CN105226166B - 一种量子点led结构及封装方法 - Google Patents
一种量子点led结构及封装方法 Download PDFInfo
- Publication number
- CN105226166B CN105226166B CN201510697811.6A CN201510697811A CN105226166B CN 105226166 B CN105226166 B CN 105226166B CN 201510697811 A CN201510697811 A CN 201510697811A CN 105226166 B CN105226166 B CN 105226166B
- Authority
- CN
- China
- Prior art keywords
- quantum dot
- glass substrate
- crystal
- bonding adhesive
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002096 quantum dot Substances 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000012856 packing Methods 0.000 title abstract description 6
- 239000000463 material Substances 0.000 claims abstract description 46
- 239000011521 glass Substances 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 239000000853 adhesive Substances 0.000 claims abstract description 26
- 230000001070 adhesive effect Effects 0.000 claims abstract description 26
- 239000010408 film Substances 0.000 claims abstract description 23
- 238000005538 encapsulation Methods 0.000 claims abstract description 20
- 239000010409 thin film Substances 0.000 claims abstract description 15
- 239000003292 glue Substances 0.000 claims abstract description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 22
- 229920000052 poly(p-xylylene) Polymers 0.000 claims description 10
- 239000000377 silicon dioxide Substances 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 7
- 235000003642 hunger Nutrition 0.000 claims description 7
- 229910052760 oxygen Inorganic materials 0.000 claims description 7
- 239000001301 oxygen Substances 0.000 claims description 7
- 230000037351 starvation Effects 0.000 claims description 7
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 6
- 229910004286 SiNxOy Inorganic materials 0.000 claims description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 229910052681 coesite Inorganic materials 0.000 claims description 6
- 229910052593 corundum Inorganic materials 0.000 claims description 6
- 229910052906 cristobalite Inorganic materials 0.000 claims description 6
- 229910052682 stishovite Inorganic materials 0.000 claims description 6
- 229910052905 tridymite Inorganic materials 0.000 claims description 6
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 6
- 238000010521 absorption reaction Methods 0.000 claims description 5
- 230000004888 barrier function Effects 0.000 claims description 5
- 229920002313 fluoropolymer Polymers 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 5
- 239000007789 gas Substances 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 238000012360 testing method Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims description 2
- 238000002834 transmittance Methods 0.000 claims 1
- 241000218202 Coptis Species 0.000 abstract description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 239000012044 organic layer Substances 0.000 description 3
- 238000012536 packaging technology Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000000295 emission spectrum Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510697811.6A CN105226166B (zh) | 2015-10-23 | 2015-10-23 | 一种量子点led结构及封装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510697811.6A CN105226166B (zh) | 2015-10-23 | 2015-10-23 | 一种量子点led结构及封装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105226166A CN105226166A (zh) | 2016-01-06 |
CN105226166B true CN105226166B (zh) | 2017-11-03 |
Family
ID=54994998
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510697811.6A Active CN105226166B (zh) | 2015-10-23 | 2015-10-23 | 一种量子点led结构及封装方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN105226166B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108447968A (zh) * | 2018-02-06 | 2018-08-24 | 惠州市华星光电技术有限公司 | 一种量子点led及其制备方法 |
CN108461610A (zh) * | 2018-02-06 | 2018-08-28 | 惠州市华星光电技术有限公司 | 一种量子点led和制备方法 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105810796A (zh) * | 2016-04-21 | 2016-07-27 | 深圳市华星光电技术有限公司 | 一种量子点材料玻璃板及其制作方法 |
CN108417698B (zh) * | 2016-07-06 | 2020-09-11 | 苏州星烁纳米科技有限公司 | 量子点封装体及其制备方法、发光装置和显示装置 |
TWI630740B (zh) * | 2016-10-21 | 2018-07-21 | 財團法人工業技術研究院 | 有機電激發光元件 |
CN108932926A (zh) * | 2017-05-23 | 2018-12-04 | Tcl集团股份有限公司 | 一种qled器件及其反向交替驱动模式 |
CN108321284B (zh) * | 2017-12-29 | 2021-02-23 | 华南师范大学 | 一种直下式量子点白光led背光模组及其制备方法 |
US10505082B2 (en) | 2018-02-06 | 2019-12-10 | Huizhou China Star Optoelectronics Technology Co., Ltd. | Quantum dot light emitting diode and manufacturing method |
CN108400223A (zh) * | 2018-05-07 | 2018-08-14 | 深圳技术大学(筹) | 发光二极管封装结构、量子点密封单元及其制备方法 |
CN108735879A (zh) * | 2018-07-26 | 2018-11-02 | 易美芯光(北京)科技有限公司 | 一种含有量子点的smd封装结构 |
CN113659058B (zh) * | 2021-08-20 | 2023-10-20 | 京东方科技集团股份有限公司 | 一种发光器件及其制备方法、显示装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2214218A2 (en) * | 2009-02-02 | 2010-08-04 | Samsung Electronics Co., Ltd. | Light emitting diode unit, display apparatus having the same and manufacturing method of the same |
CN103456865A (zh) * | 2013-09-03 | 2013-12-18 | 易美芯光(北京)科技有限公司 | 一种led封装 |
CN204204899U (zh) * | 2014-11-05 | 2015-03-11 | 创维液晶器件(深圳)有限公司 | 一种高显色性白光免封装led |
CN204289509U (zh) * | 2014-11-20 | 2015-04-22 | Tcl集团股份有限公司 | 量子点led封装结构 |
CN205264743U (zh) * | 2015-10-23 | 2016-05-25 | 易美芯光(北京)科技有限公司 | 一种量子点led结构 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101577300B1 (ko) * | 2008-10-28 | 2015-12-15 | 삼성디스플레이 주식회사 | 양자점을 이용한 백색광 발광다이오드 구조 및 이를 포함하는 백라이트 어셈블리 |
KR20110136676A (ko) * | 2010-06-14 | 2011-12-21 | 삼성엘이디 주식회사 | 양자점을 이용한 발광소자 패키지, 조광 장치 및 디스플레이 장치 |
KR20120067541A (ko) * | 2010-12-16 | 2012-06-26 | 삼성엘이디 주식회사 | 발광다이오드 패키지 및 그 제조방법 |
-
2015
- 2015-10-23 CN CN201510697811.6A patent/CN105226166B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2214218A2 (en) * | 2009-02-02 | 2010-08-04 | Samsung Electronics Co., Ltd. | Light emitting diode unit, display apparatus having the same and manufacturing method of the same |
CN103456865A (zh) * | 2013-09-03 | 2013-12-18 | 易美芯光(北京)科技有限公司 | 一种led封装 |
CN204204899U (zh) * | 2014-11-05 | 2015-03-11 | 创维液晶器件(深圳)有限公司 | 一种高显色性白光免封装led |
CN204289509U (zh) * | 2014-11-20 | 2015-04-22 | Tcl集团股份有限公司 | 量子点led封装结构 |
CN205264743U (zh) * | 2015-10-23 | 2016-05-25 | 易美芯光(北京)科技有限公司 | 一种量子点led结构 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108447968A (zh) * | 2018-02-06 | 2018-08-24 | 惠州市华星光电技术有限公司 | 一种量子点led及其制备方法 |
CN108461610A (zh) * | 2018-02-06 | 2018-08-28 | 惠州市华星光电技术有限公司 | 一种量子点led和制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN105226166A (zh) | 2016-01-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105226166B (zh) | 一种量子点led结构及封装方法 | |
CN104298001B (zh) | 直下式背光模组及其制造方法 | |
JPWO2012144030A1 (ja) | 発光装置及びその製造方法 | |
KR100693463B1 (ko) | 2 이상의 물질을 포함하는 봉지층을 구비한 광 확산 발광다이오드 | |
CN205452347U (zh) | 一种支架型量子点led封装结构 | |
TWI599078B (zh) | 具濕氣阻隔結構之晶片級封裝發光裝置 | |
JP2017531324A (ja) | 発光装置 | |
KR20130132536A (ko) | 얇은 색 변환 층을 갖는 led 기반 조명모듈과 그 제조방법 | |
CN204204899U (zh) | 一种高显色性白光免封装led | |
TW201114070A (en) | Light-emitting device | |
TW200840080A (en) | Surface mount type light emitting diode package device and light emitting element package device | |
CN105720164B (zh) | 一种白光led的制备方法 | |
CN111192868A (zh) | 一种高显指高光效封装体 | |
CN102782891A (zh) | 发光装置 | |
WO2020034390A1 (zh) | Led白光器件及其制备方法、led背光模组 | |
CN108400220A (zh) | 一种微型led显示模块的封装结构 | |
CN107275460A (zh) | 一种单面发光的led器件及封装方法 | |
JP2014086694A (ja) | 発光装置、及び発光装置の製造方法 | |
CN208284497U (zh) | 一种led器件、背光灯条和背光模组 | |
CN205264743U (zh) | 一种量子点led结构 | |
CN107785476B (zh) | 一种白光led用荧光玻璃薄膜及其制备方法 | |
CN209328939U (zh) | 一种全光谱光源封装结构 | |
CN202221781U (zh) | 一种白光led封装结构 | |
CN208873757U (zh) | 一种量子点led封装结构 | |
CN105789416A (zh) | 一种多层立体栅格发光层制备工艺及led发光器件 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180427 Address after: 330096 energy saving Jiangxi low carbon Park 7-1, No. 699 Tianxiang Avenue, Nanchang hi tech Industrial Development Zone, Nanchang, Jiangxi. Patentee after: Nanchang Yimei Photoelectric Technology Co. Ltd. Address before: 100176, No. 4, 2 building, Huilong Sen science and Technology Park, 99 Chuang fourteen street, Daxing District economic and Technological Development Zone, Beijing. Patentee before: Shineon (Beijing) Technology Co., Ltd. |
|
TR01 | Transfer of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A quantum dot LED structure and packaging method Effective date of registration: 20201116 Granted publication date: 20171103 Pledgee: Bank of Communications Ltd. Jiangxi branch Pledgor: NANCHANG YIMEI OPTOELECTRONICS TECHNOLOGY Co.,Ltd. Registration number: Y2020360000092 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |