CN105319149A - Monitoring method and monitoring device of viscosity of polishing solution - Google Patents
Monitoring method and monitoring device of viscosity of polishing solution Download PDFInfo
- Publication number
- CN105319149A CN105319149A CN201410366726.7A CN201410366726A CN105319149A CN 105319149 A CN105319149 A CN 105319149A CN 201410366726 A CN201410366726 A CN 201410366726A CN 105319149 A CN105319149 A CN 105319149A
- Authority
- CN
- China
- Prior art keywords
- polishing fluid
- viscosity
- plate
- resistivity
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
The invention discloses a monitoring method and monitoring device of the viscosity of a polishing solution. The disclosed monitoring method of the viscosity of the polishing solution comprises the following steps: measuring the temperature, and specific resistance/specific conductance of the polishing solution; calculating the physical viscosity corresponding to the specific resistance/specific conductance obtained from the measurement according to the specific resistance/specific conductance obtained from the measurement and a relation between the specific resistance/specific conductance and the physical viscosity of the polishing solution; calculating the temperature compensation viscosity of the polishing solution according to the temperature, obtained from the measurement, of the polishing solution and the calculated physical viscosity of the polishing solution; comparing the temperature compensation viscosity with the set temperature compensation viscosity; and adjusting the viscosity of the polishing solution according to the comparative result. According to the method and device, the viscosity of the polishing solution can be monitored in real time, and the viscosity of the polishing solution can be adjusted according to the change of the viscosity of the polishing solution, so that the viscosity of the polishing solution maintains stable.
Description
Technical field
The present invention relates to electrochemical polish technical field, particularly relate to a kind of Viscosity Monitoring method and monitoring device of polishing fluid.
Background technology
Electrochemical polish needs to use the polishing fluid that can conduct electricity, and wherein, the viscosity of polishing fluid is the important parameter in electrochemical polishing process.The viscosity of polishing fluid is easily by the impact of the factors vary such as environment temperature, humidity, and the viscosity of polishing fluid is too high or too low all can affect homogeneity between the clearance of electrochemical polish and sheet, and the viscosity stability of polishing fluid also directly affects the repeatability of glossing.Therefore, in electrochemical polishing process, need the viscosity of Real-Time Monitoring polishing fluid, and regulate and control according to the viscosity of viscosity B coefficent to polishing fluid of polishing fluid.
Summary of the invention
The present invention aim to provide a kind of can the viscosity of Real-Time Monitoring polishing fluid, and to regulate and control according to the viscosity of viscosity B coefficent to polishing fluid of polishing fluid, make the viscosity of polishing fluid maintain stable polishing fluid Viscosity Monitoring method and monitoring device.
According to one embodiment of present invention, the polishing fluid Viscosity Monitoring method of proposition, comprises the steps: to measure the temperature of polishing fluid and the resistivity/conductivity of polishing fluid; According to the relation measured between the resistivity/conductivity of the resistivity/conductivity that obtains and polishing fluid and the physical viscosity of polishing fluid, calculate the physical viscosity that the resistivity/conductivity that obtains with this measurement is corresponding; According to the physical viscosity of the temperature measuring the polishing fluid obtained with the polishing fluid calculated, calculate the temperature compensation viscosity of polishing fluid and the temperature compensation viscosity of this temperature compensation viscosity and setting is made comparisons, regulating the viscosity of polishing fluid according to comparative result.
According to one embodiment of present invention, the polishing fluid Viscosity Monitoring device of proposition, comprises polishing liquid bath, resistivity/conductivity measurements device, temperature measuring equipment and controller.Polishing liquid bath fills polishing fluid.The resistivity/conductivity of resistivity/conductivity measurements measurement device polishing fluid.Temperature measuring equipment measures the temperature of polishing fluid.Controller is connected with resistivity/conductivity measurements device and temperature measuring equipment respectively, relation between the resistivity/conductivity of the resistivity/conductivity that controller obtains according to resistivity/conductivity measurements measurement device and polishing fluid and the physical viscosity of polishing fluid calculates the physical viscosity of the polishing fluid corresponding with this resistivity/conductivity, and then calculate the temperature compensation viscosity of polishing fluid according to the temperature of polishing fluid that temperature measuring equipment measurement obtains with the physical viscosity of the polishing fluid calculated and the temperature compensation viscosity of this temperature compensation viscosity and setting is made comparisons, the viscosity of polishing fluid is regulated according to comparative result.
In sum, polishing fluid Viscosity Monitoring method of the present invention and monitoring device achieve the viscosity of Real-Time Monitoring polishing fluid by the resistivity or conductivity of monitoring polishing fluid, and regulate and control according to the viscosity of viscosity B coefficent to polishing fluid of polishing fluid, make the object that the viscosity of polishing fluid remains stable.
Accompanying drawing explanation
Fig. 1 discloses the process flow diagram of polishing fluid Viscosity Monitoring method of the present invention.
Fig. 2 discloses the process flow diagram of the polishing fluid Viscosity Monitoring method according to the first embodiment of the present invention.
Fig. 3 discloses the process flow diagram of polishing fluid Viscosity Monitoring method according to a second embodiment of the present invention.
Fig. 4 discloses the structural representation of the polishing fluid Viscosity Monitoring device according to the first embodiment of the present invention.
Fig. 5 discloses the structural representation of polishing fluid Viscosity Monitoring device according to a second embodiment of the present invention.
Fig. 6 discloses the relation schematic diagram between the resistivity of polishing fluid and the physical viscosity of polishing fluid.
Embodiment
By describing technology contents of the present invention, structural attitude in detail, reached object and effect, coordinate graphic being described in detail below in conjunction with embodiment.
Shown in figure 1, disclose the process flow diagram of polishing fluid Viscosity Monitoring method of the present invention.This polishing fluid Viscosity Monitoring method comprises the steps:
Step S11: measure the temperature of polishing fluid and the resistivity/conductivity (namely resistivity or conductivity) of polishing fluid;
Step S12: according to the relation measured between the resistivity/conductivity of the resistivity/conductivity that obtains and polishing fluid and the physical viscosity of polishing fluid, calculates the physical viscosity that the resistivity/conductivity that obtains with this measurement is corresponding;
Step S13: according to the physical viscosity of the temperature measuring the polishing fluid obtained with the polishing fluid calculated, calculate the temperature compensation viscosity of polishing fluid and the temperature compensation viscosity of this temperature compensation viscosity and setting is made comparisons, regulating the viscosity of polishing fluid according to comparative result.
Particularly, shown in figure 2, disclose the process flow diagram of the polishing fluid Viscosity Monitoring method according to the first embodiment of the present invention.This polishing fluid Viscosity Monitoring method comprises the steps:
Step S21: the voltage between the temperature measuring polishing fluid and the two-plate being immersed in polishing fluid, this two-plate to be just relatively immersed in polishing fluid and to be connected with constant current source;
Step S22: according to formula
calculate the resistivity of polishing fluid, wherein, U is the voltage between two-plate, and S is the area that two-plate is just relative, the electric current that I provides for constant current source, and L is the spacing between two-plate;
Step S23: according to the relation between the resistivity of the resistivity calculated and polishing fluid and the physical viscosity of polishing fluid, calculate the physical viscosity corresponding with this resistivity;
Step S24: according to the physical viscosity of the temperature measuring the polishing fluid obtained with the polishing fluid calculated, calculate the temperature compensation viscosity (TCV of polishing fluid, and the temperature compensation viscosity of this temperature compensation viscosity and setting is made comparisons TemperatureCompensatedViscosity), if the temperature compensation viscosity calculated equals the temperature compensation viscosity set, then return step S21; If the temperature compensation viscosity calculated is greater than the temperature compensation viscosity of setting, then carry out step S25; If the temperature compensation viscosity calculated is less than the temperature compensation viscosity of setting, then carry out step S26;
Step S25: supplement deionized water in polishing fluid, reduces the viscosity of polishing fluid;
Step S26: heating polishing fluid, reduces the liquid water content in polishing fluid, improves the viscosity of polishing fluid.
Shown in figure 3, disclose the process flow diagram of polishing fluid Viscosity Monitoring method according to a second embodiment of the present invention.This polishing fluid Viscosity Monitoring method comprises the steps:
Step S31: the electric current between the temperature measuring polishing fluid and the two-plate being immersed in polishing fluid, this two-plate to be just relatively immersed in polishing fluid and to be connected with constant pressure source;
Step S32: according to formula
calculate the resistivity of polishing fluid, wherein, U is the voltage between two-plate, and S is the area that two-plate is just relative, and I is the electric current between two-plate, and L is the spacing between two-plate;
Step S33: according to the relation between the resistivity of the resistivity calculated and polishing fluid and the physical viscosity of polishing fluid, calculate the physical viscosity corresponding with this resistivity;
Step S34: according to the physical viscosity of the temperature measuring the polishing fluid obtained with the polishing fluid calculated, calculate the temperature compensation viscosity (TCV of polishing fluid, and the temperature compensation viscosity of this temperature compensation viscosity and setting is made comparisons TemperatureCompensatedViscosity), if the temperature compensation viscosity calculated equals the temperature compensation viscosity set, then return step S31; If the temperature compensation viscosity calculated is greater than the temperature compensation viscosity of setting, then carry out step S35; If the temperature compensation viscosity calculated is less than the temperature compensation viscosity of setting, then carry out step S36;
Step S35: supplement deionized water in polishing fluid, reduces the viscosity of polishing fluid;
Step S36: heating polishing fluid, reduces the liquid water content in polishing fluid, improves the viscosity of polishing fluid.
Temperature compensation viscosity refers to be estimated the mathematics of liquid viscosity at specified temperatures.Because the viscosity of polishing fluid is for the change of temperature, very sensitive (temperature one has fluctuation, the viscosity of polishing fluid will change), the physical viscosity of polishing fluid can be converted to the viscosity number under assigned temperature by TCV, more be conducive to monitoring and the adjustment of viscosity under different temperatures.
TCV computing formula is as follows:
TCV＝exp{exp[ln(ln(V+0.8))–TCC(ln(Tref+273.15)–ln(T+273.15))]}–0.8
Wherein: V represents the physical viscosity of polishing fluid, TCC representation temperature penalty coefficient, be certain value, Tref represents reference temperature, and T represents the temperature of polishing fluid.
According to said temperature compensated viscometer calculate the temperature compensation viscosity that goes out of formulae discovery be remove temperature factor after viscosity, namely ignore the impact of temperature fluctuation on viscosity.Therefore, temperature compensation viscosity accurately can react the change of polishing fluid viscosity under certain reference temperature.
Before the viscosity of the above-mentioned each method of employing to polishing fluid is monitored, first polishing fluid is demarcated, namely first obtain the relation between the resistivity of polishing fluid and the physical viscosity of polishing fluid, specifically comprise: the physical viscosity adopting the polishing fluid under viscosity meter different temperatures, meanwhile, measure the resistivity of polishing fluid, according to the one-to-one relationship between the physical viscosity of polishing fluid and the resistivity of polishing fluid, obtain the relation between the resistivity of polishing fluid and the physical viscosity of polishing fluid, as shown in Figure 6.The resistivity measuring polishing fluid comprises two kinds of methods, and a kind of method is that the two-plate be just relatively immersed in polishing fluid is connected with constant current source, by the voltage between measurement two-plate and according to formula
calculate the resistivity of polishing fluid; Another kind method is that the two-plate be just relatively immersed in polishing fluid is connected with constant pressure source, by the electric current between measurement two-plate and according to formula
calculate the resistivity of polishing fluid.
Carrying out polishing fluid in calibration process and carrying out in Viscosity Monitoring process to polishing fluid, the form trait being immersed in spacing between the two-plate in polishing fluid and two-plate is consistent and constant all the time.
Similarly, the present invention also can utilize the relation be inversely proportional between the conductivity of polishing fluid and the physical viscosity of polishing fluid, monitored the viscosity of polishing fluid by the conductivity of monitoring polishing fluid, and the viscosity of polishing fluid is adjusted, make the viscosity of polishing fluid remain stable.Those skilled in the art all knows, the inverse of resistivity is conductivity, i.e. Y=1/ ρ, therefore, adopt the method similar to the present invention, monitored the viscosity of polishing fluid by the conductivity of monitoring polishing fluid, can think do not departing from the one distortion made under the prerequisite of the present invention's design.
Polishing fluid Viscosity Monitoring device of the present invention comprises polishing liquid bath, resistivity/conductivity measurements device, temperature measuring equipment and controller.Polishing liquid bath fills polishing fluid.The resistivity/conductivity of resistivity/conductivity measurements measurement device polishing fluid.Temperature measuring equipment measures the temperature of polishing fluid.Controller is connected with resistivity/conductivity measurements device and temperature measuring equipment respectively, relation between the resistivity/conductivity of the resistivity/conductivity that controller obtains according to resistivity/conductivity measurements measurement device and polishing fluid and the physical viscosity of polishing fluid calculates the physical viscosity of the polishing fluid corresponding with this resistivity/conductivity, and then calculate the temperature compensation viscosity of polishing fluid according to the temperature of polishing fluid that temperature measuring equipment measurement obtains with the physical viscosity of the polishing fluid calculated and the temperature compensation viscosity of this temperature compensation viscosity and setting is made comparisons, the viscosity of polishing fluid is regulated according to comparative result.
Particularly, shown in figure 4, disclose the structural representation of the polishing fluid Viscosity Monitoring device according to the first embodiment of the present invention.This polishing fluid Viscosity Monitoring device comprises polishing liquid bath 41, resistivity test device, temperature measuring equipment, deionized water feeding mechanism, heating arrangement 48 and controller.In the present embodiment, resistivity test device comprises two-plate 42, constant current source 43 and voltage table 44.
As shown in Figure 4, polishing liquid bath 41 fills polishing fluid.Two-plate 42 is just relatively immersed in polishing fluid, in the Viscosity Monitoring process of polishing fluid, the spacing between this two-plate 42 and the form trait of two-plate 42 constant.
Two electrodes of constant current source 43 are connected with two-plate 42 respectively, and preferably, the pole plate be connected with the anode of constant current source 43 adopts inert electrode, such as titanium, platinum etc., prevent the polished corrosion of pole plate.
Voltage table 44 measurement is immersed in the voltage between the two-plate 42 in polishing fluid, and is sent to controller by measuring the magnitude of voltage obtained.Temperature measuring equipment measures the temperature of polishing fluid, and the temperature measuring the polishing fluid obtained is sent to controller, and in one embodiment, temperature measuring equipment is thermopair 45.
The solenoid valve 47 that deionized water feeding mechanism comprises deionized water supply line 46 and is arranged on deionized water supply line 46, deionized water feeding mechanism is to polishing liquid bath 41 supplying deionized water.Heating arrangement 48 is wrapped in the outer wall of polishing liquid bath 41, and heating arrangement 48 heats polishing liquid bath 41, and the temperature of the polishing fluid in polishing liquid bath 41 is raised, and the moisture in evaporation polishing fluid, reduces the liquid water content in polishing fluid.
Controller is connected with voltage table 44, temperature measuring equipment, deionized water feeding mechanism and heating arrangement 48 respectively, and controller measures the magnitude of voltage and formula that obtain according to voltage table 44
calculate the resistivity of polishing fluid, then according to the relation between the resistivity of the resistivity that calculates and polishing fluid and the physical viscosity of polishing fluid, calculate the physical viscosity corresponding with this resistivity, and then the temperature of the polishing fluid to obtain according to temperature measuring equipment measurement and the physical viscosity of polishing fluid that calculates, calculate the temperature compensation viscosity of polishing fluid and the temperature compensation viscosity of this temperature compensation viscosity and setting is made comparisons, if this temperature compensation viscosity is greater than the temperature compensation viscosity of setting, then instruction deionized water feeding mechanism supplements deionized water to polishing liquid bath 41, to reduce the viscosity of polishing fluid, if this temperature compensation viscosity is less than the temperature compensation viscosity of setting, then instruction heating arrangement 48 heats polishing fluid, reduces the liquid water content in polishing fluid, to improve the viscosity of polishing fluid.
Shown in figure 5, disclose the structural representation of polishing fluid Viscosity Monitoring device according to a second embodiment of the present invention.This polishing fluid Viscosity Monitoring device comprises polishing liquid bath 51, resistivity test device, temperature measuring equipment, deionized water feeding mechanism, heating arrangement 58 and controller.In the present embodiment, resistivity test device comprises two-plate 52, constant pressure source 53 and reometer 54.
As shown in Figure 5, polishing liquid bath 51 fills polishing fluid.What two-plate 52 was just relative is immersed in polishing fluid, in the Viscosity Monitoring process of polishing fluid, the spacing between this two-plate 52 and the form trait of two-plate 52 constant.
Two electrodes of constant pressure source 53 are connected with two-plate 52 respectively, and preferably, the pole plate be connected with the anode of constant pressure source 53 adopts inert electrode, such as titanium, platinum etc., prevent the polished corrosion of pole plate.Reometer 54 measurement is immersed in the electric current between the two-plate 52 in polishing fluid, and is sent to controller by measuring the current value obtained.
Temperature measuring equipment measures the temperature of polishing fluid, and the temperature measuring the polishing fluid obtained is sent to controller, and in one embodiment, temperature measuring equipment is thermopair 55.
The solenoid valve 57 that deionized water feeding mechanism comprises deionized water supply line 56 and is arranged on deionized water supply line 56, deionized water feeding mechanism is to polishing liquid bath 51 supplying deionized water.Heating arrangement 58 is wrapped in the outer wall of polishing liquid bath 51, and heating arrangement 58 heats polishing liquid bath 51, and the temperature of the polishing fluid in polishing liquid bath 51 is raised, and the moisture in evaporation polishing fluid, reduces the liquid water content in polishing fluid.
Controller is connected with reometer 54, temperature measuring equipment, deionized water feeding mechanism and heating arrangement 58 respectively, and controller measures the current value and formula that obtain according to reometer 54
calculate the resistivity of polishing fluid, then according to the relation between the resistivity of the resistivity that calculates and polishing fluid and the physical viscosity of polishing fluid, calculate the physical viscosity corresponding with this resistivity, and then the temperature of the polishing fluid to obtain according to temperature measuring equipment measurement and the physical viscosity of polishing fluid that calculates, calculate the temperature compensation viscosity of polishing fluid and the temperature compensation viscosity of this temperature compensation viscosity and setting is made comparisons, if this temperature compensation viscosity is greater than the temperature compensation viscosity of setting, then instruction deionized water feeding mechanism supplements deionized water to polishing liquid bath 51, to reduce the viscosity of polishing fluid, if this temperature compensation viscosity is less than the temperature compensation viscosity of setting, then instruction heating arrangement 58 heats polishing fluid, reduces the liquid water content in polishing fluid, to improve the viscosity of polishing fluid.
Polishing fluid Viscosity Monitoring method of the present invention and monitoring device achieve the viscosity of Real-Time Monitoring polishing fluid by the resistivity of Real-Time Monitoring polishing fluid, and regulate and control according to the viscosity of viscosity B coefficent to polishing fluid of polishing fluid, make the object that the viscosity of polishing fluid remains stable.
In sum, the present invention is illustrated by above-mentioned embodiment and correlative type, and what oneself was concrete, full and accurate discloses correlation technique, and those skilled in the art can be implemented according to this.And the above embodiment be only used to illustrate the present invention, instead of be used for restriction of the present invention, interest field of the present invention, should be defined by claim of the present invention.Still all interest field of the present invention should be belonged to as the change of described component number herein or the replacement etc. of equivalence element.
Claims (10)
1. a polishing fluid Viscosity Monitoring method, is characterized in that, comprises the steps:
Measure the temperature of polishing fluid and the resistivity/conductivity of polishing fluid;
According to the relation measured between the resistivity/conductivity of the resistivity/conductivity that obtains and polishing fluid and the physical viscosity of polishing fluid, calculate the physical viscosity that the resistivity/conductivity that obtains with this measurement is corresponding;
According to the physical viscosity of the temperature measuring the polishing fluid obtained with the polishing fluid calculated, calculate the temperature compensation viscosity of polishing fluid, and the temperature compensation viscosity of this temperature compensation viscosity and setting is made comparisons, regulate the viscosity of polishing fluid according to comparative result.
2. polishing fluid Viscosity Monitoring method according to claim 1, it is characterized in that, if this temperature compensation viscosity is greater than the temperature compensation viscosity of setting, then in polishing fluid, supplement deionized water, if this temperature compensation viscosity is less than the temperature compensation viscosity of setting, then heat polishing fluid, reduce the liquid water content in polishing fluid.
3. polishing fluid Viscosity Monitoring method according to claim 1, it is characterized in that, the resistivity of described measurement polishing fluid comprises further and to be just relatively immersed in by two-plate in polishing fluid and this two-plate is connected with constant current source, measures voltage between two-plate and according to formula
calculate the resistivity of polishing fluid, wherein, U is the voltage between two-plate, and S is the area that two-plate is just relative, the electric current that I provides for constant current source, and L is the spacing between two-plate.
4. polishing fluid Viscosity Monitoring method according to claim 1, it is characterized in that, the resistivity of described measurement polishing fluid comprises further and to be just relatively immersed in by two-plate in polishing fluid and this two-plate is connected with constant pressure source, measures electric current between two-plate and according to formula
calculate the resistivity of polishing fluid, wherein, U is the voltage between two-plate, and S is the area that two-plate is just relative, and I is the electric current between two-plate, and L is the spacing between two-plate.
5. the polishing fluid Viscosity Monitoring method according to claim 3 or 4, is characterized in that, the spacing between described two-plate and the shape of two-plate remain unchanged in polishing fluid Viscosity Monitoring process.
6. a polishing fluid Viscosity Monitoring device, is characterized in that, comprising:
Polishing liquid bath, described polishing liquid bath fills polishing fluid;
Resistivity/conductivity measurements device, the resistivity/conductivity of described resistivity/conductivity measurements measurement device polishing fluid;
Temperature measuring equipment, described temperature measuring equipment measures the temperature of polishing fluid; And
Controller, described controller is connected with resistivity/conductivity measurements device and temperature measuring equipment respectively, relation between the resistivity/conductivity of the resistivity/conductivity that controller obtains according to resistivity/conductivity measurements measurement device and polishing fluid and the physical viscosity of polishing fluid, calculate the physical viscosity of the polishing fluid corresponding with this resistivity/conductivity, and then the temperature of the polishing fluid to obtain according to temperature measuring equipment measurement and the physical viscosity of polishing fluid that calculates, calculate the temperature compensation viscosity of polishing fluid and the temperature compensation viscosity of this temperature compensation viscosity and setting is made comparisons, the viscosity of polishing fluid is regulated according to comparative result.
7. polishing fluid Viscosity Monitoring device according to claim 6, is characterized in that, also comprise further:
Deionized water feeding mechanism, described deionized water feeding mechanism is to polishing liquid bath supplying deionized water, and deionized water feeding mechanism is connected with controller; And
Heating arrangement, described heating devices heat polishing liquid bath, makes the temperature of the polishing fluid in polishing liquid bath raise, and reduce the liquid water content in polishing fluid, heating arrangement is connected with controller;
If the temperature compensation viscosity of the polishing fluid that controller calculates is greater than the temperature compensation viscosity of setting, then controller instruction deionized water feeding mechanism supplements deionized water in polishing liquid bath, if this temperature compensation viscosity is less than the temperature compensation viscosity of setting, then controller instruction heating devices heat polishing fluid, reduces the liquid water content in polishing fluid.
8. polishing fluid Viscosity Monitoring device according to claim 6, it is characterized in that, described resistivity test device comprises two-plate, constant current source and voltage table, described two-plate is just relatively immersed in polishing fluid, constant current source is connected with two-plate, measured value is also sent to controller by the voltage that voltage table is measured between two-plate, the magnitude of voltage that controller is measured according to voltage table and formula
calculate the resistivity of polishing fluid, wherein, U is the voltage between two-plate, and S is the area that two-plate is just relative, and I is the electric current of constant current source, and L is the spacing between two-plate.
9. polishing fluid Viscosity Monitoring device according to claim 6, it is characterized in that, described resistivity test device comprises two-plate, constant pressure source and reometer, described two-plate is just relatively immersed in polishing fluid, constant pressure source is connected with two-plate, measured value is also sent to controller by the electric current that reometer is measured between two-plate, the current value that controller is measured according to reometer and formula
calculate the resistivity of polishing fluid, wherein, U is the voltage between two-plate, and S is the area that two-plate is just relative, and I is the electric current between two-plate, and L is the spacing between two-plate.
10. polishing fluid Viscosity Monitoring device according to claim 6, is characterized in that, described temperature measuring equipment is thermopair.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410366726.7A CN105319149A (en) | 2014-07-29 | 2014-07-29 | Monitoring method and monitoring device of viscosity of polishing solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410366726.7A CN105319149A (en) | 2014-07-29 | 2014-07-29 | Monitoring method and monitoring device of viscosity of polishing solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105319149A true CN105319149A (en) | 2016-02-10 |
Family
ID=55247014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410366726.7A Pending CN105319149A (en) | 2014-07-29 | 2014-07-29 | Monitoring method and monitoring device of viscosity of polishing solution |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105319149A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB603172A (en) * | 1944-08-17 | 1948-06-10 | Harry Tyler Booth | Improvements in viscosity control instruments |
| CN1578909A (en) * | 2001-10-29 | 2005-02-09 | Hydac电子技术有限公司 | Device and method for determining the quality of a medium, particularly of a lubricant and/or coolant |
| CN201034911Y (en) * | 2007-04-05 | 2008-03-12 | 张峰 | Portable oil-liquid iron magnelic properties abrasive grain amount and viscosity coefficient testing apparatus |
| CN103426791A (en) * | 2012-05-22 | 2013-12-04 | 盛美半导体设备（上海）有限公司 | Viscosity automatic control system and automatic control method |
-
2014
- 2014-07-29 CN CN201410366726.7A patent/CN105319149A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB603172A (en) * | 1944-08-17 | 1948-06-10 | Harry Tyler Booth | Improvements in viscosity control instruments |
| CN1578909A (en) * | 2001-10-29 | 2005-02-09 | Hydac电子技术有限公司 | Device and method for determining the quality of a medium, particularly of a lubricant and/or coolant |
| CN201034911Y (en) * | 2007-04-05 | 2008-03-12 | 张峰 | Portable oil-liquid iron magnelic properties abrasive grain amount and viscosity coefficient testing apparatus |
| CN103426791A (en) * | 2012-05-22 | 2013-12-04 | 盛美半导体设备（上海）有限公司 | Viscosity automatic control system and automatic control method |
Non-Patent Citations (2)
| Title |
|---|
| （苏）库特利雅夫采夫 等著，陈国亮 等译: "《应用电化学》", 31 August 1992, 复旦大学出版社 * |
| 曹善勇: "《Ansoft HFSS磁场分析与应用实例》", 30 April 2013, 中国水利水电出版社 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| HRP20191205T1 (en) | Apparatus and method for controlling electric vaporizer | |
| CN204570074U (en) | For fixture and the electrochemical depositer of electrochemical deposition | |
| CN207067252U (en) | A kind of device that electrical conductivity of solution is surveyed based on four electrode method | |
| RU2010117505A (en) | GAS MEASURING DEVICE AND METHOD OF ITS WORK | |
| CN105388937A (en) | Accurate constant-temperature control method and device for gas sensor | |
| CN104681380A (en) | Electrostatic chuck and plasma processing chamber thereof | |
| CN104746323B (en) | A kind of electric iron of temperature control mode improvement and the temp. control method of this electric iron | |
| CN207730753U (en) | One kind being used for power plant 2 calibration systems of online pH tables | |
| CN108195879A (en) | The method that Transient Method measures material thermal conductivity and thermal diffusion coefficient | |
| CN105331983A (en) | Control system and control method for forced current cathodic protection | |
| CN105319149A (en) | Monitoring method and monitoring device of viscosity of polishing solution | |
| CN104047032B (en) | Method for automatically adjusting energy balance of aluminum electrolysis cell | |
| CN108169565A (en) | A kind of non-linear temperature compensation method for conductivity measurement | |
| CN104807740A (en) | Testing device of high temperature erosiveness of electrodes for glass electric melting furnace and method thereof | |
| CN203705551U (en) | An electrolytic tank cathode carbon block voltage drop tester | |
| CN204255898U (en) | A kind of test unit that can realize galvanic corrosion test under different temperatures | |
| CN103426791A (en) | Viscosity automatic control system and automatic control method | |
| CN204964330U (en) | - 4 viscosimeters are scribbled to adjustable control by temperature change temperature | |
| CN104535630A (en) | Water quality measuring system of water drinking equipment | |
| CN208596126U (en) | A kind of liquid natural gas gasification rate measuring circuit | |
| CN212030780U (en) | Surface temperature sensor calibrating device | |
| CN203310907U (en) | Device for metering amount of energy saving of thermal insulation material | |
| CN207601184U (en) | A kind of measurement device of glassy solids high-temperature conductivity | |
| CN103364434B (en) | The hemisphere of large difference sample is to the measuring method of total emissivity | |
| CN103364639B (en) | The measuring method of solution resistance in dynamic pure aquatic system metal corrosion electrochemical measurement |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160210 |