CN105338743A - Circuit board manufacturing method and circuit board - Google Patents
Circuit board manufacturing method and circuit board Download PDFInfo
- Publication number
- CN105338743A CN105338743A CN201510616454.6A CN201510616454A CN105338743A CN 105338743 A CN105338743 A CN 105338743A CN 201510616454 A CN201510616454 A CN 201510616454A CN 105338743 A CN105338743 A CN 105338743A
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- Prior art keywords
- interface
- circuit board
- mainboard
- circuit
- subplate
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a circuit board manufacturing method and a circuit board. The method comprises steps of: drilling a circuit substrate in order to obtain a main board, an auxiliary board, and a plurality of stamp holes arranged on a joint of the main board and the auxiliary board; electroplating the circuit substrate with a copper foil layer in order to obtain a first copper-clad board; pasting a photosensitive film on the first copper-clad board and transferring a circuit pattern to the photosensitive film in order to obtain a second copper-clad board, wherein the circuit pattern includes a first interface circuit diagram, a second interface circuit diagram, and a wire; leading the wire out of the first interface circuit diagram and enabling the wire to pass through a gap between the stamp holes to be connected with the second interface circuit diagram; irradiating the second copper-clad board with ultraviolet in order that the photosensitive film equipped with the circuit pattern is solidified and pasted on the second interface circuit diagram; etching and removing positions which are not solidified by the photosensitive film in order to obtain a line board; printing photosensitive ink on the line board and forming a solder mask so as to obtain a circuit board. The method may save the material cost of an interface part and reduces the operating cost and the inventory risks of enterprises.
Description
Technical field
The present invention relates to circuit board technology field, particularly relate to a kind of manufacture method and circuit board of circuit board.
Background technology
In existing field of circuit boards, usually need mainboard to be separated with subplate, various different interface at this moment can be used to connect mainboard and subplate.Common male and female head connecting interface is: Video Graphics Array interface (VideoGraphicsArray, be called for short USB interface), HDMI (High Definition Multimedia Interface) (HighDefinitionMultimediaInterface, be called for short HDMI) and digital display interface (DigitalVisualInterface is called for short DVI interface).Because customer demand major-minor plate is separated, therefore after major-minor plate is separated, need according to the corresponding holding wire of dissimilar interface configuration, and need, at mainboard and the interface of subplate, corresponding male and female head connector is installed.If but when customer requirement is not separated mainboard and subplate, then still need to install male and female head connector, the material of Male head connector and female connector cannot be saved, and improves operation cost and inventory risk.
Summary of the invention
The embodiment of the present invention proposes a kind of manufacture method and circuit board of circuit board, can save the Material Cost of interface section, reduces operation cost and the inventory risk of enterprise.
The embodiment of the present invention provides a kind of manufacture method of circuit board, comprising:
To circuit substrate boring, obtain mainboard, subplate and several stamp holes; Described stamp hole is arranged on the junction of described mainboard and described subplate, is convenient to be separated described mainboard and described subplate;
Electro-coppering layers of foil on described circuit substrate, obtains the first copper-clad plate;
Light-sensitive surface is attached on the whole plate of described first copper-clad plate;
The line pattern designed in advance is transferred on described light-sensitive surface, obtains the second copper-clad plate; Described line pattern comprises the first interface line map be arranged on described mainboard and the second interface circuit figure be arranged on described subplate; Described first interface line map is connected by some wirings with described second interface circuit figure; Wherein, described wiring is drawn from described first interface line map, through the gap between described stamp hole, is connected to described second interface circuit figure;
UV-irradiation is carried out to described second copper-clad plate, makes the light-sensitive surface solidification with line pattern stick in described second copper-clad plate;
Etching is removed not by the position that described light-sensitive surface solidifies in described second copper-clad plate, obtains wiring board;
Described wiring board brushes photosensitive-ink, and after ultraviolet photoetching forms solder mask, obtains circuit board.
Further, described wiring comprises: intermediate frequency anti-phase input line, intermediate frequency positive input line, I2C bus, supply lines and IF AGC control line.
Further, describedly on described wiring board, brush photosensitive-ink, and after ultraviolet photoetching forms solder mask, after obtaining circuit board, also comprise:
Described first interface line map welds first interface, described second interface circuit figure welds the second interface;
Mainboard and the subplate of described circuit board is separated according to described stamp hole.
Further, described first interface and described second interface match;
Described first interface is connected by holding wire with described second interface, and the mainboard after being separated is connected by described holding wire with subplate.
Further, described first interface connector is USB interface connector, HDMI connector or dvi connector.
On the other hand, embodiments provide a kind of circuit board in a circuit according to the invention made by board manufacturing method, the subplate comprising mainboard and extend out from described mainboard;
In the junction of described mainboard and described subplate, be provided with the stamp hole that several are convenient to be separated described mainboard and described subplate;
Described mainboard is provided with first interface line map; Described first interface line map is provided with installing hole and the installation site of first interface;
Described subplate is provided with the second interface circuit figure; Described second interface circuit figure is provided with installing hole and the installation site of the second interface;
Described circuit board is also provided with wiring, and described wiring is drawn from described first interface line map, through the gap between described stamp hole, is connected to described second interface circuit figure.
Further, the installing hole of described first interface and installation site are welded with first interface;
The installing hole of described second interface and installation site are welded with the second interface.
Further, described first interface is male terminal, and described second interface is the female terminal matched with described male terminal;
Or described first interface is described female terminal, described second interface is described male terminal.
Further, described first interface is USB interface, HDMI or DVI interface.
Further, described circuit board also comprises holding wire, and one end of described holding wire connects described first interface, and the other end of described holding wire connects described second interface.
Implement the embodiment of the present invention, there is following beneficial effect:
The manufacture method of a kind of circuit board that the embodiment of the present invention provides, first holes to circuit substrate, and obtain mainboard, subplate and several stamp holes, stamp hole is arranged on the junction of mainboard and subplate, is convenient to be separated mainboard and subplate.Then electro-coppering layers of foil on circuit substrate, obtains the first copper-clad plate, and sticks light-sensitive surface to the whole plate of the first copper-clad plate, is transferred on light-sensitive surface, obtains the second copper-clad plate by the line pattern designed in advance.Wherein, this line pattern comprises first interface line map and the second interface circuit figure, and first interface line map and the second interface circuit figure are connected up by some and be connected, and connect up from first interface line map and draw, through the gap between stamp hole, be connected to the second interface circuit figure.Again UV-irradiation is carried out to the second copper-clad plate, the light-sensitive surface solidification with line pattern is sticked in the second copper-clad plate, and etches not by the position that light-sensitive surface solidifies in removal second copper-clad plate, obtain wiring board.Final online road plate brushes photosensitive-ink, and after ultraviolet photoetching forms solder mask, obtains circuit board.Compared to prior art, no matter whether major-minor plate is separated, still mounting interface connector is needed, the circuit board that the present invention makes connects first interface line map and the second interface circuit figure by wiring, when client does not need major-minor plate to be separated, the material of interface connector can be saved, cut operating costs.
Further, the present invention, after acquisition circuit board, first interface line map welds first interface, the second interface circuit figure welds the second interface, and is separated mainboard and subplate according to stamp hole.When client needs major-minor plate to be separated, configuring corresponding holding wire and major-minor plate can be made to connect communication, without the need to redesigning circuit diagram, effectively reducing design cost and the inventory risk of enterprise.
On the other hand, the invention provides a kind of circuit board in a circuit according to the invention made by board manufacturing method, comprise the subplate that mainboard and mainboard extend out, mainboard and the junction of subplate are provided with the stamp hole that several are convenient to be separated mainboard and subplate.Circuit board is provided with wiring, connects up to draw from the first interface line map be arranged on mainboard, through the gap between stamp hole, is connected to the second interface circuit figure be arranged on subplate.Compared to prior art, no matter whether major-minor plate is separated, and still needs to install male and female head connector, and circuit board of the present invention, when not needing major-minor plate to be separated, can be saved the material of male and female head connector, cut operating costs.And the circuit board of the present invention's making is applicable to the interface connector of multiple interfaces type, as USB interface, HDMI and DVI interface etc., can meet the demand that client is different, applied range.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of a kind of embodiment of the manufacture method of circuit board provided by the invention;
Fig. 2 is the structural representation of a kind of embodiment of circuit board provided by the invention;
Fig. 3 is the structural representation of the another kind of embodiment of circuit board provided by the invention;
Fig. 4 is the syndeton schematic diagram of USB interface provided by the invention;
Fig. 5 is the structural representation of another embodiment of circuit board provided by the invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Embodiment 1
Be the schematic flow sheet of a kind of embodiment of the manufacture method of circuit board provided by the invention see Fig. 1, Fig. 1, the method comprises the following steps:
Step 101: to circuit substrate boring, obtain mainboard, subplate and several stamp holes; This stamp hole is arranged on the junction of mainboard and subplate, is convenient to be separated mainboard and subplate.
In the present embodiment, circuit substrate is holed, except getting out stamp hole, corresponding conductive hole, device connecting hole and via hole etc. can also be got out according to the design of circuit board.Stamp hole is arranged on the junction of mainboard and subplate, is convenient to be separated mainboard and subplate.
In the present embodiment, mainboard and subplate need muscle to be connected, and for the ease of cutting, can hold some apertures, be similar to the hole at stamp edge, therefore be called stamp hole above muscle.Stamp hole in the present invention is used for when mainboard and subplate need to be separated, and is convenient to cutting.Stamp hole is the aperture of a continuous row, and its diameter can be, but not limited to as 0.5mm, and spacing is 1mm.
In the present embodiment, mainboard and subplate can be, but not limited to be in same level, still can method according to the present invention make for the circuit board of major-minor plate in Different Plane.
Step 102: electro-coppering layers of foil on circuit substrate, obtains the first copper-clad plate.
In the present embodiment, by electroplating technology, electro-coppering layers of foil on circuit substrate, makes the whole space of a whole page all plates Copper Foil, obtains the first copper-clad plate.
Step 103: light-sensitive surface is attached on the whole plate of the first copper-clad plate.
Step 104: be transferred on light-sensitive surface by the line pattern designed in advance, obtains the second copper-clad plate; This line pattern comprises the first interface line map be arranged on mainboard and the second interface circuit figure be arranged on subplate; First interface line map is connected by some wirings with the second interface circuit figure; Wherein, connect up from first interface line map and draw, through the gap between stamp hole, be connected to the second interface circuit figure.
In the present embodiment, can be, but not limited to use laser printer printed line pattern designed in advance on template or film paper, negative film can be adopted to print.Namely there is the place of line pattern not print carbon dust, do not have the place of line pattern to print upper carbon dust.Again printed template or film paper are attached in the first copper-clad plate with light-sensitive surface, complete line pattern transfer, obtain the second copper-clad plate.
In the present embodiment, the second interface circuit figure line pattern of design being arranged on the first interface line map on mainboard and being arranged on subplate.First mainboard line map and the second interface circuit figure are connected up by some and are connected, and connect up from first interface line map and draw, through the gap between stamp hole, be connected to the second interface circuit figure.When not needing major-minor plate to be separated, first interface line map is communicated by wiring with the second interface circuit figure, can interface type design as required connect up accordingly, as USB interface, HDMI or DVI interface.For example, when interface type is USB interface, this wiring comprises: intermediate frequency anti-phase input line, intermediate frequency positive input line, I2C bus, supply lines and IF AGC control line.
Step 105: carry out UV-irradiation to the second copper-clad plate, makes the light-sensitive surface solidification with line pattern stick in the second copper-clad plate.
In this example, the second copper-clad plate placed and irradiate a period of time under ultraviolet light, the local light-sensitive surface be irradiated by light can solidify and sticks in the second copper-clad plate.
Step 106: not by the position that light-sensitive surface solidifies in etching removal second copper-clad plate, obtain wiring board.
In the present embodiment, first the second copper-clad plate is put in alkaline solution the light-sensitive surface washing away and be not irradiated to, the second copper-clad plate is being put in the strong oxidizers such as ferric trichloride the copper coin eroding not no solidification light-sensitive surface and cover, thus is obtaining wiring board.
Step 107: brush photosensitive-ink in the circuit board, and after ultraviolet photoetching forms solder mask, obtain circuit board.
In the present embodiment, this circuit board comprises interconnective mainboard and subplate, and mainboard communicates by connecting up to be connected with the line map on subplate.
One as the present embodiment is illustrated, brush photosensitive-ink in the circuit board, and after uv-exposure forms welding resistance, after obtaining circuit board, also comprise: on first interface line map, weld first interface, second interface circuit figure welds the second interface, and according to the mainboard of stamp hole separate circuit boards and subplate.First interface and the second interface match, and first interface is connected by holding wire with the second interface, the mainboard after being separated is connected by holding wire with the subplate be separated, realizes Signal transmissions.In this citing, first interface can be, but not limited to as USB interface, HDMI or DVI interface.
Therefore the manufacture method of a kind of circuit board that the embodiment of the present invention provides, first holes to circuit substrate, and obtain mainboard, subplate and several stamp holes, stamp hole is arranged on the junction of mainboard and subplate, be convenient to be separated mainboard and subplate.Then electro-coppering layers of foil on circuit substrate, obtains the first copper-clad plate, and sticks light-sensitive surface to the whole plate of the first copper-clad plate, is transferred on light-sensitive surface, obtains the second copper-clad plate by the line pattern designed in advance.Wherein, this line pattern comprises first interface line map and the second interface circuit figure, and first interface line map and the second interface circuit figure are connected up by some and be connected, and connect up from first interface line map and draw, through the gap between stamp hole, be connected to the second interface circuit figure.Again UV-irradiation is carried out to the second copper-clad plate, the light-sensitive surface solidification with line pattern is sticked in the second copper-clad plate, and etches not by the position that light-sensitive surface solidifies in removal second copper-clad plate, obtain wiring board.Compared to prior art, no matter whether major-minor plate is separated, still mounting interface connector is needed, the circuit board that the present invention makes connects first interface line map and the second interface circuit figure by wiring, when client does not need major-minor plate to be separated, the material of interface connector can be saved, cut operating costs.
Further, manufacture method of the present invention, when soldering of electronic components, also comprises welding first interface connector and the second interface connector, and is separated mainboard and subplate according to stamp hole.When client needs major-minor plate to be separated, configuring corresponding holding wire and major-minor plate can be made to connect communication, without the need to redesigning circuit diagram, effectively reducing design cost and the inventory risk of enterprise.
Further, the circuit board that the present invention makes is applicable to the interface connector of multiple interfaces type, as USB interface, HDMI and DVI interface etc., can meet the demand that client is different, applied range.
Embodiment 2
See Fig. 2, it is the structural representation of a kind of embodiment of circuit board provided by the invention.As shown in Figure 2, this circuit board comprises: mainboard 1 and the subplate 2 extended out from mainboard 1.
In the junction of mainboard 1 with subplate 2, be provided with the stamp hole 3 that several are convenient to be separated mainboard 1 and subplate 2.
Mainboard 1 is provided with first interface line map.First interface line map is provided with installing hole and the installation site 201 of first interface.Subplate 2 is provided with the second interface circuit figure, the second interface circuit figure is provided with installing hole and the installation site 202 of the second interface.This circuit board is also provided with the wiring 4 for connection line figure, wiring 4 is drawn from first interface line map, through the gap between stamp hole 3, is connected to the second interface circuit figure.
In circuit board of the present invention, mainboard 1 needs muscle to be connected with subplate 2, for the ease of cutting, can hold some apertures, be similar to the hole at stamp edge, therefore be called stamp hole above muscle.Stamp hole 3 in the present invention, for when mainboard 1 needs to be separated with subplate 2, is convenient to cutting.Stamp hole 3 is the aperture of a continuous row, and its diameter can be, but not limited to as 0.5mm, and spacing is 1mm.
When printed circuit board (PCB), mainboard 1 and subplate 2 can be, but not limited to be in same level, still can realize technical scheme of the present invention for the circuit board of major-minor plate in Different Plane.
One as the present embodiment is illustrated, and is the structural representation of the another kind of embodiment of circuit board provided by the invention see Fig. 3, Fig. 3.As shown in Figure 3, the installing hole of first interface and installation site 201 are welded with first interface.The installing hole of the second interface and installation site 202 are welded with the second interface.Mainboard 1 is separated at stamp hole place with subplate 2, and wiring 4 is simultaneously disconnected.In order to make mainboard and subplate energy normal transmission signal, needing to use holding wire 5 to connect first interface and the second interface, realizing Signal transmissions.
In this citing, first interface is male terminal, and the second interface is the female terminal matched with male terminal.Or first interface is female terminal, the second interface is the male terminal matched with female terminal.
In this citing, first interface can be, but not limited to as USB interface, HDMI or DVI interface.
See the syndeton schematic diagram that Fig. 4, Fig. 4 are USB interface provided by the invention.In order to better the present embodiment is described, USB interface is adopted to illustrate accordingly, as shown in Figure 4, first interface is VGA male terminal, second interface 202 is VGA female terminal, at this moment, wiring 4 comprises: intermediate frequency anti-phase input line 10, intermediate frequency positive input line 20, I2C bus 30, supply lines 40 and IF AGC control line 50.The present invention, by arranging some wirings, realizes the Signal transmissions of dissimilar interface.
In the present embodiment, mainboard 1 and the shape of subplate 2 can be, but not limited to the shape described by Fig. 2 and Fig. 3.It is the structural representation of another embodiment of circuit board provided by the invention see Fig. 5, Fig. 5.As shown in Figure 5, the shape that mainboard 1 and subplate 2 can be different according to the Demand Design of client, has wide range of applications.
Therefore, a kind of circuit board that the embodiment of the present invention provides, the subplate 2 comprising mainboard 1 and extend out from mainboard 1.Mainboard 1 is provided with several stamp holes 3 with the junction of subplate 2.User can be different according to client demand, be separated major-minor plate by stamp hole 3.And first interface line map is provided with on mainboard 1, subplate 2 being provided with the second interface circuit figure, circuit board being also provided with the wiring 4 for connecting first interface line map and the second interface circuit figure.When major-minor plate does not need to be separated, first interface line map and the second interface circuit figure carry out Signal transmissions by wiring 4, and when major-minor plate is separated, wiring 4 disconnects when major-minor plate is separated, therefore need to weld corresponding first interface and the second interface respectively on first interface line map and the second line interface line map, and use holding wire 5 to connect first interface and the second interface, realize Signal transmissions.Compared to prior art, no matter whether major-minor plate is separated, and still needs to install male and female head connector, and circuit board of the present invention, when not needing major-minor plate to be separated, can be saved the material of male and female head connector, cut operating costs.
In addition, in the prior art, two kinds of gerber files need be set, the client of above two kinds of situations could be met, but the present invention only needs to arrange a kind of gerber file, can meet the demand of different client neatly, significantly reduces operation cost and the inventory risk of enterprise.
Further, the present invention is applicable to the male and female head connector of multiple interfaces type, as USB interface, HDMI and DVI interface etc., can meet the demand that client is different, applied range.
The above is the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a manufacture method for circuit board, is characterized in that, comprising:
To circuit substrate boring, obtain mainboard, subplate and several stamp holes; Described stamp hole is arranged on the junction of described mainboard and described subplate, is convenient to be separated described mainboard and described subplate;
Electro-coppering layers of foil on described circuit substrate, obtains the first copper-clad plate;
Light-sensitive surface is attached on the whole plate of described first copper-clad plate;
The line pattern designed in advance is transferred on described light-sensitive surface, obtains the second copper-clad plate; Described line pattern comprises the first interface line map be arranged on described mainboard and the second interface circuit figure be arranged on described subplate; Described first interface line map is connected by some wirings with described second interface circuit figure; Wherein, described wiring is drawn from described first interface line map, through the gap between described stamp hole, is connected to described second interface circuit figure;
UV-irradiation is carried out to described second copper-clad plate, makes the light-sensitive surface solidification with line pattern stick in described second copper-clad plate;
Etching is removed not by the position that described light-sensitive surface solidifies in described second copper-clad plate, obtains wiring board;
Described wiring board brushes photosensitive-ink, and after ultraviolet photoetching forms solder mask, obtains circuit board.
2. the manufacture method of circuit board according to claim 1, is characterized in that, described wiring comprises: intermediate frequency anti-phase input line, intermediate frequency positive input line, I2C bus, supply lines and IF AGC control line.
3. the manufacture method of circuit board according to claim 1, is characterized in that, describedly on described wiring board, brushes photosensitive-ink, and after ultraviolet photoetching forms solder mask, after obtaining circuit board, also comprises:
Described first interface line map welds first interface, described second interface circuit figure welds the second interface;
Mainboard and the subplate of described circuit board is separated according to described stamp hole.
4. the manufacture method of circuit board according to claim 3, is characterized in that, described first interface and described second interface match;
Described first interface is connected by holding wire with described second interface, and the mainboard after being separated is connected by described holding wire with subplate.
5. the manufacture method of circuit board according to claim 4, is characterized in that,
Described first interface connector is USB interface connector, HDMI connector or dvi connector.
6. the circuit board made by the manufacture method of the circuit board according to any one of claim 1 to 5, is characterized in that, comprising: mainboard and the subplate extended out from described mainboard;
In the junction of described mainboard and described subplate, be provided with the stamp hole that several are convenient to be separated described mainboard and described subplate;
Described mainboard is provided with first interface line map; Described first interface line map is provided with installing hole and the installation site of first interface;
Described subplate is provided with the second interface circuit figure; Described second interface circuit figure is provided with installing hole and the installation site of the second interface;
Described circuit board is also provided with wiring, and described wiring is drawn from described first interface line map, through the gap between described stamp hole, is connected to described second interface circuit figure.
7. circuit board according to claim 6, is characterized in that,
The installing hole of described first interface and installation site are welded with first interface;
The installing hole of described second interface and installation site are welded with the second interface.
8. circuit board according to claim 7, is characterized in that,
Described first interface is male terminal, and described second interface is the female terminal matched with described male terminal;
Or described first interface is described female terminal, described second interface is described male terminal.
9. circuit board according to claim 8, is characterized in that, described first interface is USB interface, HDMI or DVI interface.
10. the circuit board according to any one of claim 7 to 9, is characterized in that, described circuit board also comprises holding wire, and one end of described holding wire connects described first interface, and the other end of described holding wire connects described second interface.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510616454.6A CN105338743B (en) | 2015-09-24 | 2015-09-24 | The production method and circuit board of a kind of circuit board |
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| CN201510616454.6A CN105338743B (en) | 2015-09-24 | 2015-09-24 | The production method and circuit board of a kind of circuit board |
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| CN105338743A true CN105338743A (en) | 2016-02-17 |
| CN105338743B CN105338743B (en) | 2018-04-24 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108256269A (en) * | 2018-02-23 | 2018-07-06 | 晶晨半导体(上海)股份有限公司 | A kind of processor chips and printed circuit board |
| CN108362831A (en) * | 2018-01-18 | 2018-08-03 | 深圳市可飞科技有限公司 | Atmospheric components detection device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201369047Y (en) * | 2009-03-25 | 2009-12-23 | 浪潮电子信息产业股份有限公司 | Processor structure device |
| CN101795531A (en) * | 2010-03-11 | 2010-08-04 | 深圳和而泰智能控制股份有限公司 | Stamp hole connection structure, circuit board and circuit board dividing method |
| CN204992019U (en) * | 2015-09-24 | 2016-01-20 | 广州视源电子科技股份有限公司 | Circuit board |
-
2015
- 2015-09-24 CN CN201510616454.6A patent/CN105338743B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201369047Y (en) * | 2009-03-25 | 2009-12-23 | 浪潮电子信息产业股份有限公司 | Processor structure device |
| CN101795531A (en) * | 2010-03-11 | 2010-08-04 | 深圳和而泰智能控制股份有限公司 | Stamp hole connection structure, circuit board and circuit board dividing method |
| CN204992019U (en) * | 2015-09-24 | 2016-01-20 | 广州视源电子科技股份有限公司 | Circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108362831A (en) * | 2018-01-18 | 2018-08-03 | 深圳市可飞科技有限公司 | Atmospheric components detection device |
| CN108256269A (en) * | 2018-02-23 | 2018-07-06 | 晶晨半导体(上海)股份有限公司 | A kind of processor chips and printed circuit board |
| CN108256269B (en) * | 2018-02-23 | 2022-06-28 | 晶晨半导体(上海)股份有限公司 | Processor chip and printed circuit board |
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