CN105215856A - A kind of diamond film Jet Polishing method - Google Patents
A kind of diamond film Jet Polishing method Download PDFInfo
- Publication number
- CN105215856A CN105215856A CN201510624519.1A CN201510624519A CN105215856A CN 105215856 A CN105215856 A CN 105215856A CN 201510624519 A CN201510624519 A CN 201510624519A CN 105215856 A CN105215856 A CN 105215856A
- Authority
- CN
- China
- Prior art keywords
- workpiece
- jet
- nozzle
- diamond film
- polishing method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a kind of diamond film Jet Polishing method, abradant jet nozzle and workpiece are in accurate contact condition by the first step; Nozzle can radially move, and second step workpiece electric rotating machine is opened and constantly rotated; In process, workpiece constantly rotates, and change direction immediately after the jet arrival workpiece of ejection at a high speed and leak along nozzle edge, surface of the work is polished under the impact and rubbing action of jet; 3rd step is from abradant jet nozzle abrasive blasting on workpiece, and abradant jet nozzle transverse shifting presses close to workpiece simultaneously, carries out polishing.The present invention adopts abradant jet nozzle and workpiece to be positioned over to rotate on receiver and is in accurate contact condition, change direction immediately after the jet of ejection arrives workpiece at a high speed to leak along nozzle edge, in process, workpiece constantly rotates, nozzle can radially move, surface of the work is polished under the impact and rubbing action of jet, working (machining) efficiency is high, and speed is fast.
Description
Technical field
The present invention relates to Diamond machining techniques field, specifically belong to a kind of diamond film Jet Polishing method.
Background technology
In recent years, low-pressure chemical vapor deposition (CVD) thin diamond membrane technology is developed rapidly, has researched and developed the multiple diamond thin synthetic methods such as such as filament thermal CVD method, microwave plasma CVD technique, DC arc plasma jet CVD method and combustion flame method.According to different deposition process and sedimentary condition, under the deposition velocity of 1 ~ 980 μm/h, thin (thick) film that thickness is 0.5 ~ 1000 μm can be obtained, the diamond membrane with large area that diameter reaches 300mm can be deposited, for the extensive use of diamond film is laid a good foundation.
Because the diamond film of vapour deposition is polycrystalline film, crystal grain is more, and surface relief is uneven, can not directly use in many cases, and thus the skin processing (polishing) of diamond film is absolutely necessary important process step.Because diamond film hardness is high, thickness is thin, bulk strength is low, therefore polishing efficiency is low, and film very easily breaks and damages, and difficulty of processing is larger.
Summary of the invention
For the problems referred to above, the object of this invention is to provide a kind of diamond film Jet Polishing method, be positioned over to rotate on receiver by abradant jet nozzle and workpiece and be in accurate contact condition, change direction immediately after the jet of ejection arrives workpiece at a high speed to leak along nozzle edge, in process, workpiece constantly rotates, and nozzle can radially move, and surface of the work is polished under the impact and rubbing action of jet, working (machining) efficiency is high, and speed is fast.
The technical solution used in the present invention is as follows:
A kind of diamond film Jet Polishing method,
Abradant jet nozzle and workpiece are in accurate contact condition by the first step; Nozzle can radially move,
Second step workpiece electric rotating machine is opened and is constantly rotated; In process, workpiece constantly rotates, and change direction immediately after the jet arrival workpiece of ejection at a high speed and leak along nozzle edge, surface of the work is polished under the impact and rubbing action of jet;
3rd step is from abradant jet nozzle abrasive blasting on workpiece, and abradant jet nozzle transverse shifting presses close to workpiece simultaneously, carries out polishing.
In described second step, workpiece rotary speed is about 2500rpm.
The 3rd described step expulsion pressure 150 ~ 280MPa.
The 3rd described step abrasive material is carborundum granularity 240 ~ 580.
The 3rd described step abrasive material and the envelope-bulk to weight ratio of water are 0.3: 1.
The 3rd described step abradant jet nozzle transverse shifting speed 0.33mm/s, effluxvelocity is about 155m/s.
Compared with the prior art, beneficial effect of the present invention is as follows:
The present invention adopts abradant jet nozzle and workpiece to be positioned over to rotate on receiver and is in accurate contact condition, change direction immediately after the jet of ejection arrives workpiece at a high speed to leak along nozzle edge, in process, workpiece constantly rotates, nozzle can radially move, surface of the work is polished under the impact and rubbing action of jet, working (machining) efficiency is high, and speed is fast.
Detailed description of the invention
A kind of diamond film Jet Polishing method, abradant jet nozzle and workpiece are in accurate contact condition by the first step; Nozzle can radially move,
Second step workpiece electric rotating machine is opened and is constantly rotated; In process, workpiece constantly rotates, and workpiece rotary speed is about 2500rpm.Change direction immediately after the jet of ejection arrives workpiece at a high speed to leak along nozzle edge, surface of the work is polished under the impact and rubbing action of jet;
3rd step is from abradant jet nozzle abrasive blasting on workpiece, and abradant jet nozzle transverse shifting presses close to workpiece, expulsion pressure 150 ~ 280MPa simultaneously; Abrasive material is carborundum granularity 240 ~ 580, and the envelope-bulk to weight ratio of abrasive material and water is 0.3: 1, and abradant jet nozzle transverse shifting speed 0.33mm/s, effluxvelocity is about 155m/s, carries out polishing.
The present invention adopts abradant jet nozzle and workpiece to be positioned over to rotate on receiver and is in accurate contact condition, change direction immediately after the jet of ejection arrives workpiece at a high speed to leak along nozzle edge, in process, workpiece constantly rotates, nozzle can radially move, surface of the work is polished under the impact and rubbing action of jet, working (machining) efficiency is high, and speed is fast.
More than show and describe general principle of the present invention, principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and description just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection domain is defined by appending claims and equivalent thereof.
Claims (6)
1. a diamond film Jet Polishing method, is characterized in that:
Abradant jet nozzle and workpiece are in accurate contact condition by the first step; Nozzle can radially move,
Second step workpiece electric rotating machine is opened and is constantly rotated; In process, workpiece constantly rotates, and surface of the work is polished under the impact and rubbing action of jet;
3rd step is from abradant jet nozzle abrasive blasting on workpiece, and abradant jet nozzle transverse shifting presses close to workpiece simultaneously, carries out polishing.
2. a kind of diamond film Jet Polishing method according to claim 1, is characterized in that: in described second step, workpiece rotary speed is about 2500rpm.
3. a kind of diamond film Jet Polishing method according to claim 2, is characterized in that: the 3rd described step expulsion pressure 150 ~ 280MPa.
4. a kind of diamond film Jet Polishing method according to claim 3, is characterized in that: the 3rd described step abrasive material is carborundum granularity 240 ~ 580.
5. a kind of diamond film Jet Polishing method according to claim 4, is characterized in that: the 3rd described step abrasive material and the envelope-bulk to weight ratio of water are 0.3: 1.
6. a kind of diamond film Jet Polishing method according to claim 5, is characterized in that: the 3rd described step abradant jet nozzle transverse shifting speed 0.33mm/s, effluxvelocity is about 155m/s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510624519.1A CN105215856A (en) | 2015-09-25 | 2015-09-25 | A kind of diamond film Jet Polishing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510624519.1A CN105215856A (en) | 2015-09-25 | 2015-09-25 | A kind of diamond film Jet Polishing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105215856A true CN105215856A (en) | 2016-01-06 |
Family
ID=54985300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510624519.1A Pending CN105215856A (en) | 2015-09-25 | 2015-09-25 | A kind of diamond film Jet Polishing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105215856A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106625282A (en) * | 2017-01-09 | 2017-05-10 | 山东大学 | Abrasive water-jet selective removal method for reaction-sintered silicon carbide surface residues |
| CN109015394A (en) * | 2018-08-10 | 2018-12-18 | 天通控股股份有限公司 | A kind of dry-type processing method of large scale lithium tantalate substrate slice back side roughness |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03141193A (en) * | 1989-10-24 | 1991-06-17 | Fujitsu Ltd | Coating of diamond film |
| CN1947939A (en) * | 2006-11-02 | 2007-04-18 | 大连理工大学 | Processing method for flattening large dimension diamond diaphragm |
| CN104561925A (en) * | 2015-01-20 | 2015-04-29 | 太原理工大学 | Method for preparing self-supporting diamond film |
-
2015
- 2015-09-25 CN CN201510624519.1A patent/CN105215856A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03141193A (en) * | 1989-10-24 | 1991-06-17 | Fujitsu Ltd | Coating of diamond film |
| CN1947939A (en) * | 2006-11-02 | 2007-04-18 | 大连理工大学 | Processing method for flattening large dimension diamond diaphragm |
| CN104561925A (en) * | 2015-01-20 | 2015-04-29 | 太原理工大学 | Method for preparing self-supporting diamond film |
Non-Patent Citations (1)
| Title |
|---|
| 郭钟宁: "CVD金刚石膜抛光技术", 《工具技术》 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106625282A (en) * | 2017-01-09 | 2017-05-10 | 山东大学 | Abrasive water-jet selective removal method for reaction-sintered silicon carbide surface residues |
| CN106625282B (en) * | 2017-01-09 | 2019-02-22 | 山东大学 | The abrasive water-jet selective removal method of silicon carbide reaction-sintered surface residue |
| CN109015394A (en) * | 2018-08-10 | 2018-12-18 | 天通控股股份有限公司 | A kind of dry-type processing method of large scale lithium tantalate substrate slice back side roughness |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106217666B (en) | The water cutter device and method of cutting sapphire | |
| CN108500849A (en) | A kind of coated cutting tool aftertreatment technology | |
| CN103990815A (en) | Ductile mode machining methods for hard and brittle components of plasma processing apparatuses | |
| US20130157067A1 (en) | Plasma-resistant member and method for regenerating same | |
| CN102729153A (en) | Polishing method by blasting and nozzle structure for blasting apparatus for use in the polishing method | |
| CN105834918A (en) | Method for enhancing adhesion of low-temperature ceramic coating | |
| CN105215856A (en) | A kind of diamond film Jet Polishing method | |
| CN103447968B (en) | A kind of shot-peening processing technology | |
| CN103495928B (en) | A kind of processing method improving Sapphire Substrate sheet surface quality and product yield | |
| US20170028571A1 (en) | Knife and blade finishing method | |
| CN104385116A (en) | Polishing method of SiC semiconductor material | |
| CN102632447B (en) | Machining method of target surface | |
| CN102029570B (en) | Method and device for machining tungsten and titanium alloy target material | |
| CN206066726U (en) | The water cutter device of cutting sapphire | |
| CN103057206B (en) | A kind of super wear-resistant ceramic alloy coat scraper and manufacture method thereof | |
| US20160130694A1 (en) | Tin/tic coating and method for manufacturing the tin/tic coating and articles so coated | |
| CN103451696B (en) | A kind of stainless steel pipe with nickel layer | |
| CN105500120A (en) | Wafer grinding control method | |
| CN204565852U (en) | Nickel corollary equipment is removed in a kind of electroplated diamond line of cut polishing | |
| TWI768329B (en) | Physical dry surface treatment method of semiconductor wafer and composition for surface treatment thereof | |
| TW201249600A (en) | Processing method for silicon target surface | |
| CN103909475A (en) | Dry-type processing method of reverse side roughness of large-size sapphire substrate slice | |
| CN102528645A (en) | Double-sided polishing method for large-sized ultra-thin quartz glass sheets | |
| CN204339540U (en) | A kind of resin copper dish abrasive disk | |
| JP2020102481A5 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160106 |
|
| RJ01 | Rejection of invention patent application after publication |