CN114106518A - Slice type ultrasonic sensor - Google Patents

Slice type ultrasonic sensor Download PDF

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Publication number
CN114106518A
CN114106518A CN202111259603.XA CN202111259603A CN114106518A CN 114106518 A CN114106518 A CN 114106518A CN 202111259603 A CN202111259603 A CN 202111259603A CN 114106518 A CN114106518 A CN 114106518A
Authority
CN
China
Prior art keywords
substrate
base plate
ultrasonic sensor
adjusting
percent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111259603.XA
Other languages
Chinese (zh)
Inventor
金晓明
李炳乾
李守彬
胡晨旭
郝庆阳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
China General Nuclear Power Corp
CGN Power Co Ltd
Suzhou Nuclear Power Research Institute Co Ltd
CGNPC Inspection Technology Co Ltd
Original Assignee
China General Nuclear Power Corp
CGN Power Co Ltd
Suzhou Nuclear Power Research Institute Co Ltd
CGNPC Inspection Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by China General Nuclear Power Corp, CGN Power Co Ltd, Suzhou Nuclear Power Research Institute Co Ltd, CGNPC Inspection Technology Co Ltd filed Critical China General Nuclear Power Corp
Priority to CN202111259603.XA priority Critical patent/CN114106518A/en
Publication of CN114106518A publication Critical patent/CN114106518A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • GPHYSICS
    • G21NUCLEAR PHYSICS; NUCLEAR ENGINEERING
    • G21CNUCLEAR REACTORS
    • G21C17/00Monitoring; Testing ; Maintaining
    • G21C17/10Structural combination of fuel element, control rod, reactor core, or moderator structure with sensitive instruments, e.g. for measuring radioactivity, strain
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2227Oxides; Hydroxides of metals of aluminium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00Applications
    • C08L2203/20Applications use in electrical or conductive gadgets
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E30/00Energy generation of nuclear origin
    • Y02E30/30Nuclear fission reactors

Abstract

The invention discloses a slice type ultrasonic sensor, which comprises a substrate, an adjusting part arranged at one end part of the substrate and used for adjusting the level of the substrate, wherein the other end part of the substrate is provided with a mounting groove, the slice type ultrasonic sensor also comprises a wafer arranged in the mounting groove and a back lining layer bonded between the wafer and the mounting groove, and the back lining layer comprises the following components: alumina: 10% -30%; epoxy resin E51: 50% -80%; polyether sulfone: 5% -15%; glass beads: 3 to 7 percent. The sensor manufactured by adopting the formula process of the high-attenuation low-acoustic-impedance backing layer has wide pulse and narrow frequency band of signals, and is beneficial to the generation of plate waves.

Description

Slice type ultrasonic sensor
Technical Field
The invention belongs to the field of nuclear power detection equipment, and particularly relates to a sheet type ultrasonic sensor.
Background
Ultrasonic probes with thicknesses below 1.6 mm and even smaller are often required in the field of nuclear power detection. The existing ultrathin type mainly comprises the following two types: the ultrasonic probe disclosed in CN201520753772.2 has the transmitting end and the receiving end separately arranged, and only one column (or one row) of fuel assemblies can be detected in each action, which is not efficient; the ultrasonic probe disclosed in CN201810398207.7, whose backing layer is made of a mixture of tungsten powder and epoxy resin, has the problems of narrow pulse, wide frequency band and low detection sensitivity.
Disclosure of Invention
The invention aims to provide a sheet type ultrasonic sensor which is high in detection efficiency and accurate and stable in signal.
In order to solve the technical problems, the invention adopts the following technical scheme: a slice formula ultrasonic sensor, its includes the base plate, locates an end of base plate and is used for adjusting the horizontal regulation portion of base plate, another tip of base plate is equipped with the mounting groove, slice formula ultrasonic sensor still including install in wafer in the mounting groove and bonding the back sheet between wafer and the mounting groove, the composition of back sheet is as follows:
10 to 30 percent of alumina
Epoxy resin E5150% -80%
5 to 15 percent of polyether sulfone
3 to 7 percent of glass beads.
Preferably, the backing layer has the following components:
20 percent of alumina
Epoxy resin E5165%
Polyether sulfone 10%
5 percent of glass beads.
Preferably, the substrate is internally provided with a wire guide groove extending along the length direction of the substrate, the opening of the wire guide groove is positioned on the upper side and the lower side of the substrate, the upper side and the lower side of the substrate are provided with baffles, the baffles on the upper side and the lower side of the substrate are alternately arranged, and a through hole communicated with the wire guide groove is formed between two vertically adjacent baffles.
Optimized, the regulating part include with conveying mechanism fixed connection's fixed block, be fixed in adjusting block, a tip threaded connection on the base plate are in on the fixed block and another tip card locate adjusting screw and threaded connection on the adjusting block just compress tightly in set screw on the base plate, base plate slidable inserts and locates on the fixed block, adjusting screw's step direction parallels with the grafting direction of base plate and fixed block, and set screw's step direction is mutually perpendicular with the grafting direction of base plate and fixed block.
The invention has the beneficial effects that: according to the invention, the transmitting end and the receiving end are positioned on the stainless steel substrate on the same side, 10 groups of sheet ultrasonic sensors are adopted for simultaneous detection during actual detection, and 17 rows (or 17 rows) of fuel rods can be detected by one action; the sensor manufactured by adopting the formula process of the high-attenuation low-acoustic-impedance backing layer has wide pulse and narrow frequency band of signals, and is beneficial to the generation of plate waves.
Drawings
FIG. 1 is a schematic structural diagram of a sheet-type ultrasonic sensor;
FIG. 2 is a schematic view of a substrate and wafer structure;
FIG. 3 is a time domain diagram of a sheet-type ultrasonic sensor performance test;
FIG. 4 is a frequency domain diagram of a sheet-type ultrasonic sensor performance test;
FIG. 5 is a graphical representation of the echo amplitude of an intact pipe;
FIG. 6 is a graphical representation of the echo amplitude of a leaky pipe;
fig. 7 is a schematic diagram of the detection of the leak signal reaching 80% FSH sensitivity using the present wafer-based ultrasonic sensor.
Detailed Description
The invention is described in detail below with reference to embodiments shown in the drawings to which:
as shown in fig. 1-2, the sheet-type ultrasonic sensor 1 includes a substrate 11, an adjusting portion 12 disposed at one end of the substrate 11 and used for adjusting the level of the substrate 11, a mounting groove disposed at the other end of the substrate 11, a wafer 13 mounted in the mounting groove, and a backing layer 14 adhered between the wafer 13 and the mounting groove, wherein a wire guide groove 15 extending along the length direction of the substrate 11 is disposed in the substrate 11, openings of the wire guide groove 15 are located on upper and lower sides of the substrate 11, baffles 16 are disposed on the upper and lower sides of the substrate 11, and through holes 17 communicated with the wire guide groove 15 are formed between two baffles 16 which are alternately disposed on the upper and lower sides of the substrate 11 and are adjacent to each other. The adjusting part 12 comprises a fixing block 121 fixedly connected with the conveying mechanism 3, an adjusting block 122 fixed on the substrate 11, an adjusting screw 123 with one end part being in threaded connection with the fixing block 121 and the other end part being clamped on the adjusting block 122, and a pressing screw 124 with one end part being in threaded connection with the adjusting block and being pressed on the substrate 11, the substrate 11 is slidably inserted on the fixing block 121, the stepping direction of the adjusting screw 123 is parallel to the inserting direction of the substrate 11 and the fixing block 121, and the stepping direction of the pressing screw 124 is perpendicular to the inserting direction of the substrate 11 and the fixing block 121. The other end of the adjusting screw 123 is rotatably connected with the adjusting block 122, a connecting hole with a small belly is formed in the adjusting block 122, and the other end of the adjusting screw 123 is matched with the connecting hole and is arranged in the connecting hole. The length of the base plate 11 can be adjusted by rotating the adjusting screw 123, and the levelness of the base plate 11 can be adjusted by rotating the pressing screw 124.
The backing layer had the following composition:
10 to 30 percent of alumina
Epoxy resin E5150% -80%
5 to 15 percent of polyether sulfone
3 to 7 percent of glass beads.
Most preferably, the backing layer has the following composition:
20 percent of alumina
Epoxy resin E5165%
Polyether sulfone 10%
5 percent of glass beads.
By the formula of the high-attenuation low-acoustic-impedance backing layer, the manufactured sheet type ultrasonic sensor has wide pulse and narrow frequency band of signals, is beneficial to the generation of plate waves, and has extremely high test sensitivity; the sheet-type ultrasonic sensor is used for detecting the leakage of the pipeline wall, plate waves are generated on the pipeline wall by the sheet-type ultrasonic sensor, and when the pipeline wall has water due to leakage, the time domain graph and the frequency domain graph of a signal fed back by the sheet-type ultrasonic sensor have obvious fluctuation, as shown in fig. 3 and 4.
The contrast effect is shown in fig. 5-7, fig. 5 is a schematic diagram of the echo amplitude of the intact tube, when the signal reaches 80% FSH; FIG. 6 is a diagram showing the echo amplitude of a leaky pipe; fig. 7 is a schematic diagram of the sensitivity of 80% FSH of the leaky pipe signal detected by the thin-sheet ultrasonic sensor, which is different from the gain of the intact pipe in fig. 5, and fully illustrates the high sensitivity of the thin-sheet ultrasonic sensor.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes or modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims (4)

1. A slice formula ultrasonic sensor, its includes the base plate, locates an end of base plate and is used for adjusting the horizontal regulation portion of base plate, another tip of base plate is equipped with the mounting groove, slice formula ultrasonic sensor still including install in wafer in the mounting groove and bonding the back sheet between wafer and the mounting groove, the composition of back sheet is as follows:
10 to 30 percent of alumina
Epoxy resin E5150% -80%
5 to 15 percent of polyether sulfone
3 to 7 percent of glass beads.
2. The sheet-form ultrasonic sensor according to claim 1, wherein: the backing layer had the following composition:
20 percent of alumina
Epoxy resin E5165%
Polyether sulfone 10%
5 percent of glass beads.
3. The sheet-form ultrasonic sensor according to claim 1, wherein: the substrate is provided with a wire guide groove extending along the length direction, the opening of the wire guide groove is positioned on the upper side and the lower side of the substrate, the upper side and the lower side of the substrate are provided with baffles, the baffles on the upper side and the lower side of the substrate are alternately arranged, and a through hole communicated with the wire guide groove is formed between every two adjacent baffles.
4. The sheet-form ultrasonic sensor according to claim 1, wherein: the adjusting part comprises a fixed block fixedly connected with the conveying mechanism, an adjusting block fixed on the base plate, and an end part in threaded connection with the adjusting block and the other end part on the fixed block, wherein the adjusting block and the end part are clamped on the adjusting block, the adjusting screw and the threaded connection on the adjusting block are tightly pressed on the adjusting block, the base plate can be slidably inserted on the fixed block, the stepping direction of the adjusting screw is parallel to the inserting direction of the base plate and the fixed block, and the stepping direction of the pressing screw is perpendicular to the inserting direction of the base plate and the fixed block.
CN202111259603.XA 2021-10-28 2021-10-28 Slice type ultrasonic sensor Pending CN114106518A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111259603.XA CN114106518A (en) 2021-10-28 2021-10-28 Slice type ultrasonic sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111259603.XA CN114106518A (en) 2021-10-28 2021-10-28 Slice type ultrasonic sensor

Publications (1)

Publication Number Publication Date
CN114106518A true CN114106518A (en) 2022-03-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111259603.XA Pending CN114106518A (en) 2021-10-28 2021-10-28 Slice type ultrasonic sensor

Country Status (1)

Country Link
CN (1) CN114106518A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100242612A1 (en) * 2007-11-29 2010-09-30 Hitachi Medical Corporation Ultrasonic probe, and ultrasonic diagnostic apparatus using the same
US20120013222A1 (en) * 2010-01-19 2012-01-19 Thomas Herzog Ultrasonic Sensor for Detecting and/or Scanning Objects
CN105252687A (en) * 2015-10-08 2016-01-20 深圳市理邦精密仪器股份有限公司 Manufacturing method for ultrasound backing blocks, ultrasound backing blocks and ultrasound probe
CN108724565A (en) * 2018-04-28 2018-11-02 苏州热工研究院有限公司 A kind of cast packaging technology of ultra-thin ultrasonic probe

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100242612A1 (en) * 2007-11-29 2010-09-30 Hitachi Medical Corporation Ultrasonic probe, and ultrasonic diagnostic apparatus using the same
US20120013222A1 (en) * 2010-01-19 2012-01-19 Thomas Herzog Ultrasonic Sensor for Detecting and/or Scanning Objects
CN105252687A (en) * 2015-10-08 2016-01-20 深圳市理邦精密仪器股份有限公司 Manufacturing method for ultrasound backing blocks, ultrasound backing blocks and ultrasound probe
CN108724565A (en) * 2018-04-28 2018-11-02 苏州热工研究院有限公司 A kind of cast packaging technology of ultra-thin ultrasonic probe

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
杨金铎等: "《装饰装修材料》", vol. 4, 30 June 2020, 中国建筑工业出版社, pages: 278 - 279 *
闻荻江等: "《玻璃钢原材料》", 31 March 1990, 中国建筑工业出版社, pages: 100 - 101 *

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