CN105307776A - Synthetic jet with non-metallic blade structure - Google Patents
Synthetic jet with non-metallic blade structure Download PDFInfo
- Publication number
- CN105307776A CN105307776A CN201480016250.2A CN201480016250A CN105307776A CN 105307776 A CN105307776 A CN 105307776A CN 201480016250 A CN201480016250 A CN 201480016250A CN 105307776 A CN105307776 A CN 105307776A
- Authority
- CN
- China
- Prior art keywords
- plate
- plates
- synthetic jets
- wire
- nonmetallic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims abstract description 33
- 239000007769 metal material Substances 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 67
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 125000006850 spacer group Chemical group 0.000 claims description 19
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 230000015572 biosynthetic process Effects 0.000 claims description 10
- 238000003786 synthesis reaction Methods 0.000 claims description 8
- 238000010276 construction Methods 0.000 claims description 7
- 238000002347 injection Methods 0.000 claims description 7
- 239000007924 injection Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 238000012856 packing Methods 0.000 claims description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 5
- 229920001169 thermoplastic Polymers 0.000 claims description 4
- 239000004416 thermosoftening plastic Substances 0.000 claims description 4
- 230000008859 change Effects 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 239000012811 non-conductive material Substances 0.000 claims 1
- 229910052755 nonmetal Inorganic materials 0.000 description 26
- 239000012190 activator Substances 0.000 description 22
- 230000008569 process Effects 0.000 description 20
- 239000012530 fluid Substances 0.000 description 18
- 230000000712 assembly Effects 0.000 description 11
- 238000000429 assembly Methods 0.000 description 11
- 239000003822 epoxy resin Substances 0.000 description 11
- 229920000647 polyepoxide Polymers 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- -1 Merlon Polymers 0.000 description 7
- 239000011521 glass Substances 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 229920001903 high density polyethylene Polymers 0.000 description 3
- 239000004700 high-density polyethylene Substances 0.000 description 3
- 229920001684 low density polyethylene Polymers 0.000 description 3
- 239000004702 low-density polyethylene Substances 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 150000002843 nonmetals Chemical class 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910008599 TiW Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 230000005534 acoustic noise Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 229920005669 high impact polystyrene Polymers 0.000 description 2
- 239000004797 high-impact polystyrene Substances 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- XUIMIQQOPSSXEZ-IGMARMGPSA-N silicon-28 atom Chemical compound [28Si] XUIMIQQOPSSXEZ-IGMARMGPSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 150000003673 urethanes Chemical class 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 239000004836 Glue Stick Substances 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229920007019 PC/ABS Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 229910002115 bismuth titanate Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005421 electrostatic potential Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- MEFBJEMVZONFCJ-UHFFFAOYSA-N molybdate Chemical compound [O-][Mo]([O-])(=O)=O MEFBJEMVZONFCJ-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04F—PUMPING OF FLUID BY DIRECT CONTACT OF ANOTHER FLUID OR BY USING INERTIA OF FLUID TO BE PUMPED; SIPHONS
- F04F7/00—Pumps displacing fluids by using inertia thereof, e.g. by generating vibrations therein
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B43/00—Machines, pumps, or pumping installations having flexible working members
- F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
- F04B43/04—Pumps having electric drive
- F04B43/043—Micropumps
- F04B43/046—Micropumps with piezoelectric drive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Reciprocating Pumps (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
- Nozzles (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
- Fuel-Injection Apparatus (AREA)
Abstract
A system and method for lowering resonant frequency in a synthetic jet device for less noise, as well as lowering vibration, is disclosed. A synthetic jet device includes a first plate, a second plate spaced apart from the first plate, a spacing component coupled to and positioned between the first and second plates to form a chamber and including an orifice therein, and an actuator element coupled to at least one of the first or second plates to selectively cause deflection thereof, wherein the first and second plates are formed at least in part of a non-metallic material.
Description
The cross reference of related application
The application is the U.S. Provisional Patent Application sequence number No.61/787 submitted on March 15th, 2013, the non-provisional application of 738 and require its priority, and it is open is incorporated herein by reference.
Technical field
Synthesis jet actuator (syntheticjetactuator) is widely used technology, and its generation is sprayed for the synthesis of fluid, to affect the flowing from the teeth outwards of this fluid, to dispel the heat from its point.Common synthesis jet actuator comprises housing, and this housing limits inner chamber.Aperture is present in the wall of this housing.Actuator also comprises in this housing or mechanism around, for the volume in periodic variation inner chamber, so that a series of fluid vortex generates and is transmitted into external environment condition from the aperture of housing.The example of volume changing mechanism can comprise such as: the piston being arranged in case of sprayer, to move in aperture by fluid during the reciprocating motion of piston or to shift out aperture; Or the flexible membrane of wall as housing.Flexible membrane is activated by piezo-activator or other proper implements usually.
Background technology
Usually, control system is used for being formed time harmonic motion (time-harmonicmotion) of volume changing mechanism.When mechanism reduces chamber volume, fluid is by aperture discharge side.When fluid is by aperture, the sharp edges separation of the fluid in aperture, to form vortex sheet (vortexsheet), vortex sheet turnup becomes eddy current.These eddy current leave the edge in aperture under the self-induction speed (self-inducedvelocity) of himself.When mechanism increases chamber volume, surrounding fluid is pumped to chamber from the distance larger apart from aperture.Because eddy current has left the edge in aperture, so they are not by the impact of surrounding fluid entering into chamber.When aperture is left in eddy current advance, the injection of their complex fluids, i.e. " synthesis is sprayed ".
People recognize, acoustic noise is a unfavorable aspect of synthetic jets emitter operation, comprise two cooling injection (DCJ), and each in the opposed surface of device of two cooling injection uses actuator (that is, piezo-activator).DCJ usually they mechanical resonance pattern place or near energized, to optimize electrically to the conversion of machinery, and to realize maximum deflection under the input of minimum mechanical energy.Although DCJ operation when in their mechanical resonance pattern or near operation time be optimum, people recognize, at some frequencies operation DCJ can generate a large amount of noises, because the sonority features of device is partly determined by the driving frequency of device.
The synthetic jets emitter (comprising DCJ) of many variants constructs with the metallization piezo-activator (metalizedpiezo-actuator) utilizing conductive adhesive to be bonded to metallic plate or blade usually.By being connected to the piezoelectricity side of metallized exposure and the electrical connection being connected to plate material to realize to piezo-activator.Usual use solder or conductive glue stick.Then two in these plates are peripherally glued together, leave the aperture opening to be formed injection.When the actuating of piezo-activator, air is sucked by aperture and discharges, thus causes clean just (netpositive) air-flow.
A shortcoming of metallic plate or blade is that they are expensive, and their rigidity causes higher resonant frequency, which increases DCJ gimp.In addition, metallics can cause the vibration of increase.And the resonant frequency of DCJ may increase due to metallic plate.
Therefore, expect to provide a kind of synthetic jets emitter, such as DCJ, it has plate, and plate is made into has much lower resonant frequency, thus has less noise.Also expect that plate has the quality of reduction, this can provide lower vibration.
Summary of the invention
According to an aspect of the present invention, synthetic jets mapper arrangement comprises: the first plate; Second plate, itself and the first plate are spaced apart; Spacer member, it is attached to the first and second plates and to form chamber between them, and comprises aperture wherein; And actuator component, it is attached at least one in the first or second plate, and optionally to cause it to deflect, wherein, the first and second plates are formed by nonmetallic materials at least in part.
According to a further aspect in the invention, a kind of method making synthetic jets mapper arrangement comprises and constructs the first plate and the second plate by nonmetallic materials at least in part, at least one being attached to by actuator component in the first and second plates deflects optionally to cause it, the first plate is located relative to the second plate with by means of spacer member, first plate is affixed to the second plate to form chamber with isolated layout by spacer member, and comprises aperture wherein.The method also comprises corresponding one in the first and second plates electrical connection be attached to attached by actuator component and this actuator component extremely, to make it possible to voltage to be optionally applied to actuator component.
According to another aspect of the invention, synthetic jets mapper arrangement comprises: the first plate; Second plate, itself and the first plate are spaced apart to form chamber; And actuator component, its at least one being attached in the first or second plate deflects optionally to cause it, to change the volume in chamber.Each in first and second plates comprises the first material and the second material, this first material comprises electric insulation, nonmetallic material, this second material comprises electric conduction material, the second material be formed as following in one: packing material, metal layer and on the first material or in the wire internally or externally formed that provides.
According to accompanying drawing provide relatively of the present invention preferred embodiment the following detailed description of, will more easily understand these and other advantages and feature.
Accompanying drawing explanation
Accompanying drawing illustrate at present conception for implementing embodiments of the invention.
In the accompanying drawings:
Fig. 1 and 2 is the view of the synthetic jets emitter assemblies that can use together with embodiments of the present invention.
Fig. 3 is the cross section of the synthetic jets emitter of Fig. 1 and 2, which depict the injector when control system impels diaphragm inwardly to move towards aperture.
Fig. 4 is the cross section of the synthetic jets emitter of Fig. 1 and 2, which depict the injector when control system impels diaphragm outwards to move away from aperture.
Fig. 5 illustrates according to an embodiment of the invention for being produced on the assembling process of the synthetic jets emitter comprising non-metal board.
Fig. 6 illustrates according to an embodiment of the invention for being produced on the assembling process of the synthetic jets emitter comprising non-metal board.
Fig. 7 illustrates according to an embodiment of the invention for making the assembling process of the non-metal board of synthetic jets emitter.
Fig. 8 illustrates according to an embodiment of the invention for making the assembling process of the non-metal board of synthetic jets emitter.
Fig. 9 illustrates according to an embodiment of the invention for making the assembling process of doubling (double-folded) the non-metal board structure of synthetic jets emitter.
Figure 10 illustrates according to an embodiment of the invention for making the assembling process of the doubling non-metal board structure of synthetic jets emitter.
Figure 11 illustrates according to an embodiment of the invention for making the assembling process of the non-metal board of synthetic jets emitter.
Detailed description of the invention
Embodiments of the invention relate to the synthetic jets mapper arrangement with non-metal board, and it provides lower resonant frequency for less noise, and lower vibration.
Fig. 1-4 illustrates the general structure of the synthetic jets emitter assemblies 10 that can use together with embodiments of the present invention, and the motion of various component during its operation, for understanding the present invention better.Although illustrate concrete synthetic jets emitter assemblies 10 in figures 1-4, it should be understood that embodiments of the invention can be incorporated in the synthetic jets emitter assemblies of different structure, and therefore synthetic jets emitter assemblies 10 is not intended to limit the scope of the invention.For example, the synthetic jets emitter assemblies do not comprised for the mounting bracket of stationary positioned synthetic jets emitter is also thought within the scope of the invention.
First with reference to figure 1, synthetic jets emitter assemblies 10 shows that the sectional view of synthetic jets emitter 12 shows in fig. 2 in order to comprise synthetic jets emitter 12 and mounting bracket 14.In one embodiment, mounting bracket 14 is u shape mounting brackets, it is attached to body or the housing 16 of synthetic jets emitter 12 in one or more position, but, will be appreciated that, mounting bracket can be configured to the support with difformity/profile, such as semi-circular bracket, and this semi-circular bracket is configured to receive circular synthetic jets emitter 12 wherein.Circuit driver 18 can be positioned at outside or be attached to mounting bracket 14.In other words, circuit driver 18 far can be located apart from synthetic jets emitter assemblies 10.
Now together with reference to Fig. 1 and 2, and as shown therein, the housing 16 of synthetic jets emitter 12 limits and is partly encapsulated in the inner chamber or cave 20 wherein with gas or fluid 22.Although housing 16 and inner chamber 20 can take in fact any geometrical construction according to various embodiments of the present invention, but for the object discussed and understand, with cross section, housing 16 shows that they maintain isolated relation by therebetween spacer element 28 in order to comprise the first plate 24 and the second plate 26 (being alternatively called blade or paillon foil) in fig. 2.In one embodiment, spacer element 28, at the first and second plates 24, maintains the interval of about 1mm between 26.One or more aperture 30 is formed between the first and second plates 24,26 and the sidewall of spacer element 28, to make inner chamber 20 fluidly be communicated with the external environment condition 32 of surrounding.In an alternative embodiment, spacer element 28 comprises front surface (not shown), is formed with one or more aperture 30 in this front surface.
According to multiple embodiment, the first and second plates 24,26 can be formed by metal, plastics, glass and/or pottery.Similarly, spacer element 28 can be formed by metal, plastics, glass and/or pottery.Suitable metal comprises such as nickel, aluminium, the material of copper and molybdenum, or such as stainless steel, brass, the alloy of bronze etc.Suitable polymer and plastics comprise thermoplastic, such as polyolefin, Merlon, thermosets, epoxy resin, urethanes, acrylic resin, silicone, polyimides and have the material of photoresist ability, and other resilient plastic.Suitable pottery comprises such as titanate (such as lanthanium titanate, bismuth titanates and lead zirconate titanate) and molybdate.In addition, other components various of synthetic jets emitter 12 also can be formed by metal.
According to example embodiment, actuator 34,36 are attached to the first and second plates 24,26 respectively, and to form the first and second composite constructions or flexible membrane 38,40, they are controlled by controller assemblies or control unit system 42 by driver 18.Therefore, synthetic jets emitter 12 is configured to DCJ.In order to control diaphragm 38,40, each flexible membrane 38,40 can be equipped with metal level, and metal electrode is configurable near metal level, so that diaphragm 38,40 moves by the electrical bias (electricalbias) forced between electrode and metal level.As shown in Figure 1, in one embodiment, controller assemblies 42 is connected to driver 18 electronically, and driver 18 is directly connected in the mounting bracket 14 of synthetic jets emitter 12.In an alternative embodiment, control unit system 42 is integrated in driver 18, and driver 18 far is located apart from synthetic jets emitter 12.And control system 42 can be constructed by any suitable device such as computer, logic processor or signal generator to generate electrical bias.
In one embodiment, actuator 34,36 is piezoelectric power formula (piezoelectric power) devices, and it activated by applying harmonic wave alternating voltage, and this harmonic wave alternating voltage causes piezoelectric power device expand rapidly and shrink.During operation, electric charge is sent to piezo-activator 34,36 by driver 18 by control system 42, piezo-activator 34, the mechanical stress of the described electric charge of 36 experience response and/or strain.The stress/strain of piezoelectric power actuator 34,36 causes the deflection of the first and second plates 24,26 respectively, makes to realize time harmonic or periodic motion, and this changes at plate 24, the volume of the inner chamber 20 between 26.According to an embodiment, spacer element 28 can also be fabricated to flexible and distortion with the volume changing inner chamber 20.The volume of the gained in inner chamber 20 changes the exchange of gas or other fluids caused between inner chamber 20 and external volume 32, as the detailed description with reference to figure 3 and 4.
According to various embodiments of the present invention, piezoelectric power actuator 34,36 can be monocrystalline (monomorph) or twin crystal (bimorph) device.In monocrystalline embodiment, piezoelectric power actuator 34,36 can be connected to the plate 24,26 formed by the material comprising metal, plastics, glass or pottery.In twin crystal embodiment, one or two piezoelectric power actuator 34,36 can be the bimorph actuators being connected to the plate 24,26 formed by piezoelectric.In an alternative embodiment, twin crystal can comprise single actuator 34,36, and plate 24,26 is second actuators.
The component of synthetic jets emitter 12 can be bonded together or otherwise utilize adhesive, solder etc. to attach to each other.In one embodiment, using thermosetting adhesive or electrically conductive adhesive, with by actuator 34,36 are attached to the first and second plates 24,26, to form the first and second composite constructions 38,40.When electrically conductive adhesive, it is such as silver-colored, golden etc. that adhesive can be filled with conductive filling, wire (not shown) is attached to synthetic jets emitter 12.Suitable adhesive can have the hardness in the scope of the Xiao A hardness (ShoreAhardness) of 100 or less, and can comprise such as silicone, polyurethanes, thermoplastic elastomer etc., makes to realize 120 degree or larger operating temperature.
In an embodiment of the present invention, actuator 34,36 can comprise the device except piezoelectric power device, such as hydraulic pressure, pneumatic, magnetic, electrostatic and thermoplastic material.Therefore, in this kind of embodiment, control system 42 is configured to trigger corresponding actuator 34,36 in a corresponding way.Such as, if use electrostatic material, so control system 42 can be configured to actuator 34, and 36 electrostatic potentials providing quick alternation, to trigger and to bend the first and second plates 24,26 respectively.
The operation of synthetic jets emitter 12 is described with reference to figure 3 and 4.First with reference to figure 3, be shown in actuator 34,36 controlled to cause the first and second plates 24,26 as shown in arrow 44ly outwards mobile relative to inner chamber 20 time synthetic jets emitter 12.When the first and second plates 24,26 are bent outwardly, the internal capacity of inner chamber 20 increases, and surrounding fluid or gas 46 pour in inner chamber 20 as shown in this group arrow 48.Actuator 34,36 are controlled by control system 42, and therefore when the first and second plates 24,26 outwards move from inner chamber 20, eddy current removes from the edge in aperture 30, and not affected by the just surrounding fluid 46 be pumped in inner chamber 20.Meanwhile, the injection of surrounding fluid 46 is synthesized by eddy current, and this turbine forms strong the entrainmenting of the surrounding fluid 46 from the large distance suction apart from aperture 30.
Fig. 4 describes at actuator 34, and 36 are controlled to the synthetic jets emitter 12 when impelling the first and second plates 24,26 to flex inward in inner chamber 20 as shown in arrow 50ly.The internal capacity of inner chamber 20 reduces, and fluid 22 is discharged along by this group arrow 52 indicated direction towards device 54 (such as light emitting diode) to be cooled by aperture 30 by as cooling injection.When fluid 22 leaves inner chamber 20 by aperture 30, flow and be separated and formation vortex sheet at the sharp edges place in aperture 30, vortex sheet is rolled into eddy current and starts to move away from aperture 30 border land.
Although the synthetic jets emitter in Fig. 1-4 is shown for and is described as having single aperture wherein, also can imagine, embodiments of the invention can comprise porous mouth synthesis jet actuator.In addition, although the synthesis jet actuator as Fig. 1-4 shows for and is described as having the actuator component being included in the first and second plates on each, but also can imagine, embodiments of the invention only can comprise the single actuator component be arranged on of these plates.In addition, also can imagine, synthetic jets emitter plate can with circular, rectangle, or the structure alternatively formalized, but not illustrative square structure in this article.
According to embodiments of the invention, provide synthetic jets mapper arrangement, it comprises plate or blade, and this plate or blade partly or are integrally formed by nonmetallic materials, and is therefore after this commonly referred to as " non-metal board ".Plate can be formed by any amount of suitable nonmetallic materials, and these materials can be selected and process to arrange rigidity, and therefore adjusts the resonant frequency of synthetic jets emitter.By selecting the concrete nonmetallic materials partly or integrally forming plate, plate can be made as to be had much lower resonant frequency thus has less noise, and has the quality of reduction, and this can provide lower vibration.
According to embodiments of the invention, the nonmetallic materials partly or integrally forming plate can be multiple applicable nonmetallic materials, such as (but being not limited to): thermoplastic or thermosetting plastics, it is in polyethylene, polypropylene, polystyrene, the form of polyvinyl chloride, with polytetrafluoroethylene (PTFE) (PTFE), PETG (PET), polyethylene (PE), high density polyethylene (HDPE) (HDPE), polyvinyl chloride (PVC), polyvinylidene chloride (PVDC) low density polyethylene (LDPE) (LDPE), polypropylene (PP) polystyrene (PS), high impact polystyrene (HIPS) polyamide (PA) acronitrile-butadiene-styrene (ABS) Merlon (PC), polycarbonate/acrylonitrile butadiene styrene (PC/ABS) polyurethanes (PU), epoxy resin and their combination, comprise various thermoplastic, the combination of thermosets and filler.Filling plastics filler can comprise electrical conduction with insulation filler, such as Argent grain, pottery, glass etc.Formed plate time, can common practice be used, such as casting or injection-molded.
In some embodiments of the invention, metal coating is applied to the plate formed by nonmetallic materials.In other embodiments of the invention, plate can be made into (by using filler) of abundant electrical conductivity, so that metal coating is optional.
With reference to figure 5, show according to an embodiment of the invention for making the assembling process of non-metal board 60 (with synthetic jets emitter 12).In the first step of process, provide material or the substrate 60 of nonmetal and electric insulation, such as, by any one substrate formed in above-mentioned thermoplasticity or thermosets.In the next step, non metallic substrate 62 is immersed in catalyst (such as palladium catalyst), as indicated in 64, to trigger the surface/back side protection for plate.Then in the next step by the metal material (such as copper or nickel) of electroless plating application electrical conductivity, as pointed out at 66 places, to form the final structure of non-metal board 60.At plating, utilize conductive epoxy resin (such as Ag epoxy resin) so that piezoelectric power actuator 34,36 is affixed to plate 60.Finally, cable 68, such as electric wire or flexible circuit material, be attached to piezoelectric power actuator 34,36 and plate 60.Then adhesive, such as silicon, can be used for two of synthetic jets emitter plates 60 to link together, wherein silicon forms spacer element 28 between two plates of formed synthetic jets emitter 12.
About the process illustrating in Figure 5 and describe, replace the process of electroless plating, such as evaporation or sputtering technology, can be used for plated metal.If expect thicker metal, then can and then electroplate.Ti, Cr, TiW, Cu, Ni, Au, Al without electrolytic copper or nickel, sputtering or evaporation that typical metallization scheme can comprise that palladium triggers, after and then carry out thicker copper or the plating of nickel, it is covered with thin Au layer (if needing anti-oxidation).Sputtering or evaporation are processed usually by from the deposition of Ti, Cr or TiW, to impel metal adhesion.If needed, then web plate or common lithographic plate pattern and etching step is utilized to form pattern to finished metal.In another embodiment, plate can be cast by polymeric piezoelectric material, metallization and polarization on both sides, with shape all-in-one-piece actuator plate.
With reference now to Fig. 6, show according to an embodiment of the invention another embodiment of (multiple) non-metal board 70 (with the assembling process for making synthetic jets emitter 12).Non-metal board 70 in Fig. 6 is formed as thin one-sided laminated of the glass reinforced epoxy resin of copper (such as, FR4PCB blank) that covers and is after this alternatively called and covers copper PCB blank.In the making of synthetic jets emitter 12, provide and cover copper PCB blank 70, and then conductive epoxy resin (such as Ag epoxy resin) and piezo-activator 34,36 are applied to it subsequently, its epoxy resin by piezo-activator 34,36 copper coatings being affixed to non-metal board 70.Then cable 68, such as be coated with the wire rod of urethanes, be attached to piezoelectric element and cover copper PCB blank 70 (such as, welding, conductive epoxy resin bonding or mechanically attachment), the adhesive such as silicon 28 wherein applied along the periphery of plate 70 is for linking two of synthetic jets emitter 12 plates, plate 70 is sealed by silicon 28, also leaves perforate or aperture wherein simultaneously.
In other embodiments of the invention, the non-metal board of synthetic jets emitter 12 can be by
or another suitable dielectric material is formed.Kapton plate provides in the figure 7 for the formation of an embodiment of non-metal board, which illustrates the assembling process for making (multiple) plate.As shown in the assembling process of Fig. 7, for each non-metal board, first provide exposed Kapton plate 72, then conductive wire 74 is formed on its top surface 76 with the form sputtering wire, Kapton connector, electric wire or conductive epoxy resin.In next step in assembling process, piezo-activator 34,36 are placed on each Kapton plate 72, to be electrically coupled to conductive wire 74.Finally, provide electrical connection 68 for being connected to piezo-activator 34,36 and conductive wire 68.Adhesive, such as silicon, then can be used for two of synthetic jets emitter plates to link together, wherein silicon forms spacer element between two plates of synthetic jets emitter.
In another embodiment utilizing Kapton plate, and as shown in the assembling process of Fig. 8, provide non-metal board 78, they are configured to Kapton circuit separately, wherein thicker Kapton layer is provided with internal wiring 80 wherein, and this internal wiring 80 can be connected to piezo-activator 34,36.Internal wiring 80 can be covered by Kapton completely, and at piezo-activator 34,36 and wire contact expose partly (connection for cable 68), or can to expose completely.
With reference now to Fig. 9 and 10, in additional embodiment of the present invention, the non-metal board of synthetic jets emitter is manufactured by single-piece nonmetallic materials, its in the doubling of bridge part office to form a pair plate.First with reference to the assembling process of figure 9, to flap by first providing single-piece nonmetallic materials (such as Kapton) 82 to make, its in bridging part 84 place's doubling to limit a pair plate portion 86,88.As shown in Figure 9, bridging part 84 is formed as thin material strips, and it is along plate 86, the intermediate width of 88.But it should be understood that bridging part 84 is alternately formed as along plate 86, the whole width of 88 extends, but be configured to provide it to fold, to limit the first and second plates 86,88 separately substantially.According to example embodiment, comprise to flap 82 internal electrical be formed in wherein and connect or wire, they are capped and expose partly at piezo-activator and wire contact place.
In the embodiment in fig. 9, internal wiring is included in two piezo-activators 34, along the continuous print wire 90 extended between 36, these two piezo-activators are positioned at corresponding plate 86, piezo-activator 34 is connected on 88, each in 36, makes the quantity of the inner lead formed in flap reduce.The quantity being provided for the electrical connection 68 being connected to synthetic jets emitter also reduces, 68 only need for two piezo-activators 34 because connect, each and the continuous print conductive wire 90-that extends for crossing over bridging part 84 in 36 always have three electrical connections 68 for synthetic jets emitter.
At Fig. 9 to (and continuous print wire show wherein extend for crossing over bridging part) in the alternative of flap, Figure 10 display has discontinuous wire by bridging part to flap 82, makes the wire 92 that restriction two separates.Wire 92 is separately connected to and is positioned at corresponding plate 86, two piezo-activators 34,36 on 88, is wherein electrically connected 68 and is provided for being connected to two piezo-activators 34,36 and for conductive wire 92.Therefore, in the embodiment in figure 10, four electrical connections 68 altogether to synthesis injector are provided.
With reference now to Figure 11, show another embodiment of the non-metal board 94 (with the assembling process made for it) according to the embodiment of the present invention.Plate 94 is provided as and is formed by nonmetal, non-conducting material, such as Kapton.Each plate 94 is provided as the metal hole 96 having and be formed in wherein, and metal hole 96 is orientated as to be positioned to be placed to the corresponding piezo-activator 34 on plate 94, under 36, as the front and rear surface 98 of plate in fig. 11, shown on 100.This hole 96 available metal insert or conductive epoxy resin are filled, with formed be opposite to respective plate 94 front surface 98 on the electrical connection of rear side of piezo-activator 34,36.The signal of telecommunication to be taken to the position that electric wire or flexible circuit wire 68 can be attached to synthetic jets emitter 12 on the rear surface 100 that electric flexible circuit or sputtered lines contact 102 are formed in plate 94.
Advantageously, therefore The embodiment provides a kind of synthetic jets emitter assemblies, it comprises non-metal board, to reduce the level of acoustic noise in the operating process of synthetic jets emitter.Non-metal board is made as has the rigidity lower than metallic plate, to provide lower resonant frequency, this generates less noise, and plate also has the quality of minimizing, and this provides lower vibration in operation.Non-metal board can be formed by the material of cheapness, makes the reduction compared with metallic plate of its cost.
Therefore, according to one embodiment of present invention, synthetic jets mapper arrangement comprises: the first plate; Second plate, itself and the first plate are spaced apart; Spacer element, it is attached to the first and second plates and to form chamber between them, and comprises aperture wherein; And actuator component, it is attached at least one in the first or second plate, and optionally to cause it to deflect, wherein, the first and second plates are formed by nonmetallic materials at least in part.
According to a further aspect in the invention, a kind of method making synthetic jets mapper arrangement comprises and constructs the first plate and the second plate by nonmetallic materials at least in part, at least one being attached to by actuator component in the first and second plates deflects optionally to cause it, locate the first plate with by means of spacer member relative to the second plate, the first plate is affixed to the second plate to form chamber and to comprise aperture wherein with isolated layout by this spacer member.The method also comprises corresponding one that electrical connection to be attached in the first and second plates that actuator component and this actuator component be attached to, to make it possible to voltage to be optionally applied to actuator component.
According to another aspect of the invention, synthetic jets mapper arrangement comprises: the first plate; Second plate, itself and the first plate are spaced apart to form chamber; And actuator component, its at least one being attached in the first or second plate connects optionally to cause it to deflect, to change the volume in chamber.Each in first and second plates comprises the first material and the second material, this first material comprises electric insulation, nonmetallic materials, this second material comprises electric conduction material, this second material be formed as packing material, metal layer and on the first material or in the wire internally or externally formed that provides.
Although the embodiment having combined only limited quantity describe in detail the present invention, should be easily understood that, the present invention is not limited thereto kind of a disclosed embodiment.On the contrary, the present invention can retrofit to comprise and not describe before this but the distortion of any amount matched with the spirit and scope of the present invention, improvement, displacement or equivalent arrangements.In addition, although described various embodiment of the present invention, it should be understood that aspect of the present invention can comprise in described embodiment more only.Therefore, the present invention should not regard as and be limited by description above, but only has the scope of claims to limit.
Claims (22)
1. a synthetic jets mapper arrangement, it comprises:
First plate;
Second plate, itself and the first plate are spaced apart;
Spacer member, it is connected in the first and second plates and to form chamber between them, and comprises aperture wherein; With
Actuator component, it is connected at least one in the first or second plate, deflects optionally to cause it;
Wherein, the first and second plates are formed by nonmetallic materials at least in part.
2. synthetic jets mapper arrangement according to claim 1, wherein, these nonmetallic materials comprise electrically non-conductive material.
3. synthesis injection device according to claim 2, wherein, these nonmetallic materials comprise at least one in thermoplastic, thermosetting plastics and packing material.
4. synthetic jets mapper arrangement according to claim 2, wherein, each in first and second plates comprises electrical conductivity metal material, this electrical conductivity metal material comprise following in one: packing material, metal layer and the wire internally or externally formed.
5. synthetic jets mapper arrangement according to claim 4, wherein, each in the first and second plates comprises:
Electrically non-conductive, nonmetallic substrate; With
The metal layer of electrical conductivity, it is applied in this electrically non-conductive, nonmetallic substrate.
6. synthetic jets mapper arrangement according to claim 4, wherein, each in the first and second plates comprises copper facing printed circuit board (PCB) (PCB) blank.
7. synthetic jets mapper arrangement according to claim 4, wherein, each in the first and second plates comprises:
Flexible dielectric layer; With
The wire of electrical conductivity, on its outer surface being formed in this flexible dielectric layer or be internally formed in this flexible dielectric layer.
8. synthetic jets mapper arrangement according to claim 1, wherein, the first and second plates comprise single-piece nonmetallic materials, and these single-piece nonmetallic materials are folded to form the first and second plates along its bridge part.
9. synthetic jets mapper arrangement according to claim 8, wherein, continuous print electrical conductivity wire is internally formed in these single-piece nonmetallic materials, and extends through this bridge part and extend to the actuator component on corresponding first and second plates.
10. synthetic jets mapper arrangement according to claim 8, wherein, discontinuous electrical conductivity wire is internally formed in these single-piece nonmetallic materials, and extends through this bridge part and extend to the actuator component on the first and second plates.
11. 1 kinds of methods making synthetic jets mapper arrangement, it comprises:
The first plate and the second plate is constructed at least in part by nonmetallic materials;
Actuator component is attached at least one in the first and second plates, deflects optionally to cause it;
Locate the first plate by means of spacer member relative to the second plate, the first plate is affixed to the second plate to form chamber with isolated layout by this spacer member, and comprises aperture wherein; With
Electrical connection to be attached to attached by actuator component and this actuator component corresponding in the first and second plates extremely, to make it possible to voltage to be optionally applied to this actuator component.
12. methods according to claim 11, wherein, construct in the first plate and the second plate each comprise the material component of selection first and second plate, the rigidity of the first and second plates to be set to the amount of expectation, the resonant frequency of synthetic jets mapper arrangement is adjusted to aspiration level.
13. methods according to claim 11, wherein, each constructing in the first plate and the second plate comprises:
Electrically non-conductive, nonmetallic substrate are provided; With
The metal layer of electrical conductivity is applied in this electrically non-conductive, nonmetallic substrate.
14. methods according to claim 11, wherein, construct in the first plate and the second plate each comprise copper facing printed circuit board (PCB) (PCB) blank be provided.
15. methods according to claim 11, wherein, construct in the first plate and the second plate each comprise and be provided in the electrically non-conductive being wherein mixed with electrical conductivity packing material, nonmetallic material.
16. methods according to claim 11, wherein, construct in the first plate and the second plate each comprise flexible dielectric layer be provided, this flexible dielectric layer comprises and is formed on this flexible dielectric layer outer surface or the electrical conductivity wire be internally formed in this flexible dielectric layer, and this electrical conductivity wire provides actuator component and electrically connecting its electrical connection.
17. methods according to claim 11, wherein, construct the first plate and the second plate comprises:
There is provided single-piece electrically non-conductive, nonmetallic material, it comprises the first plate portion, the second plate portion and bridging part; With
This single-piece electrically non-conductive, nonmetallic material is folded, to make this first plate portion directed with the layout substantially parallel with this second plate portion, to form the first plate and the second plate in this bridge part office;
Wherein, this single-piece electrically non-conductive, nonmetallic material comprise one in the wire be internally formed in wherein, and this wire extends through this bridging part and extends to the actuator component at least one in the first and second plates.
18. methods according to claim 17, wherein, the wire be internally formed in this single-piece electrically non-conductive, nonmetallic material comprises the one in continuous conductors and discontinuous wire.
19. 1 kinds of synthetic jets mapper arrangement, it comprises:
First plate;
Second plate, itself and this first plate is spaced apart to form chamber; With
Actuator component, it is connected at least one in the first or second plate, optionally to cause it to deflect, to change the volume in chamber;
Wherein, each in the first and second plates comprises:
First material, it comprises electric insulation, nonmetallic material; With
Second material, it comprises electric conduction material, this second material be formed as following in one: packing material, metal layer and on the first material or in the wire internally or externally formed that provides.
20. synthetic jets mapper arrangement according to claim 19, also comprise spacer member, this spacer member is attached to the first and second plates and between them, so that the first and second plates are maintained in isolated relation, wherein, first plate, the second plate and spacer member form chamber jointly, and wherein, this spacer member comprises aperture wherein.
21. synthetic jets mapper arrangement according to claim 19, wherein, the first and second plates comprise the folded plate construction formed by single-piece electrically non-conductive, nonmetallic material, and this folded plate construction comprises:
First plate portion;
Second plate portion;
Bridging part, this first plate portion is connected to this second plate portion by it; With
Wire, it is internally formed in the plate structure of doubling, this wire extend through bridging part and extend in the first and second plates this at least one on actuator component;
Wherein, this folded plate construction folds in this bridge part office, to make the first plate portion directed with the layout substantially parallel with the second plate portion, to form the first plate and the second plate.
22. according to the synthetic jets mapper arrangement shown in claim 19, wherein, the rigidity of the first and second plates is set to scheduled volume, the resonant frequency of synthetic jets mapper arrangement is arranged on aspiration level place by the component of the first and second materials in each in the first plate and the second plate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361787738P | 2013-03-15 | 2013-03-15 | |
| US61/787738 | 2013-03-15 | ||
| PCT/US2014/024526 WO2014150915A1 (en) | 2013-03-15 | 2014-03-12 | Synthetic jet with non-metallic blade structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105307776A true CN105307776A (en) | 2016-02-03 |
| CN105307776B CN105307776B (en) | 2019-07-16 |
Family
ID=51527764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480016250.2A Expired - Fee Related CN105307776B (en) | 2013-03-15 | 2014-03-12 | Synthesize injector device and preparation method thereof |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20140271277A1 (en) |
| EP (1) | EP2969229B1 (en) |
| JP (1) | JP6412097B2 (en) |
| KR (1) | KR20150128981A (en) |
| CN (1) | CN105307776B (en) |
| TW (1) | TWI626382B (en) |
| WO (1) | WO2014150915A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106253743A (en) * | 2016-10-05 | 2016-12-21 | 吉林大学 | Bionical Octopus underwater propulsion system based on flexible piezoelectric driver |
| CN114888090A (en) * | 2022-05-16 | 2022-08-12 | 湖北腾升科技股份有限公司 | High-hardness high-nickel-chromium-molybdenum composite roll structure |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9891677B2 (en) * | 2014-09-11 | 2018-02-13 | Dell Products L.P. | Skin based system cooling using internal system fan |
| US9743551B2 (en) * | 2014-09-29 | 2017-08-22 | Ice Computer, Inc. | Thermal piezoelectric apparatus |
| KR101624717B1 (en) * | 2014-12-24 | 2016-05-26 | 주식회사 토비스 | a delay etched member and a etching method of display panel using the same |
| US9765767B2 (en) * | 2015-05-11 | 2017-09-19 | The Boeing Company | Synthetic vacuum generator |
| US9559037B2 (en) * | 2015-06-02 | 2017-01-31 | Intel Corporation | Package integrated synthetic jet device |
| CN108393199A (en) * | 2018-04-27 | 2018-08-14 | 清华大学 | Combining jet device |
| KR20220116042A (en) * | 2019-12-29 | 2022-08-19 | 액타시스 인코포레이티드 | Novel Design and Manufacturing Technology for Synthetic Jet Actuators |
| JP2024015459A (en) * | 2020-12-09 | 2024-02-02 | ソニーグループ株式会社 | Diaphragm pumps, electronic equipment, manufacturing equipment and manufacturing methods |
| KR102500363B1 (en) | 2021-03-09 | 2023-02-15 | 주식회사 아벡스 | Cleaning apparatus for inner-surface of artillery |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5155409A (en) * | 1991-07-11 | 1992-10-13 | Caterpillar Inc. | Integral conductor for a piezoelectric actuator |
| US5156772A (en) * | 1988-05-11 | 1992-10-20 | Ariel Electronics, Inc. | Circuit writer materials |
| US5889354A (en) * | 1994-08-29 | 1999-03-30 | Oceaneering International Inc. | Piezoelectric unit cell |
| US20080006393A1 (en) * | 2006-06-22 | 2008-01-10 | Nuventix Inc. | Vibration isolation system for synthetic jet devices |
| US20080174620A1 (en) * | 2006-10-03 | 2008-07-24 | Adaptivenergy, Llc. | Synthetic jets |
| US20100044459A1 (en) * | 2008-08-25 | 2010-02-25 | United States of America as represented by the Administrator of the National Aeronautics and | Advanced High Performance Vertical Hybrid Synthetic Jet Actuator |
| US20100054973A1 (en) * | 2008-08-26 | 2010-03-04 | Mehmet Arik | Method and apparatus for reducing acoustic noise in a synthetic jet |
| US20100051721A1 (en) * | 2008-08-26 | 2010-03-04 | Mehmet Arik | System and method for mounting synthetic jets |
| CN102459900A (en) * | 2009-06-03 | 2012-05-16 | 技术合伙公司 | Fluid disc pump |
| US20120170216A1 (en) * | 2011-01-04 | 2012-07-05 | General Electric Company | Synthetic jet packaging |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6722581B2 (en) * | 2001-10-24 | 2004-04-20 | General Electric Company | Synthetic jet actuators |
| US6869275B2 (en) * | 2002-02-14 | 2005-03-22 | Philip Morris Usa Inc. | Piezoelectrically driven fluids pump and piezoelectric fluid valve |
| US20060196638A1 (en) * | 2004-07-07 | 2006-09-07 | Georgia Tech Research Corporation | System and method for thermal management using distributed synthetic jet actuators |
| KR100707211B1 (en) * | 2006-02-03 | 2007-04-13 | 삼성전자주식회사 | Synthetic jet actuator |
| TWI342364B (en) * | 2007-06-29 | 2011-05-21 | Univ Nat Taiwan | Jets device |
| US8235309B2 (en) * | 2008-08-25 | 2012-08-07 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Advanced high performance horizontal piezoelectric hybrid synthetic jet actuator |
| US8006917B2 (en) * | 2008-08-26 | 2011-08-30 | General Electric Company | Method and apparatus for reducing acoustic noise in a synthetic jet |
| US8821134B2 (en) * | 2009-06-03 | 2014-09-02 | The Technology Partnership Plc | Fluid disc pump |
| US8820658B2 (en) * | 2010-12-06 | 2014-09-02 | Lockheed Martin Corporation | Heat resistant piezo bimorph synthetic jet apparatus |
| US8841820B2 (en) * | 2011-07-21 | 2014-09-23 | Lockheed Martin Corporation | Synthetic jet apparatus |
| CN105026049B (en) * | 2013-03-14 | 2017-10-17 | 通用电气公司 | Hyporesonance synthesizes emitter construction |
-
2014
- 2014-03-12 CN CN201480016250.2A patent/CN105307776B/en not_active Expired - Fee Related
- 2014-03-12 US US14/206,376 patent/US20140271277A1/en not_active Abandoned
- 2014-03-12 WO PCT/US2014/024526 patent/WO2014150915A1/en active Application Filing
- 2014-03-12 KR KR1020157028945A patent/KR20150128981A/en not_active Application Discontinuation
- 2014-03-12 JP JP2016501565A patent/JP6412097B2/en not_active Expired - Fee Related
- 2014-03-12 EP EP14767694.4A patent/EP2969229B1/en active Active
- 2014-03-14 TW TW103109235A patent/TWI626382B/en not_active IP Right Cessation
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5156772A (en) * | 1988-05-11 | 1992-10-20 | Ariel Electronics, Inc. | Circuit writer materials |
| US5155409A (en) * | 1991-07-11 | 1992-10-13 | Caterpillar Inc. | Integral conductor for a piezoelectric actuator |
| US5889354A (en) * | 1994-08-29 | 1999-03-30 | Oceaneering International Inc. | Piezoelectric unit cell |
| US20080006393A1 (en) * | 2006-06-22 | 2008-01-10 | Nuventix Inc. | Vibration isolation system for synthetic jet devices |
| US20080174620A1 (en) * | 2006-10-03 | 2008-07-24 | Adaptivenergy, Llc. | Synthetic jets |
| US20100044459A1 (en) * | 2008-08-25 | 2010-02-25 | United States of America as represented by the Administrator of the National Aeronautics and | Advanced High Performance Vertical Hybrid Synthetic Jet Actuator |
| US20100054973A1 (en) * | 2008-08-26 | 2010-03-04 | Mehmet Arik | Method and apparatus for reducing acoustic noise in a synthetic jet |
| US20100051721A1 (en) * | 2008-08-26 | 2010-03-04 | Mehmet Arik | System and method for mounting synthetic jets |
| CN102459900A (en) * | 2009-06-03 | 2012-05-16 | 技术合伙公司 | Fluid disc pump |
| US20120170216A1 (en) * | 2011-01-04 | 2012-07-05 | General Electric Company | Synthetic jet packaging |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106253743A (en) * | 2016-10-05 | 2016-12-21 | 吉林大学 | Bionical Octopus underwater propulsion system based on flexible piezoelectric driver |
| CN106253743B (en) * | 2016-10-05 | 2018-04-03 | 吉林大学 | Bionical octopus underwater propulsion system based on flexible piezoelectric driver |
| CN114888090A (en) * | 2022-05-16 | 2022-08-12 | 湖北腾升科技股份有限公司 | High-hardness high-nickel-chromium-molybdenum composite roll structure |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2969229B1 (en) | 2019-05-08 |
| EP2969229A4 (en) | 2016-11-09 |
| KR20150128981A (en) | 2015-11-18 |
| US20140271277A1 (en) | 2014-09-18 |
| TW201447114A (en) | 2014-12-16 |
| JP2016514050A (en) | 2016-05-19 |
| CN105307776B (en) | 2019-07-16 |
| TWI626382B (en) | 2018-06-11 |
| EP2969229A1 (en) | 2016-01-20 |
| JP6412097B2 (en) | 2018-10-24 |
| WO2014150915A1 (en) | 2014-09-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105307776A (en) | Synthetic jet with non-metallic blade structure | |
| USRE46003E1 (en) | Method and apparatus for reducing acoustic noise in a synthetic jet | |
| US8752775B2 (en) | Method and apparatus for reducing acoustic noise in a synthetic jet | |
| EP2698538B1 (en) | Multi-function synthetic jet and method of manufacturing same | |
| US9415413B2 (en) | Synthetic jet suspension structure | |
| US20120292401A1 (en) | Power Delivery to Diaphragms | |
| JP6348566B2 (en) | Low resonance synthetic jet structure | |
| US11952994B2 (en) | Piezoelectric pump housing and terminal arrangement | |
| US10130968B2 (en) | Low resonance acoustic synthetic jet structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190716 Termination date: 20210312 |