CN105236197A - Method and apparatus for generating work program of tape adhesion apparatus - Google Patents
Method and apparatus for generating work program of tape adhesion apparatus Download PDFInfo
- Publication number
- CN105236197A CN105236197A CN201510390490.5A CN201510390490A CN105236197A CN 105236197 A CN105236197 A CN 105236197A CN 201510390490 A CN201510390490 A CN 201510390490A CN 105236197 A CN105236197 A CN 105236197A
- Authority
- CN
- China
- Prior art keywords
- band
- outer contour
- adsorption device
- work flow
- point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
Abstract
Provided are a method and an apparatus for generating a work program of a tape adhesion apparatus. According to an embodiment of the present invention, a method for generating a work program of a tape adhesion apparatus is used for generating a work program of a tape adhesion apparatus for adsorbing and and attaching a tape on a substrate, comprising following steps: discerning an outer contour line of a tape by an image obtained by photographing the tape; calculating the center point of the tape based on the outer contour line; overlapping and attaching the outer contour line on the substrate to a mounting position of the tape.
Description
Technical field
The work flow that the present invention relates to a kind of tape adsorption device generates method and apparatus, particularly relates to a kind of work flow that automatically can generate the tape adsorption device of work flow at the band automatic laminating supplied by band dispenser device in the tape adsorption device of substrate and generates method and apparatus.
Background technology
Usually, at the electronic control unit (ECU of smart mobile phone, notebook PC, panel computer, TV, automobile; Etc. ElectronicControlUnit) need to be provided with tellite (PrintedCircuitBoard) in the equipment accurately controlled, in described tellite, intricately is pasted with widget.Such tellite (PCB) be configured to utilize epoxy resin or phenol (Phenol) resin etc. and make thin plate on Copper Foil printing needed for wiring, be thus connected between each element, and circuit can be run after applying power supply, and conducting function, insulation function, support function etc. can be performed.
Such tellite is formed with multiple wiring; described tellite is pasted with band to scheme protective substrate, shielding electromagnetic wave, insulate, to prevent light leakage, attached structure thing etc.; usually, operation tape being invested tellite is realized by the manual working of operating personnel.
So can consider a kind of tape adsorption device, it can automatically perform operation tape being invested tellite depending on manual working.The band that such tape adsorption device is adsorbable to be supplied by band dispenser device etc. and this tape is invested described tellite.
Now, input is needed to be used for the work flow of the operation of tape adsorption device.The position needing the substrate attaching band will be specified in described work flow, but there is the inconvenience needing to input the kind being attached at the band of the sticking position of described band, the installation coordinate representing described sticking position etc.
[prior art document]
[patent documentation]
Patent documentation 1: No. 2010-0045307th, KR published patent (being disclosed in 2010.05.03)
Patent documentation 2: No. 2009-0056473rd, KR published patent (being disclosed in 2009.06.03)
Summary of the invention
The present invention is used for solving the problems of the technologies described above, and its object is to provide a kind of and can automatically generate for band automatic laminating is generated method and apparatus in the work flow of the tape adsorption device of the work flow of the tape adsorption device of substrate.
Technical matters to be solved by this invention is not limited to above-mentioned technical matters, and those skilled in the art clearly understand NM other technologies problem by following record.
For the according to an embodiment of the invention a kind of work flow generation method of tape adsorption device solved the problems of the technologies described above, for generating absorption band and this tape being invested the work flow of the tape adsorption device of substrate, comprise the steps: the outer contour of band described in the image recognition that obtained by the described band of shooting; The center-point of described band is calculated based on described outer contour; Based on described band center-point and described outer contour is overlapped in the installation site described substrate attaching described band.
For the according to an embodiment of the invention a kind of work flow generating apparatus of tape adsorption device solved the problems of the technologies described above, band is adsorbed and the work flow this tape being invested the tape adsorption device of substrate for generating, comprise: pick up camera, for taking described band; Microcomputer, obtain image from described pick up camera and identify the outer contour of described band, and calculate the center-point of described band based on described outer contour, and described outer contour is overlapped in the installation site described substrate attaching described band based on the center-point of described band.
Other details of the present invention are contained in detailed description and accompanying drawing.
According to the present invention, automatically can generate the work flow of tape adsorption device, thus the ease of use of operating personnel can be improved and save production time etc.
Further, automatically can generate the work flow of tape adsorption device, thus can the mistake of work flow be prevented in advance and reduce fraction defective and improve the quality of products.
Accompanying drawing explanation
Fig. 1 is the precedence diagram of the work flow generation method of tape adsorption device according to an embodiment of the invention.
Fig. 2 is for representing the figure of the process of the work flow generation method of tape adsorption device according to Fig. 1.
Fig. 3 is the schematic diagram of the work flow generating apparatus of tape adsorption device according to an embodiment of the invention.
Fig. 4 is the pie graph of the microcomputer of the work flow generating apparatus of the adsorption device of tape shown in Fig. 3.
Fig. 5 is the planar view for illustration of the adsorption device of tape shown in Fig. 1 to Fig. 4.
Nomenclature
10: calibration camera 20: microcomputer
110: dispenser device pedestal 120A, 120B: belt conveyor
130: head 132: suction nozzle
140: suspension and support 150: control part
170: pick up camera
Detailed description of the invention
Advantage of the present invention, feature will be understood and the method used that achieves the goal with reference to the embodiment be described with reference to the accompanying drawings.But the present invention is not limited to the embodiment of following discloses, it can be implemented as different variforms, embodiment just in order to intactly openly the present invention scope of the present invention is intactly told to provide to the personnel in the technical field belonging to the present invention with general knowledge, the present invention is only defined by claims.Run through whole specification sheets, identical Reference numeral represents identical inscape.
Although in order to describe various element, inscape and/or part and use first, second etc. term, but these elements, inscape and/or part be certainly not limited to these terms.These terms are just in order to be distinguished an element, inscape or part and other elements, inscape or part and be used.Therefore, the first element below related to, the first inscape or Part I can certainly be the second element, the second inscape or Part II in technological thought of the present invention.
The term used in this specification sheets is not to limit the present invention for illustration of embodiment.In this specification sheets, if do not have special version in statement, odd number type also comprises complex number type." comprising (comprises) " of using in specification sheets and/or " form (madeof) " is not got rid of and also to exist beyond described inscape, step, operation and/or element or to be attached with other inscapes more than one, step, operation and/or element.
If do not have other to define, then all terms (comprising the term of technology and science aspect) used in this specification sheets can use the personnel in the technical field belonging to the present invention with general knowledge the implication that can jointly understand.And, as long as no special definition, then normally used be defined in term in dictionary can not by idealized or exceedingly explain.
Below, the present invention is illustrated in greater detail with reference to the accompanying drawings.
First, before the work flow investigating tape adsorption device according to an embodiment of the invention generates method and apparatus, described tape adsorption device is investigated.
With reference to figure 5, the tape adsorption device that the work flow generation method and apparatus of tape adsorption device according to an embodiment of the invention is applied is attached at substrate S for the band T supplied by band dispenser device (not shown), can comprise dispenser device pedestal 110, belt conveyor 120A, 120B, head 130, suspension and support 140, control part 150.Further, tape adsorption device can also comprise Lighting Division (not shown), pick up camera 170 etc.
In tape adsorption device; dispenser device pedestal 110, belt conveyor 120A, 120B, head 130, suspension and support 140 etc. are positioned on pedestal (not shown); band T is by the band dispenser device supply being installed on dispenser device pedestal 110; and in described dispenser device pedestal 110, be separated over cap and described band T is waited, and adsorb described band T by head 130 and this band T is attached at by belt conveyor 120A, 120B by the substrate S transferred.In order to adsorb band T that band dispenser device supplies and this band T be attached at substrate S, head 130 by means of suspension and support 140 along the movement of overall importance of X-Y direction of principal axis.In addition, the band T in order to Executive Head 130 efficiently adsorbs and attaches operation, and control part 150 controls head 130 and suspension and support 140 etc.
At this, band T is attached at substrate S and performs several functions.Such as, band T can use and attach the electricity purposes such as connection, against short-circuit (short) into the electric conductivity between electromagnetic wave shielding, PCB, and can also use as optical applications such as fiber waveguide blocking sheet, light diffusing sheet, reflector plates.And band T can use as absorbing the physical purpose such as the fixing of impacts, waterproof, parts etc., heat trnasfer, or can also use as identification purposes for identifying product such as label (Label), bar codes (BarCode).As an example, for recently rapidly universal smart mobile phone (SmartPhone), along with the slimming of product, lightweight and utilize band T in packaging technology, and in order to strengthen waterproof and dustproof function with mould internal antenna (IMA; InMoldAntenna) replace, thus the attaching of conductive strip is increased thereupon.Further, in TV, the multiple band T such as product line bar code strip, cable fixing strip, label band is used, and in PC, also use the multiple band T such as product line bar code strip, reflecting strips, conductive strip, surge protection band.In addition, in the Denso such as various electronic or automobile equipment, also widely use the multiple band T for performing above-mentioned functions.In order to so multiple band T is attached at automobile, the band dispenser device multiple band T being fed to tape adsorption device can be used.
Fig. 1 is the precedence diagram of the work flow generation method of tape adsorption device according to an embodiment of the invention.In addition, Fig. 2 is the figure representing the process realized by the work flow generation method of the tape adsorption device of Fig. 1.
With reference to figure 1 and Fig. 2, the work flow generation method of tape adsorption device according to an embodiment of the invention adsorbs band T and the work flow this band T being attached at the tape adsorption device of substrate S for generating.Specifically, in the work flow generation method of tape adsorption device according to an embodiment of the invention, take band T and obtain image (S10), and by the outer contour C (S20) of band T described in described image recognition, and calculate the center-point (S30) of described band T based on described outer contour C, and based on described band T center-point and described outer contour C is overlapped on described substrate S and attaches the installation site (S40) of described band T.Such as, specify by the outline line (outline) of the band T of pick up camera identification, and identify the center (Center) based on this band T, and utilize calibration camera (FiducialCamera) etc. to identify the shape that will attach the substrate S of identified outline line, and make outline line overlapping with the installation site of band T (Overlap), thus record needs the installation site attaching band T.
Wherein, work flow comprises the information etc. about dispenser device, suspension and support, head, parts (band), attachment point, suction nozzle and substrate.The dispenser device information that information about dispenser device comprises each dispenser device information separately, each single tape adsorption device can be arranged separately, dispenser device hold information etc., and the information about suspension and support comprises the relevant information of the quantity of the suspension and support being applied to substrate, the quantity being arranged at the suspension and support of operating line etc.And the information about head comprises the quantity of the head being provided to individual strips adhering device, the layout etc. of head, the information about parts comprises the kind, size etc. of band.In addition, the information about attachment point comprises the position and quantity etc. thereof that are installed on substrate, and the information about suction nozzle comprises the relevant information being provided to the suction nozzle quantity of head, the size of suction nozzle etc.At this, by the work flow generation method of tape adsorption device according to an embodiment of the invention, the installation site of the band being installed on substrate and the kind of band automatically can be recorded.
Obtaining image (S10) to take band T, the pick up camera 170 being arranged at tape adsorption device can be used.The pick up camera 170 being arranged at tape adsorption device can comprise at least one in following pick up camera: mobile (Fly) pick up camera, adsorbs in the process of band T and movement take substrate S and/or band T at the suction nozzle 132 of head 130; Pick up camera on platform, the size of taking described band T is greater than the band of the normal size preset; Calibration camera, shooting substrate S.Mobile camera can be installed in head 130, and moves together along with the movement of head 130 and identify whether attach operation normally carries out.On platform, pick up camera is moved to the top of the platform (not shown) being positioned at pedestal upper end and the light that irradiates based on Lighting Division and performs shooting and identify, and mainly performs the effect identifying large scale band T.Calibration camera is positioned at the top of substrate S and identifies whether band T is correctly attached at substrate S.Utilize on such mobile camera, platform in pick up camera, calibration camera at least one and take band T.
Then, in order to the outer contour C (S20) by image recognition band T, can polygon algorithm be utilized and specify the outer contour C of band T or utilize edge detection algorithm and extract described outer contour C.Such polygon algorithm and/or edge detection algorithm can comprise the adoptable all polygon algorithm of those skilled in the art and/or edge detection algorithm.As shown in Figure 2, outer contour C can be extracted from the image of the band T of shooting.
Then, in order to calculate center-point (S30) from the outer contour C of band T, in outer contour C, any point is set as initial point, and the coordinate figure represented with plane coordinates described initial point obtained as benchmark for described outer contour C, and described coordinate figure is averaging, described center-point can be calculated thus.Such as, the outer contour C of substrate S a bit can be set as initial point, and in units of preset distance, divide outer contour C and use the coordinate of (x, y) to represent.Can be averaging the coordinate figure corresponding to the outer contour C represented with plane coordinates and calculate.That is, X-axis coordinate figure and the whole phase adduction of Y-axis coordinate figure of the point that can generate dividing in whole outer contour C calculate center-point divided by the quantity of the point generated by dividing.
Then, in multiple installation sites of substrate S (such as, P1-P4) in, the center-point calculated based on the outer contour C from band T and make the outer contour C of band T move to make it accurately be overlapped in installation site (such as P2), thus the work flow generating record band T installation site automatically.
Fig. 3 is the schematic diagram of the work flow generating apparatus of tape adsorption device according to an embodiment of the invention.In addition, Fig. 4 is the pie graph of the microcomputer of the work flow generating apparatus of the adsorption device of tape shown in Fig. 3.
With reference to figure 3, the work flow generating apparatus of tape adsorption device according to an embodiment of the invention comprises calibration camera 10 and microcomputer 20.
Calibration camera 10 can take substrate S and/or band T, by the image obtained by described calibration camera 10, can obtain the relevant information of the installation site P of band T, the shape of band T and the size etc. on the shape of substrate S and size, substrate S.Certainly, as previously mentioned, except can utilizing calibration camera 10, pick up camera (not shown) etc. on mobile camera (not shown) or platform can also be utilized to take substrate S and/or band T.
Microcomputer 20 obtains image from calibration camera 10 and identifies the outer contour of band T, and calculate the center-point of described band T based on described outer contour, and based on described band T center-point and described outer contour is overlapped on described substrate S and attaches the installation site P of described band T.That is, the program generating the work flow of tape adsorption device performs in microcomputer 20.Specifically, as shown in Figure 4, microcomputer 20 can also comprise: line identification part 22, by the outer contour of image recognition band T; Center-point calculating part 24, calculates the center-point of described band T based on described outer contour; Line overlap portion 26, based on described band T center-point and described outer contour is overlapped in installation site.
This microcomputer 20 both can be arranged at the outside of tape adsorption device and obtain image by network or cable from the calibration camera 10 of tape adsorption device, also can be arranged within tape adsorption device.When being arranged in tape adsorption device, microcomputer 20 both can be made to perform the effect of the control part 150 of tape adsorption device, also microcomputer 20 and control part 150 can be embodied as independently treater.
Generate method and apparatus by the work flow of tape adsorption device according to an embodiment of the invention, the band T needing to be attached at substrate S can be recorded more easily, thus the work flow that the comfort feature that can generate user improves.
Work flow copies dependent program file (be otherwise known as PCB file) after can making in upper application (application) and relevant work flow is applied to tape adsorption device and produces, or also can directly make in tape adsorption device.When microcomputer 20 is formed independently of each other with tape adsorption device, user can utilize the upper application that is provided to microcomputer 20 grade and produce work flow.Upper application is the integration programming software of the on-line operation for tape adsorption device, and the programming software for the operation of each device becomes equipment application.When work flow being directly inputted to individual strips adhering device, it can pass through equipment man-computer interface (MMI; ManMachineInterface) perform.
Above, with reference to accompanying drawing, embodiments of the invention are described, but the personnel in technical field belonging to the present invention with general knowledge probably can understand the present invention can be embodied as other concrete forms when not changing technological thought or essential feature.Therefore, will be appreciated that the embodiment of above record is in all respects exemplary instead of determinate.
Claims (8)
1. the work flow generation method of a tape adsorption device, adsorbing band and the work flow this tape being invested the tape adsorption device of substrate for generating, comprising the steps:
The outer contour of band described in the image recognition obtained by the described band of shooting;
The center-point of described band is calculated based on described outer contour; And
Based on described band center-point and described outer contour is overlapped in the installation site described substrate attaching described band.
2. the work flow generation method of tape adsorption device as claimed in claim 1, wherein, identifies that the step of described outer contour comprises and utilizes edge detection algorithm and the step of extracting described outer contour.
3. the work flow generation method of tape adsorption device as claimed in claim 1, wherein, the step calculating described center-point comprises the steps:
In described outer contour, any point is set as initial point;
The coordinate figure represented with plane coordinates obtained for described outer contour based on described initial point; And
Described coordinate figure is averaging and calculates described center-point.
4. the work flow generation method of tape adsorption device as claimed in claim 3, wherein, divides described outer contour from described initial point with preset space length and obtains described coordinate figure.
5. a work flow generating apparatus for tape adsorption device, adsorbing band and the work flow this tape being invested the tape adsorption device of substrate for generating, comprising:
Pick up camera, for taking described band; And
Microcomputer, obtain image from described pick up camera and identify the outer contour of described band, and calculate the center-point of described band based on described outer contour, and based on described band center-point and described outer contour is overlapped in the installation site described substrate attaching described band.
6. the work flow generating apparatus of tape adsorption device as claimed in claim 5, wherein, described microcomputer comprises:
Line identification part, by the outer contour of band described in described image recognition;
Center-point calculating part, calculates the center-point of described band based on described outer contour; And
Line overlap portion, based on described band center-point and described outer contour is overlapped in described installation site.
7. the work flow generating apparatus of tape adsorption device as claimed in claim 5, wherein, described pick up camera comprises at least one in following pick up camera:
Mobile camera, takes described band at band described in the suction of head in the process of movement;
Pick up camera on platform, the size of taking described band is greater than the band of the normal size preset;
Calibration camera, takes described substrate.
8. the work flow generating apparatus of tape adsorption device as claimed in claim 5, wherein, described band be electromagnetic wave shielding band, at least one in conductive strip, the label band being printed with product information, the bar code strip being printed with bar code, impact absorbing band, waterproof band.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020140083993A KR20160004857A (en) | 2014-07-04 | 2014-07-04 | Method and apparatus for generating work program of tape adhesion apparatus |
| KR10-2014-0083993 | 2014-07-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105236197A true CN105236197A (en) | 2016-01-13 |
Family
ID=55034093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510390490.5A Pending CN105236197A (en) | 2014-07-04 | 2015-07-06 | Method and apparatus for generating work program of tape adhesion apparatus |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20160004857A (en) |
| CN (1) | CN105236197A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109324323A (en) * | 2018-09-30 | 2019-02-12 | 深圳创维－Rgb电子有限公司 | Localization method, device and the computer readable storage medium of target point |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1153451A (en) * | 1995-10-10 | 1997-07-02 | Lg产电株式会社 | Device recognizing method and apparatus for surface mounting device mounter |
| CN1309528A (en) * | 2000-02-15 | 2001-08-22 | 三星Techwin业株式会社 | Device and method for installing component |
| US20050071990A1 (en) * | 2002-02-10 | 2005-04-07 | Atsushi Nakamura | Electronic-component alignment method and apparatus therefor |
| CN1741727A (en) * | 2004-07-28 | 2006-03-01 | 重机公司 | Nozzle position correcting method for electronic device mounting appararus |
| CN101336072A (en) * | 2007-06-29 | 2008-12-31 | 富葵精密组件(深圳)有限公司 | Surface-mounted contraposition apparatus and method thereof |
| CN201888033U (en) * | 2010-12-07 | 2011-06-29 | 石九龙 | Full-automatic patch mounting/dismounting all-in-one machine based on machine vision |
-
2014
- 2014-07-04 KR KR1020140083993A patent/KR20160004857A/en not_active Application Discontinuation
-
2015
- 2015-07-06 CN CN201510390490.5A patent/CN105236197A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1153451A (en) * | 1995-10-10 | 1997-07-02 | Lg产电株式会社 | Device recognizing method and apparatus for surface mounting device mounter |
| CN1309528A (en) * | 2000-02-15 | 2001-08-22 | 三星Techwin业株式会社 | Device and method for installing component |
| US20050071990A1 (en) * | 2002-02-10 | 2005-04-07 | Atsushi Nakamura | Electronic-component alignment method and apparatus therefor |
| CN1741727A (en) * | 2004-07-28 | 2006-03-01 | 重机公司 | Nozzle position correcting method for electronic device mounting appararus |
| CN101336072A (en) * | 2007-06-29 | 2008-12-31 | 富葵精密组件(深圳)有限公司 | Surface-mounted contraposition apparatus and method thereof |
| CN201888033U (en) * | 2010-12-07 | 2011-06-29 | 石九龙 | Full-automatic patch mounting/dismounting all-in-one machine based on machine vision |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109324323A (en) * | 2018-09-30 | 2019-02-12 | 深圳创维－Rgb电子有限公司 | Localization method, device and the computer readable storage medium of target point |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160004857A (en) | 2016-01-13 |
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