CN104570326A - Method for improving packaging performance of electrowetting device and electrowetting device - Google Patents
Method for improving packaging performance of electrowetting device and electrowetting device Download PDFInfo
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- CN104570326A CN104570326A CN201510041369.1A CN201510041369A CN104570326A CN 104570326 A CN104570326 A CN 104570326A CN 201510041369 A CN201510041369 A CN 201510041369A CN 104570326 A CN104570326 A CN 104570326A
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- laminated material
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- material layer
- electrowetting device
- pixel wall
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- 238000000034 method Methods 0.000 title claims abstract description 48
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 24
- 239000002648 laminated material Substances 0.000 claims description 59
- 239000000758 substrate Substances 0.000 claims description 58
- 238000005538 encapsulation Methods 0.000 claims description 41
- 239000012530 fluid Substances 0.000 claims description 34
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 22
- 238000000576 coating method Methods 0.000 claims description 21
- 239000011248 coating agent Substances 0.000 claims description 19
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 239000011159 matrix material Substances 0.000 claims description 11
- 229920002120 photoresistant polymer Polymers 0.000 claims description 10
- 238000007639 printing Methods 0.000 claims description 4
- 239000002352 surface water Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 abstract description 27
- 238000007789 sealing Methods 0.000 abstract description 7
- 230000005484 gravity Effects 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 abstract description 4
- 230000009191 jumping Effects 0.000 abstract description 4
- 239000003292 glue Substances 0.000 description 16
- 230000002209 hydrophobic effect Effects 0.000 description 16
- 230000008569 process Effects 0.000 description 13
- 230000000694 effects Effects 0.000 description 11
- 238000001259 photo etching Methods 0.000 description 6
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- 238000003618 dip coating Methods 0.000 description 4
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 4
- 239000011505 plaster Substances 0.000 description 4
- 238000007761 roller coating Methods 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 238000004528 spin coating Methods 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 108010010803 Gelatin Proteins 0.000 description 2
- 229920002367 Polyisobutene Polymers 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 238000003854 Surface Print Methods 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 229920000159 gelatin Polymers 0.000 description 2
- 239000008273 gelatin Substances 0.000 description 2
- 235000019322 gelatine Nutrition 0.000 description 2
- 235000011852 gelatine desserts Nutrition 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- DCAYPVUWAIABOU-UHFFFAOYSA-N hexadecane Chemical compound CCCCCCCCCCCCCCCC DCAYPVUWAIABOU-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000019771 cognition Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- SOCTUWSJJQCPFX-UHFFFAOYSA-N dichromate(2-) Chemical compound [O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O SOCTUWSJJQCPFX-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- -1 more preferably Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
Abstract
The invention discloses a method for improving the packaging performance of an electrowetting device and the electrowetting device. A layer of attaching material good in hydrophobicity is arranged on the surfaces of pixel walls of a packaging attaching area, the problems that when a high-hydrophilic material is adopted to prepare the pixel walls to avoid the ink jumping phenomenon, the attaching performance of a rubber frame and the pixel walls is poor, and the packaging sealing performance is not good can be solved, an obtained packaging device is more reliable in quality, ink jumping is avoided, and the packaging sealing performance is guaranteed. Furthermore, the attaching material can cover the intersection of the longitudinal pixel walls and the transverse pixel walls, supporting columns are formed, and a series of display problems caused when base plates are bent due to gravity or stress are prevented. The method is simple in technology, low in cost and easy to control, and the obtained electrowetting device has superior packaging performance.
Description
Technical field
The present invention relates to electrowetting technology, be specifically related to a kind of method that can improve Electrowetting device encapsulation performance and the Electrowetting device obtained thus.
Background technology
Electrowetting device generally comprises two substrates, one of them substrate surface is provided with glue frame, another substrate surface is provided with the pixel wall of the arrangement in matrix, between two substrates, by the bonding between glue frame and pixel wall surface, encapsulation forms airtight chamber, and wherein airtight chamber comprises the second fluid (water or salt solusion) of nonconducting first fluid (alkane etc.), conduction, and fluid contacts with each other and immiscible.
Pixel wall normally obtains pattern structure through photoetching process, and the pixel compartments region that pixel wall surrounds is exactly viewing area, and electric moisten display device just produces display effect on this viewing area.Nonconducting first fluid is just filled in the viewing area that pixel wall formed, and the pixel wall around it for stopping that first fluid flows to surrounding pixel lattice, thus obtains stable display structure.Because first fluid is hydrophobic, therefore the upper surface of pixel wall needs higher water wettability to ensure that hydrophobic first fluid can not stride across pixel wall and flow to surrounding pixel lattice, otherwise there will be the situation that first fluid climbs over pixel wall, namely drive and jump black phenomenon, thus cause loss of voltage and first fluid can not flow back to, display cannot be repeated.
Therefore the water droplet contact angle on pixel wall surface is generally less than and equals 70 °.As the patent before inventor, application number: 201410665529.5, adopts hydrophilic SOG(spin-on-glass) material to prepare pixel wall, to improve the water wettability on pixel wall surface, avoid occur drive jump black phenomenon.
But then, for ensureing display quality, the airtight chamber that two substrates encapsulation is formed also will have good sealing property, avoid badly occurring ink leak phenomenon because of airtight in use procedure, namely ink flows out through gap, causes device failure, has a strong impact on the life-span of device.Namely require that the pixel wall of the glue frame of a substrate and another substrate surface surface wants can realize bonding closely, form completely airtight chamber.
And glue frame is generally pressure sensitive adhesive class (PSA) material makes, water or salt solusion is mainly in airtight chamber because being enclosed in, for preventing glue frame hydrophilic radical and water effect, therefore glue frame many employings hydrophobic pressure sensitive adhesive preparation, as polyacrylate, polyisobutylene etc., surface water droplet contact angle is general >=and 90 °, therefore when pixel wall surface hydrophilicity is too high, glue frame and pixel wall are difficult to bond closely, cause device package poor performance, easily produce ink leak phenomenon, namely in airtight chamber, liquid flows out, or environmental contaminants enters, thus reduce life-span and the output of device.
Summary of the invention
For solving the problem, the invention provides a kind of method and the Electrowetting device that can improve Electrowetting device encapsulation performance.
The solution that the present invention solves its technical matters is: a kind of method improving Electrowetting device encapsulation performance, comprises step:
The first substrate with packaging adhesive frame is provided;
Surface is provided to have the second substrate of pixel wall; Described pixel wall is the projection of matrix arrangement, water droplet contact angle≤50 degree on described pixel wall surface;
Arrange a laminated material layer on the surface of the pixel wall of second substrate, described laminated material layer covers the encapsulation fit area corresponding with packaging adhesive frame, pixel wall surface; The surperficial water droplet contact angle 70-120 degree of described laminated material layer;
First fluid and second fluid are applied to second substrate;
The laminated material layer on the packaging adhesive frame on first substrate surface and second substrate surface is bonded, and presses 6-24h.
For realizing the coating of laminated material at pixel wall material surface, described laminated material layer hydrophobicity can not be too strong, preferably, and surperficial water droplet contact angle 90-100 degree.
Preferably, the surface of the described pixel wall at second substrate arranges the step of laminated material layer, obtains laminated material layer by method for printing screen at pixel wall surface printing.
Preferably, the surface of the described pixel wall at second substrate arranges the step of laminated material layer, is utilize mask plate, by photoresist coating, exposure, development treatment, obtains described laminated material layer.
As the further improvement of such scheme, described laminated material layer also completely or partially covers the some point of crossing of longitudinal and transverse pixel wall be positioned at outside encapsulation fit area, namely forms some support columns for interval first substrate and second substrate in the point of crossing of longitudinal and transverse pixel wall by laminated material.
Due to the effect of gravity and capillary force, the first substrate of electric moistening display part and second substrate can present the shape of depression, and more large thinner substrate intermediate recess can be more serious, it is unequal that this just causes sealing rear device void pitch (being box thick) that is middle and edge, and surrounding spacing is greater than middle ware distance.When substrate bears the pressure from outside, the first-class cognition in pixel wall is destroyed by capillary force, leaves bad point in procedure for displaying.Therefore, the existence of support column can avoid the appearance of Similar Problems.
Because pixel wall is matrix arrangement, and pixel wall is owing to surrounding closed space to hold first fluid, therefore longitudinal and transverse pixel wall can be intersected, and form point of crossing, point of crossing described here is a region in fact.The shape in region is determined by the shape of pixel wall, laminated material can cover this region in whole or in part, forms support column, neither affects display effect, also can reach the effect that interval supports, the cross sectional shape of support column can be square, circle, polygon etc.
When laminated material covers the point of crossing of longitudinal and transverse pixel wall, when forming support column, preferably, adopt mask plate, by photoresist coating, exposure, development treatment, to obtain thicker coating, and coated shape can accurately control, thickness >=10 μm of usual described laminated material layer; Preferably, thickness >=50 μm of described laminated material layer.
Preferably, the number of described support column is every 100 pixel 1-10.
Present invention also offers a kind of Electrowetting device, the method encapsulation adopting above-mentioned any one to improve Electrowetting device encapsulation performance obtains.
The invention has the beneficial effects as follows: the present invention is by arranging the good laminated material of one deck hydrophobicity on the pixel wall surface of encapsulation fit area, avoid when adopt high water wetted material prepare pixel wall prevent from jumping black phenomenon time, glue frame and pixel wall adhesion property poor, the problem that potting is bad, and the packaging quality obtained is more reliable, both avoided and jumped ink, also ensure that the sealing of encapsulation.Further, can also in the point of crossing of longitudinal and transverse pixel wall also covering plaster condensation material, form support column, prevent substrate because of gravity or the stressed and bending series of problems caused.Method technique of the present invention is simple, and cost is low, easily controls, and the Electrowetting device obtained has excellent encapsulation performance.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly described.Obviously, described accompanying drawing is a part of embodiment of the present invention, instead of whole embodiment, and those skilled in the art, under the prerequisite not paying creative work, can also obtain other design proposals and accompanying drawing according to these accompanying drawings.
Fig. 1 is the first substrate structural representation of Electrowetting device of the present invention;
Fig. 2 is the second substrate structural representation of Electrowetting device of the present invention;
Fig. 3 be Electrowetting device of the present invention second substrate on the matrix Pareto diagram schematic diagram of pixel wall;
Fig. 4 is the process schematic representation of serigraphy laminated material layer of the present invention;
Fig. 5 is the process schematic representation that photoetching process of the present invention prepares laminated material layer;
Fig. 6 is the floor map of the mask plate used in technique shown in Fig. 5;
Fig. 7 is the distribution schematic diagram of support column of the present invention;
Fig. 8 is the floor map of the mask plate used in one embodiment of the invention;
Fig. 9 is the structural representation after the Electrowetting device encapsulation of one embodiment of the invention;
Figure 10 is the structural representation after the Electrowetting device encapsulation of another embodiment of the present invention.
Embodiment
Clear, complete description is carried out, to understand object of the present invention, characteristic sum effect fully below with reference to embodiment and the accompanying drawing technique effect to design of the present invention, concrete structure and generation.Obviously; described embodiment is a part of embodiment of the present invention, instead of whole embodiment, based on embodiments of the invention; other embodiments that those skilled in the art obtains under the prerequisite not paying creative work, all belong to the scope of protection of the invention.Each technical characteristic in the invention, can combination of interactions under the prerequisite of not conflicting conflict.
Composition graphs 1 ~ 10, be described the method for raising Electrowetting device encapsulation performance of the present invention, method of the present invention comprises the following steps:
S1: the first substrate 1 with packaging adhesive frame 13 is provided.
The structure of first substrate 1 as shown in Figure 1, comprises the first back up pad 11, is arranged at the first electrode layer 12 on the first back up pad 11 surface, and is arranged on the packaging adhesive frame 13 on the first electrode layer; First back up pad 11 can be glass, metal or Polymer-supported fagging, and can be rigidity or flexibility.First electrode layer 12 can be electroconductive ITO (tin indium oxide), metal electrode coating etc., can be shape or the form of any expectation.
First substrate 1 and second substrate 2 bond by acting as of packaging adhesive frame 13, to form the airtight chamber 3 of display, as illustrated in fig. 9 or 10.Packaging adhesive frame 13 can adopt pressure sensitive, thermo-sensitive material, photochromics, Microwave Emulsifier-Free Polymerization material etc., and because pressure sensitive using method is simple, and can not cause other damage to device, therefore packaging adhesive frame more than 13 adopts pressure sensitive.Simultaneously, because first fluid 4 is filled in the viewing area 26 in pixel wall 24 besieged city, and the mainly second fluid 5 of filling in airtight chamber 3, second fluid 5 is aqueous solution or salt solusion, therefore for ensureing that packaging adhesive frame 13 does not act on it and lost efficacy, or aqueous solution infiltrate glue frame material and affect device lifetime, packaging adhesive frame more than 13 adopts hydrophobic pressure sensitive, as polyacrylate, polyisobutylene etc.
S2: the second substrate 2 that surface has pixel wall 24 is provided, the projection that described pixel wall 24 arranges for matrix, water droplet contact angle≤50 degree on pixel wall 24 surface.
As shown in Figure 2, second substrate 2 comprises the second back up pad 21 be oppositely arranged with first substrate 1, second back up pad 21 has the second electrode lay 22, and the second electrode lay 22 can be electroconductive ITO (tin indium oxide), metal electrode coating etc., can be shape or the form of any expectation.
Be drain insulating layer 23 on the second electrode lay 22, drain insulating layer 23 can be transparent or reflection, and the thickness of drain insulating layer 23 is less than 2 μm, more preferably, is less than 1 μm.Drain insulating layer 23 can be the noncrystal fluoropolymer of such as AF1600, AF1600X or AF1601 that DuPont company provides, or any other low surface energy polymeric, as Cytop, Hyflon etc.Preferably, drain insulating layer 23 thickness is between 300 ~ 800nm.
Drain insulating layer 23 also can be divided into two-layer: insulation course and hydrophobic layer, namely first on the second electrode lay 22, is coated with one deck dielectric substance as silicon oxide layer or silicon nitride layer, has the thickness of such as 200nm, forms insulation course; And then be coated with one deck hydrophobic material, form hydrophobic layer, when the material of coating certainly meets hydrophobic and requirement that is that insulate simultaneously, AF1600, AF1600X or AF1601 described above etc., then directly can be coated with and form drain insulating layer 23.
Drain insulating layer 23 is provided with pixel wall 24, pixel wall material can be photoresist (such as, SU-8), and THICKNESS CONTROL is at 2-50 μm.
The preparation of pixel wall 24 can adopt method well known to those skilled in the art, as can be adopted a step or multistep processes coating for Other substrate materials, coating method can be, but not limited to spin coating (spin-coating), roller coating (roller-coating), slot coated (slit-coating), dip-coating (dip-coating), spraying (spray-coating), blade coating (blade-coating) etc.Then further the baking (PEB) after prebake conditions, UV exposure light irradiation and exposure is carried out to glued membrane, then obtain pixel wall 24 through development etc., jumping black phenomenon for avoiding driving, water droplet contact angle≤50 degree on pixel wall 24 surface obtained be ensured.
The application number of the submission preferably before employing the present inventor is: the method in the patent of invention of 201410665529.5 prepares pixel wall 24, namely pixel wall 24 be formed by hydrophilic SOG material or pixel wall surface there is the hydrophilic SOG material of one deck, pixel wall 24 surface hydrophilicity obtained like this is high, can avoid driving and jump black phenomenon.
The projection that the pixel wall 24 obtained arranges for matrix, as shown in Figure 3.Xsect is square or rectangular normally, and pixel wall 24 is intersected in length and breadth, forms multiple point of crossing 28.Matrix display edge is the photoresist glued membrane that exposure is cross-linked, and be encapsulation fit area 25, bandpass is 0.2-2cm, and more excellent is 0.5-1cm.The region that pixel wall 24 in the middle of matrix surrounds is viewing area 26, and first fluid 4 is just limited in this region.
S3: a laminated material layer 27 is set on the surface of the pixel wall 24 of second substrate, described laminated material layer covers the encapsulation fit area 25 corresponding with packaging adhesive frame 13, pixel wall 24 surface; The surperficial water droplet contact angle 70-120 degree of described laminated material layer 27.
Laminated material can be photoresist, also can be other comparatively hydrophobic materials, its hydrophilic and hydrophobic need meet water droplet contact angle 70-120 degree, for ensureing the Painting effect of laminated material at pixel wall material surface, and the adhesiving effect of laminated material and pixel wall material, more preferably, water droplet contact angle 90-100 degree.When laminated material adopts photoetching gelatin substance, comparatively hydrophobic SU-8 glue, KMPR glue (MicroChem company) can be selected, and the multiclass glue such as AZ glue (peace intelligence), GM glue (Gersteltec company).
Arranging of laminated material can adopt multiple method, as a step or multistep processes coating, coating method can be, but not limited to serigraphy (screen-printing), spin coating (spin-coating), roller coating (roller-coating), slot coated (slit-coating), dip-coating (dip-coating), spraying (spray-coating), blade coating (blade-coating) etc.
One embodiment of the invention, utilize wire mark plate 6, and by method for printing screen at pixel wall 24 surface printing laminated material layer 27, implementation process as shown in Figure 4.Wire mark plate 6 can be synthetic fibres net, stainless steel cloth, natural fiber silk screen etc., has strike through district and not strike through district, the position of correspondence encapsulation fit area 25, strike through district; Region not beyond strike through district correspondence encapsulation fit area 25, the not strike through district of wire mark plate 6 in network process processed by fillings such as photoetching gelatin substances, commercially available has dichromate system, diazo salt system, molysite system etc., coating in darkroom, drying, and then expose on cold light source printer and obtain after developing, stop laminated material in screen printing process through wire mark plate 6.And then by screen process press by liquid laminated material printing to the encapsulation fit area 25 of the pixel wall 24 of second substrate; And toast the solvent evaporated in liquid laminated material further, make its film forming, form laminated material layer 27; And the laminated material layer 27 of negative photoresist class is also needed after baking to the process of a step blank exposure, when namely not having mask plate or mask plate not to have a Guang Zhe district, UV illumination is penetrated, and the baking done further after illumination, physico-chemical property stable of film forming to ensure.Such as, the extraordinary AF material (Dupont) of coating hydrophobicity is as laminated material layer 27, by screen-printing machine, AF solution is printed to the encapsulation fit area 25 of the pixel wall 24 of second substrate, and then baking, first low temperature hot plate is pre-baked, and then higher temperatures convection oven completes evenly toast thoroughly, namely comparatively hydrophobic AF film is obtained on pixel wall 24 surface being positioned at encapsulation fit area 25, the AF film surface water droplet contact angle obtained is 108-120 degree, and the region encapsulated beyond fit area 25 is still the pixel wall that water wettability is high, solve to drive simultaneously and jump ink and the ink leak problem tightly do not caused of fitting.
An alternative embodiment of the invention, adopts photoresist, utilizes mask plate 7, by photoresist coating, exposure, development treatment, obtains described laminated material layer 27.As shown in Figure 5, the similar of the wire mark plate 6 used in the structure of the mask plate 7 of employing and silk-screen printing technique, floor map as shown in Figure 6 for implementation process.Particularly, be coated with the laminated material layer 27 of comparatively hydrophobic photoresist SU-8 on the pixel wall surface formed by hydrophilic SOG material, and further prebake conditions, evaporate partial solvent.Further, expose by mask plate 7 pairs of laminated material layers 27 and toast, and then by development mode wash off encapsulation fit area 25 beyond SU-8 glue, namely obtaining encapsulating surface, fit area 25 is comparatively hydrophobic SU-8 glue, SU-8 film surface water droplet contact angle is 85-95 degree, and the region encapsulated beyond fit area 25 is still the SOG pixel wall that water wettability is high, solves to drive simultaneously and jump ink and the ink leak problem tightly do not caused of fitting.
Because this laminated material layer 27 just uses the hydrophobic nature on its surface to ensure the laminating with packaging adhesive frame 13, therefore its thickness not requirement, and consider that the preparation technology of thicker material layer is more complicated, and consumable material is more, therefore, preferably, the thickness of laminated material layer 27 is≤5 μm, further preferably ,≤2 μm.
Further preferably, laminated material layer 27 is formed on pixel wall 24 surface of encapsulation fit area 25, while improving Electrowetting device encapsulation performance, can also at the zone line of pixel wall 24 matrix, also covering plaster condensation material, make it to serve as the support column between first substrate 1 and second substrate 2, prevent the series of problems because gravity or stressed substrate bend and cause.
For avoiding affecting display effect, laminated material will cover the vertical of matrix type pixel wall 24, the point of crossing 28 of horizontal pixel wall, described point of crossing 28 is actual is a region, laminated material can completely or partially cover this region, form support column, the xsect of support column can be circular, triangle, square, polygon etc., preferably, the number of support column is every 100 pixel 1-10, as shown in Figure 7, in figure, each square lattice are a pixel unit area, each pixel unit area is 10 × 10 pixels, the position of support column is as shown in stain in figure.When forming support column, the thickness of laminated material layer 27 is generally simultaneously >=and 10 μm, preferably, and >=50 μm, to reach better interval support effect.
By changing the structure of wire mark plate 6, seep through hole can be reserved needing the point of crossing 28 of covering plaster condensation material; Or change the shape of mask plate 7 during photoetching development, illumination hole is reserved in point of crossing 28, so just while the covering plaster condensation material of encapsulation fit area 25, can form in the point of crossing 28 of longitudinal and transverse pixel wall 24 support column formed by laminated material, prevent the problem that substrate causes because of gravity or stressed bending.
Because the size of support column is less, general serigraphy is difficult to reach accurate control, so preferably, adopts photoetching process to realize support column.As shown in Figure 8, the structure of the mask plate 7 improved in one embodiment of the present of invention is given.
S4: first fluid 4 and second fluid 5 are applied to second substrate 2.
First fluid 4 does not mix mutually with second fluid 5.First fluid 4 is nonconducting, can be alkane, such as hexadecane or (silicon) oil.First fluid 4 is preferably opaque, but can be colored or white.Second fluid 5 is conductions or has polarity, and can be water or salt solusion, such as, and the solution of potassium chloride in the potpourri of water and ethanol.Second fluid 5 is preferably transparent, but can be colored, white, absorption or reflection.
First fluid 4 and second fluid 5 method be applied on second substrate 2 can adopt the method known in this area to carry out, as second substrate 2 is immersed in (as water) in second fluid 5, by have near surface and first fluid 4 is assigned to substrate surface by the divider being immersed into the elongated open in second fluid 5.Because first fluid 4 is hydrophobic, second fluid 5 is hydrophilic, so first fluid 4 preferentially first covers the surface of drain insulating layer 23, is restricted in space that pixel wall 24 surrounds.
Or adopt the method announced in application CN 103852887 A before applicant to carry out.
S5: the packaging adhesive frame 13 on first substrate 1 surface is bonded with the laminated material layer 27 on second substrate 2 surface, and presses 6-24h.Pressing can ensure sealing effectiveness further, improves encapsulation performance.After pressing, just can obtain the packaged Electrowetting device of favorable sealing property.
As Fig. 9, it is the structural representation of the Electrowetting device that one embodiment of the invention obtains.
As Figure 10, it is the structural representation of the Electrowetting device that another embodiment of the present invention obtains.
Above better embodiment of the present invention is illustrated, but the invention is not limited to described embodiment, those of ordinary skill in the art also can make all equivalent modifications or replacement under the prerequisite without prejudice to spirit of the present invention, and these equivalent modification or replacement are all included in the application's claim limited range.
Claims (10)
1. improve a method for Electrowetting device encapsulation performance, it is characterized in that, comprise step:
The first substrate with packaging adhesive frame is provided;
There is provided surface to have the second substrate of pixel wall, described pixel wall is the projection of matrix arrangement, water droplet contact angle≤50 degree on described pixel wall surface;
Arrange laminated material layer on the surface of the pixel wall of second substrate, described laminated material layer covers the encapsulation fit area corresponding with packaging adhesive frame, pixel wall surface; The surperficial water droplet contact angle of described laminated material layer is 70-120 degree;
First fluid and second fluid are applied to second substrate;
The laminated material layer on the packaging adhesive frame on first substrate surface and second substrate surface is bonded, and presses 6-24h.
2. the method for raising Electrowetting device encapsulation performance according to claim 1, is characterized in that: described laminated material layer surface water droplet contact angle is 90-100 degree.
3. the method for raising Electrowetting device encapsulation performance according to claim 1, is characterized in that: the surface of the described pixel wall at second substrate arranges the step of laminated material layer, obtains laminated material layer by method for printing screen on pixel wall surface.
4. the method for raising Electrowetting device encapsulation performance according to claim 1, it is characterized in that: the surface of the described pixel wall at second substrate arranges the step of laminated material layer, be utilize mask plate, by photoresist coating, exposure, development, obtain described laminated material layer.
5. the method for the raising Electrowetting device encapsulation performance according to any one of claim 1-4, is characterized in that: thickness≤5 μm of described laminated material layer.
6. the method for raising Electrowetting device encapsulation performance according to claim 5, is characterized in that: thickness≤2 μm of described laminated material layer.
7. the method for the raising Electrowetting device encapsulation performance according to any one of claim 1,2,4, it is characterized in that: described laminated material layer also completely or partially covers the some point of crossing of longitudinal and transverse pixel wall be positioned at outside encapsulation fit area, namely form some support columns for interval first substrate and second substrate in the point of crossing of longitudinal and transverse pixel wall by laminated material.
8. the substrate of raising Electrowetting device encapsulation performance according to claim 7, is characterized in that: thickness >=50 μm of described laminated material layer.
9. the substrate of raising Electrowetting device encapsulation performance according to claim 7, is characterized in that: the number of described support column is every 100 pixel 1-10.
10. an Electrowetting device, is characterized in that: the method encapsulation adopting above-mentioned any one to improve Electrowetting device encapsulation performance obtains.
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| CN201510041369.1A CN104570326B (en) | 2015-01-27 | 2015-01-27 | A kind of method and Electrowetting device for improving Electrowetting device encapsulation performance |
| PCT/CN2016/070358 WO2016119581A1 (en) | 2015-01-27 | 2016-01-07 | Method for improving electrowetting device encapsulation performance and electrowetting device |
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| CN201510041369.1A CN104570326B (en) | 2015-01-27 | 2015-01-27 | A kind of method and Electrowetting device for improving Electrowetting device encapsulation performance |
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| CN104570326B (en) | 2017-06-20 |
| WO2016119581A1 (en) | 2016-08-04 |
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