CN105312772A - Laser machining apparatus - Google Patents
Laser machining apparatus Download PDFInfo
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- CN105312772A CN105312772A CN201510297261.9A CN201510297261A CN105312772A CN 105312772 A CN105312772 A CN 105312772A CN 201510297261 A CN201510297261 A CN 201510297261A CN 105312772 A CN105312772 A CN 105312772A
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- Prior art keywords
- laser beam
- laser
- optically focused
- component
- camera lens
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
Abstract
Provided is a laser machining apparatus. The laser machining apparatus comprises: a workpiece retaining unit to retain a workpiece; a laser beam irradiation unit to irradiate a laser beam to the workpiece retained by the workpiece retaining unit; an X-axis direction feed unit which moves the workpiece retaining unit and the laser beam irradiation unit in a processing feed direction (X-axis direction) relatively; and a Y-axis direction feed unit which moves the workpiece retaining unit and the laser beam irradiation unit in a Y-axis direction orthogonal to the X-axis direction by processing. The laser beam irradiation unit comprises: a laser beam oscillation unit to oscillate a laser beam; a condensing lens which condenses the laser beam oscillated from the laser beam oscillation unit, and irradiates the laser beam to the workpiece retained on a chuck table; and an optical axis inclining unit arranged between the laser beam oscillation unit and the condensing lens, making the optical axis of the laser beam be eccentric to a center axis of the condensing lens, and makes the optical axis of the laser beam be inclined to the center axis of the condensing lens.
Description
Technical field
The present invention relates to the laser processing device for implementing Laser Processing to machined objects such as semiconductor wafers.
Background technology
In semiconductor equipment manufacturing process, the surface of the roughly semiconductor wafer of circular plate shape marking off multiple region by being arranged in cancellate segmentation preset lines, in the region that this marks off, forming the device such as IC (integrated circuit), LSI (large scale integrated circuit).Further, each device is manufactured by carrying out segmentation along segmentation preset lines cutting semiconductor chip to the region being formed with device.
Following method is proposed: for wafer, there is the pulse laser light of absorbefacient wavelength along the irradiation of segmentation preset lines and carry out ablation as the method splitting above-mentioned semiconductor wafer along segmentation preset lines, form laser processing groove thus, and semiconductor wafer is ruptured along this laser processing groove.
The laser processing device of this enforcement Laser Processing has: machined object retaining member, and it keeps machined object; Laser light irradiation component, it irradiates laser beam to the machined object being held in this machined object retaining member; Processing feeding component, it makes machined object retaining member and laser light irradiation component process relative movement in direction of feed; And index feed component, it makes the relative movement (for example, referring to patent document 1) on the index feed direction vertical with processing direction of feed of machined object retaining member and laser light irradiation component.
Patent document 1: Japanese Unexamined Patent Publication 2006-253432 publication
But there are the following problems: when forming laser processing groove when irradiating laser beam to machined object, the cross section of groove becomes V-shape and processes and cannot continue.
Further, there are the following problems: because well width is uneven from the light incident side of laser beam towards the bottom of groove, therefore when a recess is formed, the border between the sidewall of groove and diapire can not become right angle.
Summary of the invention
The present invention completes in view of the foregoing, and its main technical task is to provide a kind of laser processing device, and the cross section of groove can not become V-shape, and the angle between the sidewall of groove and diapire can be made to be right angle.
In order to solve above-mentioned main technical task, according to the invention provides a kind of laser processing device, it has: machined object retaining member, and it keeps machined object; Laser light irradiation component, it irradiates laser beam to the machined object remained on this machined object retaining member; X-direction feeding component, it makes machined object retaining member and the relative movement in the X-axis direction of laser light irradiation component, and this X-direction is processing direction of feed; And Y direction feeding component, it carries out processing feeding to machined object retaining member and laser light irradiation component in the Y direction vertical with X-direction, it is characterized in that,
This laser light irradiation component has: laser beam oscillating member, its laser beam that vibrates; Optically focused camera lens, its laser beam vibrating from this laser beam oscillating member is assembled and irradiates the machined object remained on this chuck table; And inclined light shaft component, it is disposed between this laser beam oscillating member and this optically focused camera lens, makes the optical axis of laser beam relative to the eccentricity of central axis of this optically focused camera lens, makes the optical axis of laser beam relative to the inclined of this optically focused camera lens in optically focused side.
Above-mentioned inclined light shaft component is made up of Y direction tilting unit, and described Y direction tilting unit makes to move in the Y-axis direction from the vibrate optical axis of the laser beam of laser beam oscillating member relative to the central shaft of optically focused camera lens.
And, above-mentioned inclined light shaft component is made up of Y direction tilting unit and X-direction scanning element, and described X-direction scanning element makes to move in the X-axis direction from the vibrate optical axis of the laser beam of laser beam oscillating member relative to the central shaft of optically focused camera lens.
In laser processing device of the present invention, because laser light irradiation component has: laser beam oscillating member, its laser beam that vibrates; Optically focused camera lens, its laser beam vibrating from this laser beam oscillating member is assembled and irradiates the machined object remained on this chuck table; And inclined light shaft component, it is disposed between laser beam oscillating member and optically focused camera lens, make the optical axis of laser beam relative to the eccentricity of central axis of optically focused camera lens, make the optical axis of laser beam relative to the inclined of optically focused camera lens in optically focused side, therefore, when forming laser processing groove in the X-axis direction, for the laser processing groove formed, the optical axis of laser beam is swung while irradiate obliquely in the Y-axis direction alternately, two sidewalls can be formed thus from the light incident side of laser beam towards the parallel laser processing groove of diapire.
And, when to being formed at the laser processing groove of machined object (because well width is uneven from the light incident side of laser beam towards the bottom of groove, if therefore form groove, border then between the sidewall of groove and diapire does not become right angle) carry out revising when processing, the border formed between the sidewall of groove and diapire is irradiated with making the inclined light shaft of laser beam, the border between the sidewall in laser processing groove and diapire can be made thus to be formed as approximate right angle.
Accompanying drawing explanation
Fig. 1 is the stereogram of the laser processing device formed according to the present invention.
Fig. 2 is the structured flowchart of the laser light irradiation component being equipped on the laser processing device shown in Fig. 1.
Fig. 3 is the structured flowchart of another embodiment that the laser light irradiation component shown in Fig. 2 is shown.
Fig. 4 is the structured flowchart of the X-direction scanning element being equipped on the laser light irradiation component shown in Fig. 2.
Fig. 5 is the structured flowchart of the control member being equipped on the laser processing device shown in Fig. 1.
Fig. 6 is the stereogram illustrated pasting the state on the surface of the dicing tape be installed on the framework of ring-type as the silicon substrate of machined object.
Fig. 7 uses the laser processing device shown in Fig. 1 to the key diagram of the laser processing groove formation process that the silicon substrate as machined object is implemented.
Fig. 8 is the sectional view of the laser processing groove formed by existing Laser Processing.
Fig. 9 is the key diagram of the laser processing groove correction operation using the laser processing device shown in Fig. 1 and implement.
Label declaration
2: stationary base; 3: chuck table mechanism; 36: chuck table; 37:X direction of principal axis feeding component; 38:Y direction of principal axis feeding component; 4: laser light irradiation unit; 5: laser light irradiation component; 51: pulse laser light oscillating member; 52: optically focused camera lens; 53: inclined light shaft component; 54:Y direction of principal axis tilting unit; 541: the 1 electrical scanners; 542: the 2 electrical scanners; 543: optical axis changes mirror; 55:X direction of principal axis scanning element; 551: direction transformation mirror; 552: the 3 electrical scanners; 6: shooting component; 8: control member; 10: silicon substrate.
Detailed description of the invention
Below, with reference to accompanying drawing being preferred embodiment described in detail the laser processing device formed according to the present invention.
Fig. 1 illustrates the stereogram of the laser processing device formed according to the present invention.Laser processing device shown in Fig. 1 has: stationary base 2; Chuck table mechanism 3, it the mode of the upper movement of processing direction of feed (X-direction) shown in arrow X can be disposed in this stationary base 2, and keeps machined object; And as the laser light irradiation unit 4 of laser light irradiation component, it arranges on the base 2.
Above-mentioned chuck table mechanism 3 has: pair of guide rails 31,31, and they are disposed in stationary base 2 along X-direction abreast; 1st sliding shoe 32, it is can the mode of movement in the X-axis direction be disposed on this guide rail 31,31; 2nd sliding shoe 33, it is being disposed on the 1st sliding shoe 32 by the mode of the upper movement of the processing direction of feed (Y direction) shown in arrow Y at vertical with X-direction; Supporting table 35, it is supported on the 2nd sliding shoe 33 by cylinder part 34; And as the chuck table 36 of machined object retaining member.This chuck table 36 has the absorption chuck 361 formed by porous material, in the upper surface semiconductor wafer of the such as circular plate shape as machined object being remained on absorption chuck 361 by not shown attracting member and holding surface.Made the chuck table 36 formed like this rotate by the not shown pulse motor be disposed in cylinder part 34.In addition, be equipped with the clamping device 362 for the framework of stationary ring at chuck table 36, the framework of described ring-type is via machined objects such as boundary belt support semi-conductor wafers.
Be provided with and above-mentioned pair of guide rails 31,31 chimeric a pair guide groove 321,321 at the lower surface of above-mentioned 1st sliding shoe 32, and be provided with the pair of guide rails 322,322 formed abreast along Y direction at the upper surface of the 1st sliding shoe 32.1st sliding shoe 32 of such formation is configured to by making guide groove 321,321 and pair of guide rails 31,31 chimeric and can move in the X-axis direction along pair of guide rails 31,31.Chuck table mechanism 3 in illustrated embodiment has for making the 1st sliding shoe 32 along the X-direction feeding component 37 of pair of guide rails 31,31 movement in the X-axis direction.X-direction feeding component 37 comprises: be disposed in the external thread rod 371 between above-mentioned pair of guide rails 31,31 abreast; And for the drive source such as pulse motor 372 of this external thread rod 371 of rotary actuation.The drive tab 373 that one end of external thread rod 371 is fixed in above-mentioned stationary base 2 rotatably supports, and the other end of external thread rod 371 and the output shaft transmission of above-mentioned pulse motor 372 link.In addition, external thread rod 371 screws togather with the through internal thread hole being formed at not shown internal thread block, and described internal thread block is arranged at the central portion lower surface of the 1st sliding shoe 32 highlightedly.Therefore, by the driving that rotated forward by pulse motor 372 pairs of external thread rods 371 and reversed, the 1st sliding shoe 32 moves in the X-axis direction along guide rail 31,31.
Above-mentioned 2nd sliding shoe 33 is configured to: its lower surface is provided with a pair guide groove 331,331, this a pair guide groove 331,331 and the pair of guide rails 322,322 chimeric of upper surface being arranged at above-mentioned 1st sliding shoe 32, by making this guide groove 331,331 and pair of guide rails 322,322 chimeric, the 2nd sliding shoe 33 can move in the Y-axis direction.Chuck table mechanism 3 in illustrated embodiment has Y direction feeding component 38, and described Y direction feeding component 38 moves along the pair of guide rails 322,322 being arranged at the 1st sliding shoe 32 in the Y-axis direction for making the 2nd sliding shoe 33.Y direction feeding component 38 comprises: be disposed in the external thread rod 381 between above-mentioned pair of guide rails 322,322 abreast; And for the drive source such as pulse motor 382 of this external thread rod 381 of rotary actuation.The drive tab 383 that one end of external thread rod 381 is fixed in the upper surface of above-mentioned 1st sliding shoe 32 rotatably supports, and the other end of external thread rod 381 and the output shaft transmission of above-mentioned pulse motor 382 link.In addition, external thread rod 381 screws togather with the through internal thread hole being formed at not shown internal thread block, and described internal thread block is arranged at the central portion lower surface of the 2nd sliding shoe 33 highlightedly.Therefore, to be rotated forward and reverse driving by pulse motor 382 pairs of external thread rods 381, the 2nd sliding shoe 33 moves in the Y-axis direction along guide rail 322,322.
Above-mentioned laser light irradiation unit 4 has: support unit 41, and it is disposed in said base 2; Housing 42, it is supported by this support unit 41, in fact flatly extends; Laser light irradiation component 5, it is disposed in this housing 42; And shooting component 6, it is disposed in the leading section of housing 42, detects the machining area that will carry out Laser Processing.In addition, in the illustrated embodiment, shooting component 6 is except the common capturing element (CCD) being undertaken taking by visible rays, also comprise and ultrared infrared illumination component is irradiated to machined object, catch the ultrared optical system of being irradiated by this infrared illumination component and the capturing element (infrared C CD) etc. exporting the signal of telecommunication corresponding with the infrared ray captured by this optical system, take component 6 and the picture signal photographed is sent to control member described later.
With reference to Fig. 2, above-mentioned laser light irradiation component 5 is described.
Laser light irradiation component 5 has: pulse laser light oscillating member 51, its pulse laser light that vibrates; Concentrator 520, it has the pulse laser light being vibrated by this pulse laser light oscillating member 51 and carries out optically focused and the optically focused camera lens 52 it irradiated the machined object W remaining on chuck table 36; And inclined light shaft component 53, it is disposed between pulse laser light oscillating member 51 and optically focused camera lens 52, make the optical axis of laser beam relative to the eccentricity of central axis of optically focused camera lens 52, and make the optical axis of laser beam relative to the inclined of optically focused camera lens 52 in optically focused side.Pulse laser light oscillating member 51 is made up of YAG laser oscillator 511 and the repetition rate setting element 512 being attached to YAG laser oscillator 511.
In the embodiment shown in figure 2, inclined light shaft component 53 is made up of Y direction tilting unit 54, and described Y direction tilting unit 54 makes to move in the Y-axis direction from the vibrate optical axis of the laser beam of pulse laser light oscillating member 51 relative to the central shaft of optically focused camera lens.Y direction tilting unit 54 changes mirror 543 by the 1st electrical scanner 541, the 2nd electrical scanner 542 and optical axis and forms.1st electrical scanner 541 is formed by the 1st mirror 541a with to the angle adjustment actuator 541b that angle adjusts that arranges of the 1st mirror 541a, and angle adjustment actuator 541b is controlled by control member described later.The pulse laser light that vibrated by above-mentioned pulse laser light oscillating member 51 reflects towards the 2nd electrical scanner 542 by the 1st electrical scanner 541 of such formation.2nd electrical scanner 542 is formed by the 2nd mirror 542a with to the angle adjustment actuator 542b that angle adjusts that arranges of the 2nd mirror 542a, and angle adjustment actuator 542b is controlled by control member described later.2nd electrical scanner 542 of such formation makes to be changed mirror 543 towards optical axis reflected by the above-mentioned pulse laser light oscillating member 51 pulse laser light that, that reflected by the 1st electrical scanner 541 that vibrates.Above-mentioned optical axis changes mirror 543 and makes to be changed direction towards optically focused camera lens 52 by the above-mentioned pulse laser light oscillating member 51 pulse laser light that, that be directed to via the 1st electrical scanner 541 and the 2nd electrical scanner 542 that vibrates.Wherein, the concentrator 520 with optically focused camera lens 52 is disposed in the leading section of housing 42 as shown in Figure 1.In addition, make concentrator 520 upper mobile in focal point position adjustment direction (Z-direction) by not shown focal point position adjustment means.
Y direction tilting unit 54 in illustrated embodiment is formed in mode as above, below, is described its effect.
When under the state that the 1st mirror 541a and the 2nd mirror 542a of the 1st electrical scanner 541 and the 2nd electrical scanner 542 are located in position as illustrated in solid line in figure 2, change mirror 543 via optical axis as shown by the solid line and optically focused camera lens 52 converges to focal point P1 by the vibrate pulse laser light that of pulse laser light oscillating member 51.And, at the 1st mirror 541a of the 1st electrical scanner 541 and the 2nd electrical scanner 542 and the 2nd mirror 542a respectively as shown in phantom in Figure 2 from solid line position to the state that a direction have rotated same angle, being vibrated by pulse laser light oscillating member 51, the pulse laser light that is shown in dotted line to be changed mirror 543 and optically focused camera lens 52 via optical axis and makes optical axis relative to the inclined of optically focused camera lens 52 thus converge to focal point P1.And, in the 1st mirror 541a of the 1st electrical scanner 541 and the 2nd electrical scanner 542 and the 2nd mirror 542a is respectively as Fig. 2 shown in double dot dash line from the state that solid line position have rotated same angle to other direction, as shown in double dot dash line, changed mirror 543 and optically focused camera lens 52 via optical axis by the vibrate pulse laser light that of pulse laser light oscillating member 51 and made optical axis relative to the inclined of optically focused camera lens 52 thus converge to focal point P1.
On the other hand, for the 1st mirror 541a of the 1st electrical scanner 541 and the 2nd electrical scanner 542 and the 2nd mirror 542a, when the state making it from above-mentioned Fig. 2 deflects a little with the rotational angle of the 2nd mirror 542a of the 2nd electrical scanner 542, vibrate the pulse laser light that as shown in Figure 3 by pulse laser light oscillating member 51, make optical axis relative to the inclined of optically focused camera lens 52 via optical axis change mirror 543 and optically focused camera lens 52 thus converge to focal point P2 under the state of dotted line, make optical axis relative to the inclined of optically focused camera lens 52 via optical axis change mirror 543 and optically focused camera lens 52 thus converge to focal point P3 under the state of double dot dash line.Like this, angle can be set by the 1st mirror 541a of suitably adjustment the 1st electrical scanner 541 and the 2nd electrical scanner 542 and the 2nd mirror 542a, and make to converge to arbitrary position in Y direction with arbitrary angle of inclination by the vibrate pulse laser light that of pulse laser light oscillating member 51.
Then, about another embodiment of inclined light shaft component 53, be described with reference to Fig. 4.
Inclined light shaft component 53 shown in Fig. 4 is made up of X-direction scanning element 55, described X-direction scanning element 55 is disposed between above-mentioned Y direction tilting unit 54 and optically focused camera lens 52, makes to move in the X-axis direction from the vibrate optical axis of the laser beam of pulse laser light oscillating member 51 relative to the central shaft of optically focused camera lens.X-direction scanning element 55 is made up of direction transformation mirror 551 and the 3rd electrical scanner 552, described direction transformation mirror 551 makes the pulse laser light reflected by the optical axis change mirror 543 of above-mentioned Y direction tilting unit 54 change direction in the horizontal direction, and described 3rd electrical scanner 552 makes the optical axis of the pulse laser light after being changed direction by this direction transformation glass 551 move in the X-axis direction relative to the central shaft of optically focused camera lens 52.3rd electrical scanner 552 is formed by the 3rd mirror 552a with to the angle adjustment actuator 552b that angle adjusts that arranges of the 3rd mirror 552a, and angle adjustment actuator 552b is controlled by control member described later.About the X-direction scanning element 55 formed like this, be located in by under the state of the position shown in solid line in Fig. 4 at the 3rd mirror 552a of the 3rd electrical scanner 552, the pulse laser light be directed to via direction transformation mirror 551 converges to focal point Pa via optically focused camera lens 52 as shown by the solid line.Further, when under the state that the 3rd mirror 552a of the 3rd electrical scanner 552 is located in position shown in dotted lines in Figure 4, the pulse laser light be directed to via direction transformation mirror 551 is shown in dotted line converges to focal point Pb via optically focused camera lens 52.In addition, when the 3rd mirror 552a of the 3rd electrical scanner 552 is located in by under the state of the position shown in double dot dash line in Fig. 4, the pulse laser light be directed to via direction transformation mirror 551 converges to focal point Pc via optically focused camera lens 52 as shown in double dot dash line.Like this, can the action of actuator 552b be adjusted by control angle and make to be swung along X-direction relative to the central shaft of optically focused camera lens 52 by the vibrate optical axis of the pulse laser light of pulse laser light oscillating member 51.
Laser processing device in illustrated embodiment has the control member 8 shown in Fig. 5.Control member 8 is made up of computer, and it has: carry out the central processing unit (CPU) 81 of calculation process, the read-only storage (ROM) 82 stored control program etc., read-write random access memory (RAM) 83, input interface 84 and the output interface 85 that store operation result etc. according to control program.Detection signal from shooting component 6 grade is inputted to the input interface 84 of control member 8.Further, from the output interface 85 of control member 8, control signal is exported to angle adjustment actuator 541b, the angle adjustment actuator 542b of the 2nd electrical scanner 542, the angle adjustment actuator 552b of the 3rd electrical scanner 552 etc. of above-mentioned X-direction feeding component 37, Y direction feeding component 38, pulse laser light oscillating member the 51, the 1st electrical scanner 541.
Laser processing device in illustrated embodiment is formed in mode as above, is described below to its effect.
The stereogram of the silicon substrate as machined object has been shown in Fig. 6.Silicon substrate 10 shown in Fig. 6 is such as formed as the circle that thickness is 200 μm, is set with processing line 101 in its surface.A face of this silicon substrate 10 is pasted onto on the surface of boundary belt T, and this boundary belt T is installed on the framework F of ring-type.
The above-mentioned laser processing device of use is described the 1st embodiment that the above-mentioned silicon substrate 10 as machined object implements Laser Processing.
First, the boundary belt T side of silicon substrate 10 is positioned on the chuck table 36 of the laser processing device shown in Fig. 1.Further, by making not shown attracting member carry out action, and via boundary belt T attracting holding silicon substrate 10 (machined object maintenance operation) on chuck table 36.
By X-direction feeding component 37, the chuck table 36 carrying out attracting holding to silicon substrate 10 described above is positioned immediately below shooting component 6.Like this when chuck table 36 is located in immediately below shooting component 6, performed by shooting component 6 and control member 8 and aim at operation, described aligning operation detects the machining area that will carry out Laser Processing of silicon substrate 10.Namely, shooting component 6 and control member 8 perform the image procossing such as the pattern match of the location for carrying out processing line 101 and concentrator 520, realize the aligning of laser light irradiation position, described processing line 101 is formed at silicon substrate 10, and described concentrator 520 forms the laser light irradiation component 5 irradiating laser beam along processing line 101.
If as mentioned above to be formed in be held in chuck table 36 silicon substrate 10 on processing line 101 detect, after carrying out the aligning of laser light irradiation position, then chuck table 36 is moved to the laser light irradiation region at concentrator 520 place of the laser light irradiation component 5 irradiating laser beam as Suo Shi Fig. 7 (a), and one end (being left end in Fig. 7 (a)) of the processing line 101 of regulation is positioned immediately below the concentrator 520 of laser light irradiation component 5.Further, control member 8 controls not shown focal point position adjustment means and is positioned near the upper surface of silicon substrate 10 by the focal point of the pulse laser light irradiated from concentrator 520.Then, control member 8 paired pulses laser beam oscillating member 51 carries out controlling and irradiating pulse laser light silicon substrate 10 to absorbefacient wavelength from concentrator 520, and the angle adjustment actuator 541b of the 1st electrical scanner 541 and the 2nd electrical scanner 542 and angle adjustment actuator 542b is controlled and as shown in Figure 2 or Figure 3 the 1st mirror 541a and the 2nd mirror 542a changed to alternately dashed lines states and double dot dash line state, X-direction feeding component 37 is controlled simultaneously and chuck table 36 is moved (laser processing groove formation process) to the direction shown in arrow X1 in Fig. 7 (a) with the feed speed of regulation.Therefore, as shown in Fig. 7 (c), for the laser beam be irradiated on silicon substrate 10, its optical axis alternatively swings along Y direction with dashed lines states and double dot dash line state.Its result is, as shown in Fig. 7 (c), the light incident side (upper surface) along processing line 101 from laser beam on silicon substrate 10 is formed with the parallel laser processing groove of sidewall 110b and 110c 110 towards diapire 110a.Further, as shown in Fig. 7 (b), when the other end (in Fig. 7 (b) for right-hand member) of processing line 101 arrives the irradiation position of concentrator 520, then stop pulse laser beam irradiation and stop the movement of chuck table 36.As a result, silicon substrate 10 is formed with as shown in Fig. 7 (b) following laser processing groove 110: sidewall 110b and 110c is parallel along processing line 101 as Suo Shi Fig. 7 (c), and sidewall 110b and 110c is at a right angle relative to end 110a.
In above-mentioned laser processing groove formation process, controlled by the action of the angle adjustment actuator 552b of the 3rd electrical scanner 552 to the formation X-direction scanning element 55 shown in Fig. 4 and the 3rd mirror 552a be alternatively positioned by the position shown in dotted line and by the position shown in double dot dash line, thus the optical axis of laser beam can be made to swing while irradiate laser beam in the X-axis direction relative to the central shaft of optically focused camera lens 52, therefore, it is possible to promote the formation of above-mentioned laser processing groove 110.
In addition, the processing conditions in above-mentioned laser processing groove formation process such as sets in such a way.
The wavelength of laser beam: 355nm
Repetition rate: 50kHz
Average output: 3W
Optically focused spot diameter: φ 10 μm
Processing feed speed: 100mm/ second
Then, the above-mentioned laser processing device of use is described the 2nd embodiment that the above-mentioned silicon substrate 10 as machined object implements Laser Processing.
2nd embodiment relates to the correction processing carried out the laser processing groove 120 being formed at silicon substrate 10 along processing line 101 as shown in Figure 8.If implement common Laser Processing, then as shown in Figure 8, sidewall 120b, 120c are not parallel and become taper, and the Bu Shi right angle, border between sidewall 120b, 120c and diapire 120a.2nd embodiment is that sidewall 120b, 120c to laser processing groove 120 shown in dotted line processes and with the processing making the mode that the border between sidewall 120b, 120c and diapire 120a is right angle revise.
The border between sidewall 120b, 120c of the laser processing groove 120 being formed at above-mentioned silicon substrate 10 and diapire 120a is made to become the processing at right angle in order to implement to carry out revising, first, as shown in Fig. 9 (a), the below of optically focused camera lens 52 will be positioned near the border between the sidewall 120b of laser processing groove 120 and diapire 120a.Further, control member 8 controls not shown focal point position adjustment means and is positioned near the border between the sidewall 120b of laser processing groove 120 and diapire 120a by the irradiation position of the pulse laser light irradiated from concentrator 520 as Suo Shi Fig. 9 (a).Then, control member 8 paired pulses laser beam oscillating member 51 carries out controlling and irradiating pulse laser light silicon substrate 10 to absorbefacient wavelength from concentrator 520, and the angle adjustment actuator 541b of the 1st electrical scanner 541 and the 2nd electrical scanner 542 and angle adjustment actuator 542b is controlled and as shown in Figure 2 or Figure 3 the 1st mirror 541a and the 2nd mirror 542a changed to alternately dashed lines states and double dot dash line state, above-mentioned X-direction feeding component 37 controlled simultaneously and make chuck table 36 with the feed speed of regulation along X-direction (for the direction vertical with paper in Fig. 9 (a)) mobile (the 1st laser processing groove correction operation).Its result is, the border between the sidewall 120b of laser processing groove 120 and diapire 120a is formed as approximate right angle as shown in Fig. 9 (b).
Then, implement to carry out revising and making the border between the sidewall 120c of laser processing groove 120 and diapire 120a become the processing at right angle.From implementing the state of the 1st laser processing groove correction operation, control member 8 pairs of Y direction feeding components 38 control and will be positioned the below of optically focused camera lens 52 near the border between the sidewall 120c of laser processing groove 120 and diapire 120a as Suo Shi Fig. 9 (b).Further, control member 8 controls not shown focal point position adjustment means and near border between the sidewall 120c be positioned by the irradiation position of the pulse laser light irradiated from concentrator 520 as Suo Shi Fig. 9 (b) in laser processing groove 120 and diapire 120a.Then, control member 8 controls above-mentioned pulse laser light oscillating member 51 and irradiates pulse laser light silicon substrate 10 to absorbefacient wavelength from concentrator 520, and the dashed lines states that angle adjustment actuator 541b and the angle adjustment actuator 542b of the 1st electrical scanner 541 and the 2nd electrical scanner 542 are controlled and changed to alternately by the 1st mirror 541a and the 2nd mirror 542a as shown in Figure 2 or Figure 3 and double dot dash line state, above-mentioned X-direction feeding component 37 controlled simultaneously and make chuck table 36 with the feed speed of regulation along X-direction (for the direction vertical with paper in Fig. 9 (b)) mobile (the 2nd laser processing groove correction operation).Its result is, the border between the sidewall 120c of laser processing groove 120 and diapire 120a is formed as approximate right angle as shown in Fig. 9 (c).
As mentioned above, by implementing above-mentioned 1st laser processing groove correction operation and the 2nd laser processing groove correction operation, and as Suo Shi Fig. 9 (c), the border be formed between sidewall 120b, 120c of the laser processing groove 120 of silicon substrate 10 and diapire 120a is modified to approximate right angle.
In addition, during by stating the 1st laser processing groove correction operation and the 2nd laser processing groove correction operation on the implementation, also the action of the angle adjustment actuator 552b of the 3rd electrical scanner 552 of the formation X-direction scanning element 55 shown in above-mentioned Fig. 4 controlled and as shown in Figure 4 the 3rd mirror 552a be positioned alternately position shown in position and double dot dash line shown in dotted line, thus, swing while irradiate laser beam along X-direction relative to the central shaft of optically focused camera lens 52 due to the optical axis of laser beam can be made, therefore, it is possible to promote the formation of above-mentioned laser processing groove 110.
Above, describe the present invention according to illustrated embodiment, but the present invention is not limited only to embodiment, various distortion can be carried out in the scope of purport of the present invention.Such as, in the above-described embodiment, show the example employing electrical scanner as the Y direction tilting unit 54 of inclined light shaft component 53 and X-direction scanning element 55, but inclined light shaft component also can use acousto-optic element (AOE), electrooptic element (EOD), polygonal mirror (polygonmirror) etc.
Claims (3)
1. a laser processing device, it has: machined object retaining member, and it keeps machined object; Laser light irradiation component, it irradiates laser beam to the machined object remained on this machined object retaining member; X-direction feeding component, it makes machined object retaining member and the relative movement in the X-axis direction of laser light irradiation component, and this X-direction is processing direction of feed; And Y direction feeding component, it carries out processing feeding to machined object retaining member and laser light irradiation component in the Y direction vertical with X-direction, it is characterized in that,
This laser light irradiation component has: laser beam oscillating member, its laser beam that vibrates; Optically focused camera lens, its laser beam vibrating from this laser beam oscillating member is assembled and irradiates the machined object remained on this chuck table; And inclined light shaft component, it is disposed between this laser beam oscillating member and this optically focused camera lens, makes the optical axis of laser beam relative to the eccentricity of central axis of this optically focused camera lens, makes the optical axis of laser beam relative to the inclined of this optically focused camera lens in optically focused side.
2. laser processing device according to claim 1, wherein,
This inclined light shaft component is made up of Y direction tilting unit, and described Y direction tilting unit makes to move in the Y-axis direction from the vibrate optical axis of the laser beam of this laser beam oscillating member relative to the central shaft of this optically focused camera lens.
3. laser processing device according to claim 2, wherein,
This inclined light shaft component is made up of this Y direction tilting unit and X-direction scanning element, and described X-direction scanning element makes to move in the X-axis direction from the vibrate optical axis of the laser beam of this laser beam oscillating member relative to the central shaft of optically focused camera lens.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-126251 | 2014-06-19 | ||
| JP2014126251A JP2016002585A (en) | 2014-06-19 | 2014-06-19 | Laser processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105312772A true CN105312772A (en) | 2016-02-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510297261.9A Pending CN105312772A (en) | 2014-06-19 | 2015-06-03 | Laser machining apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2016002585A (en) |
| KR (1) | KR20150146411A (en) |
| CN (1) | CN105312772A (en) |
| TW (1) | TW201601233A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109514093A (en) * | 2017-09-14 | 2019-03-26 | 株式会社迪思科 | Laser processing device |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6721439B2 (en) * | 2016-07-11 | 2020-07-15 | 株式会社ディスコ | Laser processing equipment |
| JP7412925B2 (en) * | 2019-08-26 | 2024-01-15 | キヤノン株式会社 | Optical device and article manufacturing method |
| CN112975133A (en) * | 2021-02-07 | 2021-06-18 | 福建师范大学 | Device for quickly modifying surface of material by laser |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20150146411A (en) | 2015-12-31 |
| TW201601233A (en) | 2016-01-01 |
| JP2016002585A (en) | 2016-01-12 |
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Application publication date: 20160210 |