CN105242093B - Electronic current mutual inductor - Google Patents
Electronic current mutual inductor Download PDFInfo
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- CN105242093B CN105242093B CN201510782589.XA CN201510782589A CN105242093B CN 105242093 B CN105242093 B CN 105242093B CN 201510782589 A CN201510782589 A CN 201510782589A CN 105242093 B CN105242093 B CN 105242093B
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- 238000006243 chemical reaction Methods 0.000 claims description 54
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- 238000004891 communication Methods 0.000 claims description 24
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- 230000003750 conditioning effect Effects 0.000 claims description 18
- 238000001514 detection method Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 13
- 239000013307 optical fiber Substances 0.000 claims description 13
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- 238000001914 filtration Methods 0.000 claims description 6
- 238000009499 grossing Methods 0.000 claims description 6
- 238000005259 measurement Methods 0.000 claims description 6
- 230000010363 phase shift Effects 0.000 claims description 6
- 238000004804 winding Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 3
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- 238000012360 testing method Methods 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
- G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
- G01R15/18—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using inductive devices, e.g. transformers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F38/00—Adaptations of transformers or inductances for specific applications or functions
- H01F38/20—Instruments transformers
- H01F38/22—Instruments transformers for single phase ac
- H01F38/28—Current transformers
- H01F38/32—Circuit arrangements
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
Abstract
The present invention relates to a kind of electronic current mutual inductor, described current transformer includes the dsp chip of electronic current mutual inductor main body, image detecting apparatus and TI company, described image detecting apparatus is for carrying out skeleton defect analysis to the shell of described electronic current mutual inductor main body, and the dsp chip of described TI company receives described skeleton defect analysis result and described skeleton defect analysis result is sent to display device displays. By means of the invention it is possible to while optimizing electronic current mutual inductor structure, it is achieved the automated analysis to the skeleton defect kind of electronic current mutual inductor.
Description
Technical field
The present invention relates to electronic current mutual inductor field, particularly relate to a kind of electronic current mutual inductor.
Background technology
The structure of common transformer is as follows: the structure of ordinary electric current mutual-inductor is relatively simple, is made up of mutually insulated winding, Secondary Winding, iron core and framework, housing, binding post etc. Its operation principle is essentially identical with transformator, the number of turn (N1) of winding is less, directly being series in power circuit, when a load current (I1) is by a winding, the alternating flux sensing of generation produces the secondary current (I2) reduced in proportion; The number of turn (N2) of Secondary Winding is more, connect with the secondary load (Z) of the current coil such as instrument, relay, transmitter formation closed-loop path, owing to winding has equal ampere-turn with Secondary Winding, I1N1=I2N2, in current transformer rated transformation ratio current transformer actual motion, load impedance is only small, Secondary Winding, close to short-circuit condition, is equivalent to the transformator of a short circuit operation.
Electronic mutual inductor, by the voltage of input, current signal are carried out AC sampling, again with digital quantity, sampled value is inputted secondary meter by the transmission system such as cable, optical fiber to be connected, the sampled value of voltage, electric current is carried out computing by digital quantity input secondary meter, it is possible to obtain the parameters such as voltage effective value, current effective value, fundamental voltage, fundamental current, harmonic voltage, harmonic current, active power, fundamental power, harmonic power.
But, electronic mutual inductor of the prior art design is not reasonable, and primary equipment structure and secondary device structure remain a need for optimizing, and, existing electronic mutual inductor does not generally configure outer casing framework defect detection equipment, and the pattern still relying on manual inspection carries out, and detection efficiency is not high.
For this, the present invention has built a kind of electronic current mutual inductor, optimize the structure of existing electronic mutual inductor, improve the service behaviour of electronic mutual inductor, the more important thing is, being integrated on electronic mutual inductor by outer casing framework defect detection equipment, electronic mutual inductor self can realize defect kind and judge, improves electronic mutual inductor intelligent level.
Summary of the invention
In order to solve the technical problem that prior art exists, the invention provides a kind of electronic current mutual inductor, on the one hand, optimize the structure of existing electronic current mutual inductor, improve the product quality of electronic current mutual inductor, on the other hand, introduce high-precision various image processing equipment targetedly and the outer casing framework of electronic current mutual inductor is carried out defect kind analysis, be prevented effectively from the generation of field accident.
According to an aspect of the present invention, provide a kind of electronic current mutual inductor, described current transformer includes the dsp chip of electronic current mutual inductor main body, image detecting apparatus and TI company, described image detecting apparatus is for carrying out skeleton defect analysis to the shell of described electronic current mutual inductor main body, and the dsp chip of described TI company receives described skeleton defect analysis result and described skeleton defect analysis result is sent to display device displays.
More specifically, in described electronic current mutual inductor, including: electronic current mutual inductor main body, including the first shell, second housing, high voltage bus, air core coil, ironcore choke, signal conditioning circuit, analog to digital conversion circuit, data receiver, data transmitting equipment, electro-optic conversion equipment, downlink optical fiber, primary power source, secondary power supply, uplink optical fibers, photoelectric conversion device, fpga chip, the dsp chip of TI company, display device and wireless communication interface; First shell, is used for holding high voltage bus, air core coil, ironcore choke, signal conditioning circuit, analog to digital conversion circuit, data receiver, data transmitting equipment, electro-optic conversion equipment and primary power source; Second housing, for holding secondary power supply, photoelectric conversion device, fpga chip, the dsp chip of TI company, display device and wireless communication interface; High-definition camera equipment, is arranged on the opposite of the first shell, for the surface of the first shell is shot, to obtain corresponding surface image; Gauss denoising equipment, is connected with described high-definition camera equipment, for carrying out Gauss denoising to receiving surface image, to obtain denoising image; Smoothing processing equipment, is connected with described Gauss denoising equipment, for the denoising image received is smoothed, to obtain smoothed image; Gray processing processes equipment, is connected with described smoothing processing equipment, for the smoothed image received is carried out gray processing process, to obtain gray level image; Column border detection equipment, processes equipment with described gray processing and is connected, for described gray level image, calculating the number of each column black picture element, be more than or equal to the row of threshold number of pixels, the number of black picture element is designated as edge columns; Row rim detection equipment, processes equipment with described gray processing and is connected, for described gray level image, calculating the number of each row black picture element, be more than or equal to the row of threshold number of pixels, the number of black picture element is designated as edge lines; Skeleton splitting equipment, detect equipment with described column border and described row rim detection equipment is connected respectively, region edge columns and edge lines interweaved is as the first outer casing framework domain of the existence, and from described gray level image, it is partitioned into described first outer casing framework domain of the existence to export as skeleton subimage, with by skeleton subimage from the background of gray level image separately; Defect analysis equipment, is connected with described skeleton splitting equipment, is mated with various defect image features by described skeleton subimage, and the successful kind of output matching is as skeleton defect kind; Storage device, detects equipment, row rim detection equipment and defect analysis equipment with column border and is connected respectively, be used for prestoring threshold number of pixels and various defect image feature; High voltage bus, through air core coil and ironcore choke; Air core coil, is used as the sensing head of protection passage; Ironcore choke, as the sensing head of Measurement channel; Signal conditioning circuit, the signal of receiving core coil output, electronic circuit and processing and amplifying electronic circuit is processed, for the signal of ironcore choke output is sequentially carried out filtering, phase shift and processing and amplifying the signal after output processing including Filtering Processing electronic circuit, phase shift; Analog to digital conversion circuit, is connected with signal conditioning circuit, for the signal that signal conditioning circuit exports carries out the analog digital conversion of 8;Data receiver, is connected with analog to digital conversion circuit by SPI interface, and the data received are combined and CRC check; Data after verification are sent to electro-optic conversion equipment by SPI interface by data transmitting equipment, and the data after described verification are parallel mode; Data after verification are transmitted by electro-optic conversion equipment by downlink optical fiber; Photoelectric conversion device, receives the data after described verification by uplink optical fibers; Fpga chip, it is achieved receive the data after the verification of multidiameter delay simultaneously, and carry out parallel-serial conversion, to obtain the data after the verification of multi-path serial; The dsp chip of TI company, it is achieved be connected with the EBI of fpga chip and mount wireless communication interface; It is connected to receive skeleton defect kind with defect analysis equipment also by wireless communication interface; Data after the verification of multi-path serial are sent to the measurement server place of far-end by wireless communication interface; Primary power source, provides supply of electric power for signal conditioning circuit, analog to digital conversion circuit, data receiver, data transmitting equipment and electro-optic conversion equipment; Secondary power supply, provides supply of electric power for photoelectric conversion device, fpga chip, the dsp chip of TI company, display device and wireless communication interface; Display device, is connected with the dsp chip of TI company, for display skeleton defect kind in real time, is additionally operable to the data after the verification of real-time display multiway serial; Wherein, the data measuring server place being sent to far-end are proportional to the corresponding data after analog to digital conversion circuit analog digital conversion.
More specifically, in described electronic current mutual inductor: defect analysis device interior is embedded with wireless communication unit.
More specifically, in described electronic current mutual inductor: the dsp chip of fpga chip and TI company is integrated on one piece of surface-mounted integrated circuit.
More specifically, in described electronic current mutual inductor: wireless communication interface is bluetooth communication interface.
More specifically, in described electronic current mutual inductor: high-definition camera equipment includes ambient light sensor, secondary light source and cmos sensor.
Accompanying drawing explanation
Below with reference to accompanying drawing, embodiment of the present invention are described, wherein:
Fig. 1 is the block diagram of the electronic current mutual inductor of the present invention.
Accompanying drawing labelling: 1 electronic current mutual inductor main body; 2 image detecting apparatus; The dsp chip of 3TI company
Detailed description of the invention
Below with reference to accompanying drawings the embodiment of the electronic current mutual inductor of the present invention is described in detail.
Continuous application along with a lot of new materials, transformer occurs in that much new kind, electromagnetic transformer obtains and develops more fully, and wherein core type current transformer has adapted to the growth requirement of power construction with dry type, oil immersed type and gas-insulating type various structures. Continuous growth however as power transmission capabilities; line voltage grade improve constantly and protect the constantly perfect of requirement; general core type current transformer structure exposes weakness incompatible with it gradually; its intrinsic volume is big, magnetic saturation, ferromagnetic resonance, dynamic range are little; the weakness such as service band is narrow, it is difficult to the full development need being difficult to meet a new generation's Automation of Electric Systems, electric power digital network etc.
Along with developing rapidly of photoelectron technology, many science and technology developed countries turn to sight the electronic current mutual inductor utilizing optical sensing technology and electronics method to carry out Development of Novel, are called for short photoelectric current inductor.The standard of International Power association distributing electronic formula current transformer. The implication of electronic mutual inductor, except including the transformer of photo-electric, also includes other and various utilizes the voltage of Electronic Testing principle, current sensor.
But, existing electronic current mutual inductor structural redundancy is high, power dissipation ratio is not ideal enough, cause product second-rate produced, and existing electronic current mutual inductor itself lacks the mechanism to its outer casing framework identification, still adopting human at periodic intervals to pinpoint the pattern of detection, the accuracy of testing result and real-time cannot be protected.
For this, the present invention proposes a kind of electronic current mutual inductor, by optimizing the structure of original electronic current mutual inductor, improve end product quality, better meet the demand of buying side, it addition, at the integrated outer casing framework defect detection equipment in the primary structure position of electronic mutual inductor, improve the efficiency of primary structure outer casing framework defect kind identification.
Fig. 1 is the block diagram of the electronic current mutual inductor of the present invention, described current transformer includes the dsp chip of electronic current mutual inductor main body, image detecting apparatus and TI company, described image detecting apparatus is for carrying out skeleton defect analysis to the shell of described electronic current mutual inductor main body, and the dsp chip of described TI company receives described skeleton defect analysis result and described skeleton defect analysis result is sent to display device displays.
Then, the structure of the electronic current mutual inductor of the present invention is specifically described.
Described current transformer includes: electronic current mutual inductor main body, including the first shell, second housing, high voltage bus, air core coil, ironcore choke, signal conditioning circuit, analog to digital conversion circuit, data receiver, data transmitting equipment, electro-optic conversion equipment, downlink optical fiber, primary power source, secondary power supply, uplink optical fibers, photoelectric conversion device, fpga chip, the dsp chip of TI company, display device and wireless communication interface; First shell, is used for holding high voltage bus, air core coil, ironcore choke, signal conditioning circuit, analog to digital conversion circuit, data receiver, data transmitting equipment, electro-optic conversion equipment and primary power source; Second housing, for holding secondary power supply, photoelectric conversion device, fpga chip, the dsp chip of TI company, display device and wireless communication interface.
Described current transformer includes: high-definition camera equipment, is arranged on the opposite of the first shell, for the surface of the first shell is shot, to obtain corresponding surface image; Gauss denoising equipment, is connected with described high-definition camera equipment, for carrying out Gauss denoising to receiving surface image, to obtain denoising image; Smoothing processing equipment, is connected with described Gauss denoising equipment, for the denoising image received is smoothed, to obtain smoothed image.
Described current transformer includes: gray processing processes equipment, is connected with described smoothing processing equipment, for the smoothed image received is carried out gray processing process, to obtain gray level image; Column border detection equipment, processes equipment with described gray processing and is connected, for described gray level image, calculating the number of each column black picture element, be more than or equal to the row of threshold number of pixels, the number of black picture element is designated as edge columns; Row rim detection equipment, processes equipment with described gray processing and is connected, for described gray level image, calculating the number of each row black picture element, be more than or equal to the row of threshold number of pixels, the number of black picture element is designated as edge lines;Skeleton splitting equipment, detect equipment with described column border and described row rim detection equipment is connected respectively, region edge columns and edge lines interweaved is as the first outer casing framework domain of the existence, and from described gray level image, it is partitioned into described first outer casing framework domain of the existence to export as skeleton subimage, with by skeleton subimage from the background of gray level image separately.
Described current transformer includes: defect analysis equipment, is connected with described skeleton splitting equipment, is mated with various defect image features by described skeleton subimage, and the successful kind of output matching is as skeleton defect kind.
Described current transformer includes: storage device, detects equipment, row rim detection equipment and defect analysis equipment with column border and is connected respectively, is used for prestoring threshold number of pixels and various defect image feature.
Described current transformer includes: high voltage bus, through air core coil and ironcore choke; Air core coil, is used as the sensing head of protection passage; Ironcore choke, as the sensing head of Measurement channel; Signal conditioning circuit, the signal of receiving core coil output, electronic circuit and processing and amplifying electronic circuit is processed, for the signal of ironcore choke output is sequentially carried out filtering, phase shift and processing and amplifying the signal after output processing including Filtering Processing electronic circuit, phase shift.
Described current transformer includes: analog to digital conversion circuit, is connected with signal conditioning circuit, for the signal that signal conditioning circuit exports carries out the analog digital conversion of 8; Data receiver, is connected with analog to digital conversion circuit by SPI interface, and the data received are combined and CRC check; Data after verification are sent to electro-optic conversion equipment by SPI interface by data transmitting equipment, and the data after described verification are parallel mode.
Described current transformer includes: electro-optic conversion equipment, the data after verification is transmitted by downlink optical fiber; Photoelectric conversion device, receives the data after described verification by uplink optical fibers.
Described current transformer includes: fpga chip, it is achieved receives the data after the verification of multidiameter delay simultaneously, and carries out parallel-serial conversion, to obtain the data after the verification of multi-path serial.
Described current transformer includes: the dsp chip of TI company, it is achieved is connected with the EBI of fpga chip and mounts wireless communication interface; It is connected to receive skeleton defect kind with defect analysis equipment also by wireless communication interface.
Described current transformer includes: wireless communication interface, and the data after the verification of multi-path serial are sent to the measurement server place of far-end; Primary power source, provides supply of electric power for signal conditioning circuit, analog to digital conversion circuit, data receiver, data transmitting equipment and electro-optic conversion equipment.
Wherein, secondary power supply, provide supply of electric power for photoelectric conversion device, fpga chip, the dsp chip of TI company, display device and wireless communication interface.
Described current transformer includes: display device, is connected with the dsp chip of TI company, for display skeleton defect kind in real time, is additionally operable to the data after the verification of real-time display multiway serial.
Wherein, the data measuring server place being sent to far-end are proportional to the corresponding data after analog to digital conversion circuit analog digital conversion.
Alternatively, in described electronic current mutual inductor: defect analysis device interior is embedded with wireless communication unit; The dsp chip of fpga chip and TI company is integrated on one piece of surface-mounted integrated circuit;Wireless communication interface is bluetooth communication interface; High-definition camera equipment can include ambient light sensor, secondary light source and cmos sensor.
It addition, dsp chip, also referred to as digital signal processor, being a kind of microprocessor being particularly suitable for carrying out Digital Signal Processing computing, it is mainly applied is realize various digital signal processing algorithm real-time.
Requirement according to Digital Signal Processing, dsp chip generally has following main feature: (1) can complete a multiplication and a sub-addition within an instruction cycle; (2) program and data space is separately, it is possible to access instruction and data simultaneously; (3) there is quick RAM in sheet, generally can pass through independent data/address bus and access in two pieces simultaneously; (4) there is low overhead or without overhead loop and the hardware supported that redirects; (5) quickly interrupt processing and Hardware I/O support; (6) there are multiple hardware address generators of operation within the monocycle; (7) can the multiple operation of executed in parallel; (8) supporting pile line operation, making fetching, decoding and execution etc. operate can Overlapped Execution.
Adopt the electronic current mutual inductor of the present invention, fall behind and cannot realize the technical problem of outer casing framework defect self-inspection for electronic current mutual inductor structure in prior art, by transforming the device structure of electronic current mutual inductor, improve the product quality of electronic current mutual inductor, simultaneously, primary structure enclosure location at electronic current mutual inductor introduces high-precision skeleton defect detection equipment, thus solving above-mentioned technical problem.
Although it is understood that the present invention discloses as above with preferred embodiment, but above-described embodiment is not limited to the present invention. For any those of ordinary skill in the art, without departing under technical solution of the present invention ambit, all may utilize the technology contents of the disclosure above and technical solution of the present invention is made many possible variations and modification, or be revised as the Equivalent embodiments of equivalent variations. Therefore, every content without departing from technical solution of the present invention, the technical spirit of the foundation present invention, to any simple modification made for any of the above embodiments, equivalent variations and modification, all still falls within the scope of technical solution of the present invention protection.
Claims (1)
1. an electronic current mutual inductor, described current transformer includes the dsp chip of electronic current mutual inductor main body, image detecting apparatus and TI company, described image detecting apparatus is for carrying out skeleton defect analysis to the shell of described electronic current mutual inductor main body, and the dsp chip of described TI company receives described skeleton defect analysis result and described skeleton defect analysis result is sent to display device displays;
Described current transformer includes:
Electronic current mutual inductor main body, including the first shell, second housing, high voltage bus, air core coil, ironcore choke, signal conditioning circuit, analog to digital conversion circuit, data receiver, data transmitting equipment, electro-optic conversion equipment, downlink optical fiber, primary power source, secondary power supply, uplink optical fibers, photoelectric conversion device, fpga chip, the dsp chip of TI company, display device and wireless communication interface;
First shell, is used for holding high voltage bus, air core coil, ironcore choke, signal conditioning circuit, analog to digital conversion circuit, data receiver, data transmitting equipment, electro-optic conversion equipment and primary power source;
Second housing, for holding secondary power supply, photoelectric conversion device, fpga chip, the dsp chip of TI company, display device and wireless communication interface;
High-definition camera equipment, is arranged on the opposite of the first shell, for the surface of the first shell is shot, to obtain corresponding surface image;
Gauss denoising equipment, is connected with described high-definition camera equipment, for carrying out Gauss denoising to receiving surface image, to obtain denoising image;
Smoothing processing equipment, is connected with described Gauss denoising equipment, for the denoising image received is smoothed, to obtain smoothed image;
Gray processing processes equipment, is connected with described smoothing processing equipment, for the smoothed image received is carried out gray processing process, to obtain gray level image;
Column border detection equipment, processes equipment with described gray processing and is connected, for described gray level image, calculating the number of each column black picture element, be more than or equal to the row of threshold number of pixels, the number of black picture element is designated as edge columns;
Row rim detection equipment, processes equipment with described gray processing and is connected, for described gray level image, calculating the number of each row black picture element, be more than or equal to the row of threshold number of pixels, the number of black picture element is designated as edge lines;
Skeleton splitting equipment, detect equipment with described column border and described row rim detection equipment is connected respectively, region edge columns and edge lines interweaved is as the first outer casing framework domain of the existence, and from described gray level image, it is partitioned into described first outer casing framework domain of the existence to export as skeleton subimage, with by skeleton subimage from the background of gray level image separately;
Defect analysis equipment, is connected with described skeleton splitting equipment, is mated with various defect image features by described skeleton subimage, and the successful kind of output matching is as skeleton defect kind;
Storage device, detects equipment, row rim detection equipment and defect analysis equipment with column border and is connected respectively, be used for prestoring threshold number of pixels and various defect image feature;
High voltage bus, through air core coil and ironcore choke;
Air core coil, is used as the sensing head of protection passage;
Ironcore choke, as the sensing head of Measurement channel;
Signal conditioning circuit, the signal of receiving core coil output, electronic circuit and processing and amplifying electronic circuit is processed, for the signal of ironcore choke output is sequentially carried out filtering, phase shift and processing and amplifying the signal after output processing including Filtering Processing electronic circuit, phase shift;
Analog to digital conversion circuit, is connected with signal conditioning circuit, for the signal that signal conditioning circuit exports carries out the analog digital conversion of 8;
Data receiver, is connected with analog to digital conversion circuit by SPI interface, and the data received are combined and CRC check;
Data after verification are sent to electro-optic conversion equipment by SPI interface by data transmitting equipment, and the data after described verification are parallel mode;
Data after verification are transmitted by electro-optic conversion equipment by downlink optical fiber;
Photoelectric conversion device, receives the data after described verification by uplink optical fibers;
Fpga chip, it is achieved receive the data after the verification of multidiameter delay simultaneously, and carry out parallel-serial conversion, to obtain the data after the verification of multi-path serial;
The dsp chip of TI company, it is achieved be connected with the EBI of fpga chip and mount wireless communication interface; It is connected to receive skeleton defect kind with defect analysis equipment also by wireless communication interface;
Data after the verification of multi-path serial are sent to the measurement server place of far-end by wireless communication interface;
Primary power source, provides supply of electric power for signal conditioning circuit, analog to digital conversion circuit, data receiver, data transmitting equipment and electro-optic conversion equipment;
Secondary power supply, provides supply of electric power for photoelectric conversion device, fpga chip, the dsp chip of TI company, display device and wireless communication interface;
Display device, is connected with the dsp chip of TI company, for display skeleton defect kind in real time, is additionally operable to the data after the verification of real-time display multiway serial;
Wherein, the data measuring server place being sent to far-end are proportional to the corresponding data after analog to digital conversion circuit analog digital conversion.
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| CN201610114486.0A CN105548645B (en) | 2015-11-16 | 2015-11-16 | Electronic current mutual inductor |
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| US5163099A (en) * | 1988-05-23 | 1992-11-10 | Kabushiki Kaisha Toshiba | Imaging apparatus having a detector for determining the presence of contrasting portions in a viewed object |
| JPH08159732A (en) * | 1994-12-06 | 1996-06-21 | Taiyo Yuden Co Ltd | Appearance inspection device for electronic parts |
| JP2003232829A (en) * | 2002-02-07 | 2003-08-22 | Mitsubishi Electric Corp | Partial discharge detection device of winding equipment |
| CN1548967A (en) * | 2003-05-16 | 2004-11-24 | 孙艺夫 | Electrical equipment on-line monitoring method |
| CN2777569Y (en) * | 2005-01-26 | 2006-05-03 | 江苏省电力公司南京供电公司 | Digital current transformer character integrated measurer |
| CN100340860C (en) * | 2005-06-13 | 2007-10-03 | 北京航空航天大学 | Optical fibre current transformer and its loop detector of transformer |
| JP5475555B2 (en) * | 2010-06-08 | 2014-04-16 | 株式会社日立製作所 | Distribution equipment deterioration diagnosis device |
| CN102928742B (en) * | 2012-11-22 | 2014-11-12 | 重庆市电力公司检修分公司 | Infrared image automatic fault identifying method for high-voltage equipment |
| CN103123382A (en) * | 2013-01-31 | 2013-05-29 | 云南电力试验研究院（集团）有限公司电力研究院 | Photoelectric combined detection method aiming at mutual inductor of distribution network |
| CN103901072B (en) * | 2014-04-21 | 2017-01-11 | 国网安徽省电力公司淮南供电公司 | Method for diagnosing equipment overheating defects by utilizing infrared spectrum analysis |
| CN104483647A (en) * | 2014-12-11 | 2015-04-01 | 广东电网有限责任公司电力科学研究院 | Device and method for automatically recognizing appearance information of low-voltage current transformer in production line |
| CN104535589A (en) * | 2015-01-20 | 2015-04-22 | 广东电网有限责任公司电力科学研究院 | Online detection method and device for low-voltage current mutual inductor |
-
2015
- 2015-11-16 CN CN201610114380.0A patent/CN105510669B/en not_active Expired - Fee Related
- 2015-11-16 CN CN201610114486.0A patent/CN105548645B/en not_active Expired - Fee Related
- 2015-11-16 CN CN201510782589.XA patent/CN105242093B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN105548645A (en) | 2016-05-04 |
| CN105242093A (en) | 2016-01-13 |
| CN105548645B (en) | 2016-09-28 |
| CN105510669A (en) | 2016-04-20 |
| CN105510669B (en) | 2016-09-28 |
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