CN105318718B - Laser sintering device and method - Google Patents
Laser sintering device and method Download PDFInfo
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- CN105318718B CN105318718B CN201410377904.6A CN201410377904A CN105318718B CN 105318718 B CN105318718 B CN 105318718B CN 201410377904 A CN201410377904 A CN 201410377904A CN 105318718 B CN105318718 B CN 105318718B
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Abstract
The invention relates to a laser sintering device and a laser sintering method, wherein the device comprises a laser device which is used for generating a heating laser beam incident to the surface of a sintered sample, the heating laser beam forms a laser spot with adjustable power density and size, and the size of the laser spot is not smaller than the size of the sintered sample. The invention has excellent performances in the aspects of energy consumption, lifting temperature control and temperature zone uniformity, can effectively improve the quality performance of a sintered body, and is suitable for preparation, research and development of precise materials.
Description
Technical Field
The present invention relates to a laser sintering technique and a Laser Diode (LD) array technique. More specifically, the present invention relates to a laser sintering apparatus and method.
Background
The traditional sintering is generally carried out by adopting a high-temperature sintering furnace, and is mainly used for integral sintering of blocky solid parts prepared from powder raw materials. As shown in fig. 1, the temperature in the furnace chamber 2 is raised to a desired temperature by the temperature rise of the heating body 1, so that the sample 3 placed in the furnace chamber 2 is sintered. This method is almost all the working method of the non-hot pressing sintering furnace, and needs to heat the whole furnace chamber, so that the sample in the furnace chamber can be heated, therefore, the following disadvantages are caused:
(1) the power consumption is large;
(2) the temperature rise speed is slow, and the temperature rise is slow as the furnace chamber is larger, so that the requirement that the sintering of some high-performance materials needs to be rapidly raised in a specific temperature area cannot be met;
(3) the cooling is slow, so that extremely thick heat insulation materials are often used for keeping the temperature of the furnace chamber, and the requirement of phase change materials and the like on adjustable cooling speed is difficult to meet;
(4) the temperature is difficult to control accurately, and the temperature areas of different parts in the furnace chamber are different.
These problems directly affect the precise control of the sintering process and thus the quality of the product.
Laser sintering is a laser Rapid prototyping technology (Rapid protocol), the existing laser sintering technology usually selects lasers with larger power, the lasers are characterized in that laser beams are single-beam constant power lasers, laser spots are very small, the spot size is not easy to adjust, and the laser sintering technology is only suitable for laser scanning sintering, and the laser scanning sintering is mainly suitable for layer-by-layer sintering of structural parts with complicated shapes and structures. The technical problem to be solved urgently is the development and large-scale application of the laser sintering technology, and the quality and the performance of the sintered body are directly influenced.
Disclosure of Invention
Aiming at the technical problems in the prior art, the invention provides a sintering mode for directly heating a sample by using a laser beam, which ensures that the whole surface of the sample is uniformly heated and quickly diffused, has the characteristics of no need of an integral heating furnace chamber, lower power consumption, higher heating/cooling speed and accurate and controllable temperature rise/cooling speed, is favorable for obtaining a high-performance sintered body, and is particularly suitable for preparing a fluorescent ceramic material which is difficult to form and sinter.
The laser sintering device comprises a laser device and is used for generating a heating laser beam incident to the surface of a sintered sample, the heating laser beam forms a laser spot with adjustable power density and size, and the size of the laser spot is not smaller than that of the sintered sample.
The size of the laser spot is not smaller than that of the sintered sample, so that the whole surface of the sintered sample is uniformly heated, and then heat is quickly diffused to the whole body of the sintered sample through the direct heating surface, thereby realizing quick sintering; if the size of the laser spot is smaller than that of the sintered sample, a local area on the surface of the sintered sample cannot irradiate the laser, so that the sample is heated unevenly, the defects of surface curling, balling and the like of the sintered body are generated, uneven heating can directly cause uneven density of the final sintered body, and the overall quality is poor; if the area of the laser spot is far larger than the size of the sintered sample, a large amount of laser is wasted, which is not beneficial to energy conservation and consumption reduction, so the area of the laser spot is slightly larger than the size of the sintered sample.
The sample to be sintered has a certain absorptivity to laser, and if the reflectivity to blue and red laser is extremely high, the sample is not suitable for direct laser sintering, and the sintering device and the method are not suitable.
Preferably, the laser device includes a power supply and a laser diode array, the laser diode array is formed by arranging a plurality of laser diode units in an array, and a plurality of laser beams emitted from the laser diode array are combined to form the heating laser beam.
Preferably, the laser device further comprises an optical module, wherein the optical module comprises a focusing module, and the adjustment of the power and the size of the laser spot is realized.
Preferably, the focusing module is a lens array, and the lens array includes a plurality of lenses corresponding to the laser diode unit groups one to one, or other optical elements capable of realizing a focusing function.
More preferably, the optical module further comprises a collimating module.
Preferably, the collimating module includes a plurality of collimating lenses disposed in one-to-one correspondence with the laser diode units or other optical elements capable of achieving a collimating function.
Preferably, the laser sintering device further comprises a temperature measuring device, and the temperature measuring device is used for measuring the temperature of the sintered sample at the detection point in real time.
Preferably, the laser sintering device further comprises a control unit, one end of the control unit is connected with a power supply of the laser device, and the other end of the control unit is connected with the temperature measuring device; the control unit responds to the detection signal from the temperature measuring device, and then controls the power supply of the laser device to control the power density output of the laser facula by adjusting the power supply parameter.
Preferably, the power supply of the laser device is a pulse-direct current control power supply.
Preferably, the laser diode is a blue laser diode.
Preferably, the sintered sample is a green body obtained by pressing or injection molding of a sintered powder.
Preferably, the temperature measuring device is an infrared thermometer, and the infrared thermometer is used for monitoring the temperature of the surface of the sintered sample and feeding back the temperature to the control unit, so as to modify the temperature control program.
Preferably, the laser sintering device further comprises a closed cavity, wherein,
the sintered sample is arranged at the bottom end inside the closed cavity, wherein,
the upper end of the closed cavity is provided with a light inlet sealed by a light-transmitting material, and laser can directly irradiate on the sintered sample through the light inlet;
the sealed cavity is also provided with a first air pipe, and the first air pipe is used for guiding air out of the sealed cavity.
Preferably, the temperature measuring device is a thermocouple, one end of the thermocouple is connected with the bottom surface sintering part of the sintered sample, the other end of the thermocouple is connected with the control unit, wherein,
and the thermocouple tests the temperature of the bottom surface of the sintered sample and feeds the temperature back to the control unit, so that the temperature control program is corrected.
Preferably, the temperature measuring device further comprises an infrared thermometer, the infrared thermometer is connected with the control unit, wherein,
the infrared thermometer monitors the temperature of the surface of the sintered sample and is matched with the thermocouple, so that more accurate control is realized.
Preferably, the closed cavity is further provided with a second air pipe, and the second air pipe is used for introducing air into the closed cavity.
Preferably, the power density of the laser spot is distributed in a gradient manner so as to realize temperature gradient sintering.
Preferably, the laser sintering device comprises at least two temperature measuring devices, wherein,
each temperature measuring device can test the temperature of different areas of the laser spot, monitor the surface temperature of different gradient areas of the sintered sample and feed back the surface temperature to the control unit, thereby correcting the temperature control program.
In addition, the invention also discloses a laser sintering method, which comprises the following steps:
directly irradiating a heating laser beam with adjustable power density and size of a laser spot on the surface of a sintered sample, wherein the size of the laser spot is not smaller than that of the sintered sample;
and the sintered sample is sintered under a preset sintering system.
The sintering system is a process of making the blank body produce a series of physical and chemical changes through high-temperature treatment to form an expected mineral composition and microstructure, thereby achieving the fixed appearance and obtaining the required effect.
The method specifically comprises the following steps:
temperature system: including the heating rate, the maximum firing temperature and the heat preservation time of each stage.
Atmosphere system: the atmosphere requirements (such as oxidation, neutrality and reduction) corresponding to each stage.
A pressure system: and adjusting the pressure in the kiln to ensure the realization of temperature and atmosphere system.
The temperature control and the time control of the sintering process are realized by adjusting the switch of the heating laser beam, the power density output of the laser spot and the like in the sintering process.
The laser sintering device provided by the invention has the advantages that the laser beam is used as a heat source to sinter a sample to be sintered, the power density and the size of a laser spot are adjustable, and the size of the laser spot is not smaller than that of the sample to be sintered, so that the surface of the whole sample to be sintered is uniformly heated and the surface-to-body heat diffusion is fast, the fast integral sintering is realized, the problem of heat loss caused by the fact that a furnace chamber needs to be integrally heated in a traditional sintering furnace is solved, and the laser sintering device has the advantages of low power consumption and fast heating/cooling speed; on the other hand, the cooperation of the temperature measuring device, the control unit and the power supply ensures that the invention has excellent performances in the aspects of energy consumption, temperature rise and fall control, uniform temperature zone and the like, can effectively improve the quality performance of a sintered body, and is suitable for the preparation, research and development of precise materials.
Drawings
FIG. 1 is a schematic view of a high temperature furnace in a conventional sintering technique;
FIG. 2 is a schematic illustration of laser spot and sample size according to a first embodiment of the present invention;
FIG. 3 is a schematic diagram of a laser sintering apparatus according to an embodiment of the present invention;
FIG. 4 is a power diagram of a laser according to a first embodiment of the present invention at different currents;
FIG. 5 is a schematic view of a laser sintering apparatus according to a second embodiment of the present invention;
FIG. 6 is a schematic diagram of a laser sintering apparatus according to an embodiment of the present invention;
fig. 7 is a schematic illustration of laser spot and sample size for a fourth embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the embodiments described are presently preferred modes of carrying out the invention, and that the description is made for the purpose of illustrating the general principles of the invention and not for the purpose of limiting the scope of the invention. The protection scope of the present invention shall be defined by the appended claims, and all other embodiments obtained by those skilled in the art without any inventive work shall fall within the protection scope of the present invention.
The invention discloses a sintering device, aiming at enabling the whole surface of a sample to be uniformly heated and quickly diffused, having the characteristics of no need of an integral heating furnace chamber, lower power consumption, higher heating/cooling speed and accurate and controllable temperature rise/cooling speed, being beneficial to obtaining a high-performance sintered body and being particularly suitable for preparing a fluorescent ceramic material which is difficult to form and sinter. According to the invention, the sintered body has excellent performances in the aspects of energy consumption, temperature rise control, temperature reduction control and temperature zone uniformity, can effectively improve the quality performance of the sintered body, and is suitable for research and development of precision materials. According to the invention, the laser sintering device comprises a laser device, and is used for generating a heating laser beam incident to the surface of a sintered sample, wherein the heating laser beam forms a laser spot with adjustable power density and size, the size of the laser spot is larger than or not smaller than that of the sintered sample, and the sample is completely covered by the spot in the sintering process.
Preferably, the laser device includes a power supply and a laser diode array, the laser diode array is formed by arranging a plurality of laser diode units in an array, and a plurality of laser beams emitted from the laser diode array are combined to form the heating laser beam.
Preferably, the power supply is a pulse-to-dc controlled power supply.
Preferably, the laser device further comprises an optical module, wherein the optical module comprises a focusing module, and the adjustment of the power and the size of the laser spot is realized.
Controlling a laser diode to emit laser beams with different strengths and unchanged spot sizes by adjusting parameters such as voltage, current, pulse duty ratio and the like of a power supply; or the optical module of the laser device is adjusted, so that the sintered sample is positioned in a focusing or defocusing area of the optical module to control the size of a laser spot and the power density output.
The first embodiment is as follows:
a plurality of high-power blue-light LDs are arrayed on a support, each LD can be additionally provided with an independent lens to form a lens array, and the size and the arrangement of light spots of the blue-light LDs can be adjusted by adjusting the lens array, as shown in fig. 2:
fig. 2a is a laser spot formed by combining spots emitted by 16 laser diodes, and fig. 2b is a schematic size diagram of a sample to be sintered, which is slightly smaller than the spot size and can be completely covered by the spot. The number of the laser diodes can be selected according to light spots and sintering requirements, samples within the size of 10mm multiplied by 10mm are sintered, the size of the light spots is well adjusted, and the power density can be effectively guaranteed. In addition, the blue laser diode is only an example, and any type of laser diode can be selected according to the laser absorption rate of the material to be sintered, generally, the power of the red and blue laser diodes is larger, which is suitable for the application, and the blue laser can be selected in consideration of the cost, which is not limited specifically here.
FIG. 3 is a schematic view of the laser direct sintering of this example, wherein the powder of the material to be sintered is fully mixed, dried, granulated, and subjected to pressure press molding and isostatic pressing to obtain a green compact 3 having a size of 8mm × 8mm, which is placed on a heat-resistant low-thermal-conductivity setter plate 4. The laser 5 comprises a plurality of blue light LDs arranged in an array, the spot size of the blue light LDs is 9mm multiplied by 9mm, the laser 5 is controlled by a pulse-direct current control power supply 6 and a control unit 7, and laser beams with different intensities but unchanged spot sizes can be emitted according to program response input pulse current and direct current. The infrared thermometer 8 mainly monitors the temperature of the green body surface and feeds back the temperature to the control unit 7, thereby correcting the temperature control program.
Fig. 4 shows three diagrams of power of the low duty ratio pulse current 4a, the high duty ratio pulse current 4b, and the dc current 4 c. When the sintering is started, the laser is introduced with low-current and low-duty-cycle pulse current, wherein the laser irradiation under the low-duty-cycle pulse current can ensure that the temperature of the sample is relatively slowly increased, and the sample is also heated along with the continuous increase of the pulse current. In the process of continuously increasing the duty ratio of the pulse current, the voltage and the current can be kept unchanged, and after the pulse current gradually reaches the direct current, the continuous temperature rise is mainly achieved by gradually increasing the current. In the temperature rise process, the temperature measuring instrument detects the temperature change of the sample in real time, and when the temperature rise speed exceeds the set program, the current can be adjusted and corrected through the control unit.
When the sintering temperature is reached, high-current pulse current is adopted for heat preservation, and the pulse current is mainly used for easily adjusting the output power of the light spots. And in the cooling stage, the input current of the laser is gradually reduced, the temperature measuring instrument monitors the cooling rate of the sample in real time, and the matching with the program is corrected through the control unit. If rapid cooling is required, the laser can be directly turned off.
The output power of the laser varies mainly depending on the voltage, the current, the duty ratio of the pulse current, and the frequency of the pulse current. The change of the four main parameters can change the power output of the laser, and during programming, the adjustment parameter is determined according to the change amplitude and the change speed of the laser power, which are only examples and are not limited specifically.
Example two:
the second embodiment provides a laser direct sintering device, which first obtains a plurality of high-power blue-ray LDs, and arranges them in an array on a support, each LD may be additionally provided with an independent collimating lens, and a focusing lens is further arranged on a downstream light path of laser propagation, and the size and arrangement of laser spots of the blue-ray LDs can be adjusted by adjusting the focusing lens, so that the size of the laser spots is slightly larger than the size of the surface of a sample, as shown in fig. 2.
The structure of the apparatus is shown in fig. 5, wherein the heat insulating support 4 is placed in a closed chamber, and the heat insulating support 4 mainly functions as a setter and has a low thermal conductivity to prevent heat loss of the sintered sample. The thermocouple 9 is embedded on the surface of the support and is in contact with the lower surface of the sintered sample. After fully mixing, drying and granulating the material powder of the sintered sample, carrying out pressure press forming and isostatic pressing to obtain a green body 3 with the size of 8mm multiplied by 8mm, placing the green body on a heat-resistant low-thermal-conductivity support 4, and contacting the bottom of the green body with a thermocouple 9. The laser 1 comprises a plurality of blue light LDs arranged in an array, the spot size of the blue light LDs is 9mm multiplied by 9mm, the laser 1 is controlled by a pulse-direct current control power supply 6 and a control unit 7, and can respond to input pulse current and direct current according to programs to emit laser beams 10 with different intensities but unchanged spot sizes. The upper surface of the closed container is embedded with a glass lens 11, which has higher strength to resist the pressure during vacuum pumping and has extremely high transparency and blue light transmittance for the transmission of laser beams. In addition, the container has a first gas pipe 121 through which the sealed cavity is vacuumed to achieve vacuum sintering.
When the sintering starts, the laser 5 is introduced with pulse current with low duty ratio and low frequency, the laser irradiation under the pulse current with low duty ratio can ensure the relatively slow temperature rise of the sample, and the sample is completely covered by the light spot to ensure the uniform heating of the whole sample. The temperature data detected by the thermocouple 9 is fed back to the control unit, the control unit controls the pulse power supply to gradually increase the duty ratio and frequency of the pulse current, the sample is heated, and the duty ratio and frequency of the pulse current are increased faster when the required heating speed is higher. When the duty ratio and frequency of the pulse current are continuously increased to be close to the direct current, the current can be converted into the direct current, and the continuous temperature rise is mainly achieved by gradually increasing the current.
Since the pulse current is easier to control, a control method of stepped pulse current input may also be adopted, for example: when the voltage is constant at 120V, a pulse current with a current of 1A can be set, the duty ratio is adjustable from 10% to 90% under corresponding frequency, when the duty ratio is changed to 90%, the pulse current is changed into direct current 1A, the direct current is gradually increased from 1A to 5A, then the pulse current is changed into 10A pulse current, the duty ratio is changed from 10% to 90%, and after the direct current is changed, a certain current is continuously increased and then the pulse is changed. The setting of the dc-pulse current can be adjusted according to the actual sintering requirement, especially the temperature rising stage and the temperature maintaining stage, which are only examples and not specific limitations.
When the sintering temperature is reached, high-current pulse current is adopted for heat preservation, and the pulse current is mainly used for being matched with the thermocouple 9 to adjust the output power of the laser. In the cooling stage, the input current of the laser 5 is gradually reduced, and the temperature measuring instrument monitors the cooling rate of the sample in real time and corrects the matching with the program through the control unit. If rapid cooling is required, the laser can be directly turned off.
Compared with the first embodiment, the sintering device of the present embodiment can realize vacuum sintering, and can effectively increase the density of the sample. When vacuum sintering is needed, a vacuum pump is connected to maintain the vacuum degree in the sintering process, and meanwhile, the higher vacuum degree is beneficial to heat preservation of a sintered sample and rapid temperature rise.
Example three:
the present embodiment provides a function expanding type laser direct sintering device, as shown in fig. 6, which is a structural diagram of the present embodiment, and the main difference from the second embodiment is that an infrared thermometer 8 for monitoring the surface temperature of a sintered body is added, the infrared thermometer 8 and a thermocouple 9 are both connected to a control unit 7, and the upper and lower surface temperatures of the sintered body 3 are fed back to the control unit 7 in real time, so that more accurate control is easily achieved. And secondly, a second air pipe 122 is added, and the two air pipes are matched to realize vacuum sintering, atmosphere sintering and fluid reducing atmosphere sintering of the system, and also realize atmosphere cooling and flowing atmosphere accelerated cooling under some special conditions.
In this embodiment, the pulse-dc current input method during sintering is similar to that in the second embodiment, and the temperature of the sample can be controlled more precisely by the close fit between the infrared thermometer 8 for detecting the surface of the sintered body and the thermocouple 9 for detecting the bottom of the sintered body.
When vacuum sintering is required, the second gas pipe 122 is closed and then vacuumized.
When the atmosphere sintering is required, the second gas pipe 122 can be closed, and the first gas pipe 121 is connected with a vacuum pump for vacuum pumping. After the vacuum pumping is finished, the first air pipe 121 is closed, the second air pipe 122 is opened after being connected with an air bottle, required air is filled, then the second air pipe 122 is closed, and the first air pipe 121 is opened for vacuum pumping again. After repeating for 3 times, the air in the cavity is removed to the maximum extent, and the second air tube 122 is opened again to fill the required air, so as to obtain the gas sintering atmosphere.
When the fluid reducing atmosphere is needed for sintering, the second gas pipe 122 can be sealed first, and the first gas pipe 121 is connected with a vacuum pump for vacuumizing. After the vacuum pumping is finished, the first air pipe 121 is closed, the second air pipe 122 is opened after being connected with an air bottle, required air is filled, then the second air pipe 122 is closed, and the first air pipe 121 is opened for vacuum pumping again. After repeating for 3 times, the air in the cavity is removed to the maximum extent, at this time, the second air pipe 122 is opened to continuously fill the required air, after the air is filled for a certain time, the vacuum pump connected with the first air pipe 121 is unloaded, and the first air pipe 121 is opened to be connected with the air atmosphere. The intra-cavity gas flows in from the second gas pipe 122 and flows out from the first gas pipe 121, and sintering in a flowing reducing atmosphere can be realized.
In some special cases, when rapid cooling is required, if vacuum sintering is performed, the laser 5 may be turned off, inert gas (or other gas that does not react with the high-temperature sample) may be introduced from the second gas pipe 122, then the first gas pipe 121 may be opened to form a flow path for the gas, and then the gas flow may be increased as required to achieve faster cooling. In the case of atmosphere sintering, the first gas pipe 121 may be opened directly and then the gas flow rate may be increased.
The shape of the chamber of the sintering device is only an example and not limited to the above, especially for a device requiring gas flow, and the chamber can be designed specifically according to the needs.
Example four:
when it is desired to sinter a material of a particular structure, such as a gradient functional material, which is different from a homogeneous material or a composite material, at least two materials having different properties are selected, and the material properties are changed slowly with the change in the composition and structure of the material by continuously changing the composition and structure of the two (or more) materials so that the interface disappears. Due to the gradient material composition characteristics, the gradient laser spot needs to be precisely controlled for sintering. For example, as shown in fig. 7b, the sintered material is composed of two components, the middle component of the material requires a higher sintering temperature, and the peripheral components require a lower sintering temperature, and the sintering temperature can be achieved by adjusting the composition structure of the laser spots, as shown in fig. 7a, the laser spot is composed of a plurality of small spots, each small spot corresponds to a laser diode, each laser diode can be individually focused through optical design, and then the small spots are arranged and converged into a whole spot. For convenience of control, the large light spots of the outer ring can be grouped into one group, the small light spots of the inner ring can be grouped into one group, the two groups of small light spots are respectively connected with the control unit and the power supply, at the moment, 2 different temperature measuring instruments are needed to respectively test the temperatures of the two areas, and power output correction is carried out through the control unit. The above is merely an example, the number of the temperature measuring devices needed in detail depends on the particular situation, and is not limited in detail here.
The laser sintering spots can be designed in a variety of complex forms benefiting from the array combination of laser diodes, but the more zones, the more complex the back-end design, and can be selected as desired depending on the effect and cost control of the application.
The invention also discloses a laser sintering method, which comprises the following steps:
directly irradiating the surface of a sintered sample with heating laser beams with adjustable power density and size of laser spots, wherein the size of the laser spots is not smaller than that of the sintered sample, and the sintered sample is completely covered by the laser spots in the sintering process;
and in the sintering process, the temperature control and the time control of the sintering process are realized by adjusting parameters such as the switch of the heating laser beam, the power density output of the laser spot and the like, so that the sintered sample is sintered under a preset sintering schedule.
The foregoing description shows and describes several preferred embodiments of the invention, but as aforementioned, it is to be understood that the invention is not limited to the forms disclosed herein, but is not to be construed as excluding other embodiments and is capable of use in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as expressed herein, commensurate with the above teachings, or the skill or knowledge of the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (15)
1. A laser sintering device comprises a laser device and is used for generating a heating laser beam incident to the surface of a sintered sample, and is characterized in that the heating laser beam forms a laser spot with adjustable power density and size, and the size of the laser spot is not smaller than that of the sintered sample; the material of the sintered sample is a gradient functional material, and the power density of the laser facula is in gradient distribution so as to realize temperature gradient sintering; the laser light spots are composed of a plurality of small light spots, each small light spot corresponds to one laser diode, and the laser diodes are independently focused.
2. The laser sintering apparatus of claim 1, wherein the laser device comprises a power supply and a laser diode array, the laser diode array is formed by arranging a plurality of laser diode units in an array, and a plurality of laser beams emitted from the laser diode array are combined to form the heating laser beam.
3. The laser sintering apparatus of claim 1 wherein the laser apparatus further comprises an optical module, the optical module comprising a focusing module to adjust the power and size of the laser spot.
4. The laser sintering apparatus of claim 1, further comprising a temperature measuring device for measuring the temperature at the detection point of the sintered sample in real time.
5. The laser sintering apparatus according to claim 4, further comprising a control unit, wherein one end of the control unit is connected to a power supply of the laser apparatus, and the other end of the control unit is connected to the temperature measuring device; the control unit responds to the detection signal from the temperature measuring device, and then controls the power supply of the laser device to control the power density output of the laser facula by adjusting the power supply parameter.
6. The laser sintering apparatus of claim 2, wherein the power supply of the laser apparatus is a pulse-to-dc controlled power supply.
7. The laser sintering apparatus of claim 2 wherein the laser diode is a blue laser diode.
8. The laser sintering apparatus of claim 1 wherein the sintered sample is a green compact obtained by pressing or injection molding a sintered powder.
9. The laser sintering apparatus according to claim 5, wherein the temperature measuring device is an infrared thermometer, and the infrared thermometer is used for monitoring the temperature of the surface of the sintered sample and feeding back to the control unit, thereby correcting the temperature control program.
10. The laser sintering apparatus of claim 1 wherein the laser sintering apparatus further comprises a sealed chamber, wherein,
the sintered sample is arranged at the bottom end inside the closed cavity, wherein,
the upper end of the closed cavity is provided with a light inlet sealed by a light-transmitting material, and laser can directly irradiate on the sintered sample through the light inlet;
the sealed cavity is also provided with a first air pipe, and the first air pipe is used for guiding air out of the sealed cavity.
11. The laser sintering apparatus according to claim 5, wherein the temperature measuring device is a thermocouple, one end of the thermocouple is connected to the bottom sintering portion of the sintered sample, and the other end of the thermocouple is connected to the control unit,
and the thermocouple tests the temperature of the bottom surface of the sintered sample and feeds the temperature back to the control unit, so that the temperature control program is corrected.
12. The laser sintering apparatus of claim 11 wherein the temperature measuring device further comprises an infrared temperature measuring device, the infrared temperature measuring device being connected to the control unit, wherein,
the infrared thermometer monitors the temperature of the surface of the sintered sample and is matched with the thermocouple, so that more accurate control is realized.
13. The laser sintering apparatus of claim 10 wherein the sealed chamber further comprises a second gas pipe for introducing a gas into the sealed chamber.
14. The laser sintering apparatus of claim 5 wherein the laser sintering apparatus comprises at least two temperature measuring devices, wherein,
each temperature measuring device can test the temperature of different areas of the laser spot, monitor the surface temperature of different gradient areas of the sintered sample and feed back the surface temperature to the control unit, thereby correcting the temperature control program.
15. A laser sintering method using the laser sintering apparatus according to claim 1, comprising the steps of:
directly irradiating the surface of a sintered sample with heating laser beams with adjustable power density and size of laser spots, wherein the size of the laser spots is not smaller than that of the sintered sample, and the sintered sample is completely covered by the laser spots in the sintering process; the material of the sintered sample is a gradient functional material, and the laser spots with gradient changes are accurately controlled to be sintered;
and the sintered sample is sintered under a preset sintering system.
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