CN105278615A - Heating radiating tablet computer mainboard - Google Patents

Heating radiating tablet computer mainboard Download PDF

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Publication number
CN105278615A
CN105278615A CN201410284724.3A CN201410284724A CN105278615A CN 105278615 A CN105278615 A CN 105278615A CN 201410284724 A CN201410284724 A CN 201410284724A CN 105278615 A CN105278615 A CN 105278615A
Authority
CN
China
Prior art keywords
circuit board
tablet computer
air pump
heat radiator
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410284724.3A
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Chinese (zh)
Inventor
左维保
何蕾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ANHUI PROVINCE NATIONTEK TECHNOLOGY Co Ltd
Original Assignee
ANHUI PROVINCE NATIONTEK TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ANHUI PROVINCE NATIONTEK TECHNOLOGY Co Ltd filed Critical ANHUI PROVINCE NATIONTEK TECHNOLOGY Co Ltd
Priority to CN201410284724.3A priority Critical patent/CN105278615A/en
Publication of CN105278615A publication Critical patent/CN105278615A/en
Pending legal-status Critical Current

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Abstract

The invention discloses a heating radiating tablet computer mainboard, comprising a circuit board, sockets, and electronic components, and the mainboard also comprises cooling fins and a water-cooling assembly. The cooling fin is on the back surface of the circuit board, and the cooling fin and the circuit board are connected by threads. The water-cooling assembly comprises a micro air pump and water pipes. The micro air pump is on the back surface of the circuit board. The micro air pump and the circuit board are connected by threads. The water pipes are among the cooling fins, the water pipes and the cooling fins are connected by snap joint. Rubber pads are arranged on depressions on four corners of the outer side of the circuit board of the heating radiating tablet computer mainboard, the outer side being provided with the cooling fins. Thus, gaps are between the circuit board and the cooling fins. In addition, the spacers of the cooling fins are in an S shape, and the S-shaped concave position is provided with a buckle, a convex position is provided with a round hole. The water pipe is fixed by the buckle, the water pipe passes through the round holes. The water pipes are distributed on the cooling fins. Pure water is realized to be filled in the water pipes. Through the micro air pump, rapid circulating cooling is realized, the air outlet and the air inlet of the air pump are provided with filter screens which are fixed by hoops, so as to realize double-layer purification, thereby ensuring unblocked internal circulation of the water pipes and achieving continuous, rapid, and slient heat radiation effect.

Description

A kind of heat radiation main board of tablet computer
Technical field
The present invention relates to electronics mainboard, particularly relate to a kind of heat radiation main board of tablet computer.
Background technology
Existing main board of tablet computer is generally made up of parts such as circuit board, socket and electronic devices and components, and along with the maturation further of electronic technology, the demand of main board of tablet computer increases year by year, mainboard is the core component of panel computer, can produce amount of heat during work, conventional heat dissipating method is heat radiator and fan, can not meet quick heat radiating object, and along with increasing service time, the dust accumulation of fan, noise is large, and radiating effect is poor, cause heat dissipation for circuit board not in time, finally burn.In view of above-mentioned defect, be necessary in fact to design a kind of heat radiation main board of tablet computer.
Summary of the invention
Technical matters to be solved by this invention is: provide a kind of heat radiation main board of tablet computer, solves the efficient long-time heat dissipation problem of main board of tablet computer.
For solving the problems of the technologies described above, technical scheme of the present invention is: a kind of heat radiation main board of tablet computer, comprise circuit board, socket and electronic devices and components, characterized by further comprising heat radiator and water-cooled assembly, described heat radiator is positioned at back of circuit board, the two screw thread is connected, described water-cooled assembly comprises micro air pump and water pipe, and described micro air pump is positioned at back of circuit board, and the two screw thread is connected, described water pipe is between heat radiator, and the two buckle is connected.
Further, described micro air pump is also provided with filter screen, and filter screen is positioned at gas outlet and air intake opening, and filter screen connects with gas port clip.
Further, the corner place of described heat radiator top outer is also provided with recess, and the shape of recess is rectangle.
Further, the recess place, corner of described heat radiator top outer is also provided with rubber blanket, and rubber blanket is higher than heat radiator top 4-6mm.
Further, described heat radiator comprises heat sink and multiple row partition, and the two is integrated, shape ' S ' shape of partition.
Further, also porose position, described heat radiator top, the shape in hole is manhole, the convex place of hole is positioned at ' S ' shape.
Further, described heat radiator is also provided with annular buckle, the spill place of buckle is distributed in ' S ' shape, and the two screw thread is connected.
Compared with prior art, fill gelled corner recess outside the circuit board of this heat radiation main board of tablet computer and rubber blanket is housed, circuit board and heat radiator is made to have gap, the partition shape of heat radiator is ' S ' shape in addition, ' S ' shape recess on buckle is housed, convex position has circular hole, water pipe is formalized by buckle, circular hole interts, gather on a heat sink, realize in water pipe filling water purification, Rapid Circulation cooling is being realized via micro air pump, because the gas outlet of air pump and air intake opening have clip, fixing filter screen realizes two level evolution, ensure that water pipe inner loop is unimpeded, reach quiet radiating effect continuously and healthily.
Accompanying drawing content
Fig. 1 is the front view of heat radiation main board of tablet computer
Fig. 2 is the cut-open view of heat radiation main board of tablet computer
Circuit board 1 micro air pump 501
Socket 2 water pipe 502
Electronic devices and components 3 filter screen 503
Heat radiator 4 clip 504
Water-cooled assembly 5 buckle 401
Rubber blanket 402
Following embodiment will further illustrate in conjunction with above-mentioned accompanying drawing.
Embodiment
Hereinafter, set forth multiple specific detail, to provide the thorough understanding to the concept forming described embodiment basis.But to one skilled in the art, embodiment described obviously can be put into practice when not have in these specific detail some or all.In other cases, well-known treatment step is not specifically described.
As shown in Figure 1, comprise circuit board 1, socket 2, electronic devices and components 3, heat radiator 4, water-cooled assembly 5, micro air pump 501, water pipe 502, filter screen 503, clip 504, buckle 401, rubber blanket 402, described heat radiator 4 is positioned at circuit board 1 back side, the two screw thread is connected, described water-cooled assembly 5 comprises micro air pump 501 and water pipe 502, described micro air pump 501 is positioned at circuit board 1 back side, the two screw thread is connected, described water pipe 502 is between heat radiator 4, the two buckle is connected, described micro air pump 501 is also provided with filter screen 503, filter screen 503 is positioned at gas outlet and air intake opening, filter screen 503 connects with gas port clip 504, the corner place of described heat radiator 4 top outer is also provided with recess, the shape of recess is rectangle, the recess place, corner of described heat radiator 4 top outer is also provided with rubber blanket 402, rubber blanket 402 is higher than heat radiator 4 top 4-6mm, described heat radiator 4 comprises heat sink and multiple row partition, the two is integrated, shape ' S ' shape of partition, described also porose position, heat radiator 4 top, the shape in hole is manhole, the convex place of hole is positioned at ' S ' shape, described heat radiator 4 is also provided with annular buckle 401, buckle 401 is distributed in the spill place of ' S ' shape, the two screw thread is connected, the corner recess that heat radiator 4 is housed outside the circuit board 1 of this heat radiation main board of tablet computer is equipped with rubber blanket 402, circuit board 1 and heat radiator 4 is made to have gap, the partition shape of heat radiator 4 is ' S ' shapes in addition, ' S ' shape recess on buckle 401 is housed, convex position has circular hole, water pipe 502 is formalized by buckle 401, circular hole interts, gather on heat radiator 4, realize in water pipe 502 filling water purification, Rapid Circulation cooling is being realized via micro air pump 501, because the gas outlet of air pump and air intake opening have clip 504, fixing filter screen 503 realizes two level evolution, ensure that water pipe 502 inner loop is unimpeded, reach quiet radiating effect continuously and healthily.
The present invention is not limited to above-mentioned concrete embodiment, and those of ordinary skill in the art is from above-mentioned design, and without performing creative labour, all conversion made, all drop within protection scope of the present invention.

Claims (7)

1. a heat radiation main board of tablet computer, comprise circuit board, socket and electronic devices and components, it is characterized in that comprising heat radiator and water-cooled assembly, described heat radiator is positioned at back of circuit board, and the two screw thread is connected, and described water-cooled assembly comprises micro air pump and water pipe, described micro air pump is positioned at back of circuit board, the two screw thread is connected, and described water pipe is between heat radiator, and the two buckle is connected.
2. a kind of heat radiation main board of tablet computer as claimed in claim 1, it is characterized in that described micro air pump is also provided with filter screen, filter screen is positioned at gas outlet and air intake opening, and filter screen connects with gas port clip.
3. a kind of heat radiation main board of tablet computer as claimed in claim 1, it is characterized in that the corner place of described heat radiator top outer is also provided with recess, the shape of recess is rectangle.
4. a kind of heat radiation main board of tablet computer as claimed in claim 3, it is characterized in that the recess place, corner of described heat radiator top outer is also provided with rubber blanket, rubber blanket is higher than heat radiator top 4-6mm.
5. a kind of heat radiation main board of tablet computer as claimed in claim 1, it is characterized in that described heat radiator comprises heat sink and multiple row partition, the two is integrated, shape ' S ' shape of partition.
6. heat radiation main board of tablet computer as claimed in claim 5 a kind of, it is characterized in that also porose position, described heat radiator top, the shape in hole is manhole, the convex place of hole is positioned at ' S ' shape.
7. heat radiation main board of tablet computer as claimed in claim 6 a kind of, is characterized in that described heat radiator is also provided with annular buckle, and the spill place of buckle is distributed in ' S ' shape, the two screw thread is connected.
CN201410284724.3A 2014-06-23 2014-06-23 Heating radiating tablet computer mainboard Pending CN105278615A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410284724.3A CN105278615A (en) 2014-06-23 2014-06-23 Heating radiating tablet computer mainboard

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410284724.3A CN105278615A (en) 2014-06-23 2014-06-23 Heating radiating tablet computer mainboard

Publications (1)

Publication Number Publication Date
CN105278615A true CN105278615A (en) 2016-01-27

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410284724.3A Pending CN105278615A (en) 2014-06-23 2014-06-23 Heating radiating tablet computer mainboard

Country Status (1)

Country Link
CN (1) CN105278615A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106255393A (en) * 2016-09-26 2016-12-21 珠海格力电器股份有限公司 A kind of heat dissipation pipeline structure being applied to electronic equipment and electronic equipment
CN106449242A (en) * 2016-12-06 2017-02-22 重庆工程职业技术学院 Detachable keyboard key unit with integrated mounting characteristics

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2717020Y (en) * 2004-06-04 2005-08-10 李荣裕 Heat exchanger for cooling facility of water-cooled computer CPU
CN200979879Y (en) * 2006-12-06 2007-11-21 上海市闵行中学 A CPU heat sink
CN102123575A (en) * 2010-01-12 2011-07-13 纬创资通股份有限公司 Heat radiation module and portable electronic device provided with same
US20130016473A1 (en) * 2011-07-11 2013-01-17 Panasonic Corporation Electronic Device
CN202887086U (en) * 2012-09-29 2013-04-17 四川奥格科技有限公司 Side-blown water-cooled central processing unit (CPU) radiator
CN204028755U (en) * 2014-06-23 2014-12-17 安徽省磊鑫科技有限公司 A kind of heat radiation main board of tablet computer

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2717020Y (en) * 2004-06-04 2005-08-10 李荣裕 Heat exchanger for cooling facility of water-cooled computer CPU
CN200979879Y (en) * 2006-12-06 2007-11-21 上海市闵行中学 A CPU heat sink
CN102123575A (en) * 2010-01-12 2011-07-13 纬创资通股份有限公司 Heat radiation module and portable electronic device provided with same
US20130016473A1 (en) * 2011-07-11 2013-01-17 Panasonic Corporation Electronic Device
CN202887086U (en) * 2012-09-29 2013-04-17 四川奥格科技有限公司 Side-blown water-cooled central processing unit (CPU) radiator
CN204028755U (en) * 2014-06-23 2014-12-17 安徽省磊鑫科技有限公司 A kind of heat radiation main board of tablet computer

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106255393A (en) * 2016-09-26 2016-12-21 珠海格力电器股份有限公司 A kind of heat dissipation pipeline structure being applied to electronic equipment and electronic equipment
CN106255393B (en) * 2016-09-26 2018-10-30 珠海格力电器股份有限公司 A kind of heat dissipation pipeline structure and electronic equipment applied to electronic equipment
CN106449242A (en) * 2016-12-06 2017-02-22 重庆工程职业技术学院 Detachable keyboard key unit with integrated mounting characteristics
CN106449242B (en) * 2016-12-06 2019-04-02 重庆工程职业技术学院 A kind of dismountable keyboard key of integral type installation

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Application publication date: 20160127