CN105322086A - LED with high thermal diffusivity - Google Patents

LED with high thermal diffusivity Download PDF

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Publication number
CN105322086A
CN105322086A CN201410255751.8A CN201410255751A CN105322086A CN 105322086 A CN105322086 A CN 105322086A CN 201410255751 A CN201410255751 A CN 201410255751A CN 105322086 A CN105322086 A CN 105322086A
Authority
CN
China
Prior art keywords
light
emitting diode
substrate
heat radiation
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410255751.8A
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Chinese (zh)
Inventor
钱国珍
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHANGZHOU HONGSHUO ELECTRONICS Co Ltd
Original Assignee
CHANGZHOU HONGSHUO ELECTRONICS Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHANGZHOU HONGSHUO ELECTRONICS Co Ltd filed Critical CHANGZHOU HONGSHUO ELECTRONICS Co Ltd
Priority to CN201410255751.8A priority Critical patent/CN105322086A/en
Publication of CN105322086A publication Critical patent/CN105322086A/en
Pending legal-status Critical Current

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention discloses an LED (Light Emitting Diode) with high thermal diffusivity, comprising a light-emitting chip, a heat dissipation lampshade and a support; wherein the light-emitting chip comprises a substrate, a double-wire chip connected with the substrate, and a gasket; the gasket is arranged between the substrate and the double-wire chip, the surface of the gasket is provided with a radiating fin, the material of the radiating fin is silver or aluminum, and the heat dissipation lampshade is connected with the support. Through the above technical scheme, the LED with high thermal diffusivity is simple in structure and good in thermal diffusivity; in addition, the heat generated by the LED during operation is reduced, thus the stability is improved, and the service life is prolonged.

Description

The light-emitting diode of high-cooling property
Technical field
The present invention relates to electronic devices and components field, particularly relate to a kind of light-emitting diode of high-cooling property.
Background technology
Light-emitting diode is referred to as LED.The diode be made up with the compound of arsenic (As), phosphorus (P), nitrogen (N), indium (In) of gallium (Ga), can give off visible ray when electronics and hole-recombination, thus can be used for making light-emitting diode.As indicator light in circuit and instrument, or form word or numerical monitor.Gallium arsenide phosphide diode glows, gallium phosphide diode green light, silicon carbide diode Yellow light-emitting low temperature, indium gallium nitrogen diode blue light-emitting.
General light-emitting diode can produce very strong temperature, easily damages component body, and heat dispersion is poor.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of light-emitting diode of high-cooling property, and structure is simple, has stronger thermal diffusivity, and reduce the heat that light-emitting diode operationally produces, stability is higher, longer service life.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: the light-emitting diode providing a kind of high-cooling property, comprise luminescent wafer, heat radiation lampshade and support, described luminescent wafer comprises substrate, the two-wire wafer be connected with substrate and pad, described pad is located between substrate and two-wire wafer and is provided with pad, described gasket surface is provided with fin, and the material of described fin is silver or aluminium, and described heat radiation lampshade is connected with support.
In a preferred embodiment of the present invention, described heat radiation lampshade surface is provided with louvre.
In a preferred embodiment of the present invention, described heat radiation lampshade is connected with support by fluorescent glue.
In a preferred embodiment of the present invention, described heat radiation lampshade inwall is provided with heat absorption fiber.
The invention has the beneficial effects as follows: the light-emitting diode of a kind of high-cooling property of the present invention, structure is simple, has stronger thermal diffusivity, and reduce the heat that light-emitting diode operationally produces, stability is higher, longer service life.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings, wherein:
Fig. 1 is the structural representation of light-emitting diode one preferred embodiment of a kind of high-cooling property of the present invention;
In accompanying drawing, the mark of each parts is as follows: 1, two-wire wafer, and 2, heat absorption fiber, 3, heat radiation lampshade, 4, luminescent wafer, 5, pad, 6, substrate, 7, support.
Embodiment
Be clearly and completely described to the technical scheme in the embodiment of the present invention below, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
The embodiment of the present invention comprises:
A kind of light-emitting diode of high-cooling property, comprise luminescent wafer 1, heat radiation lampshade 3 and support 7, described luminescent wafer 1 comprises substrate 6, the two-wire wafer 1 be connected with substrate 6 and pad 5, described pad 5 is located between substrate 6 and two-wire wafer 1 and is provided with pad 5, described pad 5 surface is provided with fin, the material of described fin is silver or aluminium, and described heat radiation lampshade 3 is connected with support 7.
In addition, described heat radiation lampshade 3 surface is provided with louvre.
In addition, described heat radiation lampshade 3 is connected with support 7 by fluorescent glue.
In addition, described heat radiation lampshade 3 inwall is provided with heat absorption fiber 2, increases heat dispersion.
The light-emitting diode of a kind of high-cooling property of the present invention, structure is simple, has stronger thermal diffusivity, and reduce the heat that light-emitting diode operationally produces, stability is higher, longer service life.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.

Claims (4)

1. the light-emitting diode of a high-cooling property, it is characterized in that, comprise: luminescent wafer, heat radiation lampshade and support, described luminescent wafer comprises substrate, the two-wire wafer be connected with substrate and pad, described pad is located between substrate and two-wire wafer and is provided with pad, described gasket surface is provided with fin, and the material of described fin is silver or aluminium, and described heat radiation lampshade is connected with support.
2. the light-emitting diode of a kind of high-cooling property according to claim 1, is characterized in that, described heat radiation lampshade surface is provided with louvre.
3. the light-emitting diode of a kind of high-cooling property according to claim 1, is characterized in that, described heat radiation lampshade is connected with support by fluorescent glue.
4. the light-emitting diode of a kind of high-cooling property according to claim 1, is characterized in that, described heat radiation lampshade inwall is provided with heat absorption fiber.
CN201410255751.8A 2014-06-11 2014-06-11 LED with high thermal diffusivity Pending CN105322086A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410255751.8A CN105322086A (en) 2014-06-11 2014-06-11 LED with high thermal diffusivity

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410255751.8A CN105322086A (en) 2014-06-11 2014-06-11 LED with high thermal diffusivity

Publications (1)

Publication Number Publication Date
CN105322086A true CN105322086A (en) 2016-02-10

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410255751.8A Pending CN105322086A (en) 2014-06-11 2014-06-11 LED with high thermal diffusivity

Country Status (1)

Country Link
CN (1) CN105322086A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108397718A (en) * 2018-02-28 2018-08-14 东莞市闻誉实业有限公司 Street lamp
CN108413262A (en) * 2018-02-28 2018-08-17 东莞市闻誉实业有限公司 LED light

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102679227A (en) * 2012-05-31 2012-09-19 东莞市帝信光电科技有限公司 Plastic heat radiation type LED (light-emitting diode) bulb and plastic heat radiation seat
CN203240439U (en) * 2013-05-23 2013-10-16 浙江奥司朗照明电器有限公司 Novel ceiling lamp
CN203363951U (en) * 2013-06-05 2013-12-25 弓伟南 Novel LED roadway lighting lamp
CN103697442A (en) * 2013-12-30 2014-04-02 福立旺精密机电(中国)有限公司 LED radiating lampshade
CN203595019U (en) * 2013-12-11 2014-05-14 重庆亮康光电科技有限公司 Light condensation and heat dissipation type LED lamp

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102679227A (en) * 2012-05-31 2012-09-19 东莞市帝信光电科技有限公司 Plastic heat radiation type LED (light-emitting diode) bulb and plastic heat radiation seat
CN203240439U (en) * 2013-05-23 2013-10-16 浙江奥司朗照明电器有限公司 Novel ceiling lamp
CN203363951U (en) * 2013-06-05 2013-12-25 弓伟南 Novel LED roadway lighting lamp
CN203595019U (en) * 2013-12-11 2014-05-14 重庆亮康光电科技有限公司 Light condensation and heat dissipation type LED lamp
CN103697442A (en) * 2013-12-30 2014-04-02 福立旺精密机电(中国)有限公司 LED radiating lampshade

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108397718A (en) * 2018-02-28 2018-08-14 东莞市闻誉实业有限公司 Street lamp
CN108413262A (en) * 2018-02-28 2018-08-17 东莞市闻誉实业有限公司 LED light

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Application publication date: 20160210