CN105234313A - Bending mechanism for electronic components - Google Patents
Bending mechanism for electronic components Download PDFInfo
- Publication number
- CN105234313A CN105234313A CN201510718752.6A CN201510718752A CN105234313A CN 105234313 A CN105234313 A CN 105234313A CN 201510718752 A CN201510718752 A CN 201510718752A CN 105234313 A CN105234313 A CN 105234313A
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- CN
- China
- Prior art keywords
- bending
- plate
- electronic devices
- components
- mounting blocks
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F1/00—Bending wire other than coiling; Straightening wire
- B21F1/004—Bending wire other than coiling; Straightening wire by means of press-type tooling
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Bending Of Plates, Rods, And Pipes (AREA)
Abstract
The invention discloses a bending mechanism for electronic components. The bending mechanism comprises a rack with a horizontal top plate, a lifting drive mechanism arranged on the horizontal top plate, a bending die set connected with the lifting drive mechanism, a locating bottom plate below the bending die set and a lower die plate. The electronic components are sleeved with die plate holes and located on the locating bottom plate. The bending die set comprises an upper combined plate layer and a bending module, and a telescopic air cylinder is arranged on one side of the upper combined plate layer and connected with the bending module. Lateral pushing forming is carried out after terminals of the electronic components are bent, and the situation that the shapes of the bent terminals rebound, and consequently preset shapes are lost is avoided. According to the bending mechanism for the electronic components, manual work is replaced, and therefore the work efficiency in the bending process of the terminals of the electronic components is improved, the labor intensity of workers is lowered, and then production cost is reduced.
Description
Technical field:
The present invention relates to electronic devices and components process equipment, in particular to a kind of bending mechanism of electronic devices and components.
Background technology:
The terminal of portions of electronics components and parts can need use after bending process, and the mode that bending equipment of the prior art generally adopts upper module to press down the electronic devices and components being positioned at bed die block carries out bending process to the terminal of electronic devices and components.But due to the performance of electronic devices and components terminal material itself, when bending process completes, described upper module rises after reset, the terminal after electronic devices and components bending there will be shape bounce-back to a certain degree.
Summary of the invention:
Technical problem solved by the invention: electronic devices and components bending equipment of the prior art, when bending process terminates, its upper module for bending electronic devices and components terminal rises after reset, terminal after electronic devices and components bending there will be shape bounce-back to a certain degree, causes the terminal of electronic devices and components to can not get predetermined shape.
For solving the problems of the technologies described above, the invention provides following technical scheme:
A bending mechanism for electronic devices and components, comprise the frame being provided with horizontal top, the lift drive mechanism be arranged in horizontal top, be positioned at be connected below horizontal top and with lift drive mechanism bending module, be positioned at the positioning plate below bending module, the lower bolster be positioned on positioning plate; Described lower bolster offers multiple pattern hole, and described electronic devices and components to be set in pattern hole and to be positioned on positioning plate; Described bending module comprises upper layer group plywood and bend bar, the bottom of described upper layer group plywood is provided with slide rail, the chute coordinated with slide rail is offered at the top of described bend bar, a gap is offered in the side of described upper layer group plywood, the telescopic cylinder that one is positioned at opening position is installed at the top of upper layer group plywood, and the piston rod of telescopic cylinder is provided with a plate, and connecting plate is positioned at gap, the top of connecting plate is connected with the piston rod of telescopic cylinder, and the bottom of connecting plate is connected with bend bar.
By technique scheme, the operation principle of the bending mechanism of electronic devices and components of the present invention is as follows: electronic devices and components to be processed are positioned on positioning plate, lower bolster is positioned on positioning plate, pattern hole on lower bolster is set on electronic devices and components, and electronic devices and components treat that the terminal of bending projects upwards lower bolster; Afterwards, lift drive mechanism drives bending module to press down on lower bolster, and the terminal of electronic devices and components is by bending; Afterwards, telescopic cylinder stretches, and drive bend bar to move along slide rail transverse horizontal, the moving direction of bend bar is the wrap direction of electronic devices and components terminal; Afterwards, lift drive mechanism drives the rising of bending module to reset, and the bending process of electronic devices and components terminal completes.
By technique scheme, the bending mechanism of electronic devices and components of the present invention can be shaping carrying out thruster after the terminal bending of electronic devices and components again, prevents the terminal shape after bending from rebounding and losing predetermined shape.The bending mechanism of electronic devices and components of the present invention instead of manual work, thus improves the operating efficiency of terminal in bending of electronic devices and components, reduces the labour intensity of operating personnel, and then reduces production cost.
Illustrate as one of the present invention, described connecting plate is positioned at gap can save taking up room of whole bending mechanism, and the structure of whole bending mechanism is simplified.
Illustrate as one of the present invention, the side of described horizontal top is provided with the stop regulating block to downward-extension, and the top that the stretching, extension of described telescopic cylinder can order about connecting plate is against and stops on regulating block.Described stop regulating block drives the translation amplitude of bending mould board with the controllable telescopic cylinder that coordinates of connecting plate, avoids the damage of electronic devices and components.The position of described stop regulating block is adjustable, particularly, stop and regulating block offers screw, be spirally connected in screw adjustment bolt, the length direction of adjustment bolt is same as the telescopic direction of telescopic cylinder, stops that regulating block is arranged on upper layer group plywood by adjustment bolt, gathering sill offered by upper layer group plywood, stop that regulating block is fastened in gathering sill, the length direction of gathering sill is same as the length direction of adjustment bolt.
Illustrate as one of the present invention, described lift drive mechanism comprises servomotor, the screw mandrel connected with servomotor, and the lifter plate that is spirally connected of screw mandrel; Described horizontal top is provided with lead, and the top of lead is installed with installing plate, and described servomotor is installed on a mounting board, described lifter plate is installed with the fairlead coordinated with lead; Described horizontal top offers through hole, and in through hole, activity plugs joint pin, and the top of joint pin is fixedly connected with lifter plate, and the bottom of joint pin is fixedly connected with upper layer group plywood.As described above, driven by servomotor screw mandrel rotates, and under coordinate of lead with fairlead, screw mandrel drives lifter plate lifting, and lifter plate drives the lifting of bending module by joint pin.
As a kind of explanation of the present invention, described horizontal top is provided with spacing photoelectric induction device, and described spacing photoelectric induction device comprises the photoelectricity installing plate be fixedly mounted in horizontal top, the photoelectricity adjustable plate be fixedly mounted on photoelectricity installing plate, is arranged on upper limit element mounting blocks on photoelectricity adjustable plate and lower limit element mounting blocks, the upper limit photovoltaic sensing element be arranged on upper limit element mounting blocks, the lower limit photovoltaic sensing element be arranged on lower limit element mounting blocks; Described photoelectricity adjustable plate offers vertical dragging track, and described upper limit element mounting blocks and lower limit element mounting blocks are elastoplast block, and upper limit element mounting blocks and lower limit element mounting blocks are fastened in dragging track; The sidewall of described lifter plate is installed with upper limit photovoltaic sensing element and lower limit photovoltaic sensing element with the use of sensor block.As described above, described upper limit element mounting blocks and the height adjustable of lower limit element mounting blocks on photoelectricity adjustable plate, and then, the height adjustable of described upper limit photovoltaic sensing element and lower limit photovoltaic sensing element, adjustable for height upper limit photovoltaic sensing element and lower limit photovoltaic sensing element are electrically connected with servomotor, so, spacing photoelectric induction device can control the heave amplitude of bender group.
Illustrate as one of the present invention, described positioning plate is offered a pair installing hole, a pair installing hole diagonal angle on positioning plate is arranged, and each installing hole internal fixtion is provided with axle sleeve; The bottom of described upper layer group plywood be installed with a pair axle sleeve with the use of descending lead.When bending module comes downwards to certain altitude, descending lead inserts in axle sleeve and leads.
Illustrate as one of the present invention, described positioning plate is installed with two groups of alignment pins, two groups of alignment pin diagonal angles on positioning plate are arranged, and often organize alignment pin and comprise two alignment pins be set up in parallel; Described lower bolster is offered the locating hole with two groups of detent fit.The object of above-mentioned design is more stablize and be positioned on positioning plate by lower bolster exactly.
Illustrate as one of the present invention, described bend bar comprises the bending pressure head terminal of electronic devices and components being carried out to bending, and described bending pressure head is electrically connected with electric heater unit; Namely bending pressure head of the present invention adopts and adds thermal head, to improve the bending effect of electronic devices and components terminal further.
Accompanying drawing illustrates:
Below in conjunction with accompanying drawing, the present invention is described further:
Fig. 1 is the structural representation of the bending mechanism of a kind of electronic devices and components of the present invention;
Fig. 2 is the structural representation of the bending mechanism gained observing electronic devices and components in Fig. 1 from lower left;
Fig. 3 is the left view of Fig. 2;
Fig. 4 is A place enlarged drawing in Fig. 1.
Symbol description in figure:
10, frame; 11, horizontal top;
20, lift drive mechanism; 21, servomotor; 22, lifter plate; 23, lead; 24, installing plate; 25, joint pin;
30, bending module; 31, upper layer group plywood; 311, descending lead; 32, bend bar; 321, bending pressure head; 33, connecting plate; 34, regulating block is stopped;
41, positioning plate; 411, axle sleeve; 412, alignment pin; 42, lower bolster;
50, spacing photoelectric induction device; 51, photoelectricity installing plate; 52, photoelectricity adjustable plate; 520, dragging track; 531, upper limit element mounting blocks; 532, lower limit element mounting blocks; 54, sensor block;
A, electronic devices and components.
Detailed description of the invention:
Composition graphs 1 to Fig. 3, a bending mechanism for electronic devices and components, comprise the frame 10 being provided with horizontal top 11, the lift drive mechanism 20 be arranged in horizontal top, be positioned at be connected below horizontal top and with lift drive mechanism bending module 30, be positioned at the positioning plate 41 below bending module, the lower bolster 42 be positioned on positioning plate; Described lower bolster offers multiple pattern hole, and described electronic devices and components a to be set in pattern hole and to be positioned on positioning plate.
Composition graphs 1 to Fig. 3, described bending module comprises upper layer group plywood 31 and bend bar 32, the bottom of described upper layer group plywood is provided with slide rail, the chute coordinated with slide rail is offered at the top of described bend bar, a gap is offered in the side of described upper layer group plywood, the telescopic cylinder that one is positioned at opening position is installed at the top of upper layer group plywood, the piston rod of telescopic cylinder is provided with a plate 33, connecting plate is positioned at gap, the top of connecting plate is connected with the piston rod of telescopic cylinder, and the bottom of connecting plate is connected with bend bar.Composition graphs 1 to Fig. 3, the side of described horizontal top 11 is provided with the stop regulating block 34 to downward-extension, and the top that the stretching, extension of described telescopic cylinder can order about connecting plate 33 is against and stops on regulating block.
Described bend bar 32 comprises the bending pressure head 321 terminal of electronic devices and components a being carried out to bending, and described bending pressure head is electrically connected with electric heater unit.
Composition graphs 1 to Fig. 3, described lift drive mechanism 20 comprises servomotor 21, the screw mandrel connected with servomotor, the lifter plate 22 that is spirally connected with screw mandrel; Described horizontal top 11 is provided with lead 23, and the top of lead is installed with installing plate 24, and described servomotor is installed on a mounting board, described lifter plate is installed with the fairlead coordinated with lead; Described horizontal top offers through hole, and in through hole, activity plugs joint pin 25, and the top of joint pin is fixedly connected with lifter plate, and the bottom of joint pin is fixedly connected with upper layer group plywood 31.
Composition graphs 1, Fig. 4, described horizontal top 11 is provided with spacing photoelectric induction device 50, and described spacing photoelectric induction device comprises the photoelectricity installing plate 51 be fixedly mounted in horizontal top, the photoelectricity adjustable plate 52 be fixedly mounted on photoelectricity installing plate, is arranged on upper limit element mounting blocks 531 on photoelectricity adjustable plate and lower limit element mounting blocks 532, the upper limit photovoltaic sensing element be arranged on upper limit element mounting blocks, the lower limit photovoltaic sensing element be arranged on lower limit element mounting blocks; Described photoelectricity adjustable plate offers vertical dragging track 520, and described upper limit element mounting blocks and lower limit element mounting blocks are elastoplast block, and upper limit element mounting blocks and lower limit element mounting blocks are fastened in dragging track; The sidewall of described lifter plate 22 is installed with upper limit photovoltaic sensing element and lower limit photovoltaic sensing element with the use of sensor block 54.
Composition graphs 1 to Fig. 3, described positioning plate 41 offers a pair installing hole, and a pair installing hole diagonal angle on positioning plate is arranged, and each installing hole internal fixtion is provided with axle sleeve 411; The bottom of described upper layer group plywood 31 be installed with a pair axle sleeve with the use of descending lead 311.
Composition graphs 1 to Fig. 3, described positioning plate 41 is installed with two groups of alignment pins, 412, two groups of alignment pins diagonal angle on positioning plate and arranges, often organize alignment pin and comprise two alignment pins be set up in parallel; Described lower bolster 42 is offered the locating hole with two groups of detent fit.
In practical operation, electronic devices and components a to be processed is positioned on positioning plate 41, and lower bolster 42 is positioned on positioning plate, and the pattern hole on lower bolster 42 is set on electronic devices and components a, and electronic devices and components treat that the terminal of bending projects upwards lower bolster 42.Afterwards, lift drive mechanism 20 drives bending module to be pressed in for 30 times on lower bolster 42, and the terminal of electronic devices and components a is by bending.Afterwards, telescopic cylinder stretches, and drive bend bar 32 to move along slide rail transverse horizontal, the moving direction of bend bar 32 is the wrap direction of electronic devices and components terminal.Afterwards, lift drive mechanism 20 drives bending module 30 rising to reset, and the bending process of electronic devices and components a terminal completes.
Above content is only better embodiment of the present invention, and for those of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, this description should not be construed as limitation of the present invention.
Claims (7)
1. a bending mechanism for electronic devices and components, comprise the frame (10) being provided with horizontal top (11), the lift drive mechanism (20) be arranged in horizontal top, be positioned at be connected below horizontal top and with lift drive mechanism bending module (30), be positioned at the positioning plate (41) below bending module, the lower bolster (42) be positioned on positioning plate; Described lower bolster offers multiple pattern hole, and described electronic devices and components (a) to be set in pattern hole and to be positioned on positioning plate; It is characterized in that:
Described bending module comprises upper layer group plywood (31) and bend bar (32), the bottom of described upper layer group plywood is provided with slide rail, the chute coordinated with slide rail is offered at the top of described bend bar, a gap is offered in the side of described upper layer group plywood, the telescopic cylinder that one is positioned at opening position is installed at the top of upper layer group plywood, the piston rod of telescopic cylinder is provided with a plate (33), connecting plate is positioned at gap, the top of connecting plate is connected with the piston rod of telescopic cylinder, and the bottom of connecting plate is connected with bend bar.
2. the bending mechanism of a kind of electronic devices and components as claimed in claim 1, it is characterized in that: the side of described horizontal top (11) is provided with the stop regulating block (34) to downward-extension, the top that the stretching, extension of described telescopic cylinder can order about connecting plate (33) is against and stops on regulating block.
3. the bending mechanism of a kind of electronic devices and components as claimed in claim 1, is characterized in that: described lift drive mechanism (20) comprises servomotor (21), the screw mandrel connected with servomotor, the lifter plate (22) that is spirally connected with screw mandrel; Described horizontal top (11) is provided with lead (23), the top of lead is installed with installing plate (24), described servomotor is installed on a mounting board, described lifter plate is installed with the fairlead coordinated with lead; Described horizontal top offers through hole, and in through hole, activity plugs joint pin (25), and the top of joint pin is fixedly connected with lifter plate, and the bottom of joint pin is fixedly connected with upper layer group plywood (31).
4. the bending mechanism of a kind of electronic devices and components as claimed in claim 3, it is characterized in that: described horizontal top (11) is provided with spacing photoelectric induction device (50), described spacing photoelectric induction device comprises the photoelectricity installing plate (51) be fixedly mounted in horizontal top, be fixedly mounted on the photoelectricity adjustable plate (52) on photoelectricity installing plate, be arranged on the upper limit element mounting blocks (531) on photoelectricity adjustable plate and lower limit element mounting blocks (532), be arranged on the upper limit photovoltaic sensing element on upper limit element mounting blocks, be arranged on the lower limit photovoltaic sensing element on lower limit element mounting blocks, described photoelectricity adjustable plate is offered vertical dragging track (520), described upper limit element mounting blocks and lower limit element mounting blocks are elastoplast block, and upper limit element mounting blocks and lower limit element mounting blocks are fastened in dragging track, the sidewall of described lifter plate (22) is installed with upper limit photovoltaic sensing element and lower limit photovoltaic sensing element with the use of sensor block (54).
5. the bending mechanism of a kind of electronic devices and components as claimed in claim 1, it is characterized in that: (41) offer a pair installing hole to described positioning plate, a pair installing hole diagonal angle on positioning plate is arranged, and each installing hole internal fixtion is provided with axle sleeve (411); The bottom of described upper layer group plywood (31) be installed with a pair axle sleeve with the use of descending lead (311).
6. the bending mechanism of a kind of electronic devices and components as claimed in claim 1, it is characterized in that: described positioning plate (41) is installed with two groups of alignment pins (412), two groups of alignment pin diagonal angles on positioning plate are arranged, and often organize alignment pin and comprise two alignment pins be set up in parallel; Described lower bolster (42) is offered the locating hole with two groups of detent fit.
7. the bending mechanism of a kind of electronic devices and components as claimed in claim 1, it is characterized in that: described bend bar (32) comprises the bending pressure head (321) terminal of electronic devices and components (a) being carried out to bending, described bending pressure head is electrically connected with electric heater unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510718752.6A CN105234313A (en) | 2015-10-29 | 2015-10-29 | Bending mechanism for electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510718752.6A CN105234313A (en) | 2015-10-29 | 2015-10-29 | Bending mechanism for electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105234313A true CN105234313A (en) | 2016-01-13 |
Family
ID=55032270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510718752.6A Pending CN105234313A (en) | 2015-10-29 | 2015-10-29 | Bending mechanism for electronic components |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105234313A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106583595A (en) * | 2016-12-29 | 2017-04-26 | 无锡明珠增压器制造有限公司 | Coil bending device |
| CN111001730A (en) * | 2019-12-27 | 2020-04-14 | 成都迪锐创橙科技有限公司 | Take buffer's LED lamp pearl pin to bend and use upper portion punching press mechanism |
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| US20100251796A1 (en) * | 2009-04-06 | 2010-10-07 | Denso Corporation | Apparatus and method for shaping electric wire for stator coil of electric rotating machine |
| JP2012243946A (en) * | 2011-05-19 | 2012-12-10 | Renesas Electronics Corp | Apparatus and method for manufacturing semiconductor device |
| CN103990671A (en) * | 2014-03-21 | 2014-08-20 | 银都餐饮设备股份有限公司 | Multifunctional bending machine |
| CN104242019A (en) * | 2014-10-09 | 2014-12-24 | 苏州博众精工科技有限公司 | Flexible flat cable bending mechanism |
| CN204130892U (en) * | 2014-10-09 | 2015-01-28 | 苏州博众精工科技有限公司 | A kind of bender shift mechanism |
| CN204503869U (en) * | 2015-02-16 | 2015-07-29 | 奥美森智能装备股份有限公司 | Bender |
| CN205085324U (en) * | 2015-10-29 | 2016-03-16 | 苏州凡特斯测控科技有限公司 | Electronic components's mechanism of bending |
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2015
- 2015-10-29 CN CN201510718752.6A patent/CN105234313A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100251796A1 (en) * | 2009-04-06 | 2010-10-07 | Denso Corporation | Apparatus and method for shaping electric wire for stator coil of electric rotating machine |
| JP2012243946A (en) * | 2011-05-19 | 2012-12-10 | Renesas Electronics Corp | Apparatus and method for manufacturing semiconductor device |
| CN103990671A (en) * | 2014-03-21 | 2014-08-20 | 银都餐饮设备股份有限公司 | Multifunctional bending machine |
| CN104242019A (en) * | 2014-10-09 | 2014-12-24 | 苏州博众精工科技有限公司 | Flexible flat cable bending mechanism |
| CN204130892U (en) * | 2014-10-09 | 2015-01-28 | 苏州博众精工科技有限公司 | A kind of bender shift mechanism |
| CN204503869U (en) * | 2015-02-16 | 2015-07-29 | 奥美森智能装备股份有限公司 | Bender |
| CN205085324U (en) * | 2015-10-29 | 2016-03-16 | 苏州凡特斯测控科技有限公司 | Electronic components's mechanism of bending |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106583595A (en) * | 2016-12-29 | 2017-04-26 | 无锡明珠增压器制造有限公司 | Coil bending device |
| CN111001730A (en) * | 2019-12-27 | 2020-04-14 | 成都迪锐创橙科技有限公司 | Take buffer's LED lamp pearl pin to bend and use upper portion punching press mechanism |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160113 |