CN212625640U - Heat radiating device of light emitting diode - Google Patents
Heat radiating device of light emitting diode Download PDFInfo
- Publication number
- CN212625640U CN212625640U CN202021812392.9U CN202021812392U CN212625640U CN 212625640 U CN212625640 U CN 212625640U CN 202021812392 U CN202021812392 U CN 202021812392U CN 212625640 U CN212625640 U CN 212625640U
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- heat
- heat conduction
- heat dissipation
- fixedly connected
- emitting diode
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to the technical field of light-emitting diodes, and discloses a heat dissipation device of a light-emitting diode, which solves the problems that the general light-emitting diode can generate heat in the using process, the heat dissipation of the light-emitting diode is poor, and the service life of the light-emitting diode can be reduced; the utility model discloses, through the heat conduction cover that sets up, the heat conduction post, the cooperation of fin and cooling tube etc. is used, the diode body can produce the heat, the heat absorbs through the heat conduction cover, then transmit the cooling tube through the heat conduction post again, during through the heat dissipation wing on the heat conduction post and the fin on the cooling tube distribute away the heat, the heat in the cooling tube overflows through the louvre simultaneously, under the effect of heat dissipation fan, arrange the heat to the external world, thereby can accomplish the radiating process to the diode body, the radiating effect is good, can prolong the live time of diode body.
Description
Technical Field
The utility model belongs to the technical field of emitting diode, specifically be a emitting diode's heat abstractor.
Background
A light emitting diode, abbreviated As LED, is made of a compound containing gallium (Ga), arsenic (As), phosphorus (P), nitrogen (N), and the like; when electrons and holes are combined, they can radiate visible light, so that it can be used to make light-emitting diode, and can be used as indicator lamp in circuit and instrument, or can be formed into character or digital display, in which the gallium arsenide diode can give out red light, the gallium phosphide diode can give out green light, the silicon carbide diode can give out yellow light and the gallium nitride diode can give out blue light.
In the using process of a general light-emitting diode, heat can be generated, the heat dissipation of the light-emitting diode is poor, and the service time of the light-emitting diode can be shortened.
Disclosure of Invention
To the above situation, for overcoming prior art's defect, the utility model provides a light emitting diode's heat abstractor, the effectual in-process of having solved general light emitting diode and using can produce the heat, and light emitting diode's heat dissipation is lower relatively, can reduce light emitting diode's live time's problem.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a LED's heat abstractor, includes the circuit board, the diode body is installed on the top of circuit board, and the heat conduction cover has been cup jointed to the outside of diode body, and the bottom equidistance fixedly connected with heat conduction post of heat conduction cover, the bottom fixedly connected with cooling tube of heat conduction post, the bottom bilateral symmetry fixedly connected with mounting bracket of cooling tube, the bottom fixedly connected with heat dissipation fan of mounting bracket.
Preferably, the bottom of the heat conduction column is fixedly connected with heat dissipation fins at equal intervals.
Preferably, the bottom end of the radiating pipe is equidistantly provided with radiating holes, and the radiating pipe is equidistantly and fixedly connected with radiating fins.
Preferably, the bottom end of the diode body is symmetrically and fixedly connected with support legs, and the top parts of the support legs are fixedly connected with heat-conducting fins.
Preferably, the bottom of the heat conducting sleeve is symmetrically provided with through grooves, and the through grooves are sleeved with the heat conducting fins.
Preferably, the heat conduction sleeve is made of heat conduction silver adhesive materials, and the heat conduction column and the heat dissipation pipe are made of copper materials.
Compared with the prior art, the beneficial effects of the utility model are that:
in operation, through the heat conduction cover that sets up, the heat conduction post, the cooperation of fin and cooling tube etc. is used, the diode body can produce the heat, the heat absorbs through the heat conduction cover, then transmit the cooling tube through the heat conduction post again, the fin on heat dissipation fin on the heat conduction post and the cooling tube during, the heat distributes away the heat, the heat in the cooling tube overflows through the louvre simultaneously, under the effect of heat dissipation fan, arrange the heat to the external world, thereby can accomplish the radiating process to the diode body, the radiating effect is good, can prolong the live time of diode body.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the heat-conducting sleeve mounting structure of the present invention;
fig. 3 is a schematic view of the mounting structure of the diode body of the present invention;
in the figure: 1. a circuit board; 2. a diode body; 3. a heat conducting sleeve; 4. a heat-conducting column; 5. a radiating pipe; 6. heat dissipation holes; 7. a heat sink; 8. a mounting frame; 9. a heat dissipation fan; 10. heat dissipation fins; 11. a through groove; 12. a support leg; 13. a heat conductive sheet.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments; based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Embodiment one, by figure 1, figure 2 and figure 3 give, the utility model discloses a circuit board 1, diode body 2 is installed on circuit board 1's top, heat conduction cover 3 has been cup jointed to diode body 2's outside, can absorb the heat that diode body 2 produced, the bottom equidistance fixedly connected with heat conduction post 4 of heat conduction cover 3, be convenient for transmit the heat through heat conduction post 4, the bottom fixedly connected with cooling tube 5 of heat conduction post 4, the bottom bilateral symmetry fixedly connected with mounting bracket 8 of cooling tube 5, the bottom fixedly connected with heat dissipation fan 9 of mounting bracket 8, can arrange the heat to the external world through the mode of forced air cooling.
In the second embodiment, on the basis of the first embodiment, the heat dissipation fins 10 are fixedly connected to the bottom of the heat conduction column 4 at equal intervals, so that the heat dissipation rate of the heat conduction column 4 can be increased through the heat dissipation fins 10.
In the third embodiment, on the basis of the first embodiment, the heat dissipation holes 6 are equidistantly formed at the bottom ends of the heat dissipation pipes 5, and the heat dissipation fins 7 are fixedly connected to the heat dissipation pipes 5 at equal intervals, so that heat in the heat dissipation pipes 5 can be dissipated through the heat dissipation holes 6 and the heat dissipation fins 7.
In the fourth embodiment, on the basis of the first embodiment, the bottom end of the diode body 2 is symmetrically and fixedly connected with the support legs 12, and the top of the support legs 12 is fixedly connected with the heat-conducting fins 13, so that the contact area between the heat-conducting fins 13 and the heat-conducting sleeve 3 can be increased.
Fifth, on the basis of the first embodiment, the bottom of the heat conducting sleeve 3 is symmetrically provided with the through grooves 11, and the through grooves 11 are sleeved with the heat conducting fins 13, so that the heat conducting fins 13 are conveniently installed.
Sixth embodiment, on the basis of first embodiment, heat conduction cover 3 adopts the heat conduction silver glue material to make, and heat conduction post 4 and cooling tube 5 all adopt the copper product to make, have good heat conductivility.
The working principle is as follows: the during operation, diode body 2 can produce the heat, the heat is absorbed through heat conduction cover 3, then transmit cooling tube 5 through heat conduction post 4 again, the heat is distributed away through heat dissipation fin 10 on the heat conduction post 4 and cooling fin 7 on the cooling tube 5 during, the heat in the cooling tube 5 overflows through louvre 6 simultaneously, under the effect of heat dissipation fan 9, it is external to arrange the heat, thereby can accomplish the radiating process to diode body 2, the radiating effect is good, can prolong diode body 2's live time.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A heat dissipation device of a light emitting diode comprises a circuit board (1), and is characterized in that: diode body (2) are installed on the top of circuit board (1), and heat conduction cover (3) have been cup jointed to the outside of diode body (2), and the bottom equidistance fixedly connected with heat conduction post (4) of heat conduction cover (3), the bottom fixedly connected with cooling tube (5) of heat conduction post (4), the bottom bilateral symmetry fixedly connected with mounting bracket (8) of cooling tube (5), the bottom fixedly connected with heat dissipation fan (9) of mounting bracket (8).
2. The heat dissipation device of claim 1, wherein: the bottom of the heat conduction column (4) is fixedly connected with heat dissipation fins (10) at equal intervals.
3. The heat dissipation device of claim 1, wherein: radiating holes (6) are formed in the bottom ends of the radiating pipes (5) at equal intervals, and radiating fins (7) are fixedly connected to the radiating pipes (5) at equal intervals.
4. The heat dissipation device of claim 1, wherein: the bottom end of the diode body (2) is symmetrically and fixedly connected with support legs (12), and the top of each support leg (12) is fixedly connected with a heat-conducting fin (13).
5. The heat dissipation device of claim 1, wherein: the bottom of the heat conduction sleeve (3) is symmetrically provided with through grooves (11), and the through grooves (11) are sleeved with the heat conduction sheets (13).
6. The heat dissipation device of claim 1, wherein: the heat conduction sleeve (3) is made of heat conduction silver colloid materials, and the heat conduction column (4) and the heat dissipation pipe (5) are made of copper materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021812392.9U CN212625640U (en) | 2020-08-26 | 2020-08-26 | Heat radiating device of light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021812392.9U CN212625640U (en) | 2020-08-26 | 2020-08-26 | Heat radiating device of light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212625640U true CN212625640U (en) | 2021-02-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021812392.9U Expired - Fee Related CN212625640U (en) | 2020-08-26 | 2020-08-26 | Heat radiating device of light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212625640U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113217829A (en) * | 2021-05-11 | 2021-08-06 | 深圳市正东明光电子有限公司 | High-efficiency light-emitting diode structure and packaging equipment thereof |
-
2020
- 2020-08-26 CN CN202021812392.9U patent/CN212625640U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113217829A (en) * | 2021-05-11 | 2021-08-06 | 深圳市正东明光电子有限公司 | High-efficiency light-emitting diode structure and packaging equipment thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210226 Termination date: 20210826 |
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| CF01 | Termination of patent right due to non-payment of annual fee |