CN105246268A - Device used for assembling main control CPU - Google Patents
Device used for assembling main control CPU Download PDFInfo
- Publication number
- CN105246268A CN105246268A CN201410284648.6A CN201410284648A CN105246268A CN 105246268 A CN105246268 A CN 105246268A CN 201410284648 A CN201410284648 A CN 201410284648A CN 105246268 A CN105246268 A CN 105246268A
- Authority
- CN
- China
- Prior art keywords
- master cpu
- assembling
- pushing mechanism
- cabinet
- iron plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 34
- 229910052742 iron Inorganic materials 0.000 claims description 17
- 239000002937 thermal insulation foam Substances 0.000 claims description 13
- 239000003292 glue Substances 0.000 claims description 3
- 230000001052 transient effect Effects 0.000 abstract 3
- 239000000306 component Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Landscapes
- Resistance Heating (AREA)
- Automatic Assembly (AREA)
Abstract
The invention discloses a device used for assembling a main control CPU, which comprises a main control CPU and a motherboard, and is characterized by further comprising an automatic assembling device, wherein the automatic assembling device comprises a chassis, a transient heating assembly, a piece pushing mechanism and an industrial control module; the chassis is provided with a top plate, a bottom plate and four side plates between the top plate and the bottom plate; the chassis is located on a horizontal platform, and the chassis is in the shape of a rectangular box body; the piece pushing mechanism is located inside the chassis, and the piece pushing mechanism and the chassis are in threaded connection; the transient heating assembly is located at the upper end of the piece pushing mechanism, and the transient heating assembly and the piece pushing mechanism are in threaded connection; and the industrial control module is located at the outer side of the chassis, and the industrial control module and the chassis are in threaded connection.
Description
Technical field
The present invention relates to secret apparatus for assembling, particularly relating to a kind of device for assembling master cpu.
Background technology
Along with the development of electronic technology, the application of circuit board is also further extensive, price and odds for effectiveness become the indispensable element dominated the market, the core component master cpu of circuit board just seems particularly important, but traditional master cpu method employing is mount technology, namely be that chip mounter carries out full-automatic paster, although can be efficiently accurate, but one low joins chip mounter price just up to 360,000 yuan, and bulky weight is about more than 5, power consumption is high, little order is produced, paster needed for the research and development electronic equipment test stage or little Wei enterprise produce and bring great difficulty, in view of above-mentioned defect, be necessary to design a kind of device for assembling master cpu.
Summary of the invention
Technical problem to be solved by this invention is: provide a kind of device for assembling master cpu, solves the problem of master cpu low-cost and high-precision assembling.
For solving the problems of the technologies described above, technical scheme of the present invention is: a kind of device for assembling master cpu, comprise master cpu, motherboard, also comprise automatic assembling device, described apparatus for assembling comprises cabinet, instantaneous heating component, pushing mechanism and industry control module, described cabinet has top board and base plate and four side plates between top board and base plate, it is positioned on level table, the shape of cabinet is rectangular box, described pushing mechanism is positioned at cabinet inside, the two screw thread is connected, described instantaneous heating component is positioned at pushing mechanism upper end, the two screw thread is connected, described industry control module is positioned at outside cabinet, the two screw thread is connected.
Further, described cabinet top board center is also provided with step groove, and the shape of groove is rectangle.
Further, be also provided with cylinder bottom described pushing mechanism, cylinder is connected with base thread.
Further, bottom described pushing mechanism cylinder piston rod on be also provided with rectangle iron plate, the two is weldingly connected.
Further, described rectangle iron plate corner place is also provided with takes out tooth hole, takes out tooth hole height and is about 2-3.5mm.
Further, described rectangle iron plate is also provided with heat insulation foam, the two glue connects and is connected.
Further, described heat insulation foam corner place is also provided with position, hole, and hole is manhole.
Further, described heat insulation foam is also provided with heat-generating pipe, heat-generating pipe has linked flange plate.
Compared with prior art, this device for assembling master cpu, when starting working, only need connect source of the gas and power supply, get final product work, first motherboard is placed in step groove, again master cpu is placed on motherboard assigned address, starting switch, industrial control system runs automatically, cylinder promotes iron plate and rises, then the heat-generating pipe promoting high heat rises to groove, on fast melt master cpu, tin ball completes paster technique, heat insulation foam on iron plate can completely cut off high temperature, ensure cylinder not by high-temperature damage, the small and exquisite portable of this equipment, total weight is about 3-5Kg, cost is about 400-600 garden and is applicable to small lot order, examination paster and little Wei enterprise produce.
Accompanying drawing content
Fig. 1 is the cutaway view of the device for assembling master cpu
Fig. 2 is the enlarged drawing of instantaneous heating component
Master cpu 1 industry control module 304
Motherboard 2 cylinder 3031
Apparatus for assembling 3 heat insulation foam 3021
Cabinet 301 heat-generating pipe 3022
Instantaneous heating component 302 flange plate 3023
Pushing mechanism 303 iron plate 3024
Following embodiment will further illustrate in conjunction with above-mentioned accompanying drawing.
Embodiment
Hereinafter, set forth multiple specific detail, to provide the thorough understanding to the concept forming described embodiment basis.But to one skilled in the art, embodiment described obviously can be put into practice when not have in these specific detail some or all.In other cases, well-known treatment step is not specifically described.
As Fig. 1, shown in Fig. 2, comprise master cpu 1, motherboard 2, apparatus for assembling 3, cabinet 301, instantaneous heating component 302, pushing mechanism 303, industry control module 304, cylinder 3031, iron plate 3024, heat insulation foam 3021, heat-generating pipe 3022, flange plate 3023, described apparatus for assembling 3 comprises cabinet 301, instantaneous heating component 302, pushing mechanism 303 and industry control module 304, described cabinet 301 has top board and base plate and four side plates between top board and base plate, it is positioned on level table, the shape of cabinet 301 is rectangular boxs, it is inner that described pushing mechanism 303 is positioned at cabinet 301, the two screw thread is connected, described instantaneous heating component 302 is positioned at pushing mechanism 303 upper end, the two screw thread is connected, described industry control module 304 is positioned at outside cabinet 301, the two screw thread is connected, described cabinet 301 top board center is also provided with step groove, the shape of groove is rectangle, cylinder 3031 is also provided with bottom described pushing mechanism 303, cylinder 3031 is connected with base thread, bottom described pushing mechanism 303 cylinder 3031 piston rod on be also provided with rectangle iron plate 3024, the two is weldingly connected, described rectangle iron plate 3,024 four jiaos of places are also provided with takes out tooth hole, take out tooth hole height and be about 2-3.5mm, described rectangle iron plate 3024 is also provided with heat insulation foam 3021, the two glue connects and is connected, described heat insulation foam 3,021 four jiaos of places are also provided with position, hole, hole is manhole, described heat insulation foam 3021 is also provided with heat-generating pipe 3022, heat-generating pipe 3022 links flange plate 3023, this device for assembling master cpu, when starting working, only need connect source of the gas and power supply, get final product work, first motherboard 2 is placed in step groove, again master cpu 1 is placed on motherboard 2 assigned address, starting switch, industrial control system 304 runs automatically, cylinder 3031 Work Promote iron plate 3024 rises, screw is screwed into by the position, hole of flange plate 3023 of riveted joint on heat-generating pipe 3022 and iron plate 3024 takes out tooth hole, the two is connected, then the heat-generating pipe 3022 promoting high heat rises to groove, on fast melt master cpu 1, tin ball completes paster technique, heat insulation foam 3021 on iron plate can completely cut off high temperature, ensure cylinder 3031 not by high-temperature damage.
The present invention is not limited to above-mentioned concrete execution mode, and those of ordinary skill in the art is from above-mentioned design, and without performing creative labour, all conversion made, all drop within protection scope of the present invention.
Claims (9)
1. one kind for assembling the device of master cpu, comprise master cpu, motherboard, it is characterized in that comprising automatic assembling device, described apparatus for assembling comprises cabinet, instantaneous heating component, pushing mechanism and industry control module, described cabinet has top board and base plate and four side plates between top board and base plate, it is positioned on level table, the shape of cabinet is rectangular box, described pushing mechanism is positioned at cabinet inside, the two screw thread is connected, described instantaneous heating component is positioned at pushing mechanism upper end, the two screw thread is connected, described industry control module is positioned at outside cabinet, the two screw thread is connected.
2. a kind of device for assembling master cpu as claimed in claim 1, it is characterized in that described cabinet top board center is also provided with step groove, the shape of groove is rectangle.
3. a kind of device for assembling master cpu as claimed in claim 2, it is characterized in that also being provided with cylinder bottom described pushing mechanism, cylinder is connected with base thread.
4. a kind of device for assembling master cpu as claimed in claim 3, the piston rod that it is characterized in that cylinder bottom described pushing mechanism is also provided with rectangle iron plate, and the two is weldingly connected.
5. a kind of device for assembling master cpu as claimed in claim 4, is characterized in that described rectangle iron plate corner place is also provided with and takes out tooth hole, take out tooth hole height and be about 2-3.5mm.
6. a kind of device for assembling master cpu as claimed in claim 5, is characterized in that described rectangle iron plate is also provided with heat insulation foam, and the two glue connects and is connected.
7. a kind of device for assembling master cpu as claimed in claim 6, it is characterized in that described heat insulation foam corner place is also provided with position, hole, hole is manhole.
8. a kind of device for assembling master cpu as claimed in claim 7, is characterized in that described heat insulation foam is also provided with heat-generating pipe, and on heat-generating pipe, riveted joint has flange plate.
9. a kind of device for assembling master cpu as claimed in claim 8, it is characterized in that described heat-generating pipe is also provided with flange plate, the center of flange plate is provided with manhole, Kong Weiyu rectangle iron plate corner place to take out tooth hole site identical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410284648.6A CN105246268B (en) | 2014-06-23 | 2014-06-23 | A kind of device for assembling master cpu |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410284648.6A CN105246268B (en) | 2014-06-23 | 2014-06-23 | A kind of device for assembling master cpu |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105246268A true CN105246268A (en) | 2016-01-13 |
| CN105246268B CN105246268B (en) | 2018-10-30 |
Family
ID=55043674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410284648.6A Active CN105246268B (en) | 2014-06-23 | 2014-06-23 | A kind of device for assembling master cpu |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105246268B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1320780A (en) * | 2000-04-26 | 2001-11-07 | 伊利诺斯器械工程公司 | Differential mechanism for limiting slip |
| CN102529284A (en) * | 2010-12-23 | 2012-07-04 | 富葵精密组件(深圳)有限公司 | Press fit device and circuit board press-fit method using same |
| CN103128407A (en) * | 2011-11-24 | 2013-06-05 | 西安中科麦特电子技术设备有限公司 | Scaling powder spraying dustproof device |
| CN203040104U (en) * | 2012-12-26 | 2013-07-03 | 祐旸股份有限公司 | Electronic part automatic alignment jig device |
| US20140078387A1 (en) * | 2012-09-14 | 2014-03-20 | Omnivision Technologies (Shanghai) Co., Ltd. | Housing for wafer-level camera module |
-
2014
- 2014-06-23 CN CN201410284648.6A patent/CN105246268B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1320780A (en) * | 2000-04-26 | 2001-11-07 | 伊利诺斯器械工程公司 | Differential mechanism for limiting slip |
| CN102529284A (en) * | 2010-12-23 | 2012-07-04 | 富葵精密组件(深圳)有限公司 | Press fit device and circuit board press-fit method using same |
| CN103128407A (en) * | 2011-11-24 | 2013-06-05 | 西安中科麦特电子技术设备有限公司 | Scaling powder spraying dustproof device |
| US20140078387A1 (en) * | 2012-09-14 | 2014-03-20 | Omnivision Technologies (Shanghai) Co., Ltd. | Housing for wafer-level camera module |
| CN203040104U (en) * | 2012-12-26 | 2013-07-03 | 祐旸股份有限公司 | Electronic part automatic alignment jig device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105246268B (en) | 2018-10-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102883552A (en) | LGA and BGA repair process | |
| CN102325429A (en) | Method for bonding upper and lower magnetic cores of module power supply | |
| CN105246268A (en) | Device used for assembling main control CPU | |
| CN205506978U (en) | Can automatic radiating electronic equipment fault detector | |
| CN103336202B (en) | Electric test operation post | |
| CN204470756U (en) | Through-hole reflow positioning fixture | |
| CN203930801U (en) | Hot measurement jig | |
| CN203368930U (en) | Splicing type PCB plate | |
| CN103090996A (en) | Ultrasonic heat meter main board performance detecting device | |
| CN207635284U (en) | A kind of plastic Lam-cup structure of LED lamp | |
| CN202818834U (en) | Capacitor box heat radiation apparatus | |
| CN206892792U (en) | A kind of CPCI computers automatic heating device | |
| CN203368308U (en) | Power supply adapter | |
| CN204270572U (en) | A kind of real training instrument box | |
| CN204065178U (en) | Exchange debugging adapter | |
| CN207427691U (en) | A kind of power supply adaptor with heat exchange of heat pipe | |
| CN203881817U (en) | Electric energy meter liquid crystal screen mounting structure | |
| CN204069525U (en) | Universal tool | |
| CN204031571U (en) | A kind of integrated circuit of radiating insulating | |
| CN204795894U (en) | A cross stove device for wave -soldering | |
| CN204404691U (en) | A kind of refrigerator and display plate component thereof | |
| CN204498495U (en) | A kind of industrial computer regulator cubicle | |
| CN204524638U (en) | A kind of welded plate device | |
| CN204168689U (en) | A kind of static high-power heat-dissipation power amplifier | |
| CN102607740A (en) | Automatic temperature check table |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20180913 Address after: 247200 Xu village, Yao village, Yao county, Dongzhi County, Chizhou, Anhui Applicant after: DONGZHI WENYUAN CERAMIC TILE PROCESSING FACTORY Address before: 247100 Guichi Industrial Park, Chizhou, Anhui Applicant before: ANHUI PROVINCE NATIONTEK TECHNOLOGY Co.,Ltd. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210425 Address after: 215000 north side of Yihe road and west side of Shunfeng Road, Wujiang Economic and Technological Development Zone, Suzhou City, Jiangsu Province Patentee after: Suzhou liangwo Electronic Technology Co.,Ltd. Address before: 247200 Chizhou City, Anhui Province, Dongzhi County, Yao Du town Xu Village Hong Village Group Patentee before: DONGZHI WENYUAN CERAMIC TILE PROCESSING FACTORY |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20220803 Address after: 215000 No.168 Huayang Road, Caohu street, Xiangcheng economic and Technological Development Zone, Suzhou City, Jiangsu Province Patentee after: SUZHOU XIANGCHENG DISTRICT HONGDA ELECTRONICS Co.,Ltd. Address before: North side of Yihe Road and west side of Shunfeng Road, Economic and Technological Development Zone, Wujiang District, Suzhou City, Jiangsu Province 215000 Patentee before: Suzhou liangwo Electronic Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221103 Address after: 247200 Xu village, Yao village, Yao county, Dongzhi County, Chizhou, Anhui Patentee after: DONGZHI WENYUAN CERAMIC TILE PROCESSING FACTORY Address before: 215000 No.168 Huayang Road, Caohu street, Xiangcheng economic and Technological Development Zone, Suzhou City, Jiangsu Province Patentee before: SUZHOU XIANGCHENG DISTRICT HONGDA ELECTRONICS Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230821 Address after: 247200 Xu village, Yao village, Yao county, Dongzhi County, Chizhou, Anhui Patentee after: DONGZHI WENYUAN CERAMIC TILE PROCESSING FACTORY Patentee after: Suzhou ruiyuhua Electronic Technology Co.,Ltd. Address before: 247200 Xu village, Yao village, Yao county, Dongzhi County, Chizhou, Anhui Patentee before: DONGZHI WENYUAN CERAMIC TILE PROCESSING FACTORY |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231214 Address after: 247200 Xu village, Yao village, Yao county, Dongzhi County, Chizhou, Anhui Patentee after: DONGZHI WENYUAN CERAMIC TILE PROCESSING FACTORY Address before: 247200 Xu village, Yao village, Yao county, Dongzhi County, Chizhou, Anhui Patentee before: DONGZHI WENYUAN CERAMIC TILE PROCESSING FACTORY Patentee before: Suzhou ruiyuhua Electronic Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right |