CN105234096A - Semiconductor element testing and sorting equipment - Google Patents
Semiconductor element testing and sorting equipment Download PDFInfo
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- CN105234096A CN105234096A CN201410326747.6A CN201410326747A CN105234096A CN 105234096 A CN105234096 A CN 105234096A CN 201410326747 A CN201410326747 A CN 201410326747A CN 105234096 A CN105234096 A CN 105234096A
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Abstract
The invention discloses semiconductor element testing and sorting equipment. The semiconductor element testing and sorting equipment comprises a semiconductor element sorting device and a semiconductor element testing device, wherein the semiconductor element sorting device and the semiconductor element testing device are designed in a separable mode so that the influence of low-frequency vibration generated when the semiconductor element sorting device operates on the semiconductor element testing device can be reduced. In addition, in order to guarantee that relative position deviation or dislocation between the semiconductor element sorting device and the semiconductor element testing device cannot be caused by the separable design, an auxiliary positioning module and a floating positioning unit are further provided for auxiliary positioning and accurate positioning respectively.
Description
Technical field
The invention relates to a kind of semiconductor equipment; Particularly about a kind of testing classification equipment of semiconductor element.
Background technology
Integrated circuit (IC, Integratedcircuit) production procedure is the division of labor framework of multi-layer, though contemporary semiconductor production process is high and low rank semiconductor element structure install into after, in order to ensure relevant issues such as semiconductor element quality in use, speed, stability and compatibility, usually all need to perform and detect operation with superseded defective products semiconductor element, and the semiconductor element after test is classified process.
General dealer can utilize testing classification equipment to carry out the testing classification of semiconductor element at present, and testing classification equipment mainly can be divided into three major parts, that is: feed zone, test section and classification district, operation workflow first semiconductor element to be measured is moved to feed zone to await orders, sequentially semiconductor element to be measured is moved to test section again to test, to guarantee that electrical and function normally can operate, after semiconductor element to be measured completes test, it is qualified to be complied with again, defective, the classification of resurveying is transferred in classification district, and store and store in district in correspondence, in order to the carrying out of next technique.
But, aforesaid existing class test equipment, current application still has shortcomings, main cause is that classification board in class test equipment and tester table adopt the design of overall engagement type, and the low-frequency vibration that board of classifying in running produces easily is passed to tester table and has a strong impact on tested productivity; And break down or abnormal time the overall classification board that engages and tester table because of inconvenient maintenance; cannot carry out immediately repairing can increase on the contrary shutdown or the standby time operating speed is restricted; likely affect overall test mass or result; more can have influence on the rights and interests of client, thus can expend much time and cost.
Summary of the invention
In order to solve the problem; the present invention proposes a kind of semiconductor element test sorting device; its semiconductor element sorter is adopted separation design and can be reduced low-frequency vibration and be passed to semiconductor element to be tested; and discrete point test sorting device can convenient for maintaining with change the outfit; and break down or abnormal time maintenance personal also can continue immediately and carry out detection operation; therefore the design that testing classification equipment adopts separate type can reduce board because changing or maintenance and shutting down or the standby time, and then reach the object effectively reducing equipment cost and lifting operational security.A main purpose of the present invention is to provide a kind of semiconductor element test sorting device, its testing classification equipment adopts the generation that separation design reduces low-frequency vibration, simultaneously can not off normal or the changing of the relative positions in order to ensure the semiconductor element sorter of discrete point test sorting device and semiconductor device testing apparatus, therefore in the side of semiconductor element sorter, a pair auxiliary positioning module can be installed, in tester table can be slipped into region that auxiliary positioning module encloses, semiconductor device testing apparatus is limited in the fixed position being interval in semiconductor element sorter one distance, semiconductor element sorter and semiconductor device testing apparatus can be avoided to contact with each other, produce the problem of low-frequency vibration, and then impact test yield, when semiconductor element sorter starts action, the floating positioning unit moved in unit that carries again by being installed on transfer semiconductor element to be measured carries out precise positioning, to reach the accuracy of test.
According to above-mentioned object, first the present invention provides a kind of semiconductor element test sorting device, it comprises semiconductor element sorter, there is the first noumenon that stands on ground and be located at absorption module, pan feeding module on the first noumenon, inspect module and transport module, and transport module have connect each other carry move track, carry move unit and picking and placing unit, and semiconductor device testing apparatus, there is the second body standing on ground and the test module be located on the second body, testing arrangement has load bearing seat, test module aligned transmissions module; Wherein, a distance of being separated by between semiconductor element sorter and semiconductor device testing apparatus, semiconductor element sorter generation low-frequency vibration is blocked thus, cannot be passed in the load bearing seat of semiconductor device testing apparatus.
Via semiconductor element test sorting device provided by the present invention; the design of its separate type effectively can reduce to contact with each other between semiconductor element sorter and semiconductor device testing apparatus and produces the problem of low-frequency vibration; and semiconductor element test sorting device can be reduced because changing or maintenance and shutting down or the standby time, therefore can reach significantly lifting operation convenience and the Practical Benefit of tested productivity.
Accompanying drawing explanation
For further illustrating technology contents of the present invention, be described in detail as follows below in conjunction with embodiment and accompanying drawing, wherein:
Fig. 1 is the schematic diagram before the semiconductor element sorter of the semiconductor element test sorting device of first embodiment of the invention and semiconductor device testing apparatus combination.
Fig. 2 is the schematic diagram after the semiconductor element sorter of the semiconductor element test sorting device of first embodiment of the invention and semiconductor device testing apparatus combination.
Fig. 3 is semiconductor element sorter and the rear top view of semiconductor device testing apparatus combination of the semiconductor element test sorting device of first embodiment of the invention.
Fig. 4 is the partial enlarged drawing of the semiconductor element sorter of the semiconductor element test sorting device of Fig. 1.
Fig. 5 is the partial enlarged drawing of the semiconductor device testing apparatus of the semiconductor element test sorting device of Fig. 1.
Fig. 6 is the partial enlarged drawing of the semiconductor device testing apparatus of the semiconductor element test sorting device of second embodiment of the invention.
Fig. 7 is the inside top figure of the semiconductor element test sorting device of third embodiment of the invention.
Detailed description of the invention
The present invention mainly discloses a kind of semiconductor element test sorting device; separation design is adopted in test and the classification of its testing classification equipment; can effectively reduce semiconductor element sorter and semiconductor device testing apparatus to be subject to low-frequency vibration and affect test yield and the testing classification equipment of separation design be more convenient for clean with change the outfit; maintenance personal also can continue immediately and carry out detection operation when a failure occurs it, thus can reduce board because of change or maintenance and shut down or the standby time.Wherein for correlative technology field has, the general principle of testing classification equipment and function, usually know that the knowledgeable can understand, therefore with explanation hereinafter, be only described in detail for the semiconductor element test sorting device feature place relevant with the present invention.In addition, the accompanying drawing in following interior literary composition, not according to the actual complete drafting of relative dimensions, its effect is only expressing the schematic diagram relevant with feature of the present invention.
First, referring to Fig. 1-Fig. 6, is that semiconductor element sorter and the semiconductor device testing apparatus of the semiconductor element test sorting device showing one embodiment of the invention respectively connects forward and backward schematic diagram and partial enlarged drawing.As shown in the figure, in the present embodiment, semiconductor element test sorting device 1 mainly comprises semiconductor element sorter (Handler) 10 and semiconductor element testing arrangement (Tester) 20.Described semiconductor element sorter 10 includes one and stands on the first noumenon 11 on ground and be located at one on the first noumenon 11 and draw module 12, pan feeding module 13, and inspect module 14 and a transport module 16, wherein pan feeding module 13, inspect module 14 and transport module 16 is arranged around absorption module 12.Draw module 12 and include angularly spaced multiple absorption heads 121, and draw module 12 and can carry out spinning motion and make each absorption heads 121 produce angle displacement; Transport module 16 has the track that moves for a year connected each other and within 160, one year, moves the floating positioning unit 1610 of unit 161, one and a picking and placing unit 162, aforesaid semiconductor part classification device 10 also has charging tray 15 correspondence and is arranged at below the picking and placing unit 162 of transport module 16, puts for one or more semiconductor element; Semiconductor device testing apparatus 20 then includes the second body 21 and test module 22 that stands on ground, wherein test module 22 is arranged on the second body 21; In addition, the test module 22 of its semiconductor device testing apparatus 20 also has a plummer 23, and this plummer 23 is more laid with multiple test bench 231, separately, also include a wireless transport module 232 and be electrically coupled to multiple test bench 231, in order to launch the detecting information of multiple test bench 231, it can be testing result.In addition, semiconductor device testing apparatus 20 comprises a cover body 24 further and lives test module 22 for cover cap; And the first noumenon 11 of semiconductor element sorter 10 is all equiped with multiple rubber cushion 110 with absorbing vibration respectively with the bottom of the second body 21 of semiconductor device testing apparatus 20, the low-frequency vibration that semiconductor element sorter 10 or semiconductor device testing apparatus 20 produce effectively can be absorbed.Such as, semiconductor element can be microphone element, if microphone element is subject to the impact of low-frequency vibration, very easily causes the results abnormity of testing electrical property, and test yield is declined.
In addition, in the present embodiment, because semiconductor element sorter 10 and semiconductor device testing apparatus 20 adopt separation design, can not offset from each other or the changing of the relative positions in order to ensure the contraposition between the semiconductor element sorter 10 in the semiconductor element test sorting device 1 of separate type and semiconductor device testing apparatus 20, therefore between semiconductor element sorter 10 and semiconductor device testing apparatus 20, a pair auxiliary positioning module 111 is provided with, its auxiliary positioning module 111 is have the section that is L font respectively, and comprise a first side S2, it is parallel to the first noumenon 11 this side near transport module 16 of semiconductor element sorter 10, and a second side S1, it is perpendicular to first side S2.When the first noumenon 11 of semiconductor element sorter 10 is after a pair auxiliary positioning module 111 is installed in the side of transport module 16, in semiconductor device testing apparatus 20 can be allowed to slip into region that auxiliary positioning module 111 encloses, in other words, second body 21 by auxiliary positioning module in alignment with this first noumenon 11, and semiconductor device testing apparatus 20 is limited in the fixed position with a semiconductor element sorter 10 distance D separately, can be contacted with each other between avoiding device contact, and the low-frequency vibration causing semiconductor element sorter 10 to produce passes to semiconductor device testing apparatus 20, and then affect the test yield of semiconductor element, wherein above-mentioned contained distance D of being separated by equals this width to the second side S1 of auxiliary cover half block 111.Be noted that at this, semiconductor device testing apparatus 20 is after being tentatively limited in auxiliary cover half block 111 fixed position being interval in semiconductor element sorter 10 1 distance D by this, namely represented first time location action, now this can have been removed auxiliary cover half block 111, and when semiconductor element sorter 10 starts action, the floating positioning unit 1610 moved in unit 161 that carries again by being installed on transfer semiconductor element carries out second time location action, as long as described floating positioning unit 1610 provides equipment to have to relate to movement, and the resetting-mechanism during action such as location, provide to carry the picking and placing unit 162 moving unit 161 and position in the present embodiment, reset or buffering, therefore test module 22 moves unit 161 by floating positioning unit 1610 and aims at precise positioning with carrying, so that after making semiconductor element be drawn by picking and placing unit 162, by with carry the operation year moving unit 161 moving that track 160 is connected, the load bearing seat 23 being transferred to test module 22 is tested, the positioning unit 1610 that wherein floats is an air float element be made up of multiple crossed strip, and can be used to carry out buffering and auxiliary positioning, the setting of described crossed strip also can reach effect of reset.
Aforementioned pan feeding module 13, inspect module 14, charging tray 15 is all round absorption module 12 and arranging, and all correspond to draw module 12 absorption heads 121 below.Pan feeding module 13 one end of the present embodiment extends to below absorption heads 121, and the other end is connected to a vibrating disc 17, and vibrating disc 17 produces vibrations by the strength of a percussion mechanism (not shown).Vibrating disc 17 is the disk-like structure that central authorities give prominence to, therefore semiconductor element to be measured fall vibrating disc 17 ring week after, by the vibrations of the percussion mechanism of vibrating disc 17, semiconductor element to be measured can be made to take advantage of a situation pushed to pan feeding module 13 along with the helical guideway of surrounding place side wall.Period can go through a light sensing step, and judge the positive reverse of element under test thus, this is known technology, therefore repeats no more.And in time judging that semiconductor element to be measured is in correct orientation, then this element is continued to send into forward in its pan feeding module 13.Semiconductor element to be measured in pan feeding module 13 is taken advantage of a situation pushed, and absorption heads 121 is after pan feeding module 13 tail end draws semiconductor element to be measured, be moved on the platform in appearance test district by drawing the rotation of module 12, that is aforesaidly inspect module 14.Inspecting the position that module 14 accepts semiconductor element to be measured is positioned at below absorption heads 121 equally, it mainly utilizes camera module such as charge coupled cell (CCD) to check the apparent correctness of semiconductor element to be measured, and whether such as appearance printing word is correct or have indefectible.Once be judged as mistake or flaw, semiconductor element to be measured can be delivered to a recovery area by absorption heads 121.After checking device 14 checks semiconductor element to be measured errorless, just can be transferred to a charging tray 15 by absorption heads 121 again.
Hold above-mentioned, can learn that carrying the picking and placing unit 162 moving unit 16 is pick and place, carry semiconductor element to be measured between semiconductor element sorter 10 and semiconductor device testing apparatus 20, that is picking and placing unit 162 can carry out movement spatially.Specifically, picking and placing unit 162 is movable to the charging tray 15 be positioned at below absorption heads 121 and sentences charging tray 15 of taking, wherein charging tray 15 is responsible for storing multiplely putting down semiconductor element to be measured from absorption heads 121, now carries to move unit 161 and picking and placing unit 162 and be positioned at primary importance A as shown in Figure 2; Afterwards, charging tray 15 can be transported to the load bearing seat 23 of the test module 22 on semiconductor device testing apparatus 20 to carry out element test by picking and placing unit 162 again together with semiconductor element to be measured on it, now carry to move unit 161 and picking and placing unit 162 and be positioned at second place B as shown in Figure 2.In the present embodiment, the test module 22 on semiconductor device testing apparatus 20 is used in particular for testing microphone element, avoids semiconductor element sorter 10 to transmit low-frequency vibration to semiconductor device testing apparatus 20, and affect the test result of microphone element.In addition, as shown in Figure 4, semiconductor element sorter 10 more can comprise a packing device 18: as coil type (tapeandreel) package mechanism, its correspondence is arranged at the below of the absorption heads 121 drawing module 12, carries out testing the subsequent packages step of element to facilitate.
Then, please continue to refer to Fig. 5, the close-up schematic view of the semiconductor device testing apparatus of the semiconductor element test sorting device of the display second embodiment of the present invention.One characteristic of the present embodiment is when continuing to use semiconductor element sorter 10, the type of test module on any conversion semiconductor device testing apparatus 20, as shown the aspect of another semiconductor device testing apparatus 30 in figure, its semiconductor device testing apparatus 30 has a rotary test module 32, it comprises a rotatable platform 33; And rotatable platform 33 is subject to the control of drive unit (such as motor) and is able to rotate, and the upper of rotatable platform 33 is provided with again one or more turntable 331, it rotates separately by the control of drive unit (such as motor) respectively, the direction of rotation of described rotatable platform 33 and one or more turntable 331 can be the same or different, and rotating speed to each other also can be different.In addition, element slot 3310 and an element interface board 3312 (Deviceinterfaceboard is also comprised in each turntable 331, DIB), wherein element interface plate 3312 is generally also called component under test plate (DUTboard), feature board (Performanceboard) or support plate (Loadboard).This element interface plate 3312 (DIB) mainly provides an electric interfaces to be sent to the remainder of semiconductor device testing apparatus 20 by this electric interfaces in order to the signal of the semiconductor element by treating side.
In the present embodiment, be noted that continued to use semiconductor element sorter 10 same with the semiconductor device testing apparatus 30 in the present embodiment be adopt the separation design identical with the first embodiment.Can not offset from each other or the changing of the relative positions in order to ensure the contraposition between semiconductor element sorter 10 and semiconductor device testing apparatus 30, therefore in the side of semiconductor element sorter 10, a pair auxiliary positioning module 111 can be installed, after a pair auxiliary positioning module 111 is installed in the side of semiconductor element sorter 10, in then allow semiconductor device testing apparatus 30 slip into region that auxiliary positioning module 111 encloses, and semiconductor device testing apparatus 30 is limited in the fixed position with a semiconductor element sorter 10 distance D separately, can contact with each other between avoiding device or contact, and the low-frequency vibration causing semiconductor element sorter 10 to produce passes to semiconductor device testing apparatus 20, and then affect the tested productivity of semiconductor device testing apparatus 20, wherein the mode of operation of above-mentioned auxiliary positioning module 111 is same as described by the first embodiment, do not repeat them here.When semiconductor device testing apparatus 30 is after being tentatively limited in auxiliary cover half block 111 fixed position being interval in semiconductor element sorter 10 1 fixed range by this, namely represent first time location action, this to be removed auxiliary cover half block 111; And when semiconductor element sorter 10 starts action, the floating positioning unit 1610 moved in unit 161 that carries again by being installed on transfer semiconductor element carries out second time location action, rotary test module 32 is made to move unit 161 by floating positioning unit 1610 and aim at precise positioning with carrying, so that after making semiconductor element be drawn by picking and placing unit 162, by with carry the operation year moving unit 161 moving that track 160 is connected, be transferred on the element slot 3310 on rotary test module 32 and test.The positioning unit 1610 that wherein floats can be an air float element be made up of multiple crossed strip, and can be used to carry out buffering and auxiliary positioning, the setting of described crossed strip also can reach effect of reset.
And in the present embodiment, pan feeding module 13 in semiconductor element sorter 10, inspect module 14, charging tray 15 is identical with the first embodiment is all arrange round drawing module 12, and all correspond to draw module 12 absorption heads 121 below, namely by drawing module 12, the semiconductor element to be measured tested is sent into a coil type package mechanism 18 (please refer to Fig. 5) afterwards, to facilitate the subsequent packages step of carrying out the semiconductor element tested, aforementioned pan feeding module 13 other end is also connected to the vibrations of a vibrating disc 17 by percussion mechanism, semiconductor element to be measured is made to take advantage of a situation pushed along with the helical guideway of surrounding place side wall, (that is inspecting module 14) on the platform in appearance test district is moved to again by drawing the rotation of module 12, errorless element under test is checked just to be transferred to a charging tray 15 by absorption heads 121 again through checking device 14, afterwards, charging tray 15 can be transported to rotary test module 32 on semiconductor device testing apparatus 30 to carry out element test together with semiconductor element to be measured on it by picking and placing unit 162 again.Therefore semiconductor element sorter of the present invention can integrate with various types of semiconductor device testing apparatus, not only can reduce costs, simplified design, and testing elastic can be increased, in order to the raising of tested productivity.
Then, please continue to refer to Fig. 6, the close-up schematic view of the semiconductor device testing apparatus of the semiconductor element test sorting device of the display third embodiment of the present invention.One characteristic of the present embodiment is when continuing to use semiconductor element sorter 10, the test module 22 of semiconductor device testing apparatus is replaceable is convertible test module, the dynamic test of semiconductor element to be measured can be carried out, as shown in Figure 6, the angle of inclination test that on the semiconductor device testing apparatus 40 of the present embodiment, its convertible test module 42 rotates in front and back and the angle of inclination in left-right rotation are tested.Be noted that the present embodiment and the first embodiment Main Differences are only the conversion of test module at this, therefore repeat no more its detailed operation.
Refer to the inside top figure adopting the semiconductor element test sorting device of separation design that Fig. 7 is another embodiment of the present invention.In the present embodiment, semiconductor element sorter 70 and semiconductor device testing apparatus 20 roughly the same with previous embodiment, Main Differences is, semiconductor element sorter 70 is inner, do not adopt revolving absorption module 12 (referring to Fig. 1), to save space and other unnecessary carrying means.As shown in Figure 7, semiconductor element sorter 70 includes four chip trays 71 (tray) and moves unit 72 in two years.Carry and be displaced between chip tray 71 and test module 22 with moving unit 72 selecting type.Wherein, four chip trays 71 comprise two charging charging tray 711 and two discharging charging trays 712 respectively.Charging charging tray 711 carries not semiconductor element to be measured after tested, the semiconductor element after discharging charging tray 712 then carries after tested.
In the present embodiment, discharging charging tray 712 can comprise qualified and underproof discharging charging tray 712 respectively, in order to differentiate the semiconductor element after tested and defective semiconductor element.Similarly, the present embodiment includes two covers and carries and move unit 72, its be respectively charging carry move unit 721, discharging carries and moves unit 722.Wherein, charging is carried and is moved unit 721 and be responsible for the SEMICONDUCTOR COMPONENT HANDLING to be measured on charging charging tray 711 to the multiple test benches 231 on semiconductor device testing apparatus 20.And to be tested after, discharging is carried and is moved unit 722 and be loaded in discharging charging tray 712 by the semiconductor element on multiple test bench 231.Accordingly, semiconductor element test sorting device of the present invention can adopt semiconductor element sorter 10 or the semiconductor device testing apparatus 20 of different framework according to actual demand, and by the design architecture of separate type, can effectively block semiconductor element low-frequency vibration that sorter produces, be passed to semiconductor device testing apparatus.
In sum, known by aforesaid specification, the semiconductor element sorter of semiconductor element test sorting device provided by the present invention and semiconductor device testing apparatus are the designs of adopting separate type, semiconductor element sorter generation low-frequency vibration is blocked thus, cannot be passed in the load bearing seat of semiconductor device testing apparatus.And discrete point test sorting device can convenient for cleaning with change the outfit, when break down or abnormal time maintenance personal also can continue immediately and carry out detections operation, therefore the design that testing classification equipment adopts separate type can reduce board shuts down or the standby time because changing or keep in repair; Again, can not to offset with aiming between semiconductor device testing apparatus in order to ensure the semiconductor element sorter of discrete point test sorting device or the changing of the relative positions and affect test performance, more provide auxiliary positioning module and floating positioning unit carries out auxiliary positioning and precise positioning respectively, significantly can promote the operation convenience of semiconductor element test sorting device thus, and improve the Practical Benefit of semiconductor element test yield, reduction testing cost.
Although the present invention discloses as above with aforesaid preferred embodiment; so itself and be not used to limit the present invention; anyly have the knack of alike operator; without departing from the spirit and scope of the present invention; when doing a little change and retouching, what therefore scope of patent protection of the present invention must define depending on the right appended by this description is as the criterion.
Claims (10)
1. a semiconductor element test sorting device, it comprises:
Semiconductor element sorter, there is the first noumenon that stands on ground and be located at that one on this first noumenon draws module, a pan feeding module, inspects module and a transport module, and this transport module have connect each other within one year, move track, within one year, move unit and a picking and placing unit; And
Semiconductor element testing arrangement, have the second body standing on ground and the test module be located on this second body, this testing arrangement has a load bearing seat, this test module aims at this transport module;
Wherein, a distance of being separated by between this semiconductor element sorter and this semiconductor device testing apparatus, this semiconductor element sorter generation low-frequency vibration is blocked thus, cannot be passed in this plummer of this semiconductor device testing apparatus.
2. semiconductor element test sorting device according to claim 1, wherein be provided with a pair auxiliary positioning module between this semiconductor element sorter and this semiconductor device testing apparatus, this second body passes through this to auxiliary positioning module in alignment with this first noumenon.
3. semiconductor element test sorting device according to claim 1, wherein moves unit this year and is provided with one and floats positioning unit, this test module by this floating positioning unit with move unit this year and mutually aim at.
4. semiconductor element test sorting device according to claim 2, wherein this has to auxiliary positioning module the section that is L font, and comprises:
One first side, it is parallel to this first noumenon this side near this transport module of this semiconductor element sorter; And
One second side, it is perpendicular to this first side.
5. semiconductor element test sorting device according to claim 1, this distance of being wherein separated by between this second body and this first noumenon equals this width to this second side of auxiliary cover half block.
6. semiconductor element test sorting device according to claim 1, wherein this inspects module is a charge coupled cell.
7. semiconductor element test sorting device according to claim 1, wherein this semiconductor element sorter also has a charging tray, and its correspondence is arranged at below this picking and placing unit, at least semiconductor element storing.
8. semiconductor element test sorting device according to claim 1, wherein this semiconductor element sorter also has a coil type package mechanism, and its correspondence is arranged at below the described absorption heads of this absorption module.
9. semiconductor element test sorting device according to claim 1, wherein this semiconductor device testing apparatus also has a cover body, and its cover cap lives this test module.
10. semiconductor element test sorting device according to claim 1, wherein the bottom of this first noumenon and this second body is equiped with multiple rubber cushion with absorbing vibration respectively.
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| CN201410326747.6A CN105234096B (en) | 2014-07-10 | 2014-07-10 | Semiconductor element test sorting device |
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| CN201410326747.6A CN105234096B (en) | 2014-07-10 | 2014-07-10 | Semiconductor element test sorting device |
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| TWI707727B (en) * | 2018-04-25 | 2020-10-21 | 韓商泰克元股份有限公司 | Test handler for testing electronic component |
| CN114184934A (en) * | 2021-11-29 | 2022-03-15 | 上海御渡半导体科技有限公司 | Device and method for automatically identifying cable in ATE (automatic test equipment) system |
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| CN105234096B (en) | 2017-11-21 |
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