CN105289767B - Micro-fluidic chip - Google Patents
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- CN105289767B CN105289767B CN201510766518.0A CN201510766518A CN105289767B CN 105289767 B CN105289767 B CN 105289767B CN 201510766518 A CN201510766518 A CN 201510766518A CN 105289767 B CN105289767 B CN 105289767B
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Abstract
The invention discloses a micro-fluidic chip. The micro-fluidic chip comprises a PMMA plate, a double faced copper-clad PCB clad laminate, a control circuit structure and an electronic component. The PCB clad laminate and the PMMA plate are performed with hot pressing through a double-side acrylic acid ester pressure-sensitive tape, and solidified, bound and sealed to form a micro channel structure. According to the invention, the micro channel structure and the control circuit structure are formed by etching the double faced copper-clad PCB clad laminate, the micro channel structure is used for fluid flow, the formed circuit structure can be used for carrying the electronic component, the micro channel structure and the circuit structure are integrated, so that control and detection on the fluid can be realized. The micro-fluidic chip has the advantages of low processing cost, fast making period, and high yield; and has wide application prospect in fields of real-time on-line detection of the fluid, micro reaction synthesis, and conveying and control of the fluid.
Description
Technical field
The present invention relates to microflow control technique chip field, more particularly to a kind of to carry electronics unit based on PCB-PMMA materials
The micro-fluidic chip of device.
Background technology
Micro-fluidic chip refers to the chemistry built on one piece several square centimeters of chip or biology laboratory.It will change
The basic operation such as involved sample preparation, reaction, separation, detection, cell culture, sorting, cracking in the field such as and biology
Unit is integrated on the chip of one piece of very little, forms network by microchannel, runs through whole system with controllable fluid, to realize
The various functions of conventional chemical or biology laboratory.Micro-fluidic chip on device be mainly characterized by its accommodate fluid it is effective
Structure (including passage, reative cell and some other functional parts) is micron order yardstick at least in a dimension.With macroscopical chi
The experimental provision of degree is compared, and the micron scale construction of micro-fluidic chip significantly increases the area volume ratio of fluid environment.This
Change causes a series of peculiar effects relevant with body surface, determining its property in microfluidic system.These effects
Most of the analytical performance of micro-fluidic chip should be made significantly beyond the analysis system under macroscopic conditions.
1 (Becker H.Microfluidic Devices and SystemsII.1999,3877 of document:74-79.) report
A kind of road poly (methyl methacrylate) plate (PMMA) chip, first by the techniques such as silicon body etching, Soft lithograph, CNC processing make silicon, SU8,
Metal form, is copied to formwork structure on PMMA plates by hot compression deformation, makes MCA, then by thermocompression bonding
Method will be bonded with another piece of PMMA plates sealing with MCA PMMA plates.The micro-fluidic chip due to need process template,
Fabrication cycle length, high processing charges and production costs, complex process are loaded down with trivial details.Also, circuit is hardly formed on PMMA chips, is needed
By magnetron sputtering, electrode or circuit are formed, this shortcoming prevents PMMA micro-fluidic chips from carrying electronic devices and components, it is difficult to
Realize on-line checking microfluid information.
Chinese patent 201210446002.4 discloses a kind of preparation method of micro-fluidic chip, is made using uv-curable glue
For adhesive, cover plate and printed circuit board (PCB) (pcb board) are sealed by spin coating whirl coating, ultra-violet curing technique, but spin coating
The rubber thickness asymmetry that whirl coating technique is obtained so that MCA is easily blocked by photoresist, and is needed using ultraviolet
Light irradiation realizes the solidification of uv-curable glue, therefore it is required that cover plate is transparent, it is impossible to realize the system of multiple structure PCB micro-fluidic chips
It is standby.
Chinese patent 201010192151.3 discloses a kind of ultrasonic standing wave type micro-fluidic chip, however PCB circuits with it is micro-
Micro-fluidic chip need to be encapsulated with pcb board by a fluidic chip not entirety by using securing member, and this process seal is not
It is by the photoetching on chip and magnetron sputtering electrode that height, the easy side leakage of fluid, and micro-fluidic chip are connected with PCB circuits,
Could realize being connected with PCB circuits, complex process is loaded down with trivial details.
The content of the invention
It is an object of the invention to provide a kind of micro-fluidic chip, described micro-fluidic chip includes PMMA plates, two-sided covers
The pcb board of copper, control circuit structure and electronic devices and components, pcb board and PMMA plates are by sided acrylic ester pressure-sensitive adhesive tape warm
It is bonded and sealed to form MCA after cured, wherein, pcb board forms microfluidic channel by etching copper layer and lays control
Circuit structure, is equipped with electronic devices and components in control circuit structure.
In one specific embodiment of the present invention, a kind of micro-fluidic chip of Concentration Testing, institute are further provided
State micro-fluidic chip include the pcb board of ground floor double-sided copper-clad, ground floor PMMA plates, the pcb board of second layer double-sided copper-clad, second
The sided acrylic ester pressure-sensitive adhesive tape and phase of layer PMMA plates, the pcb board of third layer double-sided copper-clad, bonding pcb board and PMMA plates
The control circuit answered and electronic devices and components.
Wherein, the upper surface of the pcb board of described ground floor double-sided copper-clad is etched with control circuit, the pad of control circuit
Place's attachment LED electronic devices and components, as the light source of detection chip.Be machined with the pcb board of ground floor double-sided copper-clad sample outlet hole and
Light path hole.
Sample outlet hole corresponding with the pcb board of ground floor double-sided copper-clad is machined with described ground floor PMMA plates.
The upper and lower surface of the pcb board of described second layer double-sided copper-clad is etched with very low power, and is machined with sample outlet hole.
Sample holes corresponding with the pcb board of third layer double-sided copper-clad are machined with described second layer PMMA plates.
The lower surface of the pcb board of described third layer double-sided copper-clad is etched with control circuit structure, and is machined with light path hole,
Sample holes, mount photoconductive resistance, will transmit through optical signal and be converted into the signal of telecommunication at the pad of control circuit structure.
It is bonded and sealed to be formed between each layer pcb board and PMMA plates after sided acrylic ester pressure-sensitive adhesive tape hot-press solidifying
MCA.Electronic devices and components are pasted after pcb board is bonded and sealed with PMMA plates on the pad of corresponding control circuit
Dress.
In another specific embodiment of the present invention, further decline fluidic chip there is provided a kind of micro-valve control, institute
The micro-valve stated decline fluidic chip include PMMA plates, the pcb board of ground floor double-sided copper-clad, the pcb board of second layer double-sided copper-clad,
The pcb board of three layers of double-sided copper-clad, sided acrylic ester pressure-sensitive adhesive tape and corresponding control circuit and electronic devices and components.
Wherein, the upper surface of the pcb board of described ground floor double-sided copper-clad is etched with microchannel, and microchannel two ends are machined with
Through hole, the lower surface of the pcb board of double-sided copper-clad are etched with bicyclic and monocyclic circular valve arrangement centered on two through holes.
The upper surface of the pcb board of described second layer double-sided copper-clad is etched with microchannel, and microchannel two ends are machined with through hole,
The pcb board of second layer double-sided copper-clad is machined with through hole as heating chamber.
The upper and lower surface of the pcb board of described third layer double-sided copper-clad is etched with control circuit, upper surface control circuit
Connection thermal resistance wire, lower surface control circuit mount electronic components and parts, the pcb board of third layer double-sided copper-clad be also machined with sample outlet hole and
Sample holes.
Present invention also offers the preparation method of above-mentioned micro-fluidic chip, comprises the following steps that：
The MCA of micro-fluidic chip is first depending on, pcb board figure is drawn, by etching copper layer in double-sided copper-clad
Microfluidic channel is formed on pcb board and control circuit structure is laid, the PMMA plates of design size are cut, and in pcb board and PMMA
Positional punch on plate, then solidifies sided acrylic ester pressure-sensitive adhesive tape by PMMA plates and pcb board thermocompression bonding by pressure sintering,
The microchannel of sealing is formed, the soldering electronic devices and components in the control circuit structure of pcb board, that is, prepare based on PCB- afterwards
PMMA materials can carry the micro-fluidic chip of electronic devices and components.
The pcb board base material of the double-sided copper-clad includes paper base material, glass cloth base material, epoxy resin base material, polyester resin
Class base material, heat-resisting thermoplastic matrix or flexible copper-clad paper tinsel base material.
In the thermocompression bonding technique, pressure is 1200～1800N, and temperature is 50～65 DEG C, hold time as 300～
600s。
Described sided acrylic ester pressure-sensitive adhesive tape is self-supporting adhesive tape.In the polyester film support material of 1mil thickness
Acrylic Pressure Sensitive Adhesive (thickness deviation ± 0.001mils) of the uniform coating thickness for 1.1mils on material two sides.Adhesive tape is total
Thickness is 3.2mils.
Compared with prior art, remarkable advantage of the invention is as follows：
(1) by etching double-sided copper-clad pcb board layers of copper, very low power structure and control circuit structure, micro- ditch of formation are formed
Slot structure is used for flow of fluid, and the circuit structure of formation can carry electronic devices and components, and MCA is integrated with circuit structure
Integrally, the control and detection of convection cell are realized；
(2) PCB layers of copper MCA is covered with PMMA using sided acrylic ester pressure-sensitive adhesive tape by heat pressing process
Plate adhesive seal, heat pressing process are simple, convenient, it is easy to accomplish, sided acrylic ester pressure-sensitive adhesive tape be self supporting structure, thickness
It is extremely uniform, microchannel blocking is not susceptible to, viscosity is strong, good airproof performance, and chemical inertness is strong, does not occur with most of chemical reagent
Reaction, it is possible to achieve the sealing superposition of multi-layer PCB board；
(3) using the PMMA with superior optical characteristics as cover plate, simple processing, low cost, and PMMA materials
Hydrophobic character is conducive to drop molding and microchannel surface is modified.
The present invention micro-fluidic chip processing cost is low, fabrication cycle fast, high yield rate, detect in fluid real-time online,
It is micro- be synthesized, fluid conveying with control etc. field be with a wide range of applications.
Description of the drawings
Fig. 1 is the microfluidic chip structure schematic diagram of the present invention.
Fig. 2 is Concentraton gradient optical detection micro-fluidic chip schematic diagram in embodiment 1.
Fig. 3 be embodiment 1 in Concentraton gradient optical detection micro-fluidic chip ground floor pcb board positive and negative channel design and
Electrical block diagram.
Fig. 4 is the ground floor PMMA plate structure schematic diagrams of Concentraton gradient optical detection micro-fluidic chip in embodiment 1.
Fig. 5 be embodiment 1 in Concentraton gradient optical detection micro-fluidic chip second layer pcb board positive and negative channel design and
Electrical block diagram.
Fig. 6 is the second layer PMMA plate structure schematic diagrams of Concentraton gradient optical detection micro-fluidic chip in embodiment 1.
Fig. 7 is the third layer pcb board channel design of Concentraton gradient optical detection micro-fluidic chip in embodiment 1 and circuit knot
Structure schematic diagram.
Fig. 8 is that micro-valve declines fluidic chip structural representation in embodiment 2.
Fig. 9 is that the decline ground floor pcb board positive and negative channel design and micro-valve structure of fluidic chip of micro-valve is shown in embodiment 2
It is intended to.
Figure 10 is that the decline second layer pcb board positive and negative channel design and heating chamber of fluidic chip of micro-valve is shown in embodiment 2
It is intended to.
Figure 11 is that micro-valve declines the third layer pcb board positive and negative electrical block diagram of fluidic chip in embodiment 2.
Specific embodiment
The present invention is described in further detail with reference to specific embodiments and the drawings.It should be understood that these embodiments are only
For illustrating the present invention rather than limiting the scope of the present invention.Any similar to described content or impartial method and material
All can be applicable in the present invention.Preferable implementation described in embodiment is only presented a demonstration with material and is used.
The pcb board etching technics of the double-sided copper-clad described in following examples includes existing industrial pcb board etching technics, work
Skill requires minimum feature 0.1mm, and smallest passage spacing is 0.1mm, and repeatable accuracy is in ± 0.001mm, resolution 0.5um, processing
Face width 229mm × 305mm × 27mm；Described sided acrylic ester pressure-sensitive adhesive tape is self-supporting adhesive tape, in 1mil thickness
Polyester film support material two sides on uniform coating thickness for 1.1mils Acrylic Pressure Sensitive Adhesive (thickness deviation ±
0.001mils), adhesive tape gross thickness is 3.2mils.
With reference to Fig. 1, a kind of micro-fluidic chip, by PMMA plates (1), the pcb board (2) of double-sided copper-clad, control circuit structure (3)
Constitute with electronic devices and components (4), pcb board and PMMA plates are bondd after sided acrylic ester pressure-sensitive adhesive tape (5) hot-press solidifying
Sealing forms MCA, wherein, the one side of pcb board is etched with microfluidic channel (6), and the another side of pcb board is etched with control
Circuit structure (3) processed, is equipped with electronic devices and components (4) in control circuit structure (3).
A kind of preparation method of micro-fluidic chip, first by etching technics, the one side face layers of copper of pcb board is etched to be formed
Very low power, the another side layers of copper of pcb board etch to form control circuit structure, then will with sided acrylic ester pressure-sensitive adhesive tape
Pcb board and PMMA plate green tacks, and by Tbon-100 automated bonding machines, continu to press is 1200～1800N, is arranged
Temperature is 55～65 DEG C, is held time as 300～600s, solidifies sided acrylic ester pressure-sensitive adhesive tape by PMMA by pressure sintering
With pcb board thermocompression bonding, the microchannel of sealing is formed, finally the mount electronic components and parts in control circuit structure, that is, be prepared into
To the micro-fluidic chip that electronic devices and components can be carried based on PCB-PMMA materials.
Embodiment 1：Concentraton gradient optical detection micro-fluidic chip
With reference to Fig. 2～Fig. 7：
As shown in Fig. 2 pcb board (1), ground floor of the Concentraton gradient optical detection micro-fluidic chip by ground floor double-sided copper-clad
PMMA plates (2), the pcb board (3) of second layer double-sided copper-clad, second layer PMMA plates (4), the pcb board (5) of third layer double-sided copper-clad,
Sided acrylic ester pressure-sensitive adhesive tape (6) and corresponding control circuit (7) (16) and electronics unit device of bonding pcb board and PMMA plates
Part (8) (19) is constituted.
Copper layer thickness on the pcb board of double-sided copper-clad is 70 μm, and the size of PMMA plates is 25mm*75mm.
As shown in figure 3, the upper surface of the pcb board (1) of ground floor double-sided copper-clad is etched with control circuit (7), control circuit
(7) LED electronic devices and components (8) are mounted at pad, as the light source of detection chip.On the pcb board (1) of ground floor double-sided copper-clad
It is machined with sample outlet hole (9) and light path hole (10).
As shown in figure 4, be machined with ground floor PMMA plates (2) it is corresponding with the pcb board (1) of ground floor double-sided copper-clad go out sample
Hole (11).
As shown in figure 5, the upper surface of the pcb board (3) of second layer double-sided copper-clad is etched with very low power (13), lower surface etching
There is very low power (12), and be machined with sample outlet hole (14).
As shown in fig. 6, sample introduction corresponding with the pcb board (5) of third layer double-sided copper-clad is machined with second layer PMMA plates (4)
Hole (15).
As shown in fig. 7, the lower surface of the pcb board (5) of third layer double-sided copper-clad is etched with control circuit structure (16), and add
Work has light path hole (17), and sample holes (18) mount photoconductive resistance (19), will transmit through light letter at the pad of control circuit structure (16)
Number it is converted into the signal of telecommunication.
It is bonded and sealed after sided acrylic ester pressure-sensitive adhesive tape (6) hot-press solidifying between each layer pcb board and PMMA plates
Form MCA.Electronic devices and components are enterprising in the pad of corresponding control circuit after pcb board is bonded and sealed with PMMA plates
Row attachment.
By sided acrylic ester pressure-sensitive adhesive tape (6) in Fig. 2, successively by PCB (1), PMMA (2) PCB (3), PMMA
(4), PCB (5) green tack.And by Tbon-100 automated bonding machines, be 1500N in continuous, temperature is 60 DEG C, is maintained
Time is 400s.By pressure sintering curing adhesive by PMMA and pcb board thermocompression bonding, the microchannel of sealing is formed.Finally paste
Dress electronic devices and components (8) (19).
Concentraton gradient optical detection micro-fluidic chip operation principle is：The solution of two kinds of variable concentrations by through hole (18),
Through hole (15) into MCA (12), fluid through design circulation path cause two kinds of sample solutions be divided into 6 kinds it is different
The solution of Concentraton gradient, from hole (14) by the following table surface current of PCB (3) to upper surface, then by MCA (13), Jing Guotong
Hole (11) through hole (9) flows out PMMA-PCB micro-fluidic chips.Wherein fluid by through hole (14) when, on pcb board (1)
LED light source (8) transmits the solution in through hole (14) by light path hole (10), is shone through light path hole (17) through the light of solution again
The photoconductive resistance (19) of pcb board (5) lower surface is mapped to, optical signal is changed into the signal of telecommunication by photoconductive resistance, and output image signal turns
Each passage solution concentration signal is melted into, so as to reach the function of Concentraton gradient optical detection.
Embodiment 2：Micro-valve declines fluidic chip
With reference to Fig. 8～Figure 11：
As shown in figure 8, micro-valve declines, fluidic chip is by PMMA plates (1), the pcb board (2) of ground floor double-sided copper-clad, the second layer
The pcb board (3) of double-sided copper-clad, the pcb board (4) of third layer double-sided copper-clad, sided acrylic ester pressure-sensitive adhesive tape (19) and corresponding
Control circuit (13) (14) and electronic devices and components (15) (16) constitute.
As described in Figure 9, the upper surface of the pcb board (2) of ground floor double-sided copper-clad is etched with microchannel (5), microchannel (5) two
End is machined with through hole (8), and the lower surface of the pcb board (2) of double-sided copper-clad etches bicyclic valve arrangement (6) centered on two through holes
With monocyclic valve arrangement (7).Microchannel (5) width is 0.1mm, and depth is 70um, and this MCA (5) leads to as the gas storage of valve
Road connects two valve arrangements (6) (7).In figure, black is the layers of copper not being etched.The inner ring width of bicyclic valve arrangement (6) is 1mm,
Depth is 70 μm, and radius is 3mm, and valve arrangement (6) outer ring width is 1mm, and depth is 70 μm, and radius is 10mm.Monocyclic valve arrangement
(7) ring width is 1mm, and depth is 70 μm, and radius is 10mm.A diameter of 1mm of two through holes (8).
As shown in Figure 10, the upper surface of the pcb board (3) of second layer double-sided copper-clad is etched with microchannel (9), microchannel (9)
Two ends are machined with through hole (10) and through hole (11), and through hole (10) is sample outlet hole, and through hole (11) is sample holes.Second layer double-sided copper-clad
Pcb board (3) be machined with through hole (12) as heating chamber.The width of MCA (9) is 0.1mm, and depth is 70 μm.Two
The a diameter of 1mm of through hole (10) (11).The a diameter of 10mm of through hole (12).
As shown in figure 11, the upper and lower surface of the pcb board (4) of third layer double-sided copper-clad is etched with control circuit, upper surface
Control circuit (13) connection thermal resistance wire (15), lower surface control circuit (14) mount electronic components and parts (16), control thermal resistance wire add
Heat and stopping heating.The pcb board (4) of third layer double-sided copper-clad is also machined with through hole (17) and through hole (18), and through hole (17) is
Sample hole, through hole (18) are sample holes.The a diameter of 1mm of two through holes (17) (18).
Shown in Fig. 8, the PCB (2) (3) and welding kesistance of etching will be completed using sided acrylic ester pressure-sensitive adhesive tape (19)
The pcb board (4) of silk, poly (methyl methacrylate) plate (PMMA) (1) green tack.In continuous 1800N, the pressure of about 0.75MPa is in core
On piece, temperature is kept for 55 DEG C, there is provided the time of lasting pressure and temperature is 600s.By pressure sintering curing adhesive by PMMA
With pcb board thermocompression bonding, sealing passage is formed.Last pcb board (4) lower surface mount electronic components and parts (16).
The decline operation principle of fluidic chip of micro-valve is：Sided acrylic ester pressure-sensitive adhesive tape (19) is used as flap, Figure 10
In through hole (12) be heating chamber, controlled by heating control circuit (13) (14) empty in thermal resistance wire (15) heating cavities (12)
Gas.So that sided acrylic ester pressure-sensitive adhesive tape (19) is expanded as flap so that monocyclic valve arrangement in fig .9
(7) sided acrylic ester pressure-sensitive adhesive tape (19) on surface is expanded as flap.Cause the gas expansion in passage (5) so that
Bicyclic valve arrangement (6) surface sided acrylic ester pressure-sensitive adhesive tape (19) in fig .9 is expanded as flap, and film lobe blocks Figure 10
In passage (9).The interior air of resistive heater heating cavities (12) is stopped by control circuit (13) (14).So that two-sided third
Olefin(e) acid ester pressure-sensitive adhesive tape (19) is shunk as flap so that two-sided the third of monocyclic valve arrangement (7) surface in fig .9
Olefin(e) acid ester pressure-sensitive adhesive tape (19) is shunk as flap.Cause the contraction of gas in passage (5) so that valve arrangement in fig .9
(6) surface sided acrylic ester pressure-sensitive adhesive tape (19) is expanded as flap, and film lobe shrinks so that the passage (9) in Figure 10 is smooth
It is logical, so as to reach the function of micro- valve controls fluid.
Claims (4)
1. a kind of micro-fluidic chip, it is characterised in that described micro-fluidic chip successively by the pcb board of ground floor double-sided copper-clad,
Ground floor PMMA plates, the pcb board of second layer double-sided copper-clad, second layer PMMA plates, the pcb board of third layer double-sided copper-clad and corresponding
Control circuit and electronic devices and components are constituted, and described pcb board and PMMA plates are close by sided acrylic ester pressure-sensitive adhesive tape bonding
Envelope；
Wherein, the upper surface of the pcb board of described ground floor double-sided copper-clad is etched with control circuit, pastes at the pad of control circuit
Dress LED electronic devices and components, are machined with sample outlet hole and light path hole on the pcb board of ground floor double-sided copper-clad；
Sample outlet hole corresponding with the pcb board of ground floor double-sided copper-clad is machined with described ground floor PMMA plates；
The upper and lower surface of the pcb board of described second layer double-sided copper-clad is etched with very low power, and is machined with sample outlet hole；
Sample holes corresponding with the pcb board of third layer double-sided copper-clad are machined with described second layer PMMA plates；
The lower surface of the pcb board of described third layer double-sided copper-clad is etched with control circuit structure, and is machined with light path hole and enters
Sample hole, mounts photoconductive resistance at the pad of control circuit structure.
2. a kind of method for preparing micro-fluidic chip as claimed in claim 1, it is characterised in that comprise the following steps that：First
According to the MCA of micro-fluidic chip, pcb board figure is drawn, forms micro- by etching copper layer on the pcb board of double-sided copper-clad
Fluid passage and laying control circuit structure, cut the PMMA plates of design size, and the positional punch on pcb board and PMMA plates,
Then sided acrylic ester pressure-sensitive adhesive tape is solidified by PMMA plates and pcb board thermocompression bonding by pressure sintering, forms the micro- of sealing
Passage, the soldering electronic devices and components in the control circuit structure of pcb board, that is, prepared and can be taken based on PCB-PMMA materials afterwards
Carry the micro-fluidic chip of electronic devices and components.
3. preparation method according to claim 2, it is characterised in that in the thermocompression bonding technique, pressure is 1200～
1800N, temperature are 50～65 DEG C, are held time as 300～600s.
4. preparation method according to claim 2, it is characterised in that described sided acrylic ester pressure-sensitive adhesive tape be from
Support adhesive tape.
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| CN107734840B (en) * | 2017-11-29 | 2023-08-18 | 中国电子科技集团公司第二十六研究所 | Liquid cooling structure based on three-dimensional micro-channel array of printed circuit board |
| CN112892619B (en) * | 2019-12-04 | 2022-07-15 | 香港城市大学深圳研究院 | PDMS (polydimethylsiloxane) master mold with arc-shaped edge section, micro-fluidic valve and chip and preparation thereof |
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| EP1911078A1 (en) * | 2005-07-25 | 2008-04-16 | Koninklijke Philips Electronics N.V. | Interconnection and packaging method for biomedical devices with electronic and fluid functions |
| CN101738428A (en) * | 2008-11-17 | 2010-06-16 | 北京市刑事科学技术研究所 | Method for preparing drug testing chips |
| CN101881779B (en) * | 2010-05-31 | 2012-06-27 | 武汉大学 | Ultrasonic standing wave type micro-fluidic chip and preparation method thereof |
| GB201014805D0 (en) * | 2010-09-07 | 2010-10-20 | Multi Sense Technologies Ltd | Microfluidics based assay device |
| CN102923643A (en) * | 2012-11-09 | 2013-02-13 | 北京科技大学 | Method for producing novel micro-fluidic chip based on industrial standard printed circuit board process |
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