CN105355616B - A kind of anti-oxidation metal product - Google Patents
A kind of anti-oxidation metal product Download PDFInfo
- Publication number
- CN105355616B CN105355616B CN201510812752.2A CN201510812752A CN105355616B CN 105355616 B CN105355616 B CN 105355616B CN 201510812752 A CN201510812752 A CN 201510812752A CN 105355616 B CN105355616 B CN 105355616B
- Authority
- CN
- China
- Prior art keywords
- parts
- copper
- oxidation
- metal product
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/43—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/43—Manufacturing methods
- H01L2224/438—Post-treatment of the connector
- H01L2224/43848—Thermal treatments, e.g. annealing, controlled cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/4554—Coating
- H01L2224/45565—Single coating layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/4554—Coating
- H01L2224/45599—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/4554—Coating
- H01L2224/45599—Material
- H01L2224/45698—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/45699—Material of the matrix
- H01L2224/4579—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/4554—Coating
- H01L2224/45599—Material
- H01L2224/45698—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/45798—Fillers
- H01L2224/45799—Base material
- H01L2224/458—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45817—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45824—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/4554—Coating
- H01L2224/45599—Material
- H01L2224/45698—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/45798—Fillers
- H01L2224/45799—Base material
- H01L2224/45893—Base material with a principal constituent of the material being a solid not provided for in groups H01L2224/458 - H01L2224/45891, e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Carbon And Carbon Compounds (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a kind of anti-oxidation metal product, anti-oxidation metal product is bonding brass wire, and purity >=99.99wt% of copper wire, its surface is made up of coated with the anti oxidation layer that thickness is 1~2nm, anti oxidation layer the component of following parts by weight:Fuller olefinic carbon 60 .1~0.5 part, 2~8 parts of aluminium, 8~15 parts of polyethylene, 11~16 parts of polyacrylamide, 1~3 part of carbon disulfide.The metallic article of the present invention has coat adhesion high, and pin hole rate is low, high temperature resistant, and the features such as resistance to oxidation, resistivity is low, has excellent conductibility, breakdown voltage resistant height.Wherein it is possible to be resistant to more than 400 DEG C of high temperature, 200 DEG C of conditions are also can tolerate 3 hours, so as to effectively solve copper wire problem of oxidation.
Description
Technical field
The present invention relates to a kind of anti-oxidation metal product.Belong to metallic article technical field.
Background technology
Bonding gold wire is a kind of conventional metallic article of microelectronics industry, and it is to be used as connecting line in integrated circuit
Golden alloy wire, it is integrated circuit or discrete device and the crucial lead material of LED connections.
Rise recently as the hurricane of developing rapidly for semicon industry, and the price of gold, to production and using company all
Bring huge cost pressure.In addition, the integration degree more and more higher of integrated circuit, circuit plate thickness is less and less, device
On number of electrodes it is more and more, electrode spacing is more and more narrow, and packaging density also accordingly becomes less and less, and bonding gold wire is not
The encapsulation requirement increasingly improved can be met, bonding brass wire turns into the ideal material for substituting bonding gold wire, but copper cash easily aoxidizes
Characteristic hinder the application and development of copper cash.This requires the inoxidizability when storage and application to copper cash proposes will
Ask.Moreover, also to add inert gas shielding in existing bonding brass wire is packed and stored in preparation process;The storage of bare copper wire
Deposit and service life is all very short, which increases the using effect of the cost of production and storage, also further influence final products.
The content of the invention
The purpose of the present invention is to overcome above-mentioned the deficiencies in the prior art, there is provided a kind of anti-oxidation metal product.
To achieve the above object, the present invention uses following technical proposals:
A kind of anti-oxidation metal product, the anti-oxidation metal product are bonding brass wire, the purity of the copper wire >=
99.99wt%, coated with the anti oxidation layer that thickness is 1~2nm, the anti oxidation layer is by the component of following parts by weight on its surface
Composition:Fuller olefinic carbon 60 .1~0.5 part, 2~8 parts of aluminium, 8~15 parts of polyethylene, 11~16 parts of polyacrylamide, carbon disulfide 1~
3 parts.
Preferably, the anti oxidation layer is made up of the component of following parts by weight:Fuller olefinic carbon 60 .1~0.4 part, aluminium 3~8
Part, 9~14 parts of polyethylene, 12~15 parts of polyacrylamide, 1~2 part of carbon disulfide.
It is further preferred that what the anti oxidation layer was made up of the component of following parts by weight:Fuller olefinic carbon 60 .2~0.3 part,
4~7 parts of aluminium, 10~13 parts of polyethylene, 13~15 parts of polyacrylamide, 1~2 part of carbon disulfide.
Still more preferably, the anti oxidation layer is made up of the component of following parts by weight:Fuller olefinic carbon 60 .2 parts, aluminium 6
Part, 12 parts of polyethylene, 14 parts of polyacrylamide, 2 parts of carbon disulfide.
The preparation method of the anti-oxidation metal product, including step:
(1)The high purity copper that purity is 99.999wt% is put into intermediate frequency furnace and carries out melting, is allowed to be melted into copper liquid, it
After pour into graphite ingot mould, keep vacuum, after being cooled down completely in stove, open gas injection valve, and open bell, will generate
Ingot dried up with pure water cooling, then with compressed air;
(2)Using vertical melting to its further melting, put it into crucible, seal afterwards, open vavuum pump, take out true
Sky, it is warming up to after copper is completely melt, starts cast, form copper rod;
(3)The copper rod of founding is progressively drawn and attenuated on wire drawing machine, until desired diameter;
(4)The product line of wire drawing passes to annealing operation annealing;
(5)The fullerene of formula ratio, aluminium, polyethylene and polyacrylamide are added in the carbon disulfide of formula ratio, strength
Stirring forms coating liquid, and afterwards plus opening coating liquid switch makes coating liquid slowly flow out, and is covered accordingly according to diametric requirements setting
Interval velocity, speed are 0.5~2m/s:The anti oxidation layer of the recipe ratio is coated on bonding brass wire surface, by the key after annealing
Close copper wire to immerse in the trough for filling coating liquid, by the effect of surface tension of liquid copper wire infiltration below liquid level, is made
Anti oxidation layer is coated uniformly on bonding brass wire surface;
(6)150~300 DEG C of drying.
Beneficial effects of the present invention:
The metallic article of the present invention has coat adhesion high, and pin hole rate is low, high temperature resistant, the features such as resistance to oxidation, resistance
Rate is low, has excellent conductibility, breakdown voltage resistant height.Wherein it is possible to be resistant to more than 400 DEG C of high temperature, 200 DEG C are also can tolerate
Condition 3 hours, so as to effectively solve copper wire problem of oxidation.
Embodiment
With reference to embodiment, the present invention will be further elaborated, it should explanation, the description below merely to
The present invention is explained, its content is not defined.
Embodiment 1:
A kind of anti-oxidation metal product of the present invention, anti-oxidation metal product are bonding brass wire, the purity of copper wire >=
99.99wt%, its surface are made up of coated with the anti oxidation layer that thickness is 1nm, anti oxidation layer the component of following parts by weight:
Fuller olefinic carbon 60 .1kg, aluminium 2kg, polyethylene 8kg, polyacrylamide 11kg, carbon disulfide 1kg.
The preparation method of the anti-oxidation metal product:
(1)The high purity copper that purity is 99.999wt% is put into intermediate frequency furnace and carries out melting, is allowed to be melted into copper liquid, it
After pour into graphite ingot mould, keep vacuum, after being cooled down completely in stove, open gas injection valve, and open bell, will generate
Ingot dried up with pure water cooling, then with compressed air;
(2)Using vertical melting to its further melting, put it into crucible, seal afterwards, open vavuum pump, take out true
Sky, it is warming up to after copper is completely melt, starts cast, form copper rod;
(3)The copper rod of founding is progressively drawn and attenuated on wire drawing machine, until desired diameter;
(4)The product line of wire drawing passes to annealing operation annealing;
(5)The fullerene of formula ratio, aluminium, polyethylene and polyacrylamide are added in the carbon disulfide of formula ratio, strength
Stirring forms coating liquid, and afterwards plus opening coating liquid switch makes coating liquid slowly flow out, and is covered accordingly according to diametric requirements setting
Interval velocity, speed 0.5m/s:The anti oxidation layer of the recipe ratio is coated on bonding brass wire surface, by the bonded copper after annealing
Silk is immersed in the trough for filling coating liquid, causes copper wire infiltration below liquid level, to make antioxygen by the effect of surface tension of liquid
Change layer and be coated uniformly on bonding brass wire surface;
(6)150 DEG C of drying.
Embodiment 2:
A kind of anti-oxidation metal product of the present invention, anti-oxidation metal product are bonding brass wire, the purity of copper wire >=
99.99wt%, its surface are made up of coated with the anti oxidation layer that thickness is 2nm, anti oxidation layer the component of following parts by weight:
Fuller olefinic carbon 60 .5kg, aluminium 8kg, polyethylene 15kg, polyacrylamide 16kg, carbon disulfide 3kg.
The preparation method of the anti-oxidation metal product:
(1)The high purity copper that purity is 99.999wt% is put into intermediate frequency furnace and carries out melting, is allowed to be melted into copper liquid, it
After pour into graphite ingot mould, keep vacuum, after being cooled down completely in stove, open gas injection valve, and open bell, will generate
Ingot dried up with pure water cooling, then with compressed air;
(2)Using vertical melting to its further melting, put it into crucible, seal afterwards, open vavuum pump, take out true
Sky, it is warming up to after copper is completely melt, starts cast, form copper rod;
(3)The copper rod of founding is progressively drawn and attenuated on wire drawing machine, until desired diameter;
(4)The product line of wire drawing passes to annealing operation annealing;
(5)The fullerene of formula ratio, aluminium, polyethylene and polyacrylamide are added in the carbon disulfide of formula ratio, strength
Stirring forms coating liquid, and afterwards plus opening coating liquid switch makes coating liquid slowly flow out, and is covered accordingly according to diametric requirements setting
Interval velocity, speed 2m/s:The anti oxidation layer of the recipe ratio is coated on bonding brass wire surface, by the bonding brass wire after annealing
Immerse in the trough for filling coating liquid, by the effect of surface tension of liquid copper wire infiltration below liquid level, is made anti-oxidant
Layer is coated uniformly on bonding brass wire surface;
(6)300 DEG C of drying.
Embodiment 3:
A kind of anti-oxidation metal product of the present invention, anti-oxidation metal product are bonding brass wire, the purity of copper wire >=
99.99wt%, its surface are made up of coated with the anti oxidation layer that thickness is 1.5nm, anti oxidation layer the component of following parts by weight
's:Fuller olefinic carbon 60 .4kg, aluminium 3kg, polyethylene 9kg, polyacrylamide 12kg, carbon disulfide 2kg.
The preparation method of the anti-oxidation metal product:
(1)The high purity copper that purity is 99.999wt% is put into intermediate frequency furnace and carries out melting, is allowed to be melted into copper liquid, it
After pour into graphite ingot mould, keep vacuum, after being cooled down completely in stove, open gas injection valve, and open bell, will generate
Ingot dried up with pure water cooling, then with compressed air;
(2)Using vertical melting to its further melting, put it into crucible, seal afterwards, open vavuum pump, take out true
Sky, it is warming up to after copper is completely melt, starts cast, form copper rod;
(3)The copper rod of founding is progressively drawn and attenuated on wire drawing machine, until desired diameter;
(4)The product line of wire drawing passes to annealing operation annealing;
(5)The fullerene of formula ratio, aluminium, polyethylene and polyacrylamide are added in the carbon disulfide of formula ratio, strength
Stirring forms coating liquid, and afterwards plus opening coating liquid switch makes coating liquid slowly flow out, and is covered accordingly according to diametric requirements setting
Interval velocity, speed 1m/s:The anti oxidation layer of the recipe ratio is coated on bonding brass wire surface, by the bonding brass wire after annealing
Immerse in the trough for filling coating liquid, by the effect of surface tension of liquid copper wire infiltration below liquid level, is made anti-oxidant
Layer is coated uniformly on bonding brass wire surface;
(6)200 DEG C of drying.
Embodiment 4:
A kind of anti-oxidation metal product of the present invention, anti-oxidation metal product are bonding brass wire, the purity of copper wire >=
99.99wt%, its surface are made up of coated with the anti oxidation layer that thickness is 1nm, anti oxidation layer the component of following parts by weight:
Fuller olefinic carbon 60 .4kg, aluminium 7kg, polyethylene 14kg, polyacrylamide 15kg, carbon disulfide 2kg.
The preparation method of the anti-oxidation metal product:
(1)The high purity copper that purity is 99.999wt% is put into intermediate frequency furnace and carries out melting, is allowed to be melted into copper liquid, it
After pour into graphite ingot mould, keep vacuum, after being cooled down completely in stove, open gas injection valve, and open bell, will generate
Ingot dried up with pure water cooling, then with compressed air;
(2)Using vertical melting to its further melting, put it into crucible, seal afterwards, open vavuum pump, take out true
Sky, it is warming up to after copper is completely melt, starts cast, form copper rod;
(3)The copper rod of founding is progressively drawn and attenuated on wire drawing machine, until desired diameter;
(4)The product line of wire drawing passes to annealing operation annealing;
(5)The fullerene of formula ratio, aluminium, polyethylene and polyacrylamide are added in the carbon disulfide of formula ratio, strength
Stirring forms coating liquid, and afterwards plus opening coating liquid switch makes coating liquid slowly flow out, and is covered accordingly according to diametric requirements setting
Interval velocity, speed 2m/s:The anti oxidation layer of the recipe ratio is coated on bonding brass wire surface, by the bonding brass wire after annealing
Immerse in the trough for filling coating liquid, by the effect of surface tension of liquid copper wire infiltration below liquid level, is made anti-oxidant
Layer is coated uniformly on bonding brass wire surface;
(6)300 DEG C of drying.
Embodiment 5:
A kind of anti-oxidation metal product of the present invention, anti-oxidation metal product are bonding brass wire, the purity of copper wire >=
99.99wt%, its surface are made up of coated with the anti oxidation layer that thickness is 1nm, anti oxidation layer the component of following parts by weight:
Fuller olefinic carbon 60 .2kg, aluminium 6kg, polyethylene 12kg, polyacrylamide 14kg.
The preparation method of the anti-oxidation metal product:
(1)The high purity copper that purity is 99.999wt% is put into intermediate frequency furnace and carries out melting, is allowed to be melted into copper liquid, it
After pour into graphite ingot mould, keep vacuum, after being cooled down completely in stove, open gas injection valve, and open bell, will generate
Ingot dried up with pure water cooling, then with compressed air;
(2)Using vertical melting to its further melting, put it into crucible, seal afterwards, open vavuum pump, take out true
Sky, it is warming up to after copper is completely melt, starts cast, form copper rod;
(3)The copper rod of founding is progressively drawn and attenuated on wire drawing machine, until desired diameter;
(4)The product line of wire drawing passes to annealing operation annealing;
(5)The fullerene of formula ratio, aluminium, polyethylene and polyacrylamide are added in the carbon disulfide of formula ratio, strength
Stirring forms coating liquid, and afterwards plus opening coating liquid switch makes coating liquid slowly flow out, and is covered accordingly according to diametric requirements setting
Interval velocity, speed 1m/s:The anti oxidation layer of the recipe ratio is coated on bonding brass wire surface, by the bonding brass wire after annealing
Immerse in the trough for filling coating liquid, by the effect of surface tension of liquid copper wire infiltration below liquid level, is made anti-oxidant
Layer is coated uniformly on bonding brass wire surface;
(6)150 DEG C of drying.
The performance indications and test result of the gained metallic article of embodiment 1~5 are shown in Table 1.
The performance indications of table 1. and test result
Project | Index | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 |
Adhesion | 50cm/min, no cracking | Without cracking | Without cracking | Without cracking | Without cracking | Without cracking |
High temperature resistant | 200 DEG C, 0.5h/ is without cracking | Without cracking | Without cracking | Without cracking | Without cracking | Without cracking |
High temperature resistant | 200 DEG C, 3h/ is without cracking | Without cracking | Without cracking | Without cracking | Without cracking | Without cracking |
High temperature resistant | 400 DEG C, 0.5h/ is without cracking | Without cracking | Without cracking | Without cracking | Without cracking | Without cracking |
Resistivity | The μ Ω ﹒ cm of < 1.7 | 0.5 | 0.5 | 0.4 | 0.4 | 0.3 |
It is breakdown voltage resistant | > 40V | 78 | 79 | 83 | 83 | 86 |
Salt solution pin hole | 1/100m | 0 | 0 | 0 | 0 | 0 |
As it can be seen from table 1 the metallic article of the present invention has coat adhesion high, pin hole rate is low, high temperature resistant, oxytolerant
The features such as change, resistivity is low, has excellent conductibility, breakdown voltage resistant height.Wherein it is possible to more than 400 DEG C of high temperature is resistant to,
Also tolerable 200 DEG C of conditions 3 hours, so as to effectively solve copper wire problem of oxidation.
Although the above-mentioned embodiment to the present invention is described, not to the limit of the scope of the present invention
System, on the basis of technical scheme, those skilled in the art need not pay creative work can make it is each
Kind modification is deformed still within protection scope of the present invention.
Claims (4)
- A kind of 1. anti-oxidation metal product, it is characterised in that the anti-oxidation metal product is bonding brass wire, the copper wire it is pure Degree >=99.99wt%, coated with the anti oxidation layer that thickness is 1~2nm, the anti oxidation layer is by following parts by weight on its surface Component composition:Fuller olefinic carbon 60 .1~0.5 part, 2~8 parts of aluminium, 8~15 parts of polyethylene, 11~16 parts of polyacrylamide, curing 1~3 part of carbon.
- 2. a kind of anti-oxidation metal product according to claim 1, it is characterised in that the anti oxidation layer is by following heavy Measure the component composition of part:Fuller olefinic carbon 60 .1~0.4 part, 2~7 parts of aluminium, 8~14 parts of polyethylene, 11~15 parts of polyacrylamide, 1~2 part of carbon disulfide.
- 3. a kind of anti-oxidation metal product according to claim 1, it is characterised in that the anti oxidation layer is by following heavy Measure the component composition of part:Fuller olefinic carbon 60 .2 parts, 6 parts of aluminium, 12 parts of polyethylene, 14 parts of polyacrylamide, 2 parts of carbon disulfide.
- A kind of 4. preparation method of anti-oxidation metal product according to any one of claims 1 to 3, it is characterised in that including Step:(1)The high purity copper that purity is 99.999wt% is put into intermediate frequency furnace and carries out melting, is allowed to be melted into copper liquid, falls afterwards Enter in graphite ingot mould, keep vacuum, after being cooled down completely in stove, open gas injection valve, and open bell, by the ingot of generation Dried up with pure water cooling, then with compressed air;(2)Using vertical melting to its further melting, put it into crucible, seal afterwards, open vavuum pump, vacuumize, It is warming up to after copper is completely melt, starts cast, form copper rod;(3)The copper rod of founding is progressively drawn and attenuated on wire drawing machine, until desired diameter;(4)The product line of wire drawing passes to annealing operation annealing;(5)The fullerene of formula ratio, aluminium, polyethylene and polyacrylamide are added in the carbon disulfide of formula ratio, strong stirring Coating liquid is formed, afterwards plus opening coating liquid switch makes coating liquid slowly flow out, and corresponding coating speed is set according to diametric requirements Degree, speed is 0.5~2m/s:The anti oxidation layer of the recipe ratio is coated on bonding brass wire surface, by the bonded copper after annealing Silk is immersed in the trough for filling coating liquid, causes copper wire infiltration below liquid level, to make antioxygen by the effect of surface tension of liquid Change layer and be coated uniformly on bonding brass wire surface;(6)150~300 DEG C of drying.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510812752.2A CN105355616B (en) | 2015-11-20 | 2015-11-20 | A kind of anti-oxidation metal product |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510812752.2A CN105355616B (en) | 2015-11-20 | 2015-11-20 | A kind of anti-oxidation metal product |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105355616A CN105355616A (en) | 2016-02-24 |
CN105355616B true CN105355616B (en) | 2017-12-19 |
Family
ID=55331555
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510812752.2A Expired - Fee Related CN105355616B (en) | 2015-11-20 | 2015-11-20 | A kind of anti-oxidation metal product |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105355616B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108588523A (en) * | 2018-06-27 | 2018-09-28 | 湖州同光金属材料有限公司 | A kind of almag metal product of high welding performance and antioxygenic property |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106409403B (en) * | 2016-11-07 | 2018-01-02 | 南昌专腾科技有限公司 | A kind of flat enamel-covered wire and its manufacturing process |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001009226A1 (en) * | 1999-07-30 | 2001-02-08 | Ppg Industries Ohio, Inc. | Impregnated glass fiber strands and products including the same |
CN201975388U (en) * | 2010-12-15 | 2011-09-14 | 广州佳博金丝科技有限公司 | Anti-oxidation copper-based bonding wire |
CN102361026A (en) * | 2011-10-19 | 2012-02-22 | 广东佳博电子科技有限公司 | Copper-based bonding wire with anti-oxidation function |
CN203192789U (en) * | 2013-02-01 | 2013-09-11 | 风青实业股份有限公司 | Bonding wire used for semiconductor |
CN103871537A (en) * | 2012-12-07 | 2014-06-18 | 日立金属株式会社 | Copper bonding wire and manufacturing method |
CN104272455A (en) * | 2012-05-07 | 2015-01-07 | 贺利氏材料工艺有限责任两合公司 | Aluminium coated copper bond wire and method of making the same |
TW201541592A (en) * | 2014-04-17 | 2015-11-01 | Solar Applied Mat Tech Corp | Silver alloy wire |
CN105023902A (en) * | 2009-07-30 | 2015-11-04 | 新日铁住金高新材料株式会社 | Bonding wire for semiconductor |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7276222B2 (en) * | 2001-01-19 | 2007-10-02 | Chevron U.S.A. Inc. | Diamondoid-containing thermally conductive materials |
-
2015
- 2015-11-20 CN CN201510812752.2A patent/CN105355616B/en not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001009226A1 (en) * | 1999-07-30 | 2001-02-08 | Ppg Industries Ohio, Inc. | Impregnated glass fiber strands and products including the same |
CN105023902A (en) * | 2009-07-30 | 2015-11-04 | 新日铁住金高新材料株式会社 | Bonding wire for semiconductor |
CN201975388U (en) * | 2010-12-15 | 2011-09-14 | 广州佳博金丝科技有限公司 | Anti-oxidation copper-based bonding wire |
CN102361026A (en) * | 2011-10-19 | 2012-02-22 | 广东佳博电子科技有限公司 | Copper-based bonding wire with anti-oxidation function |
CN104272455A (en) * | 2012-05-07 | 2015-01-07 | 贺利氏材料工艺有限责任两合公司 | Aluminium coated copper bond wire and method of making the same |
CN103871537A (en) * | 2012-12-07 | 2014-06-18 | 日立金属株式会社 | Copper bonding wire and manufacturing method |
CN203192789U (en) * | 2013-02-01 | 2013-09-11 | 风青实业股份有限公司 | Bonding wire used for semiconductor |
TW201541592A (en) * | 2014-04-17 | 2015-11-01 | Solar Applied Mat Tech Corp | Silver alloy wire |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108588523A (en) * | 2018-06-27 | 2018-09-28 | 湖州同光金属材料有限公司 | A kind of almag metal product of high welding performance and antioxygenic property |
Also Published As
Publication number | Publication date |
---|---|
CN105355616A (en) | 2016-02-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104319088A (en) | Preparation process of vacuum epoxy resin casting type mutual inductor | |
CN105355616B (en) | A kind of anti-oxidation metal product | |
CN104002112B (en) | Method for machining die | |
JP2012519938A5 (en) | ||
CN103199073B (en) | Silver palladium alloy single crystal bonding wire and manufacture method thereof | |
CN104835798B (en) | A kind of preparation method of anti-oxidant bonding brass wire | |
CN101862922A (en) | Binary alloy sealing solder wire | |
CN104377185A (en) | Gold-plated palladium-silver alloy single crystal bonding wire and manufacturing method thereof | |
CN108962860B (en) | Preparation method of oxidation-resistant bonding copper wire material | |
CN103938002B (en) | A kind of Cu-Cr-Zr alloy casting rod reduces the vacuum melting technique of segregation | |
CN103740956A (en) | Preparation method of high-silicon aluminum alloy | |
CN102925945A (en) | Mother for preparing a lifting tube through counter-gravity casting | |
CN106493352A (en) | A kind of aluminium silicon electronic packing material and preparation method thereof | |
CN104057021B (en) | The configuration of metal type dies pouring and riser systems coating and brushing method | |
CN106591758B (en) | A kind of method electric arc spraying solid silk material and its prepare high temperature coatings | |
CN106811617A (en) | A kind of preparation method for being bonded electrum | |
CN106409403B (en) | A kind of flat enamel-covered wire and its manufacturing process | |
CN108179395A (en) | A kind of pressure ring arrangements for physical vapor deposition equipment | |
CN104404505B (en) | The spraying preparation method of Cu/Mo/Cu composite sheet | |
CN114308595A (en) | Surface nano palladium layer dip plating process for bonding oxygen-free copper wire | |
TWI594336B (en) | Insulation bonding wire | |
CN108500207A (en) | investment casting method | |
CN104988354B (en) | Preparation method and its spraying coating process of a kind of thin film capacitor with metal spraying silk | |
CN108330307A (en) | A kind of electric arc spraying zinc-copper-titanium alloy silk material and its preparation process | |
CN109637935A (en) | A kind of preparation method of anti-oxidant copper wire |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171219 Termination date: 20211120 |
|
CF01 | Termination of patent right due to non-payment of annual fee |