CN105304409A - Thermal switch based on negative thermal expansion - Google Patents
Thermal switch based on negative thermal expansion Download PDFInfo
- Publication number
- CN105304409A CN105304409A CN201510580091.5A CN201510580091A CN105304409A CN 105304409 A CN105304409 A CN 105304409A CN 201510580091 A CN201510580091 A CN 201510580091A CN 105304409 A CN105304409 A CN 105304409A
- Authority
- CN
- China
- Prior art keywords
- negative
- thermal
- expansion
- conducting element
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 230000005855 radiation Effects 0.000 abstract description 5
- 238000005057 refrigeration Methods 0.000 description 17
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 241001306288 Ophrys fuciflora Species 0.000 description 1
- 230000002547 anomalous effect Effects 0.000 description 1
- 230000004323 axial length Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910000174 eucryptite Inorganic materials 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- MEFBJEMVZONFCJ-UHFFFAOYSA-N molybdate Chemical class [O-][Mo]([O-])(=O)=O MEFBJEMVZONFCJ-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/02—Details
- H01H37/32—Thermally-sensitive members
- H01H37/46—Thermally-sensitive members actuated due to expansion or contraction of a solid
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Thermally Actuated Switches (AREA)
Abstract
The invention discloses a thermal switch based on negative thermal expansion, which comprises: the heat-conducting element is connected with the heat-conducting element, the heat-conducting element is disconnected with the heat load when the temperature of the negative heat expansion element is higher than a preset threshold value, and the heat-conducting element is closed with the heat load when the temperature of the negative heat expansion element is lower than the preset threshold value. The thermal switch based on negative thermal expansion has a simple structure and only has two parts. The thermal switch has large operation stroke, and the larger gap caused by the larger stroke can reduce the angle coefficient between two end faces of the gap, reduce radiation heat transfer and increase disconnection thermal resistance.
Description
Technical field
The present invention relates to heat flow path control technology field, particularly a kind of thermal switch based on negative expansion.
Background technology
At present, the mechanical refrigeration machine such as sterlin refrigerator has become the best means providing the large refrigerating capacity low temperature environment in space.Generally, the compressor of sterlin refrigerator and decompressor promote oscillator with linear electric motors respectively, do the high speed linear reciprocating motion of certain frequency vertically.Like this, during refrigerator operation, will produce larger vibration vertically, the focus planardetector be installed on refrigeration machine cold head is passed in this vibration, thus affects the imaging effect of focal plane.In order to reduce refrigeration vibration, proposing a kind of composite refrigeration system, utilizing active/passive refrigerating system alternately for Infrared Detectors provides cold.When main passive refrigeration modes switches, need its heat flow path of cut-off/close.In addition, for extending refrigeration machine useful life, people utilize multiple stage refrigeration machine to export cold to realize requirement to same chill station.Such as, under normal circumstances, use a mechanical refrigerator to be main refrigeration machine, other one is backup machine.When main frame breaks down, use backup machine.At this moment, need the heat flow path between refrigeration machine and chill station arranges thermal switch, to reduce not by heat transfer unnecessary between the refrigeration machine that uses and chill station.
In existing thermal switch, bimetal leaf drives thermal switch structure more complicated, and the ratio of disconnection and closed thermal resistance, about 300, in use occurred cold welding phenomenon.Memorial alloy type thermal switch utilizes memorial alloy to provide thermal switch closing force, and its structure is more complicated, and the ratio disconnecting thermal resistance and closed thermal resistance is larger.GAP TYPE thermal switch heat-transfer mechanism is that gas is full of thermal switch gap, and kill mechanism is extracted out by gas pump in gap, and its volume is comparatively large, and structure is more complicated, is mainly used in low temperature field, pole.Micro-expanded thermal switch utilizes two kinds of materials with different positive thermal coefficient of expansion to make thermal switch, be made up of with upper part 3 or 3, disconnection thermal resistance and closed thermal resistance ratio are comparatively large, but thermal switch gap width is between 0.1mm-0.4mm, and less gap increases the radiation heat transfer between both ends of the surface.In addition, micro-expanded thermal switch middle support column still connects thermal switch two ends in the off state, forms a heat flow path, reduces disconnection thermal resistance.
Summary of the invention
Based on the problems referred to above, the invention provides a kind of thermal switch based on negative expansion, by using the pyrocondensation cold expanding characteristic of negative thermal expansion material to realize the disconnection of thermal switch with closed, its formation only comprises two parts, and structure is simple, easy to make.
For above-mentioned purpose, the invention provides a kind of thermal switch based on negative expansion, it is characterized in that, comprising: negative expansion element and heat conducting element, wherein, described negative expansion element is made up of negative thermal expansion material, described negative expansion element is connected with described heat conducting element, and described negative expansion element is when temperature is higher than predetermined threshold value, and described heat conducting element and described heat load disconnect, described negative expansion element is when lower than predetermined threshold value, and described heat conducting element and described heat load close.
Wherein, negative expansion element pyrocondensation cold expanding in the temperature range of setting, when described negative expansion element high-temperature shrinkage is to the first length preset, described heat conducting element and described heat load disconnect, when negative expansion element low-temperature expansion is to the second length preset, described heat conducting element and described heat load close.
Wherein, described heat conducting element adopts high thermal conductivity material to make.
Wherein, described heat conducting element is made up of any one in copper, gold, silver.。
The invention provides a kind of thermal switch based on negative expansion, by using, the pyrocondensation cold expanding of negative thermal expansion material is specific to be realized the disconnection of thermal switch and closes, the structure of thermal switch is simple, and it is large to run stroke, the comparatively wide arc gap that larger row journey is brought can reduce angular coefficient between the both ends of the surface of thermal switch gap, thus minimizing radiant heat transfer, increase and disconnect thermal resistance.
Accompanying drawing explanation
Can understanding the features and advantages of the present invention clearly by reference to accompanying drawing, accompanying drawing is schematic and should not be construed as and carry out any restriction to the present invention, in the accompanying drawings:
Fig. 1 is the negative expansion type thermal switch schematic diagram of the embodiment of the present invention.
Fig. 2 is the negative expansion type thermal switch being in off-state in refrigeration systems;
Fig. 3 is the negative expansion type thermal switch being in closure state in refrigeration systems.
In figure, 10: refrigeration machine, 11: cold head, 21: negative expansion element, 22: heat conducting element, 23: heat load, 31: heat load end, 30: solid refrigerator, 40: Infrared Detectors.
Embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples for illustration of the present invention, but are not used for limiting the scope of the invention.
Fig. 1 is the negative expansion type thermal switch schematic diagram of the embodiment of the present invention.
With reference to Fig. 1, the thermal switch based on negative expansion of the embodiment of the present invention, comprise: negative expansion element 21 and heat conducting element 22, wherein, negative expansion element 21 is made up of negative thermal expansion material, and negative expansion element 21 makes heat conducting element 22 be connected to heat load 23 along with the reduction volumetric expansion of temperature.Particularly, negative expansion element 21 is when temperature is higher than predetermined threshold value, and described heat conducting element 22 disconnects with described heat load 23, and described negative expansion element 21 is when lower than predetermined threshold value, and described heat conducting element 22 closes with described heat load 23.
The negative thermal expansion material used in the present embodiment refers to the class material that coefficient of linear expansion or the coefficient of volume expansion are negative value in certain temperature range, and this material has Anomalous Thermal Expansion characteristic.Guilaume invention face-centered cubic Fe first in 1897
65ni
35an alloy thermal coefficient of expansion order of magnitude lower than normal iron-nickel alloy.Nineteen fifty-one Hummel finds that beta-eucryptite crystalline aggregate is after temperature reaches 1000 DEG C, and temperature continues the phenomenon occurring volume-diminished when raising.Nineteen ninety-five, the Sleight etc. of Oregonstate university of the U.S. has found ZrV
(2-X)p
xo
7the isotropy negative thermal expansion material of series, negative expansion warm area width reaches 950K.1997, Sleight etc. found that chemical general formula is A
2m
3o
12tungstates and molybdate series negative thermal expansion material, wherein Sc
2w
3o
12it is the widest negative thermal expansion material (10-1200K) of the negative expansion warm area that finds at present.
The present embodiment make use of the negative heat expansion characteristics of material, and negative expansion element 21 is when high-temperature shrinkage is to the first length preset, and heat conducting element 22 and heat load end 31 disconnect, and as shown in Figure 2, negative thermal expansion material 21 is in contraction state.Now, the negative expansion thermal switch 20 that the cold head 11 of the refrigeration machine 10 in refrigerating system connects disconnects, and heat conducting element 22 and heat load end 31 form a gap S, and heat conduction heat flux cannot pass through thermal switch 20.It should be noted that heat conducting element 22 has retractility herein, to coordinate the motion of negative expansion element 21.
Negative expansion element 21 is when low-temperature expansion is to the second length preset, and heat conducting element 22 closes with heat load end 31, and thermal switch and heat load end 31 form heat flow path, and as shown in Figure 3, negative thermal expansion material 21 is in swelling state.Now, the negative expansion thermal switch 20 that the cold head 11 of the refrigeration machine 10 in refrigerating system connects closes, and heat conducting element 22 disappears with the gap S of heat load end 31, and heat conduction heat flux is by thermal switch 20, reach the heat load end 31 of solid refrigerator 30, thus realize the refrigeration to Infrared Detectors 40.
The thermal switch movement travel of the present embodiment is large.With negative thermal expansion material Yb
2.75c
60for example, its coefficient of linear expansion when 30K is-550 × 10
-6/ K, supposes that the axial length of negative thermal expansion material is 20mm, and its axial inflatable 2.97mm at this temperature, comparatively wide arc gap reduces angular coefficient between the both ends of the surface of gap, thus reduces radiation heat transfer, and then increase effectively the disconnection thermal resistance of thermal switch.Meanwhile, in the present invention, heat conducting element 22 surface grinding is to reduce its emissivity, and lower emissivity also has the effect reducing radiation heat transfer between heat conducting element 22 and heat load end 31, and making to disconnect thermal resistance increases.
In embodiment, heat conducting element 22 adopts high thermal conductivity material, and as copper, gold, silver or its alloy are made, heat conducting element, when thermal switch closes, can strengthen refrigeration machine and by the heat conduction between cold element.
Based on said structure, the movement travel of thermal switch of the present invention is comparatively large, and can change with the length of negative thermal expansion material, and after disconnecting, heat flow path heat transfer is only the thermal radiation of S both sides, gap plane, and disconnecting thermal resistance effectively increases.In addition, thermal switch only has two parts, and structure is very simple, and processing and fabricating easily realizes.Meanwhile, Long Distances and polished surface decrease the radiant heat transfer of off-state, increase disconnection thermal resistance.
With negative thermal expansion material Yb in the present embodiment
2.75c
60for the negative expansion element of thermal switch, and setting thermal switch closed temperature is 30K.In other embodiments, thermal switch can be realized in the effective warm area selecting thermal switch to be operated in negative thermal expansion material and control heat flow path function, negative expansion element can be made according to the negative thermal expansion material that the different choice of working temperature is suitable simultaneously.Can make an amendment the concrete shape of negative expansion element 21 and heat conducting element 22, to meet application demand in other embodiment.
Above execution mode is only for illustration of the present invention; and be not limitation of the present invention; the those of ordinary skill of relevant technical field; without departing from the spirit and scope of the present invention; can also make a variety of changes and modification; therefore all equivalent technical schemes also belong to category of the present invention, and scope of patent protection of the present invention should be defined by the claims.
Claims (4)
1. the thermal switch based on negative expansion, it is characterized in that, comprise: negative expansion element and heat conducting element, wherein, described negative expansion element is made up of negative thermal expansion material, and described negative expansion element is connected with described heat conducting element, described negative expansion element is when temperature is higher than predetermined threshold value, described heat conducting element and described heat load disconnect, and described negative expansion element is when lower than predetermined threshold value, and described heat conducting element and described heat load close.
2. thermal switch as claimed in claim 1, it is characterized in that, negative expansion element pyrocondensation cold expanding in the temperature range of setting, when described negative expansion element high-temperature shrinkage is to the first length preset, described heat conducting element and described heat load disconnect, when negative expansion element low-temperature expansion is to the second length preset, described heat conducting element and described heat load close.
3. thermal switch as claimed in claim 1, is characterized in that, described heat conducting element adopts high thermal conductivity material to make.
4. thermal switch as claimed in claim 3, it is characterized in that, described heat conducting element is made up of any one in copper, gold, silver.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510580091.5A CN105304409A (en) | 2015-09-11 | 2015-09-11 | Thermal switch based on negative thermal expansion |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510580091.5A CN105304409A (en) | 2015-09-11 | 2015-09-11 | Thermal switch based on negative thermal expansion |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105304409A true CN105304409A (en) | 2016-02-03 |
Family
ID=55201523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510580091.5A Pending CN105304409A (en) | 2015-09-11 | 2015-09-11 | Thermal switch based on negative thermal expansion |
Country Status (1)
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|---|---|
| CN (1) | CN105304409A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108198687A (en) * | 2018-01-10 | 2018-06-22 | 宁波海蔓汽车科技有限公司 | The warming equipment of capacitor |
| CN108413798A (en) * | 2018-02-05 | 2018-08-17 | 南京航空航天大学 | A kind of unidirectional heat transfer structure and application method based on material heat expansion difference |
| CN108879029A (en) * | 2018-06-01 | 2018-11-23 | 合肥国轩高科动力能源有限公司 | Temperature volume switch type low-temperature control system for power battery |
| CN110455011A (en) * | 2019-07-25 | 2019-11-15 | 清华大学 | Absorption type compressor based on semiconductor refrigerating and its Cryo Refrigerator of driving |
| CN110574198A (en) * | 2017-05-01 | 2019-12-13 | 美国锂能源公司 | Negative thermal expansion current interrupter |
| CN111203084A (en) * | 2020-02-28 | 2020-05-29 | 安徽净工坊环保科技有限公司 | Energy-saving and environment-friendly purification treatment device and purification method for VOCs-containing waste gas pollution |
| CN112499640A (en) * | 2020-08-05 | 2021-03-16 | 北京航空航天大学 | Preparation of material with giant thermal hysteresis negative thermal expansion property and application of material in field of embedded pipe joint |
| CN113375494A (en) * | 2020-03-09 | 2021-09-10 | 南京师范大学 | Negative differential thermal conductance device based on interface thermal resistance effect, device and application |
| CN114078660A (en) * | 2020-08-18 | 2022-02-22 | 中国科学院理化技术研究所 | Negative thermal expansion type thermoelectric switch |
| CN114114740A (en) * | 2021-12-07 | 2022-03-01 | 惠州华星光电显示有限公司 | Device heat dissipation device, backlight module and display panel |
| CN114556689A (en) * | 2019-10-18 | 2022-05-27 | 帅福得电池有限公司 | Disconnecting and short-circuiting device comprising a thermally activatable element |
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| US4541735A (en) * | 1984-12-24 | 1985-09-17 | General Motors Corporation | Thermal sensing element using methanol saturated fluorocarbon elastomer as the heat responsive material |
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Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11842868B2 (en) * | 2017-05-01 | 2023-12-12 | American Lithium Energy Corporation | Negative thermal expansion current interrupter |
| CN110574198A (en) * | 2017-05-01 | 2019-12-13 | 美国锂能源公司 | Negative thermal expansion current interrupter |
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| CN108198687A (en) * | 2018-01-10 | 2018-06-22 | 宁波海蔓汽车科技有限公司 | The warming equipment of capacitor |
| CN108198687B (en) * | 2018-01-10 | 2019-08-13 | 宁波海蔓汽车科技有限公司 | The warming equipment of capacitor |
| CN108413798A (en) * | 2018-02-05 | 2018-08-17 | 南京航空航天大学 | A kind of unidirectional heat transfer structure and application method based on material heat expansion difference |
| CN108413798B (en) * | 2018-02-05 | 2020-04-24 | 南京航空航天大学 | Unidirectional heat transfer structure based on material thermal expansion difference and use method |
| CN108879029A (en) * | 2018-06-01 | 2018-11-23 | 合肥国轩高科动力能源有限公司 | Temperature volume switch type low-temperature control system for power battery |
| CN110455011B (en) * | 2019-07-25 | 2020-09-25 | 清华大学 | Adsorption compressor based on semiconductor refrigeration and low-temperature refrigerator driven by adsorption compressor |
| CN110455011A (en) * | 2019-07-25 | 2019-11-15 | 清华大学 | Absorption type compressor based on semiconductor refrigerating and its Cryo Refrigerator of driving |
| CN114556689A (en) * | 2019-10-18 | 2022-05-27 | 帅福得电池有限公司 | Disconnecting and short-circuiting device comprising a thermally activatable element |
| CN111203084A (en) * | 2020-02-28 | 2020-05-29 | 安徽净工坊环保科技有限公司 | Energy-saving and environment-friendly purification treatment device and purification method for VOCs-containing waste gas pollution |
| CN113375494A (en) * | 2020-03-09 | 2021-09-10 | 南京师范大学 | Negative differential thermal conductance device based on interface thermal resistance effect, device and application |
| CN113375494B (en) * | 2020-03-09 | 2022-08-12 | 南京师范大学 | Negative differential thermal conductance device based on interface thermal resistance effect, device and application |
| CN112499640A (en) * | 2020-08-05 | 2021-03-16 | 北京航空航天大学 | Preparation of material with giant thermal hysteresis negative thermal expansion property and application of material in field of embedded pipe joint |
| CN114078660A (en) * | 2020-08-18 | 2022-02-22 | 中国科学院理化技术研究所 | Negative thermal expansion type thermoelectric switch |
| CN114114740A (en) * | 2021-12-07 | 2022-03-01 | 惠州华星光电显示有限公司 | Device heat dissipation device, backlight module and display panel |
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Application publication date: 20160203 |