CN105206550B - Reaction chamber and semiconductor equipment - Google Patents
Reaction chamber and semiconductor equipment Download PDFInfo
- Publication number
- CN105206550B CN105206550B CN201410279294.6A CN201410279294A CN105206550B CN 105206550 B CN105206550 B CN 105206550B CN 201410279294 A CN201410279294 A CN 201410279294A CN 105206550 B CN105206550 B CN 105206550B
- Authority
- CN
- China
- Prior art keywords
- reflecting plate
- cavity
- sensor
- reaction chamber
- arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The present invention provides a kind of reaction chamber, the reaction chamber includes cavity and position detecting mechanism, the position detecting mechanism includes sensor and reflecting plate, the sensor and the reflecting plate are separately positioned on the bottom wall and roof of the cavity, the sensor includes light emitting part and light receiving piece, the receiving plane of the light receiving piece is parallel with the reflecting surface of the reflecting plate, the reflecting plate is for reflecting the light that the light emitting part is emitted, the light receiving piece can receive the light that the reflecting plate is reflected, between the reflecting plate and the roof of the cavity, default angle is each formed between the receiving plane of the light receiving piece and the bottom wall of the cavity.Correspondingly, the present invention also provides a kind of semiconductor equipments.Compared with prior art, whether there is or not accuracys when substrate to increase in present invention detection reaction chamber.
Description
Technical field
The present invention relates to semiconductor equipment manufacturing technology fields, and in particular to a kind of reaction chamber and including the chamber half
Conductor device.
Background technology
SOG (silicon on glass) refers to the silicon materials on glass, it is to make full use of the good light transmission of glass
Property, a kind of special SOI (silicon on for preparing of electrical insulating property and chemical stability and the good electric property of silicon
Insulator) material.It uses glass that not only there is good electric property as SOG materials prepared by substrate material, and has
Special photoelectric properties are widely used in the optoelectronic devices such as solar cell and plate of flat liquid crystal display.
Chip architecture is detected the presence of to be widely used in semiconductor equipment and highly important structure in semiconductor equipment.Half
The moment needs to detect chip current location conductor device in the process of running, is acted in next step to determine.Mainly need check bit
It is equipped between loading chamaer and transmission cavity, between transmission cavity and preheating cavity, between transmission cavity and process cavity, passes through the detection of these points
Can be determined that chip is presently in position, to carry out next step operation.
The method for detecting the presence of piece in the prior art mainly installs sensor and reflecting plate, as shown in Figure 1, in cavity 10
On be correspondingly arranged on sensor 20 and reflecting plate 30, the light emitting part of sensor 20 emits light, in sensor 20 and reflecting plate
Between 30 without substrate in the case of, when incident ray 40 by reflecting plate 30 reflection after by sensor 20 light receiving piece receive,
And the light value of the reflection light 50 received is more than the preset value of sensor 20, so as to judge sensor 20 and reflecting plate 30 it
Between without substrate.As shown in Fig. 2, the case where being provided with substrate (substrate is silicon chip 60) between sensor 20 and reflecting plate 30
Under, when the incident ray 40 that the light emitting part of sensor 20 emits is blocked by silicon chip 60, without reflection light 50 or reflected light
Line 50 is seldom, and the light value that the light receiving piece of sensor 20 receives at this time is less than preset value, so as to judge sensor 20 with
It is provided with substrate between reflecting plate 30.
But this method is only applicable to the case where substrate is silicon chip, as shown in figure 3, when substrate is SOG pieces 70, by
In SOG materials basic structure mainly by top layer silicon, intermediate SiO2Insulating layer and glass substrate composition, therefore, sensor
20 incident ray 40 reflected can be mapped in the glass substrate of SOG pieces 70, and SOG pieces 70 can significantly reflect into
Light is penetrated, causes 50 light value of reflection light that the light receiving piece of sensor 20 receives to be more than preset value, to mistakenly judge
Without substrate between sensor and reflecting plate, and then influence production efficiency.
Invention content
The purpose of the present invention is to provide a kind of reaction chamber and semiconductor equipments, accurately to judge to be in reaction chamber
It is no to be provided with substrate.
To achieve the goals above, the present invention provides a kind of reaction chamber, which includes cavity and position detection
Mechanism, the position detecting mechanism include sensor and reflecting plate, and the sensor and the reflecting plate are separately positioned on the chamber
On the bottom wall and roof of body, the sensor includes light emitting part and light receiving piece, the receiving plane of the light receiving piece with it is described
The reflecting surface of reflecting plate is parallel, and the reflecting plate is for reflecting the light that the light emitting part is emitted, the light receiving piece energy
Enough receive the light that the reflecting plate is reflected, between the reflecting plate and the roof of the cavity, the light receiving piece connects
Default angle is each formed between receipts face and the bottom wall of the cavity.
Preferably, the default angle (0 °, 10 °] in range.
Preferably, it is both provided between the sensor and the cavity and between the reflecting plate and the cavity
Support component, the support component being arranged between the sensor and the cavity make the receiving plane of the light receiving piece with
The default angle is formed between the bottom wall of the cavity, the support group being arranged between the reflecting plate and the cavity
Part makes to form the default angle between the reflecting plate and the roof of the cavity.
Preferably, the support component includes fixed part and the interconnecting piece that is connected with the fixed part, the fixed part setting
On the cavity, the sensor is arranged on the interconnecting piece of the support component between the sensor and the cavity, described
Reflecting plate is arranged on the interconnecting piece of the support component between the reflecting plate and the cavity, the fixed part and the interconnecting piece
Between be formed with the default angle.
Preferably, the fixed part and the interconnecting piece are hinged.
Preferably, the support component further includes adjustment portion, and the adjustment portion is connected with one end of the fixed part, described
The other end of fixed part and one end of the interconnecting piece are hinged, and the other end of the interconnecting piece can be moved along the adjustment portion.
Preferably, it is provided with scale mark in the adjustment portion.
Preferably, the adjustment portion is hinged with the fixed part, and being provided between the adjustment portion and the interconnecting piece can
The fixing piece of dismounting.
Preferably, the fixed part includes the first fixed arm, the second fixed arm and third fixed arm, and the interconnecting piece includes
First linking arm, the second linking arm, third linking arm and the 4th linking arm, the third fixed arm are connected to described first and fix
Between one end of arm and one end of second fixed arm, the third linking arm be connected to one end of first linking arm with
Between one end of second linking arm, the 4th linking arm is connected to the other end and described second of first linking arm
Between the other end of linking arm, and the 4th linking arm is hinged on the other end and the institute of first fixed arm by connecting pin
Between the other end for stating the second fixed arm, the adjustment portion is fixed on the third fixed arm, is set on the third linking arm
It is equipped with mounting hole, the adjustment portion passes through the mounting hole.
Correspondingly, the present invention also provides a kind of semiconductor equipments, including reaction chamber, wherein the reaction chamber is this
The above-mentioned semiconductor equipment provided is provided.
In the present invention, between the reflecting plate and the roof of cavity, the receiving plane of the light receiving piece of the sensor and
Default angle is each formed between the bottom wall of cavity, when between the sensor and the reflecting plate without substrate, the sensing
The light receiving piece of device can receive reflection light, to judge between the sensor and the reflecting plate without substrate；Work as institute
It states when being provided with substrate between sensor and the reflecting plate, the light receiving piece of the sensor does not receive reflection light, from
And judge there is substrate between the sensor and the reflecting plate.The present invention to being not limited to the material of substrate when the detection of substrate,
It is applicable not only to the detection to silicon chip, is also applied for the detection to SOG pieces, compared with prior art, improves substrate detection
Accuracy increases the scope of application.
Description of the drawings
Attached drawing is to be used to provide further understanding of the present invention, an and part for constitution instruction, with following tool
Body embodiment is used to explain the present invention together, but is not construed as limiting the invention.In the accompanying drawings：
It is shown in FIG. 1 be in prior art middle chamber without substrate when detects schematic diagram；
Shown in Fig. 2 is detects schematic diagram when silicon chip being arranged in prior art middle chamber；
Shown in Fig. 3 is detects schematic diagram when SOG pieces being arranged in prior art middle chamber；
It is shown in Fig. 4 be in embodiment middle chamber provided by the present invention without substrate when detects schematic diagram；
Shown in fig. 5 is detects schematic diagram when being provided with substrate in embodiment middle chamber provided by the present invention；
Shown in fig. 6 is that the side of support component provided by the present invention attempts；
Shown in Fig. 7 is the vertical view of support component provided by the present invention.
Reference sign
10, cavity；20：Sensor；30：Reflecting plate；40：Incident ray；50：Reflection light；60：Silicon chip；70：SOG pieces；
80：Support component；81：Fixed part；82：Interconnecting piece；83：Adjustment portion；84：Dismountable fixing piece；85：Connecting pin；811：The
One fixed arm；812：Second fixed arm；813：Third fixed arm；821：First linking arm：822：Second linking arm；823：Third
Linking arm；824：4th linking arm；90：Substrate.
Specific implementation mode
The specific implementation mode of the present invention is described in detail below in conjunction with attached drawing.It should be understood that this place is retouched
The specific implementation mode stated is merely to illustrate and explain the present invention, and is not intended to restrict the invention.
As an aspect of of the present present invention, a kind of reaction chamber is provided, which includes cavity 10 and position detection machine
Structure, as shown in Figure 3 and Figure 4, the position detecting mechanism include sensor 20 and reflecting plate 30, and sensor 20 and reflecting plate 30 are distinguished
It is arranged on the bottom wall and roof of cavity 10, sensor 20 includes light emitting part and light receiving piece, the reception of the light receiving piece
Face is parallel with the reflecting surface of reflecting plate 30, and reflecting plate 30 is described for reflecting the incident ray 40 that the light emitting part is emitted
Light receiving piece can receive the light that reflecting plate 30 is reflected, between reflecting plate 30 and the roof of cavity 10, the light receiving piece
Receiving plane and the bottom wall of cavity 10 between be each formed with default angle.
In the present invention, between reflecting plate 30 and the roof of cavity 10, the receiving plane of the light receiving piece and cavity 10
Default angle is each formed between bottom wall, as shown in figure 4, when between sensor 20 and reflecting plate 30 without substrate, sensor 20
The incident ray 40 that is emitted of light emitting part by the reflection of reflecting plate 30, reflection light 50 can connect by the light receiving piece
It receives, to judge between sensor 20 and reflecting plate 30 without substrate；As shown in figure 5, when being set between sensor 20 and reflecting plate 30
When being equipped with substrate 90 (substrate 90 can be silicon chip, or SOG pieces), incidence that the light emitting part of sensor 20 is emitted
There are certain angles between light 40 and reflecting plate 30 so that there are certain angles between reflection light 50 and incident ray 40
Degree, thus the position of the light receiving piece is deviated from, cause the light receiving piece not receive reflection light 50, to judge to pass
Without substrate between sensor 20 and reflecting plate 30.Compared with prior art, the accuracy for improving substrate detection, is applicable not only to pair
The detection of silicon chip is also applied for the detection to SOG pieces.
The light emitting part and light receiving piece of sensor 20 can be arranged in the same detection probe, it is to be understood that
The direction of the launch of the light emitting part can be parallel to reflecting plate perpendicular to reflecting plate 30, the receiving plane of the light receiving piece
30, so that the incident ray 40 that light emitting part is emitted, after the reflection of reflecting plate 30, reflection light 50 can be by institute
Light receiving piece is stated to receive.
In the present invention, described in being determined according to experiment " predetermined angle ", as long as the light receiving piece is allow to exist
Reflection light 50 is not received in the case of setting substrate 90, reflection light 50 is received in the case of no substrate 90.
Preferably, the default angle (0 °, 10 °] in range.
As the present invention a kind of specific implementation mode, as shown in Figure 4 and Figure 5, between sensor 20 and cavity 10 and
Support component 80 is both provided between reflecting plate 30 and cavity 10, the support component 80 being arranged between sensor 20 and cavity 10
Make to form the default angle between the receiving plane of the light receiving piece and the bottom wall of cavity 10, be arranged in reflecting plate 30 and cavity
Support component 80 between 10 makes to form the default angle between reflecting plate 30 and the roof of cavity 10.
Further, as shown in fig. 6, support component 80 may include fixed part 81 and the company that is connected with the fixed part 81
Socket part 82, fixed part 81 are arranged on cavity 10, and the support component between the sensor 20 and cavity 10 is arranged in sensor 20
On 80 interconnecting piece 82, on the interconnecting piece 82 for the support component 80 that reflecting plate 30 is arranged between the reflecting plate 30 and cavity 10,
Default angle is formed between fixed part 81 and interconnecting piece 82, so that the bottom of the receiving plane of the light receiving piece and chamber 10
The default angle is formed between wall, and the default angle is formed between reflecting plate 30 and the roof of chamber 10.
Connection type of the present invention between fixed part 81 and interconnecting piece 82 is not especially limited, for the ease of to fixed part
Angle between 81 and interconnecting piece 82 is adjusted, it is preferable that as shown in fig. 6, fixed part 81 is hinged with interconnecting piece 82.
Further, as shown in fig. 6, support component 80 can also include adjustment portion 83, adjustment portion 83 and fixed part 81
One end be connected, the other end of fixed part 81 and one end of interconnecting piece 82 are hinged, and the other end of interconnecting piece 82 can be along adjustment portion
83 movements, to according to location determination interconnecting piece 82 of the other end in adjustment portion 83 of interconnecting piece 82 and between fixed part 81
Angle, to form the default angle.
Further, as shown in fig. 6, being provided with scale mark in adjustment portion 83, the scale mark and interconnecting piece 82 and
Angle between fixed part 81 is corresponding, to which the angle accurately between interconnecting piece 82 and fixed part 81 is adjusted.
Further, adjustment portion 83 is hinged with fixed part 81, is provided between adjustment portion 83 and interconnecting piece 82 detachable
Fixing piece 84 (e.g., screw-nut).In practical operation, the other end of interconnecting piece 82 is moved along adjustment portion 83, meanwhile, it passes
The light emitting part of sensor 20 works as sensor towards the substrate transmitting incident ray 40 being arranged between sensor 20 and reflecting plate 30
When 20 light receiving piece receives reflection light 50, interconnecting piece 82 and adjustment portion 83 are fixed by fixing piece 81.It should be understood that
It is that (support component 80 being arranged between sensor 20 and cavity 10 and setting are in reflecting plate 30 and chamber for two support components 80
Support component 80 between body 10) interconnecting piece 82 it is identical as the angle between fixed part 81 so that when sensor 20 with
When between reflecting plate 30 without substrate, the light that the light emitting part of sensor 30 is emitted, can be with after the reflection of reflecting plate 30
It is received by the light receiving piece.
Sensor 20 is generally arranged at the outer wall of cavity 10, in order to install, that is, sets the fixed part 81 of support component 80
It sets on the outer wall of cavity 10, support component 80 blocks light in order to prevent, further, as shown in fig. 7, fixed part
81 include the first fixed arm 811, the second fixed arm 812 and third fixed arm 813, and interconnecting piece 82 includes the first linking arm 821, the
Two linking arms 822, third linking arm 823 and the 4th linking arm 824, third fixed arm 813 are connected to the one of the first fixed arm 811
Between end and one end of the second fixed arm 812, one end that third linking arm 823 is connected to the first linking arm 821 is connect with second
Between one end of arm 822, the 4th linking arm 824 be connected to the first linking arm 821 the other end and the second linking arm 822 it is another
Between end, and the 4th linking arm 824 is hinged on the other end and the second fixed arm 812 of the first fixed arm 811 by connecting pin 85
The other end between, adjustment portion 83 is fixed on third fixed arm 813, and mounting hole, adjustment portion are provided on third linking arm 823
83 pass through the mounting hole.First linking arm of the support component 80 that sensor 20 is arranged between sensor 20 and cavity 10
821 and second on linking arm 822, the first connection of the support component 80 that reflecting plate 30 is arranged between reflecting plate 30 and cavity 10
On arm 821 and the second linking arm 822.Fixed part 81 and interconnecting piece 82 are all formed as loop configuration, consequently facilitating light is sensing
It is propagated between device 20 and reflecting plate 30, improves the accuracy of detection.
It is understood that the 4th linking arm 824 is connected to the other end and the second linking arm 822 of the first linking arm 821
The other end between, to be formed as one end of interconnecting piece 82；Third linking arm 823 be connected to one end of the first linking arm 821 with
Between one end of second linking arm 822, to be formed as the other end of interconnecting piece 82；Third linking arm 823 is connected to the first connection
Between one end of arm 821 and one end of the second linking arm 822, to be formed as one end of fixed part 81；First fixed arm 811 it is another
The other end of fixed part 81 is collectively formed in the other end of one end and the second fixed arm 812.
It is the description to reaction chamber provided by the present invention above, it can be seen that between reflecting plate and the roof of cavity,
Default angle is each formed between the receiving plane of light receiving piece and the bottom wall of cavity, when between sensor and reflecting plate without substrate
When, the light receiving piece of sensor can receive reflection light, to judge between sensor and reflecting plate without substrate；Work as sensing
When being provided with substrate between device and reflecting plate, the light receiving piece of sensor does not receive reflection light, to judge sensor with
There is substrate between reflecting plate.It is unrelated with the material of substrate when the present invention is to the detection of substrate, it is applicable not only to the detection to silicon chip,
It is also applied for the detection to SOG pieces, compared with prior art, the accuracy of substrate detection is improved, increases the scope of application.
As another aspect of the present invention, a kind of semiconductor equipment, including above-mentioned reaction chamber provided by the present invention are provided
Room, specifically, the reaction chamber can be loading chamaer, preheating cavity or process cavity etc., by detecting substrate in reaction chamber
Detection determine substrate position.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, however the present invention is not limited thereto.For those skilled in the art, in the essence for not departing from the present invention
In the case of refreshing and essence, various changes and modifications can be made therein, these variations and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a kind of reaction chamber, which includes cavity and position detecting mechanism, which includes sensor
And reflecting plate, the sensor and the reflecting plate are separately positioned on the bottom wall and roof of the cavity, the sensor packet
Light emitting part and light receiving piece are included, the receiving plane of the light receiving piece is parallel with the reflecting surface of the reflecting plate, the reflecting plate
The light emitted for reflecting the light emitting part, the light receiving piece can receive the light that the reflecting plate is reflected,
It is characterized in that, between the reflecting plate and the roof of the cavity, the bottom of the receiving plane of the light receiving piece and the cavity
Default angle is each formed between wall；
When the light receiving piece of the sensor can receive reflection light, without base between the sensor and the reflecting plate
Piece；When the light receiving piece of the sensor does not receive reflection light, there is substrate between the sensor and the reflecting plate.
2. reaction chamber according to claim 1, which is characterized in that the default angle (0 °, 10 °] in range.
3. reaction chamber according to claim 1, which is characterized in that between the sensor and the cavity, Yi Jisuo
It states and is both provided with support component between reflecting plate and the cavity, the branch being arranged between the sensor and the cavity
Support component makes to form the default angle between the receiving plane of the light receiving piece and the bottom wall of the cavity, and setting is described anti-
The support component penetrated between plate and the cavity makes to be formed between the reflecting plate and the roof of the cavity described default
Angle.
4. reaction chamber according to claim 3, which is characterized in that the support component includes fixed part and fixed with this
The connected interconnecting piece in portion, the fixed part are arranged on the cavity, and the sensor is arranged in the sensor and the cavity
Between support component interconnecting piece on, the company of the support component between the reflecting plate and the cavity is arranged in the reflecting plate
In socket part, the default angle is formed between the fixed part and the interconnecting piece.
5. reaction chamber according to claim 4, which is characterized in that the fixed part is hinged with the interconnecting piece.
6. reaction chamber according to claim 4, which is characterized in that the support component further includes adjustment portion, the tune
Section portion is connected with one end of the fixed part, and the other end of the fixed part and one end of the interconnecting piece are hinged, the connection
The other end in portion can be moved along the adjustment portion.
7. reaction chamber according to claim 6, which is characterized in that be provided with scale mark in the adjustment portion.
8. reaction chamber according to claim 6, which is characterized in that the adjustment portion is hinged with the fixed part, described
Dismountable fixing piece is provided between adjustment portion and the interconnecting piece.
9. reaction chamber according to claim 6, which is characterized in that the fixed part is consolidated including the first fixed arm, second
Fixed arm and third fixed arm, the interconnecting piece include the first linking arm, the second linking arm, third linking arm and the 4th linking arm,
The third fixed arm is connected between one end of first fixed arm and one end of second fixed arm, and the third connects
It connects arm to be connected between one end of first linking arm and one end of second linking arm, the 4th linking arm is connected to
Between the other end of first linking arm and the other end of second linking arm, and the 4th linking arm passes through connecting pin
It is hinged between the other end of first fixed arm and the other end of second fixed arm, the adjustment portion is fixed on described
On third fixed arm, mounting hole is provided on the third linking arm, the adjustment portion passes through the mounting hole.
10. a kind of semiconductor equipment, including reaction chamber, which is characterized in that the reaction chamber is to appoint in claim 1 to 9
Reaction chamber described in meaning one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410279294.6A CN105206550B (en) | 2014-06-20 | 2014-06-20 | Reaction chamber and semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410279294.6A CN105206550B (en) | 2014-06-20 | 2014-06-20 | Reaction chamber and semiconductor equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105206550A CN105206550A (en) | 2015-12-30 |
| CN105206550B true CN105206550B (en) | 2018-08-24 |
Family
ID=54954140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410279294.6A Active CN105206550B (en) | 2014-06-20 | 2014-06-20 | Reaction chamber and semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105206550B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110752168B (en) * | 2019-09-24 | 2022-08-16 | 北京北方华创微电子装备有限公司 | Wafer detection device, wafer transmission system and wafer detection method |
| CN113113329A (en) * | 2021-03-05 | 2021-07-13 | 北京北方华创微电子装备有限公司 | Epitaxial equipment monitoring method and corresponding epitaxial equipment monitoring device |
| CN113161275B (en) * | 2021-04-13 | 2022-12-20 | 上海广川科技有限公司 | Semiconductor device with a plurality of semiconductor chips |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1669120A (en) * | 2002-06-21 | 2005-09-14 | 应用材料有限公司 | Angled sensors for detecting substrates |
| CN102171806A (en) * | 2008-10-01 | 2011-08-31 | 川崎重工业株式会社 | Substrate detection device and method |
| CN203085578U (en) * | 2013-01-25 | 2013-07-24 | 苏州富德莱光电科技有限公司 | Angle-adjustable folding photovoltaic tripod |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8099190B2 (en) * | 2007-06-22 | 2012-01-17 | Asm International N.V. | Apparatus and method for transferring two or more wafers whereby the positions of the wafers can be measured |
-
2014
- 2014-06-20 CN CN201410279294.6A patent/CN105206550B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1669120A (en) * | 2002-06-21 | 2005-09-14 | 应用材料有限公司 | Angled sensors for detecting substrates |
| CN102171806A (en) * | 2008-10-01 | 2011-08-31 | 川崎重工业株式会社 | Substrate detection device and method |
| CN203085578U (en) * | 2013-01-25 | 2013-07-24 | 苏州富德莱光电科技有限公司 | Angle-adjustable folding photovoltaic tripod |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105206550A (en) | 2015-12-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105206550B (en) | Reaction chamber and semiconductor equipment | |
| CN103119420B (en) | Refractive index measuring device, and refractive index measuring method | |
| CN103698029B (en) | The fixing device of a kind of thermocouple and temperature measuring equipment | |
| WO2019024730A1 (en) | Detector assembly, detector, and laser ranging system | |
| CN101846616A (en) | Device and method for automatically detecting incident angle in elliptical polarization measuring system | |
| US20100051835A1 (en) | Thin substrate pitch measurement equipment | |
| US10379300B2 (en) | Method for assembling optical module | |
| JP2019516980A5 (en) | ||
| CN105185722A (en) | Wafer holding device | |
| CN105717432A (en) | Partial discharge positioning device and method | |
| CN110455250A (en) | A kind of detection door of construction material flatness | |
| US8750656B2 (en) | Optical adapter and optical signal transmission device including same | |
| WO2004072585A3 (en) | Wafer bond strength evaluation apparatus | |
| CN105305163B (en) | Floating junction device and its manufacturing method | |
| CN209706769U (en) | Shaft coupling coaxality measuring mechanism | |
| KR101173686B1 (en) | Apparatus For Sensing Existence Or Chop of Substrates For Flat Panel Display In a Cassette | |
| TWI736972B (en) | Angle detecting device and angle detecting method | |
| CN208621655U (en) | Micro-strip device test fixture | |
| CN105806847A (en) | Detection device of substrate | |
| CN101024446B (en) | Non-contacting type edge-detecting device and using method | |
| US11927603B2 (en) | Probes that define retroreflectors, probe systems that include the probes, and methods of utilizing the probes | |
| CN204009238U (en) | A kind of dual sensor flame detection probe spectroscope module | |
| CN106653670B (en) | A kind of electro-static sucker device | |
| CN104589246B (en) | Quick inspection tooling for CMM detection | |
| WO2023279514A1 (en) | Measurement device, measurement compensation system, measurement method, and measurement compensation method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 100176 No. 8 Wenchang Avenue, Beijing economic and Technological Development Zone Applicant after: Beijing North China microelectronics equipment Co Ltd Address before: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Applicant before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |