CN105196482A - Mold for bottom cover of notebook computer - Google Patents
Mold for bottom cover of notebook computer Download PDFInfo
- Publication number
- CN105196482A CN105196482A CN201510689671.8A CN201510689671A CN105196482A CN 105196482 A CN105196482 A CN 105196482A CN 201510689671 A CN201510689671 A CN 201510689671A CN 105196482 A CN105196482 A CN 105196482A
- Authority
- CN
- China
- Prior art keywords
- plate
- cope match
- lower bolster
- notebook computer
- bottom cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2602—Mould construction elements
- B29C45/2606—Guiding or centering means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2673—Moulds with exchangeable mould parts, e.g. cassette moulds
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention relates to the technical field of manufacturing of molds for bottom covers of notebook computers, in particular to a mold for a bottom cover of a notebook computer. The mold comprises an upper mold plate and a lower mold plate, wherein mold kernels are arranged on the surfaces, contacting each other, of the upper mold plate and the lower mold plate respectively; a hot runner is arranged on the lower mold plate; a clamping plate, an ejection plate, a cushion plate, a heat flow plate, a bottom plate and a heat insulation plate are also sequentially arranged right below the lower mold plate from top to bottom; an ejection oil cylinder is also arranged in the cushion plate; an ejection rod of the ejection oil cylinder is connected with the ejection plate; a lock plate is also arranged on the same side of the upper mold plate and the lower mold plate; two ends of the lock plate are fixedly connected with the upper mold plate and the lower mold plate; an opening/closing counter is also arranged between the upper mold plate and the lower mold plate. According to the mold for the bottom cover of the notebook computer, lock blocks are arranged on the upper mold plate and the lower mold plate, so that the upper mold plate and the lower mold plate can be fixed in a working process, and cannot deviate in position.
Description
Technical field
The present invention relates to notebook computer bottom cover manufacturing technology field, particularly relate to a kind of notebook computer bottom cover mould.
Background technology
In existing notebook computer bottom cover mould, between cope match-plate pattern and lower bolster when Operating In Persistent Current Mode, there is the inaccurate situation of closed position possibly.Especially because bolster weight is larger when bolster is ejected by cylinder rod, the stressed appearance of cylinder rod bends, be easy to occur misplacing between cope match-plate pattern and lower bolster, the quality of product is affected possibly after dislocation, or shaping product is not easy to take out, notebook computer bottom cover also can be caused to occur in the fabrication process, and the probability of defect ware increases.The workload of mould can not be added up simultaneously in existing mould in time, and then situation cannot be manufactured by Real-time Obtaining.
Summary of the invention
The object of the invention is to propose a kind of notebook computer bottom cover mould, can make in moving process bolster can not occur position skew, for reaching this object, the present invention by the following technical solutions:
A kind of notebook computer bottom cover mould, comprise cope match-plate pattern, lower bolster, the one side that described cope match-plate pattern and lower bolster contact with each other is respectively arranged with die, described lower bolster is provided with hot runner, also clamping plate are provided with successively from top to bottom immediately below described lower bolster, top board, backing plate, heat flux plates, lower shoe and thermal insulation board, also ejection cylinder is provided with in described backing plate, the push rod of described ejection cylinder is connected with top board, the homonymy of described cope match-plate pattern and lower bolster is also provided with jam plate, described jam plate two ends respectively with cope match-plate pattern, lower bolster is fixedly connected with, folding counter is also provided with between described cope match-plate pattern and lower bolster.
As preferably, described hot runner is 8.
As preferably, above described cope match-plate pattern, be also provided with upper plate.
As preferably, described die comprises lower die and upper cores, and described lower die is positioned on lower bolster, and described upper cores is positioned on cope match-plate pattern, and described cope match-plate pattern and lower bolster closed after, lower die and upper cores bonded to each otherly can make that die is inner forms chamber.
As preferably, described thermal insulation board also offers sprue gate.
As preferably, described cope match-plate pattern and upper plate are connected by screw.
As preferably, be all connected by screw between the upper and lower plates that described lower bolster, clamping plate, top board, backing plate, heat flux plates, lower shoe, thermal insulation board contact with each other.
As preferably, described jam plate is fixedly connected with by screw with cope match-plate pattern, lower bolster.
Beneficial effect of the present invention:
Cope match-plate pattern and lower bolster, by arranging lock dog on cope match-plate pattern and lower bolster, operationally can be fixed, can not produce position deviation therebetween by the present invention.
Accompanying drawing explanation
Fig. 1 is the structural representation of notebook computer bottom cover mould provided by the invention.
In figure:
1, cope match-plate pattern; 2, lower bolster; 31, upper cores; 32, lower die; 4, hot runner; 5, clamping plate; 6, top board; 7, backing plate; 8, heat flux plates; 9, thermal insulation board; 91, cast gate; 10, ejection cylinder; 11, jam plate; 12, upper plate; 13, lower shoe.
Detailed description of the invention
In order to make those skilled in the art understand technical scheme of the present invention better, further illustrate technical scheme of the present invention below in conjunction with accompanying drawing by detailed description of the invention.
Please refer to Fig. 1, Fig. 1 is the structural representation of notebook computer bottom cover mould provided by the invention.
The invention provides a kind of notebook computer bottom cover mould, this notebook computer bottom cover mould can prevent that position occurs between cope match-plate pattern 1 and lower bolster 2 and offset, it comprises cope match-plate pattern 1, lower bolster 2, the one side that described cope match-plate pattern 1 and lower bolster 2 contact with each other is respectively arranged with die, described lower bolster 2 is provided with hot runner 4, also be provided with clamping plate 5, top board 6, backing plate 7, heat flux plates 8, lower shoe 13 and thermal insulation board 9 successively from top to bottom immediately below described lower bolster, thermal insulation board 9 also offers sprue gate 91.Also be provided with ejection cylinder 10 in described backing plate 7, the push rod of described ejection cylinder 10 is connected with top board 6, and described cope match-plate pattern 1 is also provided with jam plate 11 with the homonymy of lower bolster 2, and described jam plate 11 two ends are fixedly connected with cope match-plate pattern 1, lower bolster 2 respectively.More specifically, described jam plate 11 is fixedly connected with by screw with cope match-plate pattern 1, lower bolster 2, easily dismantles when the benefit that screw connects is dismounting, only screwdriver need be used to be backed out by screw and can complete dismounting task.
Folding counter is also provided with between cope match-plate pattern 1 and lower bolster 2.This folding counter can count according to the folding situation of mould, and then can obtain the workload of this mould, convenient operation personal management.
In the present embodiment, as preferably, the quantity of described hot runner 4 is 8, is certainly not limited to above-mentioned 8 in other embodiments, arranges 8 product qualities that can make to produce better compared with the hot runner of other quantity in the present embodiment.
In the present embodiment, as optimal technical scheme, above described cope match-plate pattern 1, be also provided with upper plate 12.
Die comprises lower die 32 and upper cores 31, described lower die 32 is positioned on lower bolster 2, described upper cores 31 is positioned on cope match-plate pattern 1, and described cope match-plate pattern 1 closed with lower bolster 2 after, lower die 32 and upper cores 31 can bonded to each otherly make die inside form chamber, this kind of structure expediently lower bolster folding, more easily takes out product simultaneously.
In the present embodiment, described cope match-plate pattern 1 is connected by screw with upper plate 12.All be connected by screw too between the upper and lower plates that wherein said lower bolster 2, clamping plate 5, top board 6, backing plate 7, heat flux plates 8, lower shoe 13, thermal insulation board 9 contact with each other.This kind of connected mode easy disassembly, when one of them parts damages, only need change, and without the need to by whole part replacement, saves economical old.
Note, above display and describe general principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not by the restriction of above-mentioned embodiment; what describe in above-mentioned embodiment and description just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications; these changes and improvements all fall in the claimed scope of the invention, and claimed scope of the present invention is defined by appending claims and equivalent thereof.
Claims (8)
1. a notebook computer bottom cover mould, comprise cope match-plate pattern (1), lower bolster (2), it is characterized in that, the one side that described cope match-plate pattern (1) and lower bolster (2) contact with each other is respectively arranged with die, described lower bolster (2) is provided with hot runner (4), clamping plate (5) are also provided with successively from top to bottom immediately below described lower bolster, top board (6), backing plate (7), heat flux plates (8), lower shoe (13) and thermal insulation board (9), ejection cylinder (10) is also provided with in described backing plate (7), the push rod of described ejection cylinder (10) is connected with top board (6), described cope match-plate pattern (1) is also provided with jam plate (11) with the homonymy of lower bolster (2), described jam plate (11) two ends respectively with cope match-plate pattern (1), lower bolster (2) is fixedly connected with, folding counter is also provided with between described cope match-plate pattern (1) and lower bolster (2).
2. notebook computer bottom cover mould according to claim 1, is characterized in that, described hot runner (4) is 8.
3. notebook computer bottom cover mould according to claim 1, is characterized in that, described cope match-plate pattern (1) top is also provided with upper plate (12).
4. notebook computer bottom cover mould according to claim 1, it is characterized in that, described die comprises lower die (32) and upper cores (31), described lower die (32) is positioned on lower bolster (2), described upper cores (31) is positioned on cope match-plate pattern (1), and described cope match-plate pattern (1) and lower bolster (2) closed after, lower die (32) and upper cores (31) can bonded to each otherly make die inside form chamber.
5., according to the arbitrary described notebook computer bottom cover mould of claim 1-4, it is characterized in that, described thermal insulation board (9) also offers sprue gate (91).
6. notebook computer bottom cover mould according to claim 5, is characterized in that, described cope match-plate pattern (1) and upper plate (12) are connected by screw.
7. notebook computer bottom cover mould according to claim 6, it is characterized in that, be all connected by screw between the upper and lower plates that described lower bolster (2), clamping plate (5), top board (6), backing plate (7), heat flux plates (8), lower shoe (13), thermal insulation board (9) contact with each other.
8. notebook computer bottom cover mould according to claim 7, is characterized in that, described jam plate (11) is fixedly connected with by screw with cope match-plate pattern (1), lower bolster (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510689671.8A CN105196482A (en) | 2015-10-22 | 2015-10-22 | Mold for bottom cover of notebook computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510689671.8A CN105196482A (en) | 2015-10-22 | 2015-10-22 | Mold for bottom cover of notebook computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105196482A true CN105196482A (en) | 2015-12-30 |
Family
ID=54944604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510689671.8A Pending CN105196482A (en) | 2015-10-22 | 2015-10-22 | Mold for bottom cover of notebook computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105196482A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201645698U (en) * | 2009-06-02 | 2010-11-24 | 东莞市鑫艺来塑胶制品有限公司 | Rubber product forming die |
| CN102765150A (en) * | 2012-07-24 | 2012-11-07 | 宁波舜宇模具有限公司 | Quick mould change device |
| CN203004216U (en) * | 2012-11-23 | 2013-06-19 | 昆山博爱模具开发有限公司 | Injection mould of light-emitting diode (LED) shell |
| CN103587036A (en) * | 2013-11-04 | 2014-02-19 | 昆山顺康达工业产品设计有限公司 | Injection mold and manufacture method of high mirror surface of product surface |
| CN205097460U (en) * | 2015-10-22 | 2016-03-23 | 泰逸电子（昆山）有限公司 | Notebook computer bottom mould |
-
2015
- 2015-10-22 CN CN201510689671.8A patent/CN105196482A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201645698U (en) * | 2009-06-02 | 2010-11-24 | 东莞市鑫艺来塑胶制品有限公司 | Rubber product forming die |
| CN102765150A (en) * | 2012-07-24 | 2012-11-07 | 宁波舜宇模具有限公司 | Quick mould change device |
| CN203004216U (en) * | 2012-11-23 | 2013-06-19 | 昆山博爱模具开发有限公司 | Injection mould of light-emitting diode (LED) shell |
| CN103587036A (en) * | 2013-11-04 | 2014-02-19 | 昆山顺康达工业产品设计有限公司 | Injection mold and manufacture method of high mirror surface of product surface |
| CN205097460U (en) * | 2015-10-22 | 2016-03-23 | 泰逸电子（昆山）有限公司 | Notebook computer bottom mould |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151230 |
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| WD01 | Invention patent application deemed withdrawn after publication |