CN105304548A - 晶圆夹盘 - Google Patents

晶圆夹盘 Download PDF

Info

Publication number
CN105304548A
CN105304548A CN201510668908.4A CN201510668908A CN105304548A CN 105304548 A CN105304548 A CN 105304548A CN 201510668908 A CN201510668908 A CN 201510668908A CN 105304548 A CN105304548 A CN 105304548A
Authority
CN
China
Prior art keywords
chuck
wafer
wafer chuck
clamping hole
chuck seat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510668908.4A
Other languages
English (en)
Inventor
戴惠宇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHANGZHOU LONGDE ELECTRIC Co Ltd
Original Assignee
CHANGZHOU LONGDE ELECTRIC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHANGZHOU LONGDE ELECTRIC Co Ltd filed Critical CHANGZHOU LONGDE ELECTRIC Co Ltd
Priority to CN201510668908.4A priority Critical patent/CN105304548A/zh
Publication of CN105304548A publication Critical patent/CN105304548A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Abstract

本发明涉及夹盘技术领域，尤其是一种晶圆夹盘，包括夹盘座，所述夹盘座中间设有圆形夹孔，夹孔周边套由橡胶套，所述夹盘座底部设有防震垫脚，侧面设有可伸缩的工件台。本发明可对晶圆进行固定方便测量，并且提供稳定支撑，确保数据准确。

Description

晶圆夹盘
技术领域
本发明涉及夹盘技术领域，尤其是一种晶圆夹盘。
背景技术
现有的晶圆都是拿在手上进行测量，操作时不方便。
发明内容
为了克服现有的技术的不足，本发明提供了一种晶圆夹盘。
本发明解决其技术问题所采用的技术方案是：一种晶圆夹盘，包括夹盘座，所述夹盘座中间设有圆形夹孔，夹孔周边套由橡胶套，所述夹盘座底部设有防震垫脚，侧面设有可伸缩的工件台。
本发明的有益效果是，本发明可对晶圆进行固定方便测量，并且提供稳定支撑，确保数据准确。
附图说明
下面结合附图和实施例对本发明进一步说明。
图1是本发明的主视图。
图2是本发明的侧视图。
图中1、夹盘座，2、夹孔，3、橡胶套，4、防震脚垫，5、工件台。
具体实施方式
如图1-2是本发明的结构示意图，一种晶圆夹盘，包括夹盘座1，所述夹盘座1中间设有圆形夹孔2，夹孔2周边套由橡胶套3，所述夹盘座1底部设有防震垫脚4，侧面设有可伸缩的工件台5。本发明可对晶圆进行固定方便测量，并且提供稳定支撑，确保数据准确。

Claims (1)

1.一种晶圆夹盘，包括夹盘座（1），其特征是，所述夹盘座（1）中间设有圆形夹孔（2），夹孔（2）周边套由橡胶套（3），所述夹盘座（1）底部设有防震垫脚（4），侧面设有可伸缩的工件台（5）。
CN201510668908.4A 2015-10-13 2015-10-13 晶圆夹盘 Pending CN105304548A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510668908.4A CN105304548A (zh) 2015-10-13 2015-10-13 晶圆夹盘

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510668908.4A CN105304548A (zh) 2015-10-13 2015-10-13 晶圆夹盘

Publications (1)

Publication Number Publication Date
CN105304548A true CN105304548A (zh) 2016-02-03

Family

ID=55201625

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510668908.4A Pending CN105304548A (zh) 2015-10-13 2015-10-13 晶圆夹盘

Country Status (1)

Country Link
CN (1) CN105304548A (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5046909A (en) * 1989-06-29 1991-09-10 Applied Materials, Inc. Method and apparatus for handling semiconductor wafers
US6514776B1 (en) * 1999-06-24 2003-02-04 Kumiko Yanagi Instrument and method for measuring contamination of wafer surface
CN103187346A (zh) * 2011-12-29 2013-07-03 无锡华润华晶微电子有限公司 用于夹持晶圆以对其进行腐蚀的夹具

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5046909A (en) * 1989-06-29 1991-09-10 Applied Materials, Inc. Method and apparatus for handling semiconductor wafers
US6514776B1 (en) * 1999-06-24 2003-02-04 Kumiko Yanagi Instrument and method for measuring contamination of wafer surface
CN103187346A (zh) * 2011-12-29 2013-07-03 无锡华润华晶微电子有限公司 用于夹持晶圆以对其进行腐蚀的夹具

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Application publication date: 20160203