided with the arc surface 911 corresponding with the inner surface of torus 1, and body 91 has inner chamber, institute
State and multiple fluid holes 912 are distributed on arc surface 911, each fluid hole 912 connects the inner chamber of body 91, and body 91 connects a feed tube
92, feed tube 92 connects with the inner chamber of body 91；Feed tube 92 connects plating liquid pump again；Arc surface 911 on the body 91 with
Minimum spacing between the inner surface of torus 1 is preferably 5-15mm.
Electrode 10 is being provided with beside the top both sides of torus 1.
The course of work of the present embodiment is：Referring to Fig. 3, lead frame 100 is first installed, is provided with lead frame 100 more
Positioning hole 4a corresponding to individual is engaged with multiple locating dowels 12 on torus 1；Then press plate mechanism 3, part belt 34 are put down
Press against on lead frame 100, make lead frame 100 need to electroplate below fitted with part sealed rubber ring 2, sealed rubber ring 2
On the just corresponding lead frame 100 of electroplating ventilating hole 21 electroplating site, then start plating liquid pump and inputted from feed tube 92 and electroplated
Liquid；Electroplate liquid is just projected through the plating on the radial direction through hole 13 and sealed rubber ring 2 on torus 1 from multiple fluid holes 912 to be led to
Hole 21 is sprayed on the position that lead frame 100 need to be electroplated, then the function of current provided by electrode 10, just can be in lead frame
100 local locations that need to be electroplated plate required metal such as silver etc.；Lead frame 100 is pulled simultaneously, is produced by the pressure of belt 34
Raw frictional force, just drive torus 1 to rotate and belt 34 is done shuttling movement in itself, realize circulation electroplating activity；Pass through again
The movement velocity and size of current of lead frame 100 are controlled, can just control the thickness of plating.
It the above is only a preferred embodiment of the invention, those skilled in the art is made equivalent change by claim
Both fall within the protection domain of this case.
Claims (8)
- A kind of 1. Dian Du mechanisms of lead frame, it is characterised in that：Including torus, torus outer peripheral face is provided with least one ring Shape groove and the location structure being engaged with lead frame, sealed rubber ring are embedded with annular groove, sealed rubber ring is provided with and lead frame The adaptable electroplating ventilating hole of frame electroplating site, torus correspond to the electroplating ventilating hole on sealed rubber ring provided with radial direction through hole；Liftable press plate mechanism is provided with the upside of torus, the bottom of torus coordinates at least two support wheels, should Swaged lead framework makes lead frame be fitted with position sealed rubber ring when press plate mechanism declines, and makes annulus when pulling lead frame Body rotates with support wheel；The centre of torus is provided with bubbler, and bubbler sprays electroplate liquid towards lead frame；Beside torus top It is provided with electrode；The press plate mechanism includes a lifting support, and lifting support is equipped with two driven pulleys in the both sides on torus top, lifting Support is fitted with a tensioning wheel in torus, and two are equipped with belt between driven pulley and tensioning wheel, when lifting support declines, Part belt pressure is on the lead frames；The upper articulation of the lifting support is hinged in a fixed seat in the middle part of a support bar, one end of support bar, The other end connection balancing weight of support bar.
- A kind of 2. Dian Du mechanisms of lead frame according to claim 1, it is characterised in that：The sealed rubber ring is by multiple Sealing joint strip splicing forms, and more chimeric posts is provided with below each sealing joint strip, it is chimeric logical that torus is provided with multiple radial directions Hole, every chimeric post are fitted together to through hole through a radial direction.
- A kind of 3. Dian Du mechanisms of lead frame according to claim 1, it is characterised in that：Electroplated on the sealed rubber ring The outer ledge of through hole is provided with seal convexity.
- A kind of 4. Dian Du mechanisms of lead frame according to claim 1, it is characterised in that：The location structure includes setting Multiple locating dowels in torus outer peripheral face are put, lead frame is provided with multiple corresponding positioning holes and matched with multiple locating dowels Close.
- A kind of 5. Dian Du mechanisms of lead frame according to claim 1, it is characterised in that：On the torus outer peripheral face Provided with two annular flanges, torus is engaged by two annular flanges with four support wheels, and each two support wheel is articulated in In a piece support shaft, every support shaft is parallel with the axial direction of torus.
- A kind of 6. Dian Du mechanisms of lead frame according to claim 5, it is characterised in that：The outer peripheral face of each support wheel It is engaged provided with annular engagement groove with an annular flange.
- A kind of 7. Dian Du mechanisms of lead frame according to claim 1, it is characterised in that：The bubbler includes one Body, body are provided with the arc surface corresponding with the torus inner surface, and body has inner chamber, is distributed on the arc surface multiple Fluid hole, each fluid hole connect chamber body, and body connects a feed tube, and feed tube connects with chamber body.
- A kind of 8. Dian Du mechanisms of lead frame according to claim 1, it is characterised in that：Close to torus top two Electrode is provided with beside side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510894826.1A CN105369307B (en) | 2015-12-08 | 2015-12-08 | A kind of Dian Du mechanisms of lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510894826.1A CN105369307B (en) | 2015-12-08 | 2015-12-08 | A kind of Dian Du mechanisms of lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105369307A CN105369307A (en) | 2016-03-02 |
| CN105369307B true CN105369307B (en) | 2017-12-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510894826.1A Expired - Fee Related CN105369307B (en) | 2015-12-08 | 2015-12-08 | A kind of Dian Du mechanisms of lead frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105369307B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101514466A (en) * | 2008-11-17 | 2009-08-26 | 郑建国 | Selective plating device |
| CN201485521U (en) * | 2009-08-14 | 2010-05-26 | 宁波华龙电子股份有限公司 | Continuous electroplating device for lead frame of integrated circuit |
| EP2444528A3 (en) * | 2010-10-19 | 2013-05-22 | SCHOTT Solar AG | Method and device for galvanising substrates and solar cells |
| CN203487256U (en) * | 2013-10-12 | 2014-03-19 | 普瑞迅金属表面处理（苏州）有限公司 | Spot plating wheel |
| CN205329183U (en) * | 2015-12-08 | 2016-06-22 | 厦门冠通电子科技有限公司 | Point of lead frame plates mechanism |
-
2015
- 2015-12-08 CN CN201510894826.1A patent/CN105369307B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101514466A (en) * | 2008-11-17 | 2009-08-26 | 郑建国 | Selective plating device |
| CN201485521U (en) * | 2009-08-14 | 2010-05-26 | 宁波华龙电子股份有限公司 | Continuous electroplating device for lead frame of integrated circuit |
| EP2444528A3 (en) * | 2010-10-19 | 2013-05-22 | SCHOTT Solar AG | Method and device for galvanising substrates and solar cells |
| CN203487256U (en) * | 2013-10-12 | 2014-03-19 | 普瑞迅金属表面处理（苏州）有限公司 | Spot plating wheel |
| CN205329183U (en) * | 2015-12-08 | 2016-06-22 | 厦门冠通电子科技有限公司 | Point of lead frame plates mechanism |
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| Publication number | Publication date |
|---|---|
| CN105369307A (en) | 2016-03-02 |
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Granted publication date: 20171205 Termination date: 20211208 |