CN105307378A - Manufacturing method of substrate structure, substrate structure and metal component - Google Patents
Manufacturing method of substrate structure, substrate structure and metal component Download PDFInfo
- Publication number
- CN105307378A CN105307378A CN201410344661.6A CN201410344661A CN105307378A CN 105307378 A CN105307378 A CN 105307378A CN 201410344661 A CN201410344661 A CN 201410344661A CN 105307378 A CN105307378 A CN 105307378A
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- metallic substrates
- substrate
- protective layer
- metal
- board structure
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Abstract
The invention provides a manufacturing method of a substrate structure, the substrate structure and a metal component. The manufacturing method of the substrate structure comprises the following steps: carrying out a chemical surface treatment on a metal substrate to form a protection layer on a surface of the metal substrate; assembling the metal substrate on a substrate; and forming a metal pattern on the substrate, wherein the metal pattern and the metal substrate are mutually separated. The invention further provides the substrate structure and the metal component. According to the manufacturing method of the substrate structure, the substrate structure and the metal component provided by the invention, the manufacturing method is simple, the waste of a chemical plating solution can be reduced, and the problem of cosmetic defects caused by an additional metal layer is avoided.
Description
Technical field
The present invention relates to a kind of manufacture method of board structure, board structure and hardware, and in particular to a kind of manufacture method, board structure and the hardware with the board structure of protective layer.
Background technology
For circuit board and antenna applications (antennaapplication), the plating of special metal chemistry is conventional to form metal pattern on plastic substrate.But, plastic substrate itself along with being provided with other hardware (metalcomponent), such as, is often metal nut (metalnut) or metal insert (metalinsert) etc.These hardwares have active metal surface (activemetalsurface); therefore in the plating process making metal pattern; often have the situation of hardware adhering to additional metal levels to occur, cause the increase of chemical plating cost and the risk of short circuit.For example, on the helicoid of metal nut, have additional metal levels, by other component installaiton to metal nut time, the metal level that chemical plating gets on can be squeezed and drop, and then as short circuit.And, when unscheduled region also being formed metal pattern, will the consumption of chemical plating fluid be caused to increase, but also the problem having bad order produce.
Current existing certain methods is used to trial and solves the problem, and such as, applies to repel metal ion on positive charge to hardware by electrode, and then prevents unnecessary chemical plating to occur.But along with the applying of additional charge, chemical plating bath (platingbath) will become unstable and too increase the risk plating out (platingout).In addition, above-mentioned anti-electroplating method also needs to use expensive tool just can carry out.Therefore, convenient anti-electroplating method economic again, becomes the target that those skilled in the art desire most ardently development.
Therefore, need to provide a kind of manufacture method of board structure, board structure and hardware to solve the problems referred to above.
Summary of the invention
The invention provides the manufacture method of a kind of hardware, board structure and board structure, wherein by being formed on the surface of metallic substrates by protective layer, to reach anti-plated function.
The manufacture method of a kind of board structure of the present invention comprises: carry out a chemical surface treatment to form a protective layer on the surface of this metallic substrates to a metallic substrates; This metallic substrates is assembled on a substrate; And form a metal pattern on the substrate, this metal pattern and this metallic substrates separated from one another.
In one embodiment of this invention, above-mentioned the method that metallic substrates carries out chemical surface treatment to be comprised: metallic substrates is dipped in a mercaptan compound (thiolcompound) solution.
In one embodiment of this invention, the above-mentioned method forming metal pattern on substrate comprises chemical plating (electrolessplating).
A kind of board structure of the present invention comprises: a substrate, a metal pattern, a metallic substrates and a protective layer; This metal pattern is arranged on this substrate; This metallic substrates is arranged on this substrate; This protective layer covers the surface of this metallic substrates, and this protective layer is bonded to the surface of this metallic substrates in the mode of chemical bond.
In one embodiment of this invention, the surface of the complete covering metal substrate of above-mentioned protective layer.
In one embodiment of this invention, be embedded in substrate in above-mentioned metallic substrates part, and protective layer is between metallic substrates and substrate.
In one embodiment of this invention, above-mentioned metallic substrates comprises a metal nut or a metal sheet (metalsheet).
In one embodiment of this invention, the material of above-mentioned metal pattern comprises copper, nickel, gold or above-mentioned combination in any.
In one embodiment of this invention, above-mentioned protective layer used alkylthio group, arylthio or aromatic alkylthio are bonded to the surface of this metallic substrates in the mode of chemical bond.
A kind of hardware of the present invention comprises: a metallic substrates and a protective layer; The part surface of this protective layer this metallic substrates at least coated, and this protective layer is bonded to this metallic substrates in the mode of chemical bond.
In one embodiment of this invention, the surface of the complete covering metal substrate of above-mentioned protective layer.
In one embodiment of this invention, above-mentioned protective layer used alkylthio group, arylthio or aromatic alkylthio are bonded to the surface of metallic substrates in the mode of chemical bond.
Based on above-mentioned, the manufacture method of board structure of the present invention forms protective layer on the metallic substrate by the method for soaking, and therefore manufacture method is simple.By the surface of protective layer covering metal substrate, during chemical plating, metal substrate surface can not form additional metal levels, therefore can reduce the waste of chemical plating fluid, and the bad order problem caused because of extra metal level.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate appended accompanying drawing to be described in detail below.
Accompanying drawing explanation
Fig. 1 is the making step flow chart of the board structure of one embodiment of the invention.
Fig. 2 to Fig. 6 is the Making programme schematic diagram of the board structure of Fig. 1.
Primary clustering symbol description:
S10 ~ S30 step
10 board structures
100,100a hardware
110,110a metallic substrates
120 mercaptan compound solution
130 protective layers
200 substrates
300 metal patterns
310 layers of copper
320 nickel dams
330 layer gold
A-A ' hatching line
Embodiment
Fig. 1 is the making step flow chart of the board structure of one embodiment of the invention.Fig. 2 to Fig. 6 is the Making programme schematic diagram of the board structure of Fig. 1.Fig. 4 is the generalized section of Fig. 3.Fig. 6 is the generalized section of Fig. 5.First, please refer to Fig. 1 and Fig. 2, carry out step S10, a chemical surface treatment is carried out to a metallic substrates 110.Above-mentioned chemical surface treatment is such as metallic substrates 110 be immersed in a mercaptan compound solution 120, to form a protective layer 130 on the surface of metallic substrates 110.
Metallic substrates 110 can be the metal insert for being arranged on substrate (being such as casing, circuit board etc.), and it can be locked instrument or other have the device of specific function.For example, metallic substrates 110 can be metal nut or metal sheet etc.Illustrating metal nut in Fig. 2 is that example illustrates, it has screw thread, is suitable for allowing screw admittedly lock in this.But the present invention is not as limit.The material of metallic substrates 110 is such as brass (brass) or nickel (nickel).
Mercaptan compound solution 120 is such as be dissolved among solvent by mercaptan compound being formed, but the present invention does not get rid of mercaptan compound solution 120 can also comprise other compositions.The mercaptan compound of the present embodiment has hydrophobicity backbone (backbone), and it is such as be selected from the group be made up of pungent certain herbaceous plants with big flowers mercaptan, octadecanethiol (Octadecanethiol), nonane mercaptan (Nonanethiol), 1-hexadecanethiol (1-Hexadecanethiol), 1-butane thiol (1-Butanethiol), three grades of nonyl mercaptan (tert-Nonylmercaptan), benzyl mercaptan (Benzylmercaptan) and thiophenols (Thiophenol).Solvent is such as the appropriate solvent of alcohol or the above-mentioned mercaptan compound of other solubilized.
For example, metallic substrates 110 can be immersed in pungent certain herbaceous plants with big flowers thiol solution 120 DEG C about 10 minutes, solution temperature is about 40 DEG C.Then, metallic substrates 110 taken out with after water rinse, at 70 DEG C after dry 20 minutes, protective layer 130, by the surface of covering metal substrate 110, forms a hardware 100 by this.Hardware 100 comprises metallic substrates 110 and is positioned at the protective layer 130 on metallic substrates 110 surface.Protective layer 130 can the surface of covering metal substrate 110 completely, or the part surface of only covering metal substrate 110.The present embodiment is that the method by soaking forms protective layer 130 in metallic substrates 110, does not therefore need to use extra tool also not need use resin-coated on the surface of metal substrate 110.
When metallic substrates 110 is immersed in mercaptan compound solution 120, the metallic atom on the surface with metallic substrates 110 produces and reacts by the mercaptan in mercaptan compound, and be bonded to the surface of metallic substrates 110 in the mode of chemical bond with the form of alkylthio group, arylthio or aromatic alkylthio, wherein sulphur atom is combined producing with metallic atom in the mode of chemical bond.That is, protective layer 130 is bonded to the surface of metallic substrates 110 in the mode of chemical bond.Thus, mercaptan compound can form a careful protective layer 130 on the surface of metallic substrates 110, protective layer 130 is for being electrically insulated and having hydrophobic property.Protective layer 130 has good chemical resistance (chemicalresistant) and thermal endurance (thermalresistant).The thickness of protective layer 130 is such as 0.1 to 5 nanometer (nm).Due to suitable thin of the thickness of protective layer 130; when metallic substrates 110 is metal nut; all the protective layer 130 on screw thread also not easily have influence on the size of screw thread, therefore follow-up when screw and nut are assembled, also not easily there is screw and the off size phenomenon of nut.In addition, protective layer 130 is electrically insulated, situation that chip drops that to be therefore just protective layer 130 occur in the process of locking, the phenomenon that also can not be short-circuited in an electronic.
Please refer to Fig. 1, Fig. 3 and Fig. 4, carry out step S20, hardware 100 (being namely configured with the metallic substrates 110 of protective layer 130) is assembled on a substrate 200.The material of substrate 200 is such as plastic cement.Bury in hardware 100 part in substrate 200 by hot melt (hotmeltingmethod) or by Inset ejection molding method (insertmoldmethod).Wherein, when being assembled by Inset ejection molding method, can reduce further hot melt issuable substrate 200 possibility of being out of shape increase the associativity of hardware and substrate.Substrate 200 exposes the part surface of hardware 100.Protective layer 130 is the surface of metallic substrates 110 that exposes of covered substrate 200 at least.In the present embodiment, protective layer 130 is such as the surface of complete covering metal substrate 110, and therefore protective layer 130 can, between substrate 200 and metallic substrates 110, make substrate 200 not contact with metallic substrates 110.But the present invention is not limited thereto.In other embodiments, protective layer 130 also only can the surface of metallic substrates 110 that exposes of covered substrate 200, and the metallic substrates 110 be embedded in therefore in substrate 200 such as contacts with substrate 200.In other words, in a previous step, metallic substrates 110 only can carry out chemical surface treatment for the surface exposed by substrate 200.As shown in Figure 3 and Figure 4; hardware 100 can be the metal nut being coated with protective layer 130; or substrate 200 also can be configured with hardware 100a, and it is such as using metal sheet as metallic substrates 110a, and the surface of metallic substrates 110a is coated with protective layer 130.
Then, please refer to Fig. 5 and Fig. 6, carry out step S30, substrate 200 is formed a metal pattern 300, metal pattern 300 is separated from one another with metallic substrates 110.Metal pattern 300 is such as antenna, contact (pad) or other electronic building bricks be made up of metal level.The material of metal pattern 300 comprises copper, nickel, gold, silver or above-mentioned combination in any.The method forming metal pattern 300 comprises chemical plating.In the present embodiment, on substrate 200, metal pattern is formed by chemical plating.The metal pattern 300 of the present embodiment is such as antenna, and it comprises plurality of conductive layers.First, can form layers of copper 310 on substrate 200, it has good conductivity.Then, layers of copper 310 forms nickel dam 320, it has good resistance to scraping.Then, nickel dam 320 forms layer gold 330, it can reduce the oxidation of nickel dam 320.But the present invention is not limited thereto.Metal pattern 300 also can be only include single conductive layer.
Specifically, substrate 200 can be dipped in chemical plating fluid and carry out electroless plating, to form metal pattern 300 at substrate 200.Now, because protective layer 130 covers on the surface of metal substrate 110, and metal pattern 300 can not be formed on protective layer 130, and therefore metal pattern 300 can not plate on the metallic substrate 110 and reach anti-plated function.In other words, metal pattern 300 only can be formed on the predetermined position formed, and can not be formed in metallic substrates 110.Thus, the consumption of chemical plating fluid can not be wasted, cost can be saved further, and avoid because additional metal levels causes apparent impact.Moreover the present embodiment is after first hardware 100 and substrate 200 being assembled, then carries out the technique of chemical gilding metal patterns 300.If when hardware 100 is smooth with the assembling process of substrate 200, failed product not yet electroplates upper metal, therefore can reduce the cost of manufacture of required burden when assembling unsuccessfully.
So far, can the making of roughly completing substrate structure 10.Referring again to Fig. 5 and Fig. 6, board structure 10 comprises substrate 200, metal pattern 300, metallic substrates 110 and a protective layer 130.Metal pattern 300 is arranged on substrate 200.Metallic substrates 110 is arranged on substrate 200.The surface of protective layer 130 covering metal substrate 110, and protective layer 130 is bonded to the surface of metallic substrates 110 in the mode of chemical bond.
In sum, the manufacture method of board structure of the present invention forms protective layer on the metallic substrate by the method for soaking, and do not need to use extra tool also not need extra coating resin, therefore manufacture method is simple.When forming metal pattern with electroless plating method; by the surface of protective layer covering metal substrate, metal substrate surface can not form extra metal level, therefore can the waste of minimizing plating solution; to save cost, and avoid because additional metal levels causes apparent impact.
Claims (12)
1. a manufacture method for board structure, the manufacture method of this board structure comprises:
One chemical surface treatment is carried out to form a protective layer on the surface of this metallic substrates to a metallic substrates;
This metallic substrates is assembled on a substrate; And
Form a metal pattern on the substrate, this metal pattern and this metallic substrates separated from one another.
2. the manufacture method of board structure as claimed in claim 1, wherein comprises the method that this metallic substrates carries out this chemical surface treatment:
This metallic substrates is dipped in a mercaptan compound solution.
3. the manufacture method of board structure as claimed in claim 1, the method wherein forming this metal pattern on the substrate comprises chemical plating.
4. a board structure, this board structure comprises:
One substrate;
One metal pattern, this metal pattern is arranged on this substrate;
One metallic substrates, this metallic substrates is arranged on this substrate; And
One protective layer, this protective layer covers the surface of this metallic substrates, and this protective layer is bonded to the surface of this metallic substrates in the mode of chemical bond.
5. board structure as claimed in claim 4, wherein this protective layer covers the surface of this metallic substrates completely.
6. board structure as claimed in claim 4, be wherein embedded in this substrate in this metallic substrates part, and this protective layer is between this metallic substrates and this substrate.
7. board structure as claimed in claim 4, wherein this metallic substrates comprises a metal nut or a metal sheet.
8. board structure as claimed in claim 4, wherein the material of this metal pattern comprises copper, nickel, gold or above-mentioned combination in any.
9. board structure as claimed in claim 4, wherein this protective layer used alkylthio group, arylthio or aromatic alkylthio are bonded to the surface of this metallic substrates in the mode of chemical bond.
10. a hardware, this hardware comprises:
One metallic substrates; And
One protective layer, the part surface of this protective layer this metallic substrates at least coated, and this protective layer is bonded to this metallic substrates in the mode of chemical bond.
11. hardwares as claimed in claim 10, wherein this protective layer covers the surface of this metallic substrates completely.
12. hardwares as claimed in claim 10, wherein this protective layer used alkylthio group, arylthio or aromatic alkylthio are bonded to the surface of this metallic substrates in the mode of chemical bond.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410344661.6A CN105307378B (en) | 2014-07-18 | 2014-07-18 | Manufacturing method, board structure and the metal component of board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410344661.6A CN105307378B (en) | 2014-07-18 | 2014-07-18 | Manufacturing method, board structure and the metal component of board structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105307378A true CN105307378A (en) | 2016-02-03 |
| CN105307378B CN105307378B (en) | 2018-10-19 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030146421A1 (en) * | 2000-03-30 | 2003-08-07 | Yasuhiro Wakizaka | Curable composition and multilayered circuit substrate |
| CN101090132A (en) * | 2006-05-10 | 2007-12-19 | 卡西欧计算机株式会社 | Display device and manufacturing method thereof |
| US20100118390A1 (en) * | 2005-08-02 | 2010-05-13 | Blair Steven M | Sub-wavelength metallic apertures as light enhancement devices |
| CN102237568A (en) * | 2010-04-30 | 2011-11-09 | 上海莫仕连接器有限公司 | Antenna device and making method thereof |
| CN103477728A (en) * | 2011-03-30 | 2013-12-25 | 富士胶片株式会社 | Printed circuit board, manufacturing method therefor, and metal-surface treatment liquid |
| CN103582283A (en) * | 2012-07-27 | 2014-02-12 | 富葵精密组件(深圳)有限公司 | Flexible printed circuit board and manufacturing method |
-
2014
- 2014-07-18 CN CN201410344661.6A patent/CN105307378B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030146421A1 (en) * | 2000-03-30 | 2003-08-07 | Yasuhiro Wakizaka | Curable composition and multilayered circuit substrate |
| US20100118390A1 (en) * | 2005-08-02 | 2010-05-13 | Blair Steven M | Sub-wavelength metallic apertures as light enhancement devices |
| CN101090132A (en) * | 2006-05-10 | 2007-12-19 | 卡西欧计算机株式会社 | Display device and manufacturing method thereof |
| CN102237568A (en) * | 2010-04-30 | 2011-11-09 | 上海莫仕连接器有限公司 | Antenna device and making method thereof |
| CN103477728A (en) * | 2011-03-30 | 2013-12-25 | 富士胶片株式会社 | Printed circuit board, manufacturing method therefor, and metal-surface treatment liquid |
| CN103582283A (en) * | 2012-07-27 | 2014-02-12 | 富葵精密组件(深圳)有限公司 | Flexible printed circuit board and manufacturing method |
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| Publication number | Publication date |
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| CN105307378B (en) | 2018-10-19 |
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