CN105236942A - High-heat-conduction ceramic substrate material and preparing method thereof - Google Patents
High-heat-conduction ceramic substrate material and preparing method thereof Download PDFInfo
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Abstract
The invention discloses a high-heat-conduction ceramic substrate material. The high-heat-conduction ceramic substrate material is prepared from, by weight, 82 parts to 90 parts of aluminum oxide powder, 7 parts to 18 parts of silicon carbide, 6 parts to 15 parts of mullite, 4 parts to 14 parts of bentonite, 3 parts to 8 parts of carbon fibers, 5 parts to 16 parts of fluorapatite, 3 parts to 13 parts of vanadium nitride, 4 parts to 10 parts of yttrium oxide, 11 parts to 20 parts of binding agents and 35 parts to 48 parts of solvents. The invention further discloses a preparing method of the high-heat-conduction ceramic substrate material. The heat conductivity coefficient of the ceramic substrate material prepared with the preparing method is larger than 1.8 W/m.K, the coefficient of thermal expansion is 5.23*10<-6>/K to 6.08*10<-6>/K and is close to the coefficient of thermal expansion of wafer silicon, and the matching degree is good; in addition, the breaking strength of the prepared ceramic substrate material is larger than or equal to 0.7 Mpa, and good comprehensive performance is shown.
Description
Technical field
The invention belongs to stupalith field, be specifically related to a kind of high heat-conducting ceramic substrate material and preparation method thereof.
Background technology
Common ceramic substrate is divided into alumina type, beryllium oxide type and nitrogenize aluminium profiles.The wherein thermal conductivity of beryllium oxide tool superelevation, but limit the development of self due to its toxicity.The coefficient of expansion that aluminium nitride has high thermal conductivity and matches with silicon, but if aln surface has very thin zone of oxidation can affect its thermal conductivity, require higher to preparation technology, aluminium nitride price is generally higher in addition, also governs its development.Aluminium oxide ceramic substrate is baseplate material the most frequently used in LED field, just due to its machinery, heat, on electrical property relative to other oxide ceramics of great majority, intensity and chemical stability high, and abundant raw material source, is applicable to various technology manufacture and different shapes; But alumina-ceramic not easily densified sintering product, thermal conductivity is low, and thermal expansivity does not mate with wafer silicon, limits its application, needs the composition and ratio and the preparation method that improve alumina-ceramic further, make it play better application.
Summary of the invention
The technical problem solved is: the thermal conductivity solving traditional alumina-ceramic is low, and thermal expansivity the problem such as not to mate in wafer silicon, provides a kind of high heat-conducting ceramic substrate material and preparation method thereof.
Technical scheme: in order to solve the problem, the invention provides a kind of high heat-conducting ceramic substrate material, counts by weight, be prepared from by following raw material:
Alumina powder jointed 82 ~ 90 parts, 7 ~ 18 parts, silicon carbide, mullite 6 ~ 15 parts, wilkinite 4 ~ 14 parts, 3 ~ 8 parts, carbon fiber, fluorapatite 5 ~ 16 parts, vanadium nitride 3 ~ 13 parts, yttrium oxide 4 ~ 10 parts, binding agent 11 ~ 20 parts and solvent 35 ~ 48 parts.
Preferably, described alumina powder jointed be α-Al
2o
3nanometer powder.
Preferably, described binding agent is the compound binding agent be made up of paraffin, polyvinyl alcohol and carboxymethyl cellulose.
Further, preferably, described binding agent is paraffin, polyvinyl alcohol and carboxymethyl cellulose is the compound binding agent of 3:2:1 composition in mass ratio.
Preferably, described solvent be deionized water, dehydrated alcohol and Virahol by volume for 3:1:0.2 tri compound forms.
Preferably, a kind of high heat-conducting ceramic substrate material, counts by weight, is prepared from by following raw material:
Alumina powder jointed 87 parts, 14 parts, silicon carbide, mullite 12 parts, wilkinite 9 parts, 7 parts, carbon fiber, fluorapatite 13 parts, vanadium nitride 11 parts, yttrium oxide 8 parts, binding agent 18 parts and solvent 45 parts.
A preparation method for high heat-conducting ceramic substrate material, comprises following preparation process:
Alumina powder jointed, silicon carbide, mullite, wilkinite, carbon fiber, fluorapatite, vanadium nitride and the yttrium oxide of certainweight number are placed in ball grinder, then the solvent of certainweight number is added, take ratio of grinding media to material as the ratio ball milling 10 ~ 36h of 2.8:1, add the binding agent of certainweight number afterwards, after mixing, obtain compound;
Compound is placed in mould and obtains green compact with the injection molding of 40 ~ 160Mpa;
Green compact are placed in sintering oven, and under the protective atmosphere of hydrogen, carry out high temperature sintering, sintering condition is: heat-up rate is 2 ~ 15 DEG C/min, sintering temperature is 1350 ~ 1520 DEG C, soaking time is 20 ~ 40h, naturally cools to room temperature, to obtain final product after having sintered.
Preferably, described injection molding pressure is 120Mpa.
Preferably, described sintering condition is: heat-up rate is 8 DEG C/min, sintering temperature is 1420 DEG C, soaking time is 28h.
The present invention has following beneficial effect: the thermal conductivity of the Ceramic Substrate Material prepared by the present invention is greater than 1.8W/mK, and thermal expansivity is 5.23 × 10
-6/ K ~ 6.08 × 10
-6/ K, close to the thermal expansivity of wafer silicon, matching degree is better, and the folding strength of Ceramic Substrate Material prepared is in addition not less than 0.7Mpa, shows good over-all properties.
Embodiment
In order to understand the present invention further, below in conjunction with embodiment, invention preferred embodiment is described, but should be appreciated that these describe just for further illustrating the features and advantages of the present invention, instead of limiting to the claimed invention.
Embodiment 1
A kind of high heat-conducting ceramic substrate material, count by weight, be prepared from by following raw material:
Alumina powder jointed 82 parts, 7 parts, silicon carbide, mullite 6 parts, wilkinite 4 parts, 3 parts, carbon fiber, fluorapatite 5 parts, vanadium nitride 3 parts, yttrium oxide 4 parts, binding agent 11 parts and solvent 35 parts.Wherein, described alumina powder jointed be α-Al
2o
3nanometer powder; Described binding agent is paraffin, polyvinyl alcohol and carboxymethyl cellulose is the compound binding agent of 3:2:1 composition in mass ratio; Described solvent be deionized water, dehydrated alcohol and Virahol by volume for 3:1:0.2 tri compound forms.
The preparation method of described high heat-conducting ceramic substrate material, comprises following preparation process:
Alumina powder jointed, silicon carbide, mullite, wilkinite, carbon fiber, fluorapatite, vanadium nitride and the yttrium oxide of above-mentioned parts by weight are placed in ball grinder, then the solvent of above-mentioned parts by weight is added, take ratio of grinding media to material as the ratio ball milling 10h of 2.8:1, add the binding agent of above-mentioned parts by weight afterwards, after mixing, obtain compound;
Compound is placed in mould and obtains green compact with the injection molding of 40Mpa;
Green compact are placed in sintering oven, and under the protective atmosphere of hydrogen, carry out high temperature sintering, sintering condition is: heat-up rate is 2 DEG C/min, sintering temperature is 1350 DEG C, soaking time is 20h, naturally cools to room temperature, to obtain final product after having sintered.
Carry out performance test to above-mentioned prepared Ceramic Substrate Material, result shows: thermal conductivity is 1.8W/mK, and thermal expansivity is 5.23 × 10
-6/ K, folding strength is 1.2MPa.
Embodiment 2
A kind of high heat-conducting ceramic substrate material, count by weight, be prepared from by following raw material:
Alumina powder jointed 90 parts, 18 parts, silicon carbide, mullite 15 parts, wilkinite 14 parts, 8 parts, carbon fiber, fluorapatite 16 parts, vanadium nitride 13 parts, yttrium oxide 10 parts, binding agent 20 parts and solvent 48 parts.Wherein, described alumina powder jointed be α-Al
2o
3nanometer powder; Described binding agent is paraffin, polyvinyl alcohol and carboxymethyl cellulose is the compound binding agent of 3:2:1 composition in mass ratio; Described solvent be deionized water, dehydrated alcohol and Virahol by volume for 3:1:0.2 tri compound forms.
The preparation method of described high heat-conducting ceramic substrate material, comprises following preparation process:
Alumina powder jointed, silicon carbide, mullite, wilkinite, carbon fiber, fluorapatite, vanadium nitride and the yttrium oxide of above-mentioned parts by weight are placed in ball grinder, then the solvent of above-mentioned parts by weight is added, take ratio of grinding media to material as the ratio ball milling 36h of 2.8:1, add the binding agent of above-mentioned parts by weight afterwards, after mixing, obtain compound;
Compound is placed in mould and obtains green compact with the injection molding of 160Mpa;
Green compact are placed in sintering oven, and under the protective atmosphere of hydrogen, carry out high temperature sintering, sintering condition is: heat-up rate is 15 DEG C/min, sintering temperature is 1520 DEG C, soaking time is 40h, naturally cools to room temperature, to obtain final product after having sintered.
Carry out performance test to above-mentioned prepared Ceramic Substrate Material, result shows: thermal conductivity is 2.4W/mK, and thermal expansivity is 5.84 × 10
-6/ K, folding strength is 0.7MPa.
Embodiment 3
A kind of high heat-conducting ceramic substrate material, count by weight, be prepared from by following raw material:
Alumina powder jointed 86 parts, 12 parts, silicon carbide, mullite 10 parts, wilkinite 9 parts, 6 parts, carbon fiber, fluorapatite 11 parts, vanadium nitride 8 parts, yttrium oxide 7 parts, binding agent 15 parts and solvent 41 parts.Wherein, described alumina powder jointed be α-Al
2o
3nanometer powder; Described binding agent is paraffin, polyvinyl alcohol and carboxymethyl cellulose is the compound binding agent of 3:2:1 composition in mass ratio; Described solvent be deionized water, dehydrated alcohol and Virahol by volume for 3:1:0.2 tri compound forms.
The preparation method of described high heat-conducting ceramic substrate material, comprises following preparation process:
Alumina powder jointed, silicon carbide, mullite, wilkinite, carbon fiber, fluorapatite, vanadium nitride and the yttrium oxide of above-mentioned parts by weight are placed in ball grinder, then the solvent of above-mentioned parts by weight is added, take ratio of grinding media to material as the ratio ball milling 24h of 2.8:1, add the binding agent of above-mentioned parts by weight afterwards, after mixing, obtain compound;
Compound is placed in mould and obtains green compact with the injection molding of 100Mpa;
Green compact are placed in sintering oven, and under the protective atmosphere of hydrogen, carry out high temperature sintering, sintering condition is: heat-up rate is 8 DEG C/min, sintering temperature is 1435 DEG C, soaking time is 30h, naturally cools to room temperature, to obtain final product after having sintered.
Carry out performance test to above-mentioned prepared Ceramic Substrate Material, result shows: thermal conductivity is 2.1W/mK, and thermal expansivity is 5.76 × 10
-6/ K, folding strength is 0.9MPa.
Embodiment 4
A kind of high heat-conducting ceramic substrate material, count by weight, be prepared from by following raw material:
Alumina powder jointed 87 parts, 14 parts, silicon carbide, mullite 12 parts, wilkinite 9 parts, 7 parts, carbon fiber, fluorapatite 13 parts, vanadium nitride 11 parts, yttrium oxide 8 parts, binding agent 18 parts and solvent 45 parts.Wherein, described alumina powder jointed be α-Al
2o
3nanometer powder; Described binding agent is paraffin, polyvinyl alcohol and carboxymethyl cellulose is the compound binding agent of 3:2:1 composition in mass ratio; Described solvent be deionized water, dehydrated alcohol and Virahol by volume for 3:1:0.2 tri compound forms.
The preparation method of described high heat-conducting ceramic substrate material, comprises following preparation process:
Alumina powder jointed, silicon carbide, mullite, wilkinite, carbon fiber, fluorapatite, vanadium nitride and the yttrium oxide of above-mentioned parts by weight are placed in ball grinder, then the solvent of above-mentioned parts by weight is added, take ratio of grinding media to material as the ratio ball milling 36h of 2.8:1, add the binding agent of above-mentioned parts by weight afterwards, after mixing, obtain compound;
Compound is placed in mould and obtains green compact with the injection molding of 100Mpa;
Green compact are placed in sintering oven, and under the protective atmosphere of hydrogen, carry out high temperature sintering, sintering condition is: heat-up rate is 7 DEG C/min, sintering temperature is 1420 DEG C, soaking time is 30h, naturally cools to room temperature, to obtain final product after having sintered.
Carry out performance test to above-mentioned prepared Ceramic Substrate Material, result shows: thermal conductivity is 2.6W/mK, and thermal expansivity is 5.91 × 10
-6/ K, folding strength is 1.1MPa.
Embodiment 5
A kind of high heat-conducting ceramic substrate material, count by weight, be prepared from by following raw material:
Alumina powder jointed 88 parts, 10 parts, silicon carbide, mullite 12 parts, wilkinite 11 parts, 7 parts, carbon fiber, fluorapatite 12 parts, vanadium nitride 8 parts, yttrium oxide 6 parts, binding agent 14 parts and solvent 40 parts.Wherein, described alumina powder jointed be α-Al
2o
3nanometer powder; Described binding agent is paraffin, polyvinyl alcohol and carboxymethyl cellulose is the compound binding agent of 3:2:1 composition in mass ratio; Described solvent be deionized water, dehydrated alcohol and Virahol by volume for 3:1:0.2 tri compound forms.
The preparation method of described high heat-conducting ceramic substrate material, comprises following preparation process:
Alumina powder jointed, silicon carbide, mullite, wilkinite, carbon fiber, fluorapatite, vanadium nitride and the yttrium oxide of above-mentioned parts by weight are placed in ball grinder, then the solvent of above-mentioned parts by weight is added, take ratio of grinding media to material as the ratio ball milling 24h of 2.8:1, add the binding agent of above-mentioned parts by weight afterwards, after mixing, obtain compound;
Compound is placed in mould and obtains green compact with the injection molding of 120Mpa;
Green compact are placed in sintering oven, and under the protective atmosphere of hydrogen, carry out high temperature sintering, sintering condition is: heat-up rate is 8 DEG C/min, sintering temperature is 1420 DEG C, soaking time is 28h, naturally cools to room temperature, to obtain final product after having sintered.
Carry out performance test to above-mentioned prepared Ceramic Substrate Material, result shows: thermal conductivity is 2.3W/mK, and thermal expansivity is 6.08 × 10
-6/ K, folding strength is 1.0MPa.
Claims (9)
1. a high heat-conducting ceramic substrate material, is characterized in that, counts by weight, is prepared from by following raw material:
Alumina powder jointed 82 ~ 90 parts, 7 ~ 18 parts, silicon carbide, mullite 6 ~ 15 parts, wilkinite 4 ~ 14 parts, 3 ~ 8 parts, carbon fiber, fluorapatite 5 ~ 16 parts, vanadium nitride 3 ~ 13 parts, yttrium oxide 4 ~ 10 parts, binding agent 11 ~ 20 parts and solvent 35 ~ 48 parts.
2. a kind of high heat-conducting ceramic substrate material according to claim 1, is characterized in that, described alumina powder jointed be α-Al
2o
3nanometer powder.
3. a kind of high heat-conducting ceramic substrate material according to claim 1, is characterized in that, described binding agent is the compound binding agent be made up of paraffin, polyvinyl alcohol and carboxymethyl cellulose.
4. a kind of high heat-conducting ceramic substrate material according to claim 1 or 3, is characterized in that, described binding agent is paraffin, polyvinyl alcohol and carboxymethyl cellulose is the compound binding agent of 3:2:1 composition in mass ratio.
5. a kind of high heat-conducting ceramic substrate material according to claim 1, is characterized in that, described solvent be deionized water, dehydrated alcohol and Virahol by volume for 3:1:0.2 tri compound forms.
6. a kind of high heat-conducting ceramic substrate material according to claim 1, is characterized in that, count by weight, be prepared from by following raw material:
Alumina powder jointed 87 parts, 14 parts, silicon carbide, mullite 12 parts, wilkinite 9 parts, 7 parts, carbon fiber, fluorapatite 13 parts, vanadium nitride 11 parts, yttrium oxide 8 parts, binding agent 18 parts and solvent 45 parts.
7. the preparation method of a kind of high heat-conducting ceramic substrate material as claimed in claim 1, is characterized in that, comprise following preparation process:
Alumina powder jointed, silicon carbide, mullite, wilkinite, carbon fiber, fluorapatite, vanadium nitride and the yttrium oxide of certainweight number are placed in ball grinder, then the solvent of certainweight number is added, take ratio of grinding media to material as the ratio ball milling 10 ~ 36h of 2.8:1, add the binding agent of certainweight number afterwards, after mixing, obtain compound;
Compound is placed in mould and obtains green compact with the injection molding of 40 ~ 160Mpa;
Green compact are placed in sintering oven, and under the protective atmosphere of hydrogen, carry out high temperature sintering, sintering condition is: heat-up rate is 2 ~ 15 DEG C/min, sintering temperature is 1350 ~ 1520 DEG C, soaking time is 20 ~ 40h, naturally cools to room temperature, to obtain final product after having sintered.
8. the preparation method of a kind of high heat-conducting ceramic substrate material according to claim 7, is characterized in that, described injection molding pressure is 120Mpa.
9. the preparation method of a kind of high heat-conducting ceramic substrate material according to claim 7, it is characterized in that, described sintering condition is: heat-up rate is 8 DEG C/min, sintering temperature is 1420 DEG C, soaking time is 28h.
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| CN105732015A (en) * | 2016-03-03 | 2016-07-06 | 福建省德化荣信陶瓷有限公司 | Domestic ceramic switch panel and manufacturing process thereof |
| CN106495697A (en) * | 2016-10-21 | 2017-03-15 | 过冬 | A kind of zirconium carbide ceramics heater and the preparation method of heater |
| CN107235717A (en) * | 2017-08-01 | 2017-10-10 | 合肥安力电力工程有限公司 | A kind of high strength electrical ceramics and preparation method thereof |
| CN107602095A (en) * | 2017-10-16 | 2018-01-19 | 王若梅 | A kind of high thermal conductivity ceramic substrate and preparation method thereof |
| CN108191407A (en) * | 2017-12-09 | 2018-06-22 | 宁波市河清源技术转移服务有限公司 | A kind of insulating radiation nano composite ceramic |
| CN109400175A (en) * | 2018-11-15 | 2019-03-01 | 中国科学院上海硅酸盐研究所 | A kind of preparation method of high thermal conductivity silicon nitride ceramics substrate material |
| CN115490503A (en) * | 2022-10-25 | 2022-12-20 | 娄底市海天特种陶瓷有限公司 | Ceramic composite material and fuse porcelain tube |
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| CN105732015A (en) * | 2016-03-03 | 2016-07-06 | 福建省德化荣信陶瓷有限公司 | Domestic ceramic switch panel and manufacturing process thereof |
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| CN106495697A (en) * | 2016-10-21 | 2017-03-15 | 过冬 | A kind of zirconium carbide ceramics heater and the preparation method of heater |
| CN107235717A (en) * | 2017-08-01 | 2017-10-10 | 合肥安力电力工程有限公司 | A kind of high strength electrical ceramics and preparation method thereof |
| CN107602095A (en) * | 2017-10-16 | 2018-01-19 | 王若梅 | A kind of high thermal conductivity ceramic substrate and preparation method thereof |
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| CN108191407A (en) * | 2017-12-09 | 2018-06-22 | 宁波市河清源技术转移服务有限公司 | A kind of insulating radiation nano composite ceramic |
| CN109400175A (en) * | 2018-11-15 | 2019-03-01 | 中国科学院上海硅酸盐研究所 | A kind of preparation method of high thermal conductivity silicon nitride ceramics substrate material |
| CN109400175B (en) * | 2018-11-15 | 2020-07-31 | 中国科学院上海硅酸盐研究所 | Preparation method of high-thermal-conductivity silicon nitride ceramic substrate material |
| CN115490503A (en) * | 2022-10-25 | 2022-12-20 | 娄底市海天特种陶瓷有限公司 | Ceramic composite material and fuse porcelain tube |
| CN116041085A (en) * | 2022-10-25 | 2023-05-02 | 山东中为电子科技有限公司 | Porous ceramic cover plate capable of optimizing warpage of ceramic substrate and application of porous ceramic cover plate |
| CN116041085B (en) * | 2022-10-25 | 2024-04-12 | 山东中为电子科技有限公司 | Porous ceramic cover plate capable of optimizing warpage of ceramic substrate and application of porous ceramic cover plate |
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Application publication date: 20160113 |