CN105314838B - 基板切断装置及方法 - Google Patents

基板切断装置及方法 Download PDF

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Publication number
CN105314838B
CN105314838B CN201510316541.XA CN201510316541A CN105314838B CN 105314838 B CN105314838 B CN 105314838B CN 201510316541 A CN201510316541 A CN 201510316541A CN 105314838 B CN105314838 B CN 105314838B
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China
Prior art keywords
substrate
region
heat conduction
conduction element
cooling
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CN201510316541.XA
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Chinese (zh)
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CN105314838A (zh
Inventor
徐镛植
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Publication of CN105314838A publication Critical patent/CN105314838A/zh
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mining & Mineral Resources (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
CN201510316541.XA 2014-07-14 2015-06-10 基板切断装置及方法 Active CN105314838B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020140088314A KR101641939B1 (ko) 2014-07-14 2014-07-14 기판 브레이크 장치 및 방법
KR10-2014-0088314 2014-07-14

Publications (2)

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CN105314838A CN105314838A (zh) 2016-02-10
CN105314838B true CN105314838B (zh) 2020-02-14

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CN201510316541.XA Active CN105314838B (zh) 2014-07-14 2015-06-10 基板切断装置及方法

Country Status (3)

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KR (1) KR101641939B1 (ko)
CN (1) CN105314838B (ko)
TW (1) TWI658012B (ko)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101687342A (zh) * 2007-07-13 2010-03-31 三星钻石工业股份有限公司 脆性材料基板的加工方法及用于该方法的裂痕形成装置
CN101842203A (zh) * 2007-11-02 2010-09-22 三星钻石工业株式会社 脆性材料基板的截断方法
CN101934427A (zh) * 2009-06-30 2011-01-05 三星钻石工业股份有限公司 脆性材料基板的割断方法
CN102646584A (zh) * 2011-02-16 2012-08-22 株式会社东京精密 工件分割装置及工件分割方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100676249B1 (ko) * 2001-05-23 2007-01-30 삼성전자주식회사 기판 절단용 냉매, 이를 이용한 기판 절단 방법 및 이를수행하기 위한 장치
KR100788199B1 (ko) * 2006-07-18 2007-12-26 주식회사 에스에프에이 기판 절단시스템 및 그 방법
KR101407415B1 (ko) * 2012-08-30 2014-06-17 주식회사 에스에프에이 기판 절단시스템
KR101420627B1 (ko) * 2013-04-10 2014-07-17 박명아 유리 기판 열 커팅 장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101687342A (zh) * 2007-07-13 2010-03-31 三星钻石工业股份有限公司 脆性材料基板的加工方法及用于该方法的裂痕形成装置
CN101842203A (zh) * 2007-11-02 2010-09-22 三星钻石工业株式会社 脆性材料基板的截断方法
CN101934427A (zh) * 2009-06-30 2011-01-05 三星钻石工业股份有限公司 脆性材料基板的割断方法
CN102646584A (zh) * 2011-02-16 2012-08-22 株式会社东京精密 工件分割装置及工件分割方法

Also Published As

Publication number Publication date
TW201613833A (en) 2016-04-16
TWI658012B (zh) 2019-05-01
KR20160008312A (ko) 2016-01-22
KR101641939B1 (ko) 2016-07-22
CN105314838A (zh) 2016-02-10

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