CN105252687B - A kind of preparation method of ultrasonic backing block, ultrasonic backing block and ultrasonic probe - Google Patents
A kind of preparation method of ultrasonic backing block, ultrasonic backing block and ultrasonic probe Download PDFInfo
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- CN105252687B CN105252687B CN201510644803.5A CN201510644803A CN105252687B CN 105252687 B CN105252687 B CN 105252687B CN 201510644803 A CN201510644803 A CN 201510644803A CN 105252687 B CN105252687 B CN 105252687B
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Abstract
The invention discloses a kind of preparation method of ultrasonic backing block, ultrasonic backing block and ultrasonic probe.The present invention relates to medical instruments field, there is provided a kind of preparation method of ultrasonic backing block, including：Extracting epoxy resin, the solid state powder containing at least two compositions are stand-by；The two is well mixed and removes bubble removing；Mixed solution is inserted into centrifugal device to be centrifuged first；Rubber is added into centrifugal device, the mixed solution of epoxy resin, solid state powder and rubber is centrifuged again, obtains the ultrasonic backing block sample block of hierarchy；Ultrasonic backing block sample block is subjected to cutting and obtains independent ultrasonic backing block.The present invention is by effectively being mixed and being layered the materials such as epoxy resin, solid state powder, rubber by centrifugal device, the sandwich construction ultrasound backing block of preset thickness and acoustic impedance is obtained, and then reaches improvement ultrasonic transducer bandwidth and the effect of sensitivity by changing back sheet acoustic impedance and thickness.The more matching layer manufacturing method thereof of this method is easier to implement, and avoids the selection because the material that the matching layer number of plies increases and brings, processing, the difficulty prepared.
Description
Technical field
The invention belongs to technical field of medical instruments, more particularly to a kind of preparation method of ultrasonic backing block, ultrasonic backing
Block structure and ultrasonic probe.
Background technology
Ultrasonic imaging is the detection and diagnostic means being widely used at present, and has the advantages that lossless, convenient, reliable, is passed through
Ultrasonic probe produces ultrasonic signal in light tight media, and receives institute's reflectance ultrasound in light tight object by probe
The information such as the intensity of ripple signal, frequency, time, phase, by handling the information, reflection institute detected object can be obtained
The visual image of internal structure acoustic characteristic distribution, and then detected or diagnostic result.
Such as Fig. 1, supersonic imaging apparatus includes probe 1, and the transducing of ultrasonic wave is launched and received to the core texture in probe 1 is
Device 2, probe 1 launches ultrasonic signal while keeping contacting with detection object 3 to detection object 3, while receiving by examining
The signal that the detection target surveyed in the body of object 3 reflects.Such as Fig. 2, transducer 2 includes：Piezoelectric element 21, for launching and connecing
Receive ultrasonic wave；Matching layer 22, the preceding surface of piezoelectric element 21 is arranged on, for reducing between detection object and piezoelectric element 21
Impedance mismatching；Back sheet 23, the rear surface of piezoelectric element 21 is arranged on, the ultrasound of the back-propagation for absorbing piezoelectric element 21
Ripple.
The performance quality of ultrasonic transducer mainly has two characterization parameters, i.e. frequency bandwidth and sensitivity.All the time, grind
Hair personnel do continuous exploration in terms of matching layer, constantly to be lifted frequency bandwidth and the sensitivity of ultrasonic transducer,
Bilayer, three layer the matching layer even matching layer of more layers of the structure with layer from initial individual layer matching layer till now.But
It is, with the increase of the matching layer number of plies, the preparation of selection, matching layer either from raw material and the follow-up mill of matching layer
Cut, cut etc. both increases many difficulty, also adds difficulty for the making of ultrasonic probe in succession.
The content of the invention
It is an object of the invention to provide a kind of preparation method of ultrasonic backing block, it is intended to by more holding than making matching layer
The technique easily implemented makes ultrasonic backing block, to improve the frequency bandwidth of ultrasonic transducer and sensitivity.
The present invention is achieved in that a kind of preparation method of ultrasonic backing block, comprises the steps：
Extracting epoxy resin, the solid state powder containing at least two compositions of micron dimension are stand-by；
The epoxy resin is well mixed with the solid state powder and removes bubble removing；
The mixed solution of the epoxy resin and solid state powder is inserted into centrifugal device to be centrifuged first；
Rubber is added into the centrifugal device, the mixed solution of the epoxy resin, solid state powder and rubber is entered
Row centrifuges again, obtains the ultrasonic backing block sample block of hierarchy；
The ultrasonic backing block sample block is cut, obtains independent ultrasonic backing block.
Another object of the present invention is to provide a kind of ultrasonic backing block, including the acoustic impedance stacked gradually it is different first
Back sheet, the second back sheet and the 3rd back sheet, first back sheet include the first particulate and epoxy resin, second back of the body
Lining includes the second particulate and epoxy resin, and the 3rd back sheet includes the 3rd particulate and epoxy resin, first particulate,
The particle diameter of second particulate and the 3rd particulate is respectively less than 40 microns, and the density of first back sheet is less than second back sheet
Density, the density of second back sheet are less than the density of the 3rd back sheet, first back sheet, the second back sheet and the 3rd
The thickness of back sheet is respectively less than the half of wavelength when ultrasonic wave transmits wherein.
Another object of the present invention is to provide a kind of ultrasonic probe, including transducer, the transducer includes described
Ultrasonic backing block.
The present invention by materials such as epoxy resin, solid state powder, rubber by centrifugal device mainly by effectively being mixed and being divided
Layer, the sandwich construction ultrasound backing block of preset thickness and acoustic impedance is obtained, and then by changing acoustic impedance, the thickness of every layer of back sheet
Degree improves bandwidth, the effect of sensitivity of ultrasonic transducer to reach.The preparation method compared to more matching Rotating fields selections,
Processing, making, cutting etc. are easier to implement, and then effectively avoid the choosing because the material that the matching layer number of plies increases and brings
The difficulty select, process, prepared.It is substantially better than using the frequency bandwidth and sensitivity of the ultrasonic transducer of the backing block using individual layer
The bandwidth of the transducer of back sheet and sensitivity, it is adapted to be widely used in supersonic imaging apparatus field.
Brief description of the drawings
Fig. 1 is the operation principle schematic diagram of supersonic imaging apparatus in the prior art；
Fig. 2 is the structural representation of ultrasonic transducer in the prior art；
Fig. 3 is the operation principle schematic diagram of ultrasonic transducer provided in an embodiment of the present invention；
Fig. 4 is the preparation method flow chart of ultrasonic backing block provided in an embodiment of the present invention；
Fig. 5 is the structural representation of ultrasonic backing block provided in an embodiment of the present invention.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
The embodiment of the present invention illustrates the performance parameter of ultrasonic transducer first.Ultrasonic transducer as shown in Figure 3, includes
Matching layer 01, backing block 03 and piezoelectricity a period of time 02 positioned there between, backing block 03 include three layers of back sheet, i.e. the first backing
The 031, second back sheet 032 of layer and the 3rd back sheet 033.When ultrasonic propagation is carried on the back to first backward caused by piezoelectricity a period of time 02
During the interface of lining 031, for a part of ultrasonic wave T4 because acoustic impedance difference between the two is back to piezoelectricity a period of time, a part is super
Sound wave T1 enters the first back sheet 031；With should T1 propagate to the interface of the first back sheet 031 and the second back sheet 032 when,
For a part of ultrasonic wave T5 because acoustic impedance difference is back to piezoelectricity a period of time 02, a part of ultrasonic wave T2 enters the second back sheet 032；Phase
That answers can also produce ultrasonic wave T6 and T3.If back wave T4, T5, T6 are strong, sensitivity is just high, if transmitted wave T1, T2, T3
By force, bandwidth is just wider, therefore according to the different demands for probe, can design the backing block of more backing Rotating fields, and then
By changing the acoustic impedance and thickness of every layer of back sheet, reach the purpose for the characteristic (bandwidth, sensitivity) for improving ultrasonic transducer.
The embodiment of the present invention provides a kind of method for making sandwich construction backing block.
It is described in detail below in conjunction with specific implementation of the specific embodiment to the present invention：
Fig. 4 is refer to, the embodiment of the present invention provides a kind of preparation method of ultrasonic backing block, comprised the steps：
In step S101, extracting epoxy resin, the solid state powder containing at least two compositions are stand-by；
In step s 102, epoxy resin is well mixed with solid state powder and removes bubble removing；
In step s 103, the mixed solution of epoxy resin and solid state powder is inserted into centrifugal device to be centrifuged first；
In step S104, rubber is added into centrifugal device, the mixing of epoxy resin, solid state powder and rubber is molten
Liquid is centrifuged again, obtains the ultrasonic backing block sample block of hierarchy；
In step S105, ultrasonic backing block sample block is cut, obtains independent ultrasonic backing block.
After above-mentioned steps, the backing block containing multilayer backing layer can be obtained, different back sheets have predetermined thickness and
Acoustic impedance, the acoustic impedance of every layer of back sheet are different.Ultrasonic transducer is adjusted by designing the backing layer thickness and acoustic impedance
Frequency bandwidth and sensitivity.
In above-mentioned steps S101, metal or nonmetallic micro mist shape solid powder that particle diameter is micron dimension are have selected, can
After ball mill is fully ground, will be sieved, be selected with the sub-sieve of corresponding mesh number from the solid powder particle of outside purchase
Take the particle of the uniform particle sizes filtered out stand-by.It is preferred by testing selection particle diameter for several times less than 40 μm, in favor of follow-up mixing
Uniform centrifugation is layered and then obtains preferable bandwidth and sensitivity.Epoxy resin then selects coefficient of viscosity relatively low in favor of true
Empty degasification, and the selection operation time is longer to prevent its too fast solidification.The rubber used in above-mentioned steps S104 also may be used
To get all the ready in the lump, rubber then selects the larger species of attenuation coefficient, in favor of increasing backing layer bandwidth.In addition, solid state powder contains
Some compositions can be two kinds, three or more.
In above-mentioned steps S102, epoxy resin is well mixed with solid state powder and is specially the step of removing bubble removing：
Epoxy resin, which is sufficiently stirred, is well mixed wherein each component, then puts it into and bubble removing is removed in getter；Then by micron
The solid state powder of magnitude is added in epoxy resin, is stirred to well mixed then the mixture of solid state powder and epoxy resin is true
Empty degasification is to remove bubble therein.
More specifically, each component (wherein including the component beneficial to solidification) of appropriate epoxy resin is poured into glass beaker
In, it is stirred well to each component and is well mixed, puts it into pumping in getter and remove bubble therein for a period of time.Then will
The solid state powder of sieved micron dimension is added in epoxy resin, and stirring a period of time is well mixed to it, and this is mixed
Thing vacuum degassing removes bubble therein for a period of time.By the above-mentioned process for removing bubble removing twice, mixture degasification can be made
Effect is more preferable, evenly.
In above-mentioned steps S103, the mixed solution by evenly mixing, after the completion of degasification can specifically be poured into accordingly
In the centrifuge tube of size, the relevant position that centrifuge tube is put into centrifuge, by testing for several times, selected centrifuge parameters are：
Rotating speed -3000~6000r/min, time -100~300s.If centrifugation time is too short, rotating speed is excessively slow, it will causes several
Different material is not properly separated, so that not reaching the purpose of layering；Centrifugation time is long, and rotating speed is excessive, can cause not jljl
Interface between matter tends to be fuzzy, equally can also influence hierarchy.By controlling above-mentioned rotating speed and centrifugation time, with reference to above-mentioned
Material and mass ratio selection, can obtain predetermined thickness and the layering backing block of acoustic impedance, and the acoustic impedance of every layer of back sheet is different.
In the step S102 and S103 of the present embodiment, if solid state powder composition is too many, disposably by total material
The difficulty that the layering of each material can be increased into centrifuge tube is added so as to influence centrifugal effect, therefore, when contained by solid state powder into
When being divided to more than two kinds, first two kinds of powder therein and epoxy resin can be mixed, then by centrifugal treating.Then again by it
The powder of his composition and the mixture of epoxy resin add centrifugal device and carry out centrifugal treating, so as to reduce centrifugation difficulty, increase
Success rate prepared by sample block.
Centrifuging first and centrifuging selected centrifugal method again in the embodiment of the present invention is density gradient centrifugation, i.e. sample
Product are centrifuged in density gradient media, and this is a kind of zone separation method that the different component of density is able to separate, centrifugation
The particle of different densities forms the clear zone of discontinuity in several interfaces in density gradient solution afterwards, and then obtains clear layer
Sandwich construction backing block.
In embodiments of the present invention, the material of following component and mass ratio is have selected by test of many times：As one
Specific embodiment, solid state powder contain tungsten powder, alumina powder and Si powder, and particle diameter is respectively less than 40 microns, tungsten powder and ring
The mass ratio of oxygen tree fat is 8.0:1.0~12:1.0, the mass ratio of alumina powder and epoxy resin is 0.8:1.0~2.0:
1.0, the mass ratio of Si powder and epoxy resin is 0.15:1.0~0.5:1.0.More specifically, the matter of tungsten powder and epoxy resin
It can be 8.0 to measure ratio:1.0, can be 12:1.0, or 10:1.0；The mass ratio of alumina powder and epoxy resin can
Think 0.8:1.0, can be 2.0:1.0, or 1.5:1.0；The mass ratio of Si powder and epoxy resin can be 0.15:
1.0, or 0.5:1.0, or 0.3:1.0.The backing block of making contains the back sheet of three layers of not acoustic impedance, according to
Secondary is the first back sheet：Tungsten-epoxy resin layer, the second back sheet：Aluminum oxide-epoxy resin layer and the 3rd back sheet：Silicon-epoxy
Resin bed.Each thickness degree is respectively less than the half of wavelength when ultrasonic wave transmits wherein.Above-mentioned mass ratio is the present embodiment
Preferred range, if mass ratio is more than or less than above range, each component mixing can be caused uneven, influence the preparation of backing block
Effect.
Table 1 is the performance parameter using the ultrasonic transducer of above-mentioned backing block：
Table 1
As another specific embodiment, solid state powder contains scandium oxide powder, alumina powder and glass powder, and particle diameter is equal
Less than 40 microns, the mass ratio of scandium oxide powder and epoxy resin is 0.8:1.0~1.5:1.0, alumina powder and asphalt mixtures modified by epoxy resin
The mass ratio of fat is 0.8:1.0~2.0:1.0, the mass ratio of glass powder and epoxy resin is 0.2:1.0~1.0:1.0.More
Specifically, the mass ratio of scandium oxide powder and epoxy resin can be 0.8:1.0, can be 1.5:1.0, or 1.2:
1.0；The mass ratio of alumina powder and epoxy resin can be 0.8:1.0, can be 2.0:1.0, or 1.5:1.0；
The mass ratio of glass powder and epoxy resin is 0.2:1.0, can be 1.0:1.0, or 0.6:1.0.The backing of making
Block contains three layers of back sheet, is followed successively by the first back sheet：Scandium oxide-epoxy resin layer, the second back sheet：Aluminum oxide-asphalt mixtures modified by epoxy resin
Lipid layer and the 3rd back sheet：Glass-epoxy resin layer.Each thickness degree is respectively less than two points of wavelength when ultrasonic wave transmits wherein
One of.Likewise, above-mentioned mass ratio is the present embodiment preferred range, if mass ratio is more than or less than above range, can cause
Each component mixing is uneven, influences the preparation effect of backing block.
Table 2 is the performance parameter using the ultrasonic transducer of above-mentioned backing block：
Table 2
Table 3 below shows the performance of the ultrasonic transducer of individual layer backing Rotating fields, the raw material of single back sheet selection
Mixture for tungsten powder with epoxy resin, solid state powder are respectively with the mass ratio of epoxy resin：8.0:1.0~15:1.0
(g), thickness 1-2cm.
Table 3
| Single back sheet | |
| Acoustic impedance | 14MRayl |
| Sensitivity dB, 1V/V | -57.8 |
| Bandwidth, 6dB% | 77 |
| Pulse length, 20dB μ s | 0.64 |
In table 4, raw material that single back sheet is selected are aluminum oxide with the mixture of epoxy resin, the same epoxy of solid state powder
The mass ratio of resin is respectively：0.8:1.0~2.0:1.0 (g), thickness 1-2cm.
Table 4
| Single back sheet | |
| Acoustic impedance | 3.5MRayl |
| Sensitivity dB, 1V/V | -52.4 |
| Bandwidth, 6dB% | 67 |
| Pulse length, 20dB μ s | 1.07 |
More than in four forms, we are clear that：
1), 3.5MRayl mono- backing Rotating fields of the more backing Rotating fields of the 14.0-5.0-3.5MRayl gradual changes of table 1 with table 4
Compare, on the basis of loss of sensitivity 1.7dB, bandwidth improves 13%；
2), 3.5MRayl mono- backing Rotating fields phase of the more backing Rotating fields of the 5.0-4.0-2.5MRayl gradual changes of table 2 with table 4
Than on the basis of loss of sensitivity 1dB, bandwidth improves 14%；
3), 14.0MRayl mono- backing Rotating fields of the more backing Rotating fields of the 14.0-5.0-3.5MRayl gradual changes of table 1 with table 3
Compare, all lifted on sensitivity and bandwidth.
The embodiment of the present invention is mainly by effectively mixed by centrifugal device by materials such as epoxy resin, solid state powder, rubber
Merge layering, obtain the sandwich construction ultrasound backing block of preset thickness and acoustic impedance.Especially by above-mentioned material selection and quality
Proportioning, with reference to the rational design of centrifugal rotational speed and centrifugation time, acoustic impedance, the thickness for changing every layer of back sheet are surpassed with reaching to improve
The bandwidth of sonic transducer, the effect of sensitivity.Selection, processing, making, cutting of the preparation method compared to more matching Rotating fields
Etc. being easier to implement, and then effective avoid the selection because the material that the matching layer number of plies increases and brings, processing, prepare
It is difficult.
With further reference to Fig. 5, the present invention further provides a kind of ultrasonic backing block 03, the ultrasonic backing block 03 can pass through
Prepared by the above method, specifically include：The first different back sheet 031 of the acoustic impedance that stacks gradually, the second back sheet 032 and the 3rd
Back sheet 033, the first back sheet 031 include the first particulate and epoxy resin, and the second back sheet 032 includes the second particulate and epoxy
Resin, the 3rd back sheet 033 include the 3rd particulate and epoxy resin, and the particle diameter of the first particulate, the second particulate and the 3rd particulate is equal
Less than 40 microns, the density of the first back sheet 031 is more than the density of the second back sheet 032, and the density of the second back sheet 032 is more than
The density of 3rd back sheet 033, the thickness of the first back sheet 031, the second back sheet 032 and the 3rd back sheet 033, which is respectively less than, to be surpassed
The half of wavelength when sound wave transmits wherein.Every layer of back sheet of the ultrasonic backing block 03 has predetermined thickness and acoustic resistance
It is anti-, and every layer of acoustic impedance difference, change the bandwidth of ultrasonic transducer by changing thickness and the acoustic impedance of every layer of back sheet
Degree and sensitivity.
In the backing block, the first particulate, the second particulate and the 3rd particulate correspond to the solid state powder in the above method respectively
Three kinds of different components, its particle diameter is preferably smaller than 40 microns.The mixture of three kinds of components and epoxy resin passes through centrifugal method point
Layer, form above-mentioned first back sheet 031, the second back sheet 032 and the 3rd back sheet 033.Certainly, the backing block is not limited to three layers
Back sheet, it can also be four layers, five layers or even more layers.
As a specific embodiment, it is 8.0 that the first back sheet 031 of the backing block, which includes mass ratio,:1.0~12:1.0
Tungsten and epoxy resin；It is 0.8 that second back sheet 032, which includes mass ratio,:1.0~2.0:1.0 aluminum oxide and epoxy resin；The
It is 0.15 that three back sheets 033, which include mass ratio,:1.0~0.5:1.0 silicon and epoxy resin.More specifically, tungsten and epoxy resin
Mass ratio can be 8.0:1.0, can be 12:1.0, or 10:1.0；The mass ratio of aluminum oxide and epoxy resin can
Think 0.8:1.0, can be 2.0:1.0, or 1.5:1.0；The mass ratio of silicon and epoxy resin can be 0.15:1.0
Can also be 0.5:1.0, or 0.3:1.0.
As another specific embodiment, it is 0.8 that the first back sheet 031 of the backing block 03, which includes mass ratio,:1.0~
1.5:1.0 scandium oxide and epoxy resin；It is 0.8 that second back sheet 032, which includes mass ratio,:1.0~2.0:1.0 aluminum oxide with
Epoxy resin；It is 0.2 that 3rd back sheet 033, which includes mass ratio,:1.0~1.0:1.0 glass and epoxy resin.More specifically,
The mass ratio of scandium oxide and epoxy resin can be 0.8:1.0, can be 1.5:1.0, or 1.2:1.0；Aluminum oxide with
The mass ratio of epoxy resin can be 0.8:1.0, can be 2.0:1.0, or 1.5:1.0；Glass and epoxy resin
Mass ratio is 0.2:1.0, can be 1.0:1.0, or 0.6:1.0.
There is the performance parameter described in above-mentioned Tables 1 and 2 using the ultrasonic transducer of the backing block, performance, which is substantially better than, adopts
With the performance of the ultrasonic transducer of conventional monolayers back sheet, ultrasonic imaging effect is improved.Changed it is appreciated that including the ultrasound
The ultrasonic probe of energy device falls within protection scope of the present invention.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement made within refreshing and principle etc., should be included in the scope of the protection.
Claims (10)
1. a kind of preparation method of ultrasonic backing block, it is characterised in that comprise the steps：
Extracting epoxy resin, the solid state powder containing at least two compositions are stand-by；
The epoxy resin is well mixed with the solid state powder and removes bubble removing；
The mixed solution of the epoxy resin and solid state powder is inserted into centrifugal device to be centrifuged first；
Rubber is added into the centrifugal device, the mixed solution of the epoxy resin, solid state powder and rubber is carried out again
Secondary centrifugation, obtain the ultrasonic backing block sample block of hierarchy；
The ultrasonic backing block sample block is cut, obtains independent ultrasonic backing block.
2. preparation method as claimed in claim 1, it is characterised in that the particle diameter of the solid state powder is micron dimension.
3. preparation method as claimed in claim 2, it is characterised in that the particle diameter of the solid state powder is less than 40 microns.
4. the preparation method as described in claim 1,2 or 3, it is characterised in that the solid state powder contains tungsten powder, aluminum oxide
The mass ratio of powder and Si powder, the tungsten powder and the epoxy resin is 8.0:1.0~12:1.0, the alumina powder
Mass ratio with the epoxy resin is 0.8:1.0~2.0:1.0, the Si powder and the mass ratio of the epoxy resin are
0.15:1.0~0.5:1.0.
5. the preparation method as described in claim 1,2 or 3, it is characterised in that the solid state powder contains scandium oxide powder, oxygen
The mass ratio of change aluminium powder and glass powder, the scandium oxide powder and the epoxy resin is 0.8:1.0~1.5:1.0, institute
The mass ratio for stating alumina powder and the epoxy resin is 0.8:1.0~2.0:1.0, the glass powder and the asphalt mixtures modified by epoxy resin
The mass ratio of fat is 0.2:1.0~1.0:1.0.
6. preparation method as claimed in claim 1, it is characterised in that described to mix the epoxy resin and the solid state powder
Close uniformly and be specially the step of removing bubble removing：
The epoxy resin, which is sufficiently stirred, is well mixed wherein each component, then puts it into and bubble removing is removed in getter；
The solid state powder of micron dimension is added in the epoxy resin, stirred to well mixed, then by solid state powder and epoxy
The mixture vacuum degassing of resin is to remove bubble therein.
A kind of 7. ultrasonic backing block, it is characterised in that obtained using the preparation method described in any one of claim 1~6, it is described
In preparation method it is described first centrifugation and centrifuge again using density-gradient centrifugation method carry out, the ultrasonic backing block is at least
The first different back sheet of acoustic impedance including stacking gradually, the second back sheet and the 3rd back sheet, the first back sheet bag
The first particulate and epoxy resin are included, second back sheet includes the second particulate and epoxy resin, and the 3rd back sheet includes
3rd particulate and epoxy resin, the particle diameter of first particulate, the second particulate and the 3rd particulate are respectively less than 40 microns, and described first
The density of back sheet is more than the density of second back sheet, and the density of second back sheet is more than the close of the 3rd back sheet
Degree, the thickness of first back sheet, the second back sheet and the 3rd back sheet are respectively less than wavelength when ultrasonic wave transmits wherein
Half.
8. ultrasonic backing block as claimed in claim 7, it is characterised in that it is 8.0 that first back sheet, which includes mass ratio,:
1.0~12:1.0 tungsten and epoxy resin；It is 0.8 that second back sheet, which includes mass ratio,:1.0~2.0:1.0 aluminum oxide
With epoxy resin；It is 0.15 that 3rd back sheet, which includes mass ratio,:1.0~0.5:1.0 silicon and epoxy resin.
9. ultrasonic backing block as claimed in claim 7, it is characterised in that it is 0.8 that first back sheet, which includes mass ratio,:
1.0~1.5:1.0 scandium oxide and epoxy resin；It is 0.8 that second back sheet, which includes mass ratio,:1.0~2.0:1.0 oxygen
Change aluminium and epoxy resin；It is 0.2 that 3rd back sheet, which includes mass ratio,:1.0~1.0:1.0 glass and epoxy resin.
10. a kind of ultrasonic probe, including transducer, it is characterised in that the transducer is included described in claim 7,8 or 9
Ultrasonic backing block.
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| WO2020062257A1 (en) * | 2018-09-30 | 2020-04-02 | 深圳迈瑞生物医疗电子股份有限公司 | Backing block of ultrasonic probe, manufacturing method of backing block, and ultrasonic probe |
| US20200155119A1 (en) * | 2018-11-21 | 2020-05-21 | Siemens Medical Solutions Usa, Inc. | Composite acoustic absorber for ultrasound transducer array |
| CN110819073A (en) * | 2019-11-25 | 2020-02-21 | 飞依诺科技(苏州)有限公司 | Backing material, preparation method thereof and ultrasonic probe |
| CN113926681B (en) * | 2021-10-12 | 2022-11-15 | 陕西博纵电子科技有限公司 | Large-bandwidth ultrasonic transducer and manufacturing method of back lining layer thereof |
| CN114106518A (en) * | 2021-10-28 | 2022-03-01 | 中广核检测技术有限公司 | Slice type ultrasonic sensor |
| CN114308600B (en) * | 2021-12-16 | 2022-11-04 | 国网山东省电力公司烟台供电公司 | Air coupling ultrasonic transducer for non-contact detection of insulation defects of switch cabinet |
| CN115138547A (en) * | 2022-06-30 | 2022-10-04 | 中国工程物理研究院电子工程研究所 | Piezoelectric micromechanical ultrasonic transducer back lining material, preparation method and filling method |
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| US6514618B1 (en) * | 1998-11-06 | 2003-02-04 | Acoustic Imaging Technologies Corp. | Multilayer backing material for 2-D ultrasonic imaging arrays |
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| US6514618B1 (en) * | 1998-11-06 | 2003-02-04 | Acoustic Imaging Technologies Corp. | Multilayer backing material for 2-D ultrasonic imaging arrays |
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