CN107602095A - A kind of high thermal conductivity ceramic substrate and preparation method thereof - Google Patents
A kind of high thermal conductivity ceramic substrate and preparation method thereof Download PDFInfo
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Abstract
The invention discloses a kind of high thermal conductivity ceramic substrate and preparation method thereof, belong to electronic package material technical field.Count in parts by weight, weigh 70~80 parts of alumina powders, 10~15 parts of brown iron oxides, 20~25 parts of cupric oxide powders, 20~25 parts of carbon dusts, 13~18 parts of boron oxide powders, 12~16 parts of modified glass-fibers, 8~14 parts of metallic oxide crystal whiskers and 3~5 parts of ice crystals successively；By carbon dust, boron oxide powder, after ice crystal and modified glass-fiber mixing and ball milling, sieving, obtains compound powder, by compound powder, alumina powder, after brown iron oxide, cupric oxide powder and metallic oxide crystal whisker mixing, add in mould, it is compressing in mould, blank is obtained, blank is moved into sintering furnace and sintered, obtains high thermal conductivity ceramic substrate.Ceramic substrate prepared by the present invention has excellent heat conductivility and mechanical strength.
Description
Technical field
The invention discloses a kind of high thermal conductivity ceramic substrate and preparation method thereof, belongs to electronic package material technology neck
Domain.
Background technology
During Electronic Packaging, substrate mainly plays mechanical support protection and is electrically interconnected（Insulation）Effect.With electronic seal
Dress technology gradually develops towards miniaturization, high density, multi-functional and high reliability direction, and the power density of electronic system increases therewith
Add, heat dissipation problem is increasingly severe.Good general does not cause device performance degradation, structural failure, is layered or burns for radiating.Good device
Part radiating depends on the heat radiation structure design of optimization, encapsulating material selection（Thermal interfacial material and heat-radiating substrate）And encapsulation manufacture work
Skill etc..Wherein, the selection of baseplate material is key link, directly influences device cost, performance and reliability.
Electronic Packaging is as follows to baseplate material performance requirement：Thermal conductivity is high, and dielectric constant is low, the thermal expansion with chip material
Coefficients match, mechanical strength is high, and processing characteristics is good, and cost is low etc..In fact, above-mentioned performance is difficult to meet simultaneously, sometimes even
It is conflicting, it can only be selected in practical application according to specific encapsulated object.Conventional baseplate material mainly includes plastics base
Plate, metal substrate, ceramic substrate and the major class of composite base plate four.At present, although ceramic substrate is not in leading position, but due to
The continuous reduction of its good thermal conductivity, heat resistance, insulating properties, low thermal coefficient of expansion and cost, in Electronic Packaging particularly work(
Rate electronic device such as IGBT（Igbt）、LD（Laser diode）, great power LED（Light emitting diode）、CPV
（Focus type photovoltaic）Application in encapsulation is more and more extensive.For a long time, most ceramic substrate materials continue to use oxidation always
Aluminium and beryllium oxide ceramics, but the thermal conductivity of aluminum oxide substrate is low, and thermal coefficient of expansion and silicon less match；Although beryllium oxide has excellent
Good combination property, but its higher production cost and it is hypertoxic the shortcomings that limit its application.Therefore from performance, cost
Consider that the two can not fully meet the needs of modern electronic devices development with factors such as environmental protection.
Therefore, the shortcomings that how improving traditional ceramics substrate mechanical property and bad heat conductivility, to obtain higher synthesis
The ceramic substrate of performance, it is that it is promoted and is applied to broader field, meets industrial production demand urgent problem to be solved.
The content of the invention
The present invention solves the technical problem of：Lacked for traditional ceramics substrate mechanical property and heat conductivility are bad
A kind of point, there is provided high thermal conductivity ceramic substrate and preparation method thereof.
In order to solve the above-mentioned technical problem, the technical solution adopted in the present invention is：
A kind of high thermal conductivity ceramic substrate, is made up of the raw material of following parts by weight：
70~80 parts of alumina powder
10~15 parts of brown iron oxide
20~25 parts of cupric oxide powder
20~25 parts of carbon dust
13~18 parts of boron oxide powder
12~16 parts of modified glass-fiber
8~14 parts of metallic oxide crystal whisker
3~5 parts of ice crystal
The preparation method of the modified glass-fiber is：
By nano silicon and silane coupler in mass ratio 8：11~10：11 mixing, and add nano silicon quality
10~12 times of absolute ethyl alcohol, after being stirred, treatment fluid is obtained, by glass fibre and treatment fluid in mass ratio 1：6~1：8 is mixed
Close, sonic oscillation, filter, dry, obtain modified glass-fiber；
The preparation method of the high thermal conductivity ceramic substrate is：
（1）Formed by raw material and weigh each component；
（2）By carbon dust, boron oxide powder, after ice crystal and modified glass-fiber mixing and ball milling, sieving, compound powder is obtained, will be mixed
After conjunction feed powder end, alumina powder, brown iron oxide, cupric oxide powder and metallic oxide crystal whisker mixing, add in mould, in mould
It is compressing, blank is obtained, blank is moved into sintering furnace and sintered, obtains high thermal conductivity ceramic substrate.
The metallic oxide crystal whisker is any one in magnesia crystal whisker or cupric oxide whisker.
The glass fibre is any one in alkali-free glass fibre or medium-alkali glass fibre.
The silane coupler is silane coupler KH-560, in silane resin acceptor kh-550 or Silane coupling reagent KH-570
Any one.
Step（2）The compressing condition be prior to pressure be 80~90MPa suppress 30~45s, be then at pressure
100~110MPa suppresses 100~110s.
The beneficial effects of the invention are as follows：
（1）The present invention adds brown iron oxide, cupric oxide powder and carbon dust, first, iron oxide when preparing high thermal conductivity ceramic substrate
The addition of powder and cupric oxide powder can serve as fluxing agent, make the sintering temperature of ceramic substrate reduce, from the cause for making aluminium oxide ceramics
Density improves, and then is improved the mechanical property of product, and secondly, in sintering process, the carbon in carbon dust can be with oxygen reduction
Change iron powder and iron and copper in cupric oxide powder, and the density of iron and copper is both greater than the density of aluminum oxide, therefore in sintering process
In the iron that is displaced and a copper part can be deposited on substrate bottom, subsequently with copper foil recombination process, be advantageous to substrate with
The welding of copper foil, both compatibilities are improved, and effectively reduce thermal contact resistance, overall thermal conductivity energy is improved, in addition, part iron and copper
Two layers uniform layers of copper and iron layer can be formed in alumina ceramic face, and firm mode combines, so that product surface
Thermal conductivity improve, furthermore the addition of carbon dust can react with silica, generation carborundum be distributed in ceramic substrate
In system, it is improved the heat conductivility of product；
（2）The present invention adds modified glass fibre peacekeeping metallic oxide crystal whisker when preparing high thermal conductivity ceramic substrate, on the one hand,
Surface-active is improved glass fibre after modification, and contact site is increased, and after adding in ceramic substrate system, can be made in system
Adhesion enhancing between each material, so that the mechanical property of product is improved, on the other hand, modified glass fibre peacekeeping metal
The addition of oxide whisker, the hole left after carbon dust reaction can be filled, so that the consistency of ceramic substrate system is carried
Height, and then it is improved the mechanical property of product.
Brief description of the drawings
Fig. 1 ceramic substrates heat conductivility and mechanics properties testing result.
Embodiment
By nano silicon and silane coupler in mass ratio 8：11~10：11 are mixed in beaker, and into beaker
The absolute ethyl alcohol of 10~12 times of nano silicon quality is added, beaker immigration digital display is tested the speed constant temperature blender with magnetic force, Yu Wen
Spend for 45~60 DEG C, under conditions of rotating speed is 300~360r/min, after being stirred, obtain treatment fluid, by glass fibre and processing
Liquid in mass ratio 1：6~1：8 are mixed in flask, and flask is moved into sonic oscillation instrument, under conditions of frequency is 45~55kHz
After 15~22min of sonic oscillation, filtering, filter cake is obtained, filter cake is moved into drying box, dried under conditions of being 75~90 DEG C in temperature
60~80min, obtain modified glass-fiber；Count in parts by weight, weigh 70~80 parts of alumina powders, 10~15 parts of iron oxide successively
Powder, 20~25 parts of cupric oxide powders, 20~25 parts of carbon dusts, 13~18 parts of boron oxide powders, 12~16 parts of modified glass-fibers, 8~14
Part metallic oxide crystal whisker and 3~5 parts of ice crystals；By carbon dust, boron oxide powder, ice crystal and modified glass-fiber add mixer
In be stirred, obtain compound, add mixture into ball mill, and into ball mill add 4~5 times of mixture quality oxygen
Change zirconium ball milling pearl, after 2~3h of ball milling, cross 100~120 mesh sieves, obtain compound powder, by compound powder, alumina powder, oxidation
Iron powder, cupric oxide powder and metallic oxide crystal whisker mixing after, add mould in, by mould move into forcing press in, in temperature be 70
It is compressing under conditions of~80 DEG C, blank is obtained, blank is moved into sintering furnace, is led to 80~120mL/min speed into stove
Enter argon gas, under argon gas guard mode, under conditions of temperature is 1150~1300 DEG C, sinter molding, cool to room temperature with the furnace
Afterwards, come out of the stove, obtain high thermal conductivity ceramic substrate.The metallic oxide crystal whisker is any one in magnesia crystal whisker or cupric oxide whisker
Kind.The glass fibre is any one in alkali-free glass fibre or medium-alkali glass fibre.The silane coupler is that silane is even
Join agent KH-560, any one in silane resin acceptor kh-550 or Silane coupling reagent KH-570.The compressing condition is
It is that 80~90MPa suppresses 30~45s prior to pressure, is that 100~110MPa suppresses 100~110s then at pressure.
Example 1
By nano silicon and silane coupler in mass ratio 10：11 are mixed in beaker, and nanometer two is added into beaker
The absolute ethyl alcohol that 12 times of siliconoxide mass, beaker immigration digital display is tested the speed constant temperature blender with magnetic force, is 60 DEG C in temperature, rotating speed is
Under conditions of 360r/min, after being stirred, treatment fluid is obtained, by glass fibre and treatment fluid in mass ratio 1：8 are mixed in flask
In, flask is moved into sonic oscillation instrument, after sonic oscillation 22min under conditions of frequency is 55kHz, filtering, filter cake is obtained, will filter
Cake moves into drying box, dries 80min under conditions of being 90 DEG C in temperature, obtains modified glass-fiber；Count, claim successively in parts by weight
Take 80 parts of alumina powders, 15 parts of brown iron oxides, 25 parts of cupric oxide powders, 25 parts of carbon dusts, 18 parts of boron oxide powders, 16 parts of modified glass fibres
Dimension, 14 parts of metallic oxide crystal whiskers and 5 parts of ice crystals；By carbon dust, boron oxide powder, ice crystal and modified glass-fiber add stirring
It is stirred in machine, obtains compound, added mixture into ball mill, and the oxygen of 5 times of mixture quality is added into ball mill
Change zirconium ball milling pearl, after ball milling 3h, cross 120 mesh sieves, compound powder is obtained, by compound powder, alumina powder, brown iron oxide, oxygen
After changing copper powder and metallic oxide crystal whisker mixing, add in mould, mould is moved into forcing press, in the condition that temperature is 80 DEG C
Under it is compressing, obtain blank, by blank move into sintering furnace in, argon gas is passed through into stove with 120mL/min speed, argon gas protect
Under state, under conditions of temperature is 1300 DEG C, sinter molding, after cooling to room temperature with the furnace, comes out of the stove, obtain high thermal conductivity ceramic base
Plate.The metallic oxide crystal whisker is magnesia crystal whisker.The glass fibre is alkali-free glass fibre.The silane coupler is
Silane coupler KH-560.The compressing condition is 110MPa then at pressure to be that 90MPa suppresses 45s prior to pressure
Suppress 110s.
Example 2
By nano silicon and silane coupler in mass ratio 10：11 are mixed in beaker, and nanometer two is added into beaker
The absolute ethyl alcohol that 12 times of siliconoxide mass, beaker immigration digital display is tested the speed constant temperature blender with magnetic force, is 60 DEG C in temperature, rotating speed is
Under conditions of 360r/min, after being stirred, treatment fluid is obtained, by glass fibre and treatment fluid in mass ratio 1：8 are mixed in flask
In, flask is moved into sonic oscillation instrument, after sonic oscillation 22min under conditions of frequency is 55kHz, filtering, filter cake is obtained, will filter
Cake moves into drying box, dries 80min under conditions of being 90 DEG C in temperature, obtains modified glass-fiber；Count, claim successively in parts by weight
Take 80 parts of alumina powders, 18 parts of boron oxide powders, 16 parts of modified glass-fibers, 14 parts of metallic oxide crystal whiskers and 5 parts of ice crystals；Will
Boron oxide powder, ice crystal and modified glass-fiber are added in mixer and are stirred, and are obtained compound, are added mixture into ball mill
In, and the zirconium oxide ball milling pearl of 5 times of mixture quality is added into ball mill, after ball milling 3h, 120 mesh sieves are crossed, obtain compound powder
End, by compound powder, after alumina powder and metallic oxide crystal whisker mixing, add in mould, mould moved into forcing press,
It is compressing under conditions of temperature is 80 DEG C, blank is obtained, blank is moved into sintering furnace, with 120mL/min speed into stove
Argon gas is passed through, under argon gas guard mode, under conditions of temperature is 1300 DEG C, sinter molding, after cooling to room temperature with the furnace, is gone out
Stove, obtain high thermal conductivity ceramic substrate.The metallic oxide crystal whisker is magnesia crystal whisker.The glass fibre is that alkali-free glass is fine
Dimension.The silane coupler is silane coupler KH-560.The compressing condition be prior to pressure be 90MPa compacting
45s, it is that 110MPa suppresses 110s then at pressure.
Example 3
Count in parts by weight, weigh 80 parts of alumina powders successively, 15 parts of brown iron oxides, 25 parts of cupric oxide powders, 25 parts of carbon dusts, 18 parts
Boron oxide powder, 16 parts of glass fibres, 14 parts of metallic oxide crystal whiskers and 5 parts of ice crystals；By carbon dust, boron oxide powder, ice crystal and
Glass fibre is added in mixer and is stirred, and is obtained compound, is added mixture into ball mill, and is added and mixed into ball mill
The zirconium oxide ball milling pearl of 5 times of quality of material is closed, after ball milling 3h, 120 mesh sieves is crossed, compound powder is obtained, by compound powder, aluminum oxide
After powder, brown iron oxide, cupric oxide powder and metallic oxide crystal whisker mixing, add in mould, mould is moved into forcing press, Yu Wen
Spend to be compressing under conditions of 80 DEG C, obtain blank, blank is moved into sintering furnace, is passed through with 120mL/min speed into stove
Argon gas, under argon gas guard mode, under conditions of temperature is 1300 DEG C, sinter molding, after cooling to room temperature with the furnace, come out of the stove,
Obtain high thermal conductivity ceramic substrate.The metallic oxide crystal whisker is magnesia crystal whisker.The glass fibre is alkali-free glass fibre.
The silane coupler is silane coupler KH-560.The compressing condition be prior to pressure be 90MPa suppress 45s,
It is that 110MPa suppresses 110s then at pressure.
Example 4
By nano silicon and silane coupler in mass ratio 10：11 are mixed in beaker, and nanometer two is added into beaker
The absolute ethyl alcohol that 12 times of siliconoxide mass, beaker immigration digital display is tested the speed constant temperature blender with magnetic force, is 60 DEG C in temperature, rotating speed is
Under conditions of 360r/min, after being stirred, treatment fluid is obtained, by glass fibre and treatment fluid in mass ratio 1：8 are mixed in flask
In, flask is moved into sonic oscillation instrument, after sonic oscillation 22min under conditions of frequency is 55kHz, filtering, filter cake is obtained, will filter
Cake moves into drying box, dries 80min under conditions of being 90 DEG C in temperature, obtains modified glass-fiber；Count, claim successively in parts by weight
Take 80 parts of alumina powders, 15 parts of brown iron oxides, 25 parts of cupric oxide powders, 25 parts of carbon dusts, 18 parts of boron oxide powders, 16 parts of modified glass fibres
5 parts of ice crystals of peacekeeping；By carbon dust, boron oxide powder, ice crystal and modified glass-fiber are added in mixer and are stirred, and must be mixed
Material, is added mixture into ball mill, and the zirconium oxide ball milling pearl of 5 times of mixture quality is added into ball mill, after ball milling 3h,
120 mesh sieves are crossed, obtain compound powder, by compound powder, alumina powder, brown iron oxide, after cupric oxide powder mixing, add mould
In, mould is moved into forcing press, it is compressing under conditions of temperature is 80 DEG C, blank is obtained, blank is moved into sintering furnace,
Argon gas is passed through into stove with 120mL/min speed, under argon gas guard mode, under conditions of temperature is 1300 DEG C, sintered into
Type, after cooling to room temperature with the furnace, come out of the stove, obtain high thermal conductivity ceramic substrate.The silane coupler is silane coupler KH-560.
The compressing condition is that 110MPa suppresses 110s then at pressure to be that 90MPa suppresses 45s prior to pressure.
Comparative example：The ceramic substrate of circuit board Co., Ltd of Shenzhen production.
The high thermal conductivity ceramic substrate of the gained of example 1 to 4 and comparative example product are subjected to performance detection, specific detection method
It is as follows：
1. heat conductivility：Using thermal resistance tester（The body heat resistance of measurable multiple solutions system and interface resistance）To test specimen Thermal Synthetic
Conductance is detected；
2. mechanical property：Test specimen tensile strength is detected according to GB/T14619.
Specific testing result is shown in brief description of the drawings, from brief description of the drawings Fig. 1 testing results, technical solution of the present invention preparation
High thermal conductivity ceramic substrate its mechanical property while its heat conductivility is improved also significantly improves, in pottery electronic package material skill
Had broad prospects in the development in art field.
Claims (5)
- A kind of 1. high thermal conductivity ceramic substrate, it is characterised in that：It is made up of the raw material of following parts by weight：70~80 parts of alumina powder10~15 parts of brown iron oxide20~25 parts of cupric oxide powder20~25 parts of carbon dust13~18 parts of boron oxide powder12~16 parts of modified glass-fiber8~14 parts of metallic oxide crystal whisker3~5 parts of ice crystalThe preparation method of the modified glass-fiber is：By nano silicon and silane coupler in mass ratio 8：11~10：11 mixing, and add nano silicon quality 10~12 times of absolute ethyl alcohol, after being stirred, treatment fluid is obtained, by glass fibre and treatment fluid in mass ratio 1：6~1：8 is mixed Close, sonic oscillation, filter, dry, obtain modified glass-fiber；The preparation method of the high thermal conductivity ceramic substrate is：（1）Formed by raw material and weigh each component；（2）By carbon dust, boron oxide powder, after ice crystal and modified glass-fiber mixing and ball milling, sieving, compound powder is obtained, will be mixed After conjunction feed powder end, alumina powder, brown iron oxide, cupric oxide powder and metallic oxide crystal whisker mixing, add in mould, in mould It is compressing, blank is obtained, blank is moved into sintering furnace and sintered, obtains high thermal conductivity ceramic substrate.
- A kind of 2. high thermal conductivity ceramic substrate according to claim 1, it is characterised in that：The metallic oxide crystal whisker is Any one in magnesia crystal whisker or cupric oxide whisker.
- A kind of 3. high thermal conductivity ceramic substrate according to claim 1, it is characterised in that：The glass fibre is alkali-free glass Any one in glass fiber or medium-alkali glass fibre.
- A kind of 4. high thermal conductivity ceramic substrate according to claim 1, it is characterised in that：The silane coupler is silane Any one in coupling agent KH-560, silane resin acceptor kh-550 or Silane coupling reagent KH-570.
- A kind of 5. high thermal conductivity ceramic substrate according to claim 1, it is characterised in that：Step（2）It is described compressing Condition be prior to pressure be 80~90MPa suppress 30~45s, then at pressure be 100~110MPa suppress 100~110s.
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108484182A (en) * | 2018-04-08 | 2018-09-04 | 江苏中翼汽车新材料科技有限公司 | Magnesium oxide-based ceramic foam filter of a kind of magnesia crystal whisker fabricated in situ magnesium aluminate spinel enhancing and preparation method thereof |
| CN112110718A (en) * | 2020-11-18 | 2020-12-22 | 广东欧文莱陶瓷有限公司 | Ceramic tile with natural touch and preparation method thereof |
| CN112723892A (en) * | 2021-01-07 | 2021-04-30 | 林萍华 | Preparation method of ceramic material with excellent thermal conductivity and ceramic material |
| CN115093203A (en) * | 2022-07-07 | 2022-09-23 | 张欢湛 | Preparation method of carbon-based aluminum oxide composite material |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105236942A (en) * | 2015-11-11 | 2016-01-13 | 苏州宽温电子科技有限公司 | High-heat-conduction ceramic substrate material and preparing method thereof |
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2017
- 2017-10-16 CN CN201710956913.4A patent/CN107602095B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105236942A (en) * | 2015-11-11 | 2016-01-13 | 苏州宽温电子科技有限公司 | High-heat-conduction ceramic substrate material and preparing method thereof |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108484182A (en) * | 2018-04-08 | 2018-09-04 | 江苏中翼汽车新材料科技有限公司 | Magnesium oxide-based ceramic foam filter of a kind of magnesia crystal whisker fabricated in situ magnesium aluminate spinel enhancing and preparation method thereof |
| WO2019196178A1 (en) * | 2018-04-08 | 2019-10-17 | 江苏中翼汽车新材料科技有限公司 | Magnesium aluminate spinel reinforced magnesium oxide-based foam ceramic filter synthesized in situ from magnesium oxide whisker, and preparation method therefor |
| US20200316505A1 (en) * | 2018-04-08 | 2020-10-08 | Jiangsu Zhongyi Automobile New Material Technology Co., Ltd. | Magnesium aluminate spinel reinforced magnesium oxide-based foam ceramic filter synthesized in situ from magnesium oxide whisker, and preparation method therefor |
| US11702366B2 (en) * | 2018-04-08 | 2023-07-18 | Jiangsu Zhongyi Automobile New Material Technology Co., Ltd. | Magnesium aluminate spinel reinforced magnesium oxide-based foam ceramic filter synthesized in situ from magnesium oxide whisker, and preparation method therefor |
| CN112110718A (en) * | 2020-11-18 | 2020-12-22 | 广东欧文莱陶瓷有限公司 | Ceramic tile with natural touch and preparation method thereof |
| CN112723892A (en) * | 2021-01-07 | 2021-04-30 | 林萍华 | Preparation method of ceramic material with excellent thermal conductivity and ceramic material |
| CN112723892B (en) * | 2021-01-07 | 2022-06-10 | 东莞市钧杰陶瓷科技有限公司 | Preparation method of ceramic material with excellent thermal conductivity and ceramic material |
| CN115093203A (en) * | 2022-07-07 | 2022-09-23 | 张欢湛 | Preparation method of carbon-based aluminum oxide composite material |
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