CN105305004B - Crack source array waveguide insertion fixed bonding moulding process - Google Patents
Crack source array waveguide insertion fixed bonding moulding process Download PDFInfo
- Publication number
- CN105305004B CN105305004B CN201510871516.8A CN201510871516A CN105305004B CN 105305004 B CN105305004 B CN 105305004B CN 201510871516 A CN201510871516 A CN 201510871516A CN 105305004 B CN105305004 B CN 105305004B
- Authority
- CN
- China
- Prior art keywords
- crack
- line source
- waveguide
- bonding
- source waveguide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The present invention relates to crack source array waveguides to be embedded in fixed bonding moulding process, comprises the following steps：S1, mold is made；S2, crack line source waveguide filling；S3, installation gap gasket；S4, composite bottom board：First bonding agent is equably applied on bottom plate, then by one with bonding agent facing towards crack line source waveguide, and is fitted in the line source waveguide of crack, horizontally slip bottom plate；S5, pressure；S6, shaping；S7, rim frame.The advantage of the invention is that：The flatness precision of crack line source waveguide array shaping aft antenna can be effectively improved using crack line source waveguide insertion mold fixed bonding moulding technique, in antenna aperture 2m × below 1m, its flatness is smaller than 0.1mm, its line source port face plane degree mainly processes kerve precision to ensure, so as to fulfill application of the high precision planeness crack line source waveguide in radar array antenna by numerical controlled machinery.
Description
Technical field
The present invention relates to crack source array waveguide production technical field, particularly crack source array waveguide insertion is fixed
Adhesive moulding technique.
Background technology
Usually used crack line source waveguide material is hollow and thin-walled aluminum alloy materials, existing crack line source waveguide surface battle array
Moulding process is by smoothing crack line source waveguide, is installed single crack line source waveguide one by one with fastener press fitting connecting mode
On frame, crack line source waveguide planar array is formed.This method is by fastener during the battle array installation forming of face
The methods of elasticity, the curvature of crack line source waveguide correct when going ensure the flatness of frame, line source face installation after plane
Degree adjustment, detection process are extremely cumbersome, complicated, and operability is not high, causes whole crack line source waveguide surface battle array flatness serious
Bigger than normal, in antenna aperture 2m × below 1m, flatness is more than more than 1.0mm, can not meet requirement.
The content of the invention
The shortcomings that it is an object of the invention to overcome the prior art, provides a kind of crack source array waveguide insertion and fixes
Adhesive moulding technique can effectively improve crack line source using crack line source waveguide insertion mold fixed bonding moulding technique
Waveguide array is molded the flatness precision of aft antenna, and in antenna aperture 2m × below 1m, flatness is smaller than 0.1mm, line
Source port face plane degree mainly processes kerve precision to ensure, so as to fulfill the line source waveguide of high precision planeness crack by numerical controlled machinery
Application in radar array antenna.
The purpose of the present invention is achieved through the following technical solutions：Crack source array waveguide insertion fixed bonding shaping work
Skill comprises the following steps：
S1, mold is made：Processing bonding forming mold is required according to crack source array waveguide dimensions, ensures bonding forming
The kerve depth of mold meets product requirement, and flatness is less than 0.1mm；
S2, crack line source waveguide filling：Every piece of crack line source waveguide is smoothed, and is sequentially embedded bonding forming mold
Kerve in；
S3, installation gap gasket：Gap gasket is inserted between the line source waveguide of adjacent two pieces of cracks, ensures crack line source ripple
The ranks spacing led is consistent；
S4, composite bottom board：First bonding agent is equably applied on bottom plate, then by one with bonding agent facing towards splitting
The waveguide of suture source, and be fitted in the line source waveguide of crack, horizontally slip bottom plate；
S5, pressure：It is pressed in equal pressing plate of the plane precision less than 0.2mm on bottom plate, applies 180~220N on equal pressing plate
Power, stand 1~3h；
S6, shaping：After bonding agent is formed by curing entirety, equal pressing plate is removed, crack line is taken out from bonding forming mold
Source waveguide surface battle array；
S7, rim frame：According to crack line source waveguide surface array edge height dimension, matching frame is selected, by viscous
The mode connected with screw is connect, the fixed border on the edge of crack line source waveguide surface battle array obtains crack source array waveguide.
The bottom plate is carbon fiber board.
The bonding agent is epoxy adhesive.
The present invention has the following advantages：
1st, crack line source waveguide insertion fixed bonding moulding technique is that crack line source waveguide is reversely embedded in high-precision
In forming mold, between being inserted into waveguide line source row with gap plastic spacer, ensure the consistent of crack line source waveguide column pitch
Property, then adhesive is uniformly applied on carbon fiber board backboard, reverse side is fitted in the crack line source waveguide back faces arranged, with one
Determine weight straight pressing plate carry out pressurization be adhesively fixed, by the automatic adaptability in adhesive landfill gap, improve crack
The tight ness rating that waveguide front is bonded with bonding forming die face, and to there is certain curved line source waveguide to be generated in equal pressing plate
Bonding agent cures under the action of pressure, and generation determines automatically levelling and has certain curved waveguide effect to improve crack line source ripple
The flatness of guide face battle array realizes front high-precision one-pass molding.
2nd, bottom plate is carbon fiber board, mitigates the weight of planar array.
3rd, crack line source ripple can be effectively improved using crack line source waveguide insertion mold fixed bonding moulding technique
The flatness precision of array shaping aft antenna is led, in antenna aperture 2m × below 1m, flatness is smaller than 0.1mm, line source
Port face plane degree mainly processes kerve precision to ensure by numerical controlled machinery.Exist so as to fulfill the line source waveguide of high precision planeness crack
Application in radar array antenna.
4th, the epoxy adhesive of certain viscosity is used between the waveguide of crack line source and bottom plate, it can fracture line source waveguide upper table
Face height not filled and led up automatically by uniform thickness state.
5th, using surface plate gravity pressuring method, in bonding, fracture source array waveguide centainly bends and carries out gravity and add
Pressure correction is fixed, and the flatness of waveguide lower surface is made to be less than 0.1mm.
Description of the drawings
Fig. 1 is the structure diagram of bonding forming mold；
Fig. 2 is enlarged structure schematic diagram at A in Fig. 1；
Fig. 3 is the overlooking the structure diagram of bonding forming mold；
Fig. 4 is the structure diagram of crack source array waveguide；
In figure：1- die holders, 2- kerves, 3- mounting holes, the line source waveguide of 4- long cracks, the short crack line source waveguides of 5-, 6- gaps
Gasket, 7- adhesive linkages, 8- bottom plates.
Specific embodiment
The present invention will be further described with reference to the accompanying drawings and examples, but protection scope of the present invention is not limited to
It is as described below.
【Embodiment 1】
Crack source array waveguide insertion fixed bonding moulding process, comprises the following steps：
S1, mold is made：Processing bonding forming mold is required according to crack source array waveguide dimensions, ensures bonding forming
The kerve depth of mold meets product requirement, and flatness is less than 0.1mm；
S2, crack line source waveguide filling：Every piece of crack line source waveguide is smoothed, and is sequentially embedded bonding forming mold
Kerve in；
S3, installation gap gasket：Gap gasket is inserted between the line source waveguide of adjacent two pieces of cracks, ensures crack line source ripple
The ranks spacing led is consistent；
S4, composite bottom board：First bonding agent is equably applied on bottom plate, the bonding agent be epoxy adhesive, bottom
Plate is carbon fiber board, then by one with bonding agent facing towards crack line source waveguide, and is fitted in the line source waveguide of crack, left
Right sliding floor；
S5, pressure：It is pressed in equal pressing plate of the plane precision less than 0.2mm on bottom plate, applies the power of 180N on equal pressing plate,
Stand 3h；
S6, shaping：After bonding agent is formed by curing entirety, equal pressing plate is removed, crack line is taken out from bonding forming mold
Source waveguide surface battle array；
S7, rim frame：According to crack line source waveguide surface array edge height dimension, matching frame is selected, by viscous
The mode connected with screw is connect, the fixed border on the edge of crack line source waveguide surface battle array obtains crack source array waveguide, such as
Shown in Fig. 4.
【Embodiment 2】
Crack source array waveguide insertion fixed bonding moulding process, comprises the following steps：
S1, mold is made：Processing bonding forming mold is required according to crack source array waveguide dimensions, ensures bonding forming
The kerve depth of mold meets product requirement, and flatness is less than 0.1mm；
S2, crack line source waveguide filling：Every piece of crack line source waveguide is smoothed, and is sequentially embedded bonding forming mold
Kerve in；
S3, installation gap gasket：Gap gasket is inserted between the line source waveguide of adjacent two pieces of cracks, ensures crack line source ripple
The ranks spacing led is consistent；
S4, composite bottom board：First bonding agent is equably applied on bottom plate, the bonding agent be epoxy adhesive, bottom
Plate is carbon fiber board, then by one with bonding agent facing towards crack line source waveguide, and is fitted in the line source waveguide of crack, left
Right sliding floor；
S5, pressure：It is pressed in equal pressing plate of the plane precision less than 0.2mm on bottom plate, applies the power of 200N on equal pressing plate,
Stand 2h；
S6, shaping：After bonding agent is formed by curing entirety, equal pressing plate is removed, crack line is taken out from bonding forming mold
Source waveguide surface battle array；
S7, rim frame：According to crack line source waveguide surface array edge height dimension, matching frame is selected, by viscous
The mode connected with screw is connect, the fixed border on the edge of crack line source waveguide surface battle array obtains crack source array waveguide, such as
Shown in Fig. 4.
【Embodiment 3】
Crack source array waveguide insertion fixed bonding moulding process, comprises the following steps：
S1, mold is made：Processing bonding forming mold is required according to crack source array waveguide dimensions, ensures bonding forming
The kerve depth of mold meets product requirement, and flatness is less than 0.1mm；
S2, crack line source waveguide filling：Every piece of crack line source waveguide is smoothed, and is sequentially embedded bonding forming mold
Kerve in；
S3, installation gap gasket：Gap gasket is inserted between the line source waveguide of adjacent two pieces of cracks, ensures crack line source ripple
The ranks spacing led is consistent；
S4, composite bottom board：First bonding agent is equably applied on bottom plate, the bonding agent be epoxy adhesive, bottom
Plate is carbon fiber board, then by one with bonding agent facing towards crack line source waveguide, and is fitted in the line source waveguide of crack, left
Right sliding floor；
S5, pressure：It is pressed in equal pressing plate of the plane precision less than 0.2mm on bottom plate, applies the power of 220N on equal pressing plate,
Stand 1h；
S6, shaping：After bonding agent is formed by curing entirety, equal pressing plate is removed, crack line is taken out from bonding forming mold
Source waveguide surface battle array；
S7, rim frame：According to crack line source waveguide surface array edge height dimension, matching frame is selected, by viscous
The mode connected with screw is connect, the fixed border on the edge of crack line source waveguide surface battle array obtains crack source array waveguide, such as
Shown in Fig. 4.
As shown in Figure 1, Figure 2 and Figure 3, the bonding forming mold includes die holder 1, is provided on the upper surface of die holder 1
Fitting-type face offers multiple kerves 2 being mutually parallel on fitting-type face evenly and at intervals, and the flatness of kerve 2 is less than
0.1mm, the both ends of each kerve 2 are respectively arranged with mounting hole 3.When loading crack line source waveguide, by long crack line source waveguide 4
Bottom surface is smoothed, and is sequentially loaded into kerve 2, by short crack line source waveguide 5 between two neighboring long crack line source waveguide 4,
Gap gasket 6 is inserted between long crack line source waveguide 4 and short crack line source waveguide 5, it is ensured that two neighboring long crack line source ripple
It leads the distance between 4 to be consistent, the upper surface of long crack line source waveguide 4 and short crack line source waveguide 5 is compound by adhesive linkage 7
It is bonded with bottom plate 8.
Claims (3)
1. crack source array waveguide is embedded in fixed bonding moulding process, it is characterised in that：Comprise the following steps：
S1, mold is made：Processing bonding forming mold is required according to crack source array waveguide dimensions, ensures bonding forming mold
Kerve depth meet product requirement, flatness is less than 0.1mm；
S2, crack line source waveguide filling：Every piece of crack line source waveguide is smoothed, and is sequentially embedded the bottom of bonding forming mold
In slot；
S3, installation gap gasket：Gap gasket is inserted between the line source waveguide of adjacent two pieces of cracks, ensures crack line source waveguide
Ranks spacing is consistent；
S4, composite bottom board：First bonding agent is equably applied on bottom plate, then by one with bonding agent facing towards crack line
Source waveguide, and be fitted in the line source waveguide of crack, horizontally slip bottom plate；
S5, pressure：It is pressed in equal pressing plate of the flatness less than 0.2mm on bottom plate, applies the power of 180~220N on equal pressing plate,
Stand 1~3h；
S6, shaping：After bonding agent is formed by curing entirety, equal pressing plate is removed, crack line source ripple is taken out from bonding forming mold
Guide face battle array；
S7, rim frame：According to crack line source waveguide surface array edge height dimension, select matching frame, by bonding and
The mode of screw connection, the fixed border on the edge of crack line source waveguide surface battle array obtain crack source array waveguide.
2. source array waveguide in crack according to claim 1 is embedded in fixed bonding moulding process, it is characterised in that：It is described
Bottom plate be carbon fiber board.
3. source array waveguide in crack according to claim 1 is embedded in fixed bonding moulding process, it is characterised in that：It is described
Bonding agent be epoxy adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510871516.8A CN105305004B (en) | 2015-12-02 | 2015-12-02 | Crack source array waveguide insertion fixed bonding moulding process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510871516.8A CN105305004B (en) | 2015-12-02 | 2015-12-02 | Crack source array waveguide insertion fixed bonding moulding process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105305004A CN105305004A (en) | 2016-02-03 |
| CN105305004B true CN105305004B (en) | 2018-05-22 |
Family
ID=55201963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510871516.8A Expired - Fee Related CN105305004B (en) | 2015-12-02 | 2015-12-02 | Crack source array waveguide insertion fixed bonding moulding process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105305004B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112909510B (en) * | 2021-01-27 | 2022-11-25 | 宇联星程(浙江)科技有限公司 | Carbon fiber silver-plated conductive carbon fiber composite material antenna |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1251904A (en) * | 1998-10-20 | 2000-05-03 | 住友金属矿山株式会社 | Manufacture of optical fiber array |
| CN104600428A (en) * | 2015-01-22 | 2015-05-06 | 成都锦江电子系统工程有限公司 | System for improving isolation degree of continuous wave radar receiving and transmitting antenna |
| CN104723119A (en) * | 2015-03-27 | 2015-06-24 | 大族激光科技产业集团股份有限公司 | Workbench underbed mounting surface and adhering method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3136870B2 (en) * | 1993-10-12 | 2001-02-19 | 日立電線株式会社 | Optical fiber array and method of manufacturing the same |
| US20100238085A1 (en) * | 2009-03-23 | 2010-09-23 | Toyota Motor Engineering & Manufacturing North America, Inc. | Plastic waveguide slot array and method of manufacture |
-
2015
- 2015-12-02 CN CN201510871516.8A patent/CN105305004B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1251904A (en) * | 1998-10-20 | 2000-05-03 | 住友金属矿山株式会社 | Manufacture of optical fiber array |
| CN104600428A (en) * | 2015-01-22 | 2015-05-06 | 成都锦江电子系统工程有限公司 | System for improving isolation degree of continuous wave radar receiving and transmitting antenna |
| CN104723119A (en) * | 2015-03-27 | 2015-06-24 | 大族激光科技产业集团股份有限公司 | Workbench underbed mounting surface and adhering method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105305004A (en) | 2016-02-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102154538B1 (en) | Resin molding device and method of manufacturing resin molded products | |
| US20140250665A1 (en) | Z-pin patch and method for manufacturing or coupling a composite laminated structure using same | |
| CN101337430B (en) | Method for welding plastic products by ultrasonic wave | |
| CN105305004B (en) | Crack source array waveguide insertion fixed bonding moulding process | |
| US8616875B2 (en) | Light guide plate stamp and method of manufacturing the same | |
| CN102903794A (en) | Sealant overflow process of photovoltaic assembly framing | |
| CN113000682B (en) | Mechanical loading tool and loading method for outer grid wallboard | |
| CN206286858U (en) | A kind of clamping device for processing rectangular waveguide pipe leak | |
| CN203695760U (en) | Ironing and thinning die structure | |
| CN210061732U (en) | Curing tool for polymer adhesive film | |
| CN102846049B (en) | Television bench bracket structure and manufacturing method thereof | |
| CN203141733U (en) | Tabletop mold for SMC (Sheet Molding Compound) mold pressed table tennis table | |
| CN209289752U (en) | A kind of 3D glass protection film pastes equipment | |
| CN112590246A (en) | DR flat bed with edge strips, flat bed forming die and forming method | |
| CN106077292A (en) | The sagging manufacturing process of a kind of abnormal-shaped section bar part and shaping dies | |
| CN213360728U (en) | Novel pressure maintaining clamp for tablet personal computer | |
| CN106002185B (en) | The apparatus and method that flexible die is installed in a kind of laser flexible loading | |
| CN214323899U (en) | Die with inclination angle | |
| CN203934207U (en) | The shell of 3C Product | |
| CN205573237U (en) | Laminating device of 3D diaphragm | |
| CN214324432U (en) | Reinforced aluminum-plastic composite board | |
| CN106560453A (en) | Apparatus For Forming Touch Window Glass For Portable Terminal | |
| CN102700224A (en) | Method for laminating thin molded laminate flooring by laminating device | |
| CN109218642A (en) | A kind of television set glass back plate, television set and preparation method thereof | |
| CN203697423U (en) | Movable plate of injection molding machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180522 Termination date: 20191202 |