CN105242394A - Flexible electrowetting display device and preparation technology thereof - Google Patents
Flexible electrowetting display device and preparation technology thereof Download PDFInfo
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- CN105242394A CN105242394A CN201510560814.5A CN201510560814A CN105242394A CN 105242394 A CN105242394 A CN 105242394A CN 201510560814 A CN201510560814 A CN 201510560814A CN 105242394 A CN105242394 A CN 105242394A
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- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/004—Optical devices or arrangements for the control of light using movable or deformable optical elements based on a displacement or a deformation of a fluid
- G02B26/005—Optical devices or arrangements for the control of light using movable or deformable optical elements based on a displacement or a deformation of a fluid based on electrowetting
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Abstract
The invention discloses a flexible electrowetting display device and a preparation technology thereof. The flexible electrowetting display device comprises an upper substrate, a lower substrate and multiple fluid chambers which are arranged between the upper and lower substrates and separated by a pixel wall. Each fluid chamber is internally filled with mutually insoluble first fluid and second fluid. One surface, which is opposite to the lower substrate, of the upper substrate is provided with a conductive layer. One surface, which is opposite to the upper substrate, of the lower substrate is provided with a conductive layer, a hydrophobic insulating layer and the pixel wall which are arranged in turn. The upper substrate and the lower substrate are flexible polyimides substrates. According to the preparation technology, manufacturing of the flexible electrowetting display device is realized based on the existing preparation technology of a flat-panel electrowetting display device so that cost of equipment replacement is saved for enterprises, industry upgrading is facilitated, and development of the flexible display device can be accelerated.
Description
Technical field
The present invention relates to a kind of flexible electrical moisten display part and preparation technology thereof.
Background technology
Along with the develop rapidly of electronic technology, the digital product of feature richness fly into already ordinary other, frivolous, portable wearable electronic equipment becomes the new focus attracted the attention of millions of people.Produce style different, the electronic equipment of comfortable wearing, a display device that can bend and even can fold is indispensable.The display device that we use at present is all generally inflexibility or folding, and has inadequate natural endowment in weight, portability, impact resistance etc., cannot meet the demand of the more renewals of people.And there is the favor that the plurality of advantages flexible display devices such as ultralight, ultra-thin, rollable, portable, shock resistance start to be subject to people, one of important development direction becoming following display technique.Countries in the world manufacturer enthusiasm in the preparation of curve flexibility display part is surging, and has obtained certain achievement, and as Samsung, the LG of Korea S, the Sony etc. of Japan has all been proposed the product such as mobile phone, TV with curved-surface display.But they are still substrate with hard material, not yet realize the flexible effect that can bend arbitrarily, and employing is self luminous OLED, power dissipation ratio is higher, and on the wearing electronic equipment that electricity is limited, application can't reach desirable effect.Realize the display of low-power consumption, reflective display technique is one of optimal selection, and the wetting display technique of electricity is a member important in reflective display, is the reflective display technique of one that can realize video and colored display.
The wetting display of electricity refers to by changing the voltage be applied between liquid-solid electrode, change the interfacial tension between liquid and solid, thus change liquid realizes the driving of liquid and the change of space distribution at the contact angle of solid surface, finally reach the function of transmitted light or reflected light being carried out to photoswitch, complete display.Its ultimate principle is: the contact angle being changed liquid in display unit by impressed voltage, and then the distribution changing liquid, finally reaches the function of transmitted light or reflected light being carried out to switch.Three this type of switches are applied in the three primary colours (RGB) of color respectively, by reaching colored display object to the switch of these three kinds of colors and color assignment.This display can utilize extraneous light source, and can only need luminous place to carry out energy drives, and therefore it has the series of advantages such as energy consumption is low, rich color, volume are little, the response time is short.Be a kind of reflective display because electricity soaks display, in energy consumption, health and chromaticity, have outstanding performance, be therefore broadly considered one of following main flow display technique.
On existing electric moistening display part, infrabasal plate is generally the hard substrates such as glass, flat-panel display device can only be made, flexible flexible display device can not be made, its preparation technology can with reference to the record in the article of J.Micromech.Microeng.19 (2009) 065029 such as Zhou, first on substrate, deposit one deck hydrophobic layer, on hydrophobic layer, one deck hydrophilic lithographic glue is deposited after graphical, in order to strengthen the clinging power between photoresist and hydrophobic layer, need to carry out surface modification before deposition hydrophilic layer, then by photoetching process, patterned process is carried out to this layer of water wetted material, this layer forms pixel compartments.After pixel compartments is formed, heating reflow treatment is carried out to whole plate, recover the hydrophobic performance of hydrophobic layer.
As can be seen here, in existing electric moistening display manufacture craft, plane machining and pyroprocessing are two links that not can bypass.And for the making of flexible display device, best selection adopts high-molecular organic material as substrate, but easily there is deformation in polymeric substrate, non-refractory, and this brings certain difficulty to the preparation for flexible display device.
Summary of the invention
For solving the problem, the invention provides a kind of flexible electrical moisten display part and preparation technology thereof.
The solution that the present invention solves its technical matters is:
A kind of flexible electrical moisten display part, the some fluid chamber comprising upper substrate, infrabasal plate and separated by pixel wall between upper and lower substrate, immiscible first fluid and second fluid is filled with in described each fluid chamber, the one side that described upper substrate is relative with infrabasal plate is provided with conductive layer, the one side that described infrabasal plate is relative with upper substrate is disposed with conductive layer, drain insulating layer and pixel wall, and described upper substrate and infrabasal plate are flexible polyimide substrate.
Preferably, described drain insulating layer contact angle is 100-120 degree, specific inductive capacity 1.0 to 10.0.
Preferably, described pixel wall material is hydrophilic polymeric material, as hydrophilic polyimide photoresist, and PI, PDMS, PEN, PCO, PET, COC etc.
Preferably, described conductive layer is metal material layer, and inorganic oxide leads film or electroconductive organic film.
Other one side of the present invention, additionally provides a kind of preparation technology of flexible electrical moisten display part, comprises the following steps:
1, prepared substrate; Described substrate comprises upper substrate and infrabasal plate, and described upper substrate and infrabasal plate are flexible polyimide substrate, adopts following steps to prepare,
1.1 make cofferdam on hard floor;
1.2 add polyimide solution in the cofferdam prepared, and spin-coating film, then at 30-50 DEG C of boiler portion solvent;
1.3 repeat step 1.2 several times, obtain the polyimide film of desired thickness;
The 1.4 base plate low-temperature heats with polyimide film step 1.3 obtained, make the solvent in polyimide film volatilize;
1.5 be warming up to 200-300 DEG C after stop immediately heating, naturally cool to room temperature, obtain flexible transparent polyimide substrate;
2, electrode layer is made;
2.1 adopt magnetron sputtering method at described upper substrate and lower substrate surface depositing conducting layer;
2.2 circuit etching display device on the conductive layer obtained;
3, drain insulating layer is applied;
In lower substrate surface coating film forming, then heating, drying that step 2 obtains, obtain drain insulating layer;
4, pixel wall is prepared;
In the drain insulating layer surface preparation pixel wall that step 3 obtains;
5, fill, encapsulation;
The pixel wall layers periphery of 5.1 infrabasal plates obtained in step 4 arranges glue frame, fills inconsistent first fluid and second fluid;
5.2 utilize glue frame, and the bonding realizing the infrabasal plate plate obtained in upper substrate obtained in step 2 and step 5.1 encapsulates, and obtains described flexible display device.
Preferably, in described step 2.1, conductive layer is ito film, thickness 50-250nm.
Preferably, in described step 3, drain insulating layer is individual layer fluoropolymer film, or the multilayer films of insulation course composite hydrophobic layer.When drain insulating layer is individual layer fluoropolymer film, be preferably fluorinated polyimide film or amorphous Teflon film.
Preferably, the drain insulating layer contact angle obtained in described step 3 is 100-120 degree, specific inductive capacity 1.0 to 10.0.
When drain insulating layer is fluorinated polyimide film, can adopt spin-coating film, film forming heats 5-60min at being placed on 40-70 DEG C, is then warming up to 222-300 DEG C, stops heating immediately, naturally cools to room temperature, forms polyimide drain insulating layer.
When drain insulating layer is amorphous Teflon film, can adopt spin-coating film, film forming heats 5-15min at being placed on 65 DEG C, naturally cools to room temperature, form amorphous Teflon insulating hydrophobic insulation course after stopping heating.
Preferably, silk screen print method or photoetching process is adopted to prepare pixel wall in described step 4.
Further preferably, adopt silk screen print method to prepare pixel wall in described step 4, pixel wall viscosity of material 100-10000cSt, the pixel wall condition of cure obtained is as follows: be placed in baking oven, be warming up to 200-300 DEG C, stops heating immediately, naturally cools to room temperature.
Further preferably, in described step 4, photoetching process is adopted to prepare pixel wall, before preparing pixel materials film coating, need to do water wettability process, then carry out lithography experiments, after obtaining pixel wall structure, substrate needs to put into baking oven and carries out high temperature reflux process, oven temperature 170-250 DEG C.
The invention has the beneficial effects as follows: the invention provides a kind of flexible electrical moisten display part and preparation technology thereof, the preparation technology of flexible electrical moisten display part of the present invention realizes the making of flexible electrical moisten display part based on the preparation technology of existing dull and stereotyped electric moistening display part, for enterprise has saved the more cost of exchange device, be beneficial to industrial upgrading, the development of flexible display device can be accelerated.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly described.Obviously, described accompanying drawing is a part of embodiment of the present invention, instead of whole embodiment, and those skilled in the art, under the prerequisite not paying creative work, can also obtain other design proposals and accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation of electric moistening display part of the present invention;
Fig. 2 is the schematic flow sheet of the embodiment of the present invention 1;
Fig. 3 is the electric moistening display part photo figure in kind of the embodiment of the present invention 1;
Fig. 4 is the display effect figure of the electric moistening display part of the embodiment of the present invention 1.
Embodiment
Clear, complete description is carried out, to understand object of the present invention, characteristic sum effect fully below with reference to embodiment and the accompanying drawing technique effect to design of the present invention, concrete structure and generation.Obviously; described embodiment is a part of embodiment of the present invention, instead of whole embodiment, based on embodiments of the invention; other embodiments that those skilled in the art obtains under the prerequisite not paying creative work, all belong to the scope of protection of the invention.Each technical characteristic in the invention, can combination of interactions under the prerequisite of not conflicting conflict.
As shown in Figure 1, flexible electrical moisten display part of the present invention, the some fluid chamber comprising upper substrate 1, infrabasal plate 2 and separated by pixel wall 4 between upper and lower substrate, immiscible first fluid 6 and second fluid 7 is filled with in each fluid chamber, the one side that upper substrate 1 is relative with infrabasal plate 2 is provided with conductive layer 3, the one side that infrabasal plate 2 is relative with upper substrate 1 is disposed with conductive layer 3, drain insulating layer 5 and pixel wall 4, upper substrate 1 and infrabasal plate 2 are flexible polyimide substrate.
Drain insulating layer 5 is all formed by fluorochemicals usually, can be single layer structure also can be the composite multi-layer membrane structure formed by hydrophobic layer and insulation course, in order to improve the combination between drain insulating layer 5 and infrabasal plate 2, the contact angle of preferred drain insulating layer 5 is 100-120 degree, specific inductive capacity 1.0 to 10.0.As, can be formed for fluorinated polyimide.
The normally hydrophilic polymeric material of pixel wall 6 material, as hydrophilic polyimide photoresist, PI, PDMS, PEN, PCO, PET, COC etc.
Conductive layer 3 is metal material layer, and inorganic oxide leads film or electroconductive organic film, and as being that gold, silver, copper, aluminium, ITO, IPO and Graphene etc. are formed, preferably, described conductive layer 3 is ITO material.
Flexible electrical moisten display part of the present invention can adopt following steps to prepare,
1, prepared substrate; Described substrate comprises upper substrate 1 and infrabasal plate 2, and described upper and lower substrate is flexible polyimide substrate.
In described step 1, upper and lower substrate adopts following steps to prepare:
1.1 make cofferdam on hard floor; Hard floor can be the inorganic material base plates such as glass, or plastic bottom board etc., as long as do not react with polyimide, and certain temperature can be born; Preferably, described base plate is glass or the brilliant base plate of circle.
Cofferdam, mainly in order to define the shape of the limitation imines substrate obtained, can adopt the stationary frame structure etc. of solid frame (pre-processed plate frame), printing rubber frame (framed structure of liquid printing and dry aftershaping), photoetching acquisition.
1.2 add polyimide solution in the cofferdam prepared, and spin-coating film, then at 30-50 DEG C of boiler portion solvent.
For the ease of film forming, preferably, the viscosity of polyimide solution is 1000-10000cSt, and volume is 1-100ml.Easy employing low speed coating, rotating speed is 100-1000r/min, and spin-coating time is 10-30s, to ensure homogeneity and the continuity of film forming.
After spin coating, partial solvent is removed in heating, reaches the effect of sizing, avoid the coating before subsequent coated impact, but simultaneously, reserve part solvent again, makes rete have certain viscosity, ensures to combine closely between the rete applied below; Preferably, the time of 30-50 DEG C of boiler portion solvent is 5-30min.
1.3 repeat step 1.2 several times, obtain the polyimide film of desired thickness.
The thickness of polyimide film sets, in conjunction with the condition of spin coating proceeding and the character of polyimide solution, preferably between 100-1000 μm according to the thickness of application.
Multiplicity also adjusts along with the change of thickness, and preferably, if described flexible polyimide substrate is the upper substrate of electric moistening display part, multiplicity is 2-5 time; If described flexible polyimide substrate is the infrabasal plate of electric moistening display part, multiplicity is 5-10 time.
The 1.4 base plate low-temperature heats with polyimide film step 1.3 obtained, make the solvent in polyimide film volatilize.
Such as, be placed in 70 DEG C, heating 10-40min.
1.5 be warming up to 200-300 DEG C after stop immediately heating, naturally cool to room temperature, polyimide film peeled off from base plate, obtain described flexible polyimide substrate.
2, electrode layer 3 is made.
2.1 adopt magnetron sputtering method at described upper substrate 1, infrabasal plate 2 surface deposition conductive layer 3; Common conductive layer 3 has metallic film: gold, silver, copper, aluminium, ITO, IPO and Graphene etc., and be preferably ITO conductive film, thickness is at 50-250nm.
2.2 circuit etching display device on the conductive layer 3 obtained; The method of laser ablation or photoengraving can be adopted, the conductive layers such as ITO 3 etch the circuit of display device.
3, drain insulating layer 5 is applied.
In the coating of infrabasal plate 2 surface film forming, then heating, drying that step 2 obtains, obtain drain insulating layer 5.Preferably, the contact angle of drain insulating layer 5 is 100-120 degree, specific inductive capacity 1.0 to 10.0.
Drain insulating layer 5 can be single layer structure also can be the multilayer film be composited by hydrophobic layer and insulation course, usually be all the drain insulating layer 5 of the individual layer formed by fluoropolymer, or be only form hydrophobic layer, in order to ensure insulation course, the insulation course that formed by SiC etc. of compound one deck again, forms the drain insulating layer 5 of sandwich construction.
Fluoropolymer can be the noncrystal fluoropolymer of such as AF1600, AF1600X or AF1601 that DuPont company provides, or any other low surface energy polymeric such as CYTOP, HYFLON, as Cytop, Hyflon etc., after solution coating, heating, drying is except desolventizing.
Preferably, described when forming the drain insulating layer 5 of individual layer, adopt fluorinated polyimide film or amorphous Teflon material spin coating preparation.When especially adopting fluorinated polyimide, the drain insulating layer 5 of formation can have better bonding properties with polyimide infrabasal plate 2.
As, when drain insulating layer 5 adopts fluorinated polyimide solution spin-coating film, film forming heats 5-60min at being placed on 40-70 DEG C, is then warming up to 222-300 DEG C, stops heating immediately, naturally cools to room temperature, forms polyimide drain insulating layer.Preferably, during spin-coating film, fluorinated polyimide solution concentration is 10-18wt%, and use amount is 1-5ml, and spin-coating film rotating speed is 500-2000r/min, and spin-coating time is 60-100s.
Wherein in the step of 40-70 DEG C of heating, can carry out step by step, also can once complete, at can being first placed in 40 DEG C, heating 5-10min, then rise to 50 DEG C of heating 10-20min, finally rise to 70 DEG C of heating 20-40min; Or directly at a certain temperature, heating a period of time, as 60 DEG C, 10min; Or 55 DEG C, 20min etc.Preferably, substep carries out, and such film-formation result is better.
When drain insulating layer 5 adopts amorphous Teflon material (AF1600, CYTOP, HYFLON etc.) spin-coating film time, heat 5-15min at 65 DEG C can being placed in after film forming, naturally cool to room temperature after stopping heating, form amorphous Teflon insulating hydrophobic insulation course.Preferably, during spin-coating film, Teflon material solution concentration 1-5wt%, use amount 1-3mL, spin-coating film rotating speed is 500-1500r/min, and spin-coating time is 10-60s,
4, pixel wall 4 is prepared.
The drain insulating layer 5 surface preparation pixel wall 4 that arbitrary known method is obtaining in step 3 can be adopted.
Pixel wall 4 is formed by hydrophilic polymer materials, as hydrophilic polyimide photoresist, and PI, PDMS, PEN, PCO, PET, COC etc.Drain insulating layer 5 surface can be coated on by modes such as spin coating, roller coating, serigraphy, slot coated, then by mask lithography technique, obtain required pixel wall 4 pattern.
Preferably, the mode of photoetching or serigraphy is adopted.
When adopting the mode of serigraphy, pixel wall 4 layers is set on drain insulating layer 5, specifically, can pixel wall 4 silk screen be placed in drain insulating layer, on silk screen, apply hydrophilic polyimide solution, take away silk screen and make hydrophilic polyimide solution through wire mesh shape pixel wall 4 structure.This eliminate photoetching process, directly in drain insulating layer 5, apply pixel wall 4, and patterned while, achieve pixel wall 4 sticking in drain insulating layer 5, easy control simple to operate.The pixel wall 4 obtained after serigraphy needs to adopt the method for heating to remove wherein solvent, solidifying and setting, preferably, is placed in baking oven, is warming up to 200-300 DEG C, stop heating immediately, naturally cool to room temperature.
Preferably, when adopting silk screen print method to prepare pixel wall, pixel wall viscosity of material 100-10000cSt, the pixel wall condition of cure obtained is as follows: be placed in baking oven, be warming up to 200-300 DEG C, stops heating immediately, naturally cools to room temperature.
And when adopting photoetching process to prepare pixel wall, preferably, before preparing pixel materials film coating, need to do water wettability process, then carry out lithography experiments, after obtaining pixel wall structure, substrate needs to put into baking oven and carries out high temperature reflux process, oven temperature 170-250 DEG C.
Preferably, in order to improve the bonding properties between each layer, pixel wall 4 material is hydrophilic polyimide, especially when drain insulating layer 5 material in step 3 is fluorinated polyimide.And when drain insulating layer 5 and pixel wall 4 material all adopt polyimide, preferably, the fluorinated polyimide solution forming drain insulating layer 5 and the hydrophilic polyimide solution forming pixel wall 4 material can adopt solvent that is identical or that mix, to realize the excellent bonds between drain insulating layer 5 and pixel wall 4, and can directly pixel wall 4 be arranged on drain insulating layer 5, without the need to carrying out surface modification to drain insulating layer 5 as classic method, backflow recovers hydrophobic performance etc., thus simplifies technique.Preferably, all adopt dimethyl acetamide as solvent, better can promote the Adhesion property between pixel wall 4 and drain insulating layer 5 like this.
5, fill, encapsulation.
Pixel wall 4 layers of periphery of 5.1 infrabasal plates 2 obtained in step 4 arrange glue frame, fill inconsistent first fluid 6 and second fluid 7; First fluid 6 can be ink etc., and second fluid 7 can be water etc.
5.2 utilize glue frame, and the bonding realizing the infrabasal plate 2 obtained in upper substrate 1 obtained in step 2 and step 5.1 encapsulates, and obtains described flexible display device.
The preparation method of flexible Electrowetting device of the present invention is described below in conjunction with the embodiment optimized.
Embodiment 1
A preparation technology for flexible electrical moisten display part, as shown in Figure 2, comprises
1, prepared substrate
1.1 make cofferdam on glass hard floor.
1.2 add polyimide solution in the cofferdam prepared, and its viscosity is 7000cSt, and volume is 5ml; Then at rotating speed 600r/min, spin coating 20s film forming, finally at 40 DEG C of heating 15min evaporation section solvents.
The operation of 1.3 repetition steps 1.2 2 times, obtains the polyimide film for electric moistening display part upper substrate.
The operation of repetition step 1.2 10 times, obtains the polyimide film for electric moistening display part infrabasal plate.
1.4 base plates had for the polyimide film of electric moistening display part upper substrate step 1.3 obtained are placed in 70 DEG C, heating 10min;
The base plate had for the polyimide film of electric moistening display part upper substrate step 1.3 obtained is placed in 70 DEG C, heating 40min.
1.5 base plates with the polyimide film for electric moistening display part upper substrate that step 1.4 is obtained, heating is stopped immediately after being warming up to 200 DEG C, naturally cool to room temperature, polyimide film is peeled off from base plate, obtain the flexible polyimide substrate for electric moistening display part upper substrate;
The base plate with the polyimide film for electric moistening display part infrabasal plate that step 1.4 is obtained, heating is stopped immediately after being warming up to 300 DEG C, naturally cool to room temperature, polyimide film is peeled off from base plate, obtain the flexible polyimide substrate for electric moistening display part infrabasal plate.
2, electrode layer is made
2.1 adopt magnetron sputtering method at described upper substrate and lower substrate surface deposition ITO conductive layer, and thickness is at 150nm.
2.2 on the ITO conductive layer obtained laser ablation go out the circuit of display device.
3, drain insulating layer is applied
The lower substrate surface obtained in step 2 adds the fluorinated polyimide solution 3ml that concentration is 13wt%, and solvent is dimethyl acetamide, and rotating speed is spin coating 80s film forming under 1500r/min condition, and wherein the solvent of fluorinated polyimide solution is dimethyl acetamide; Then heat 7min at being placed in 40 DEG C, then rise to 50 DEG C of heating 15min, then rise to 70 DEG C of heating 30min, be finally warming up to 280 DEG C, stop heating immediately, naturally cool to room temperature, form polyimide drain insulating layer.
4, pixel wall is prepared
Be solvent with dimethyl acetamide, prepare hydrophilic polyimide solution, viscosity is 7000cSt, adopts the drain insulating layer surface printing pixel wall that the mode of serigraphy obtains in step 3; Then substrate is placed in baking oven, is warming up to 235 DEG C, stop heating immediately, naturally cool to room temperature.
5, fill, encapsulation
The pixel wall layers periphery of 5.1 infrabasal plates obtained in step 4 arranges glue frame, fills inconsistent water and colored ink.
5.2 encapsulation
Utilize glue frame, the bonding realizing the infrabasal plate plate obtained in upper substrate obtained in step 2 and step 5.1 encapsulates, and obtain flexible display device, as shown in Figure 3, display effect as shown in Figure 4 for its photo in kind.
Embodiment 2
A preparation technology for flexible electrical moisten display part, comprises
1, prepared substrate
1.1 make cofferdam in polymer base.
1.2 add polyimide solution in the cofferdam prepared, and its viscosity is 2000cSt, and volume is 80ml; Then at rotating speed 150r/min, spin coating 30s film forming, finally at 50 DEG C of heating 30min evaporation section solvents.
The operation of 1.3 repetition steps 1.2 3 times, obtains the polyimide film for electric moistening display part upper substrate.
The operation of repetition step 1.2 8 times, obtains the polyimide film for electric moistening display part infrabasal plate.
1.4 base plates had for the polyimide film of electric moistening display part upper substrate step 1.3 obtained are placed in 70 DEG C, heating 20min;
The base plate had for the polyimide film of electric moistening display part upper substrate step 1.3 obtained is placed in 70 DEG C, heating 60min.
1.5 base plates with the polyimide film for electric moistening display part upper substrate that step 1.5 is obtained, heating is stopped immediately after being warming up to 200 DEG C, naturally cool to room temperature, substrate version is dissolved by chemical method and removes, separate Kapton, obtain the flexible polyimide substrate for electric moistening display part upper substrate;
The base plate with the polyimide film for electric moistening display part infrabasal plate step 1.5 obtained, stops heating immediately, naturally cools to room temperature, obtain the flexible polyimide substrate for electric moistening display part infrabasal plate after being warming up to 250 DEG C.
2, electrode layer is made.
2.1 adopt magnetron sputtering method at described upper substrate and lower substrate surface deposition ITO conductive layer, and thickness is at 50nm.
2.2 on the ITO conductive layer obtained laser ablation go out the circuit of display device.
3, drain insulating layer is applied.
The lower substrate surface obtained in step 2 adds the fluorinated polyimide solution 1ml that concentration is 10wt%, and solvent is dimethyl acetamide, and rotating speed is spin coating 60s film forming under 500r/min condition, and wherein the solvent of fluorinated polyimide solution is dimethyl acetamide; Then heat 5min at being placed in 40 DEG C, then rise to 50 DEG C of heating 10min, then rise to 70 DEG C of heating 20min, be finally warming up to 222 DEG C, stop heating immediately, naturally cool to room temperature, form polyimide drain insulating layer.
4, pixel wall is prepared.
Take dimethyl acetamide as solvent, hydrophilic polyimide solution, viscosity is 7000cSt, adopts the drain insulating layer surface printing pixel wall that the mode of serigraphy obtains in step 3; Then substrate is placed in baking oven, is warming up to 200 DEG C, stop heating immediately, naturally cool to room temperature.
5, fill, encapsulation
The pixel wall layers periphery of 5.1 infrabasal plates obtained in step 4 arranges glue frame, fills inconsistent water and colored ink.
5.2 utilize glue frame, and the bonding realizing the infrabasal plate plate obtained in upper substrate obtained in step 2 and step 5.1 encapsulates.
Device is put into isopropyl alcohol by 5.3, is dissolved the substrate plate material removed on infrabasal plate by chemical method, peels off and obtains flexible display device.
Embodiment 3
1, prepared substrate
1.1 make cofferdam on glass film plates.
1.2 add polyimide solution in the cofferdam prepared, and its viscosity is 10000cSt, and volume is 1ml; Then at rotating speed 1000r/min, spin coating 10s film forming, finally at room temperature stablizes 1min, then 30 DEG C of heating 5min evaporation section solvents.
The operation of 1.3 repetition steps 1.2 5 times, obtains the polyimide film for electric moistening display part upper substrate.
The operation of repetition step 1.2 10 times, obtains the polyimide film for electric moistening display part infrabasal plate.
1.4 base plates had for the polyimide film of electric moistening display part upper substrate step 1.3 obtained are placed in 70 DEG C, heating 10min;
The base plate had for the polyimide film of electric moistening display part upper substrate step 1.3 obtained is placed in 70 DEG C, heating 40min.
1.5 base plates with the polyimide film for electric moistening display part upper substrate that step 1.4 is obtained, heating is stopped immediately after being warming up to 280 DEG C, naturally cool to room temperature, polyimide film is peeled off from base plate, obtain the flexible polyimide substrate for electric moistening display part upper substrate;
The base plate with the polyimide film for electric moistening display part infrabasal plate that step 1.4 is obtained, heating is stopped immediately after being warming up to 300 DEG C, naturally cool to room temperature, polyimide film is peeled off from base plate, obtain the flexible polyimide substrate for electric moistening display part infrabasal plate.
2, electrode layer is made
2.1 adopt magnetron sputtering method at described lower surface deposition ITO conductive layer, and thickness is at 250nm.
2.2 adopt wet press method to prepare transparent dargyrome lattice structure on the surface of described upper substrate, make transparency conducting layer, thickness 20nm.
On 2.3 conductive layers obtained in step 2.2, laser ablation goes out the circuit of display device.
3, drain insulating layer is applied
The lower substrate surface interpolation concentration obtained in step 2 is, the AF1600 solution 3ml of 3%, and solvent is CF4100, and rotating speed is spin coating 50s film forming under 1500r/min condition; Then heat 5min at being placed in 65 DEG C, stop heating immediately, naturally cool to room temperature, form AF1600 drain insulating layer.
4, pixel wall is prepared
The film that step 3 obtains by 4.1 hydrophobic surface process is put into solution and is carried out surface plasma etching, and energy is 5w, time 30s.
The 4.2 drain insulating layer surface spin coating SU-83050 handled well, speed 1500rpm, time 30s; Put 95 DEG C of heating on hot plate naturally to cool after 3 minutes; Be placed in exposure machine and utilize the mask plate prepared to carry out aligning and uv-exposure 40s; Put 95 DEG C of heating on hot plate naturally to cool after 3 minutes; Develop 1.5min in SU-8 developer solution, and with deionized water rinsing 30s, 95 DEG C of heating 2min, obtain pixel wall structure on hot plate.
4.3 substrates step 4.2 obtained are put into heating furnace under 200 degree, are added hot reflux 2 hours, then naturally cool.
5, fill, encapsulation
The pixel wall layers periphery of 5.1 upper substrates obtained in step 4 arranges glue frame, fills inconsistent water and colored ink.
The 5.2 glue frames utilizing well cutting in advance, the bonding realizing the infrabasal plate plate obtained in upper substrate obtained in step 2 and step 5.1 encapsulates, and obtains flexible display device.
Electricity is wetting, and to have another name called electricity moistening, and the present invention is equally applicable to electric moistening flexible display device.
Above better embodiment of the present invention is illustrated, but the invention is not limited to described embodiment, those of ordinary skill in the art also can make all equivalent modifications or replacement under the prerequisite without prejudice to spirit of the present invention, and these equivalent modification or replacement are all included in the application's claim limited range.
Claims (10)
1. a flexible electrical moisten display part, the some fluid chamber comprising upper substrate, infrabasal plate and separated by pixel wall between upper and lower substrate, immiscible first fluid and second fluid is filled with in described each fluid chamber, the one side that described upper substrate is relative with infrabasal plate is provided with conductive layer, the one side that described infrabasal plate is relative with upper substrate is disposed with conductive layer, drain insulating layer and pixel wall, it is characterized in that: described upper substrate and infrabasal plate are flexible polyimide substrate.
2. flexible electrical moisten display part according to claim 1, is characterized in that: described drain insulating layer contact angle is 100-120 degree, specific inductive capacity 1.0 to 10.0.
3. flexible electrical moisten display part according to claim 1 and 2, is characterized in that: described pixel wall material is hydrophilic polymeric material.
4. flexible electrical moisten display part according to claim 3, is characterized in that: described conductive layer is metal material layer, and inorganic oxide leads film or electroconductive organic film.
5. a preparation technology for flexible electrical moisten display part, is characterized in that, comprises the following steps:
1, prepared substrate; Described substrate comprises upper substrate and infrabasal plate, and described upper substrate and infrabasal plate are flexible polyimide substrate, adopts following steps to prepare,
1.1 make cofferdam on hard floor;
1.2 add polyimide solution in the cofferdam prepared, and spin-coating film, then at 30-50 DEG C of boiler portion solvent;
1.3 repeat step 1.2 several times, obtain the polyimide film of desired thickness;
The 1.4 base plate low-temperature heats with polyimide film step 1.3 obtained, make the solvent in polyimide film volatilize;
1.5 be warming up to 200-300 DEG C after stop immediately heating, naturally cool to room temperature, obtain flexible transparent polyimide substrate;
2, electrode layer is made;
2.1 adopt magnetron sputtering method at described upper substrate and lower substrate surface depositing conducting layer;
2.2 circuit etching display device on the conductive layer obtained;
3, drain insulating layer is applied;
In lower substrate surface coating film forming, then heating, drying that step 2 obtains, obtain drain insulating layer;
4, pixel wall is prepared;
In the drain insulating layer surface preparation pixel wall that step 3 obtains;
5, fill, encapsulation;
The pixel wall layers periphery of 5.1 infrabasal plates obtained in step 4 arranges glue frame, fills inconsistent first fluid and second fluid;
5.2 utilize glue frame, and the bonding realizing the infrabasal plate plate obtained in upper substrate obtained in step 2 and step 5.1 encapsulates, and obtains described flexible electrical moisten display part.
6. the preparation technology of flexible electrical moisten display part according to claim 5, is characterized in that, in described step 3, drain insulating layer is individual layer fluoropolymer film, or the multilayer films of insulation course composite hydrophobic layer.
7. the preparation technology of flexible electrical moisten display part according to claim 6, is characterized in that, in described step 3, drain insulating layer is individual layer fluorinated polyimide film or amorphous Teflon film.
8. the preparation technology of flexible electrical moisten display part according to claim 5, is characterized in that: in described step 4, adopts silk screen print method or photoetching process to prepare pixel wall.
9. the preparation technology of flexible electrical moisten display part according to claim 8, it is characterized in that: in described step 4, silk screen print method is adopted to prepare pixel wall, pixel wall viscosity of material 100-10000cSt, the pixel wall condition of cure obtained is as follows: be placed in baking oven, be warming up to 200-300 DEG C, stop heating immediately, slowly cool to room temperature.
10. the preparation technology of flexible electrical moisten display part according to claim 9, it is characterized in that: in described step 4, adopt photoetching process to prepare pixel wall, before preparing pixel materials film coating, need to do water wettability process, then lithography experiments is carried out, after obtaining pixel wall structure, substrate needs to put into baking oven and carries out high temperature reflux process, oven temperature 170-250 DEG C.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106291912A (en) * | 2016-08-10 | 2017-01-04 | 华南师范大学 | Electrowetting hydrophobicity dielectric layer, its preparation method and Electrowetting device |
| CN106291911A (en) * | 2016-08-10 | 2017-01-04 | 华南师范大学 | Hydrophobicity dielectric layer, its preparation method and the Electrowetting device of lamination layer structure |
| CN107065172A (en) * | 2017-05-08 | 2017-08-18 | 东南大学 | A kind of covering visible light to infrared band wide spectrum display |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012055724A1 (en) * | 2010-10-29 | 2012-05-03 | Miortech Holding B.V. | Electrowetting optical element. |
| CN102591006A (en) * | 2011-01-13 | 2012-07-18 | 胜华科技股份有限公司 | Electrowetting display unit |
| CN102627780A (en) * | 2012-03-30 | 2012-08-08 | 北京化工大学 | Method for preparing submicron polyimide self-supporting film by adopting spin-coating method |
| CN103044916A (en) * | 2012-12-24 | 2013-04-17 | 南京依麦德光电材料科技有限公司 | Flexible transparent polyimide thin film and preparation method thereof |
| CN103257445A (en) * | 2013-05-28 | 2013-08-21 | 东南大学 | Flexible electric moisturizing display device |
| CN104570326A (en) * | 2015-01-27 | 2015-04-29 | 深圳市国华光电科技有限公司 | Method for improving packaging performance of electrowetting device and electrowetting device |
-
2015
- 2015-09-02 CN CN201510560814.5A patent/CN105242394A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012055724A1 (en) * | 2010-10-29 | 2012-05-03 | Miortech Holding B.V. | Electrowetting optical element. |
| CN102591006A (en) * | 2011-01-13 | 2012-07-18 | 胜华科技股份有限公司 | Electrowetting display unit |
| CN102627780A (en) * | 2012-03-30 | 2012-08-08 | 北京化工大学 | Method for preparing submicron polyimide self-supporting film by adopting spin-coating method |
| CN103044916A (en) * | 2012-12-24 | 2013-04-17 | 南京依麦德光电材料科技有限公司 | Flexible transparent polyimide thin film and preparation method thereof |
| CN103257445A (en) * | 2013-05-28 | 2013-08-21 | 东南大学 | Flexible electric moisturizing display device |
| CN104570326A (en) * | 2015-01-27 | 2015-04-29 | 深圳市国华光电科技有限公司 | Method for improving packaging performance of electrowetting device and electrowetting device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106291912A (en) * | 2016-08-10 | 2017-01-04 | 华南师范大学 | Electrowetting hydrophobicity dielectric layer, its preparation method and Electrowetting device |
| CN106291911A (en) * | 2016-08-10 | 2017-01-04 | 华南师范大学 | Hydrophobicity dielectric layer, its preparation method and the Electrowetting device of lamination layer structure |
| CN106291911B (en) * | 2016-08-10 | 2019-06-11 | 华南师范大学 | Hydrophobicity dielectric layer, preparation method and the Electrowetting device of lamination layer structure |
| CN106291912B (en) * | 2016-08-10 | 2019-12-24 | 华南师范大学 | Electrowetting hydrophobic dielectric layer, preparation method thereof and electrowetting device |
| CN107065172A (en) * | 2017-05-08 | 2017-08-18 | 东南大学 | A kind of covering visible light to infrared band wide spectrum display |
| CN107065172B (en) * | 2017-05-08 | 2021-10-19 | 东南大学 | Wide spectrum display covering visible light to infrared wave band |
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