CN105290639A - Manufacturing method for copper-added soldering tin bar - Google Patents

Manufacturing method for copper-added soldering tin bar Download PDF

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Publication number
CN105290639A
CN105290639A CN201510850451.9A CN201510850451A CN105290639A CN 105290639 A CN105290639 A CN 105290639A CN 201510850451 A CN201510850451 A CN 201510850451A CN 105290639 A CN105290639 A CN 105290639A
Authority
CN
China
Prior art keywords
tin bar
soldering tin
metallic
copper
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510850451.9A
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Chinese (zh)
Inventor
杨伟帅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Lotte Chemical Technology Co Ltd
Original Assignee
Suzhou Lotte Chemical Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Lotte Chemical Technology Co Ltd filed Critical Suzhou Lotte Chemical Technology Co Ltd
Priority to CN201510850451.9A priority Critical patent/CN105290639A/en
Publication of CN105290639A publication Critical patent/CN105290639A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262Sn as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40Making wire or rods for soldering or welding

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention discloses a manufacturing method for a copper-added soldering tin bar. The method includes the following steps that (1) soldering tin bar components are weighed, and 0.5-0.85 part, by weight, of metallic nickel, 70-75 parts, by weight, of metallic tin, 0.5-0.95 part, by weight, of metallic bismuth, 1-3.5 parts, by weight, of metallic lead, and 5-10 parts, by weight, of metallic copper are weighed; (2) melting of the soldering tin bar is carried out, and the weighed metal is put into a melting furnace and stirred sufficiently until all the metal is melted; and (3) moulding by casting is carried out, and a mixture obtained in the step (2) is poured into a mold to complete moulding by casting. In this way, the soldering tin bar manufactured through the manufacturing method for the copper-added soldering tin bar makes full use of the heat conducting performance of the metallic copper, the melting speed and soldering speed of soldering tin are increased, the soldering production effect is improved, and the using effect is better.

Description

A kind of preparation method adding brazing tin bar
Technical field
The present invention relates to scolding tin field, particularly relate to a kind of preparation method adding brazing tin bar.
Background technology
For the difficult point that copper and stainless dissimilar welding are also in welding operation, because the good heat-conducting effect of copper, and stainless heat conductivity is poor, the separately difference of both coefficients of expansion, if adopt the words of gas welding operation, be easy to cause the solder of melting in the process of welding to roll about and do not glue in face on stainless steel, the temperature now for both mother metals controls to be difficult point.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of preparation method adding brazing tin bar.
For solving the problems of the technologies described above, the invention provides a kind of preparation method adding brazing tin bar, comprising the following steps:
(1) take soldering tin bar component, take metallic nickel 0.5-0.85 part respectively, metallic tin 70-75 part, bismuth metal 0.5-0.95 part, metallic lead 1-3.5 part, metallic copper 5-10 part, described number is weight proportion,
(2) fusing of soldering tin bar, drops into melting furnace by the above-mentioned metal taken, fully stirs, until it all melts,
(3) moulding by casting, is poured on mould by the mixture obtained in step (2), moulding by casting.
In a preferred embodiment of the present invention, the temperature of described melting furnace remains on 330-365 degree Celsius, and fusing time is 10-15 minute.
In a preferred embodiment of the present invention, in described soldering tin bar component, also comprise 0.12-0.25 part gold.
In a preferred embodiment of the present invention, in described soldering tin bar component, also comprise 0.55-0.85 part rare earth alloy.
The invention has the beneficial effects as follows: the soldering tin bar that the preparation method that the present invention adds brazing tin bar is made takes full advantage of the heat conductivility of copper metal, enhance burn-off rate and the speed of welding of scolding tin, improve the production effect of welding, result of use is better.
Detailed description of the invention
Be clearly and completely described to the technical scheme in the embodiment of the present invention below, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
The embodiment of the present invention comprises:
Add a preparation method for brazing tin bar, comprise the following steps:
(1) take soldering tin bar component, take metallic nickel 0.5-0.85 part respectively, metallic tin 70-75 part, bismuth metal 0.5-0.95 part, metallic lead 1-3.5 part, metallic copper 5-10 part, described number is weight proportion,
(2) fusing of soldering tin bar, drops into melting furnace by the above-mentioned metal taken, fully stirs, until it all melts,
(3) moulding by casting, is poured on mould by the mixture obtained in step (2), moulding by casting.
This soldering tin bar takes full advantage of the heat conductivility of copper metal, and enhance burn-off rate and the speed of welding of scolding tin, improve the production effect of welding, result of use is better.
The temperature of described melting furnace remains on 330-365 degree Celsius, and fusing time is 10-15 minute.
0.12-0.25 part gold is also comprised in described soldering tin bar component.
0.55-0.85 part rare earth alloy is also comprised in described soldering tin bar component.
Be different from prior art, the soldering tin bar that the preparation method that the present invention adds brazing tin bar is made takes full advantage of the heat conductivility of copper metal, and enhance burn-off rate and the speed of welding of scolding tin, improve the production effect of welding, result of use is better.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.

Claims (4)

1. add a preparation method for brazing tin bar, it is characterized in that, comprise the following steps:
(1) take soldering tin bar component, take metallic nickel 0.5-0.85 part respectively, metallic tin 70-75 part, bismuth metal 0.5-0.95 part, metallic lead 1-3.5 part, metallic copper 5-10 part, described number is weight proportion,
(2) fusing of soldering tin bar, drops into melting furnace by the above-mentioned metal taken, fully stirs, until it all melts,
(3) moulding by casting, is poured on mould by the mixture obtained in step (2), moulding by casting.
2. the preparation method adding brazing tin bar according to claim 1, is characterized in that, the temperature of described melting furnace remains on 330-365 degree Celsius, and fusing time is 10-15 minute.
3. the preparation method adding brazing tin bar according to claim 1, is characterized in that, also comprises 0.12-0.25 part gold in described soldering tin bar component.
4. the preparation method adding brazing tin bar according to claim 1, is characterized in that, also comprises 0.55-0.85 part rare earth alloy in described soldering tin bar component.
CN201510850451.9A 2015-11-30 2015-11-30 Manufacturing method for copper-added soldering tin bar Pending CN105290639A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510850451.9A CN105290639A (en) 2015-11-30 2015-11-30 Manufacturing method for copper-added soldering tin bar

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510850451.9A CN105290639A (en) 2015-11-30 2015-11-30 Manufacturing method for copper-added soldering tin bar

Publications (1)

Publication Number Publication Date
CN105290639A true CN105290639A (en) 2016-02-03

Family

ID=55188821

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510850451.9A Pending CN105290639A (en) 2015-11-30 2015-11-30 Manufacturing method for copper-added soldering tin bar

Country Status (1)

Country Link
CN (1) CN105290639A (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0988920A1 (en) * 1998-09-14 2000-03-29 Murata Manufacturing Co., Ltd. Soldered article
JP2001001180A (en) * 1999-06-21 2001-01-09 Tanaka Electronics Ind Co Ltd Solder and electronic part using the solder
CN101011782A (en) * 2007-01-24 2007-08-08 太仓市南仓金属材料有限公司 Leadless soft tin solder
CN101036961A (en) * 2006-03-15 2007-09-19 亚通电子有限公司 Lead-free tin-radicel soft solder
CN101264557A (en) * 2008-01-07 2008-09-17 常州市晶尔力金属制品厂 Tin-copper base lead-free solder and preparation thereof
CN104526190A (en) * 2014-12-23 2015-04-22 苏州龙腾万里化工科技有限公司 Novel tin bar manufacturing method
CN104625464A (en) * 2014-12-23 2015-05-20 苏州龙腾万里化工科技有限公司 Novel lead-free tin bar

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0988920A1 (en) * 1998-09-14 2000-03-29 Murata Manufacturing Co., Ltd. Soldered article
JP2001001180A (en) * 1999-06-21 2001-01-09 Tanaka Electronics Ind Co Ltd Solder and electronic part using the solder
CN101036961A (en) * 2006-03-15 2007-09-19 亚通电子有限公司 Lead-free tin-radicel soft solder
CN101011782A (en) * 2007-01-24 2007-08-08 太仓市南仓金属材料有限公司 Leadless soft tin solder
CN101264557A (en) * 2008-01-07 2008-09-17 常州市晶尔力金属制品厂 Tin-copper base lead-free solder and preparation thereof
CN104526190A (en) * 2014-12-23 2015-04-22 苏州龙腾万里化工科技有限公司 Novel tin bar manufacturing method
CN104625464A (en) * 2014-12-23 2015-05-20 苏州龙腾万里化工科技有限公司 Novel lead-free tin bar

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Application publication date: 20160203

RJ01 Rejection of invention patent application after publication