CN105188262A - Linked printed circuit board structure for display light-emitting diode (LED) backboard - Google Patents

Linked printed circuit board structure for display light-emitting diode (LED) backboard Download PDF

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Publication number
CN105188262A
CN105188262A CN201510557097.0A CN201510557097A CN105188262A CN 105188262 A CN105188262 A CN 105188262A CN 201510557097 A CN201510557097 A CN 201510557097A CN 105188262 A CN105188262 A CN 105188262A
Authority
CN
China
Prior art keywords
circuit board
printed circuit
connection sheet
sheet printed
board structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201510557097.0A
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Chinese (zh)
Other versions
CN105188262B (en
Inventor
李泽清
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
APCB Electronics Kunshan Co Ltd
Original Assignee
APCB Electronics Kunshan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by APCB Electronics Kunshan Co Ltd filed Critical APCB Electronics Kunshan Co Ltd
Priority to CN201510557097.0A priority Critical patent/CN105188262B/en
Publication of CN105188262A publication Critical patent/CN105188262A/en
Application granted granted Critical
Publication of CN105188262B publication Critical patent/CN105188262B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/142Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Led Device Packages (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)

Abstract

The invention discloses a linked printed circuit board structure for a display light-emitting diode (LED) backboard. The linked printed circuit board structure comprises a plurality of circuit board wafers which are connected with one another, wherein each circuit board wafer comprises opposite two surfaces; the two surfaces are a front copper surface and a reverse copper surface; each reverse copper surface is covered with a white reflection layer; each front copper surface is covered with an organic solderability preservative film, and is provided with a plug-in bonding pad and a surface mounting part bonding pad; the linked printed circuit board comprises one surface and another surface, which are opposite; and each circuit board wafer is that each front copper surface covered with the organic solderability preservative film is located on one surface of the linked printed circuit board and each reverse copper surface covered with the white reflection layer is located on the other surface of the linked printed circuit board. In the manufacture procedure, the white reflection layers are not stained with the organic solderability preservative films, so that the appearance and the reflecting property of the linked printed circuit board structure are ensured.

Description

For the connection sheet printed circuit board structure of display led backboard
Technical field
The invention belongs to art of printed circuit boards, be specifically related to a kind of connection sheet printed substrate for display led backboard.
Background technology
At present, the wiring board of LED backplane is that connection sheet is produced when producing, and type-setting mode is typesetting alternating between negative and positive, namely be in positive and negative setting between adjacent monolithic, the copper face of one piece of monolithic is upper, the ink surface of adjacent monolithic is upper, this kind of structure is through anti-oxidant processing procedure OSP (organic guarantor welds film) line, copper face OSP film can stick on roller, OSP film on roller can be instead stained with on the ink of wiring board another side, cause product heterochromatic through SMT plug-in unit high temperature process plate face ink surface, cause bad order and function of surface to weaken.
Summary of the invention
In order to solve the problem, the invention provides a kind of connection sheet printed circuit board structure for display led backboard, this organic guarantor for the connection sheet printed circuit board structure of display led backboard welds film and can not be stained with white reflecting layer, thus ensures outward appearance and the reflecting properties of product.
The present invention in order to the technical scheme solving its technical problem and adopt is:
A kind of connection sheet printed circuit board structure for display led backboard, comprise interconnective multi-disc wiring board monolithic, it is characterized in that: wiring board monolithic described in every sheet all has two relative surfaces and is front copper face and reverse side copper face, described reverse side copper face is coated with white reflecting layer, described front copper face is coated with organic guarantor and welds film, described front copper face have plug-in unit pad and surface mount part pad, described sheet printed substrate has relative one side and another side, every sheet wiring board monolithic is all be coated with front copper face that organic guarantor welds film to be positioned at the one side of connection sheet printed substrate and the reverse side copper face being coated with white reflecting layer is positioned at the another side of connection sheet printed substrate.
The present invention in order to the technical scheme solving its technical problem and adopt is:
Say further, described surface mount part pad is welded with LED chip.
Say further, described plug-in unit pad is welded with plug-in element.
Say further, the base material of described wiring board monolithic is Double-sided copper clad laminate.Furthermore, the base material of described wiring board monolithic is CME-3 base material.
Say further, described white reflecting layer is white ink layer.
The invention has the beneficial effects as follows: the reverse side copper face of the every sheet wiring board monolithic of the present invention on the connection sheet printed substrate of display led backboard is coated with white reflecting layer and front copper face is coated with organic guarantor welds film, front copper face have plug-in unit pad and surface mount part pad, every sheet wiring board monolithic is all be coated with front copper face that organic guarantor welds film to be positioned at the one side of connection sheet printed substrate and the reverse side copper face being coated with white reflecting layer is positioned at the another side of connection sheet printed substrate, therefore, the present invention is in processing procedure, organic guarantor welds film and can not be stained with on white reflecting layer, thus ensure outward appearance and the reflecting properties of product.
Accompanying drawing explanation
Fig. 1 is Facad structure schematic diagram of the present invention;
Fig. 2 is inverse layer structure schematic diagram of the present invention.
Embodiment
Below by way of specific instantiation, the specific embodiment of the present invention is described, those skilled in the art can understand advantage of the present invention and effect easily by content disclosed in the present specification.The present invention also can be implemented in further, different ways, that is, not departing under disclosed category, can give different modifications and change.
Embodiment: a kind of connection sheet printed circuit board structure for display led backboard, comprise interconnective multi-disc wiring board monolithic 1, wiring board monolithic described in every sheet all has two relative surfaces and is front copper face and reverse side copper face, described reverse side copper face is coated with white reflecting layer 11, described front copper face is coated with organic guarantor and welds film 12, described front copper face have plug-in unit pad 13 and surface mount part pad 14, described sheet printed substrate has relative one side A1 and another side A2, every sheet wiring board monolithic is all be coated with front copper face that organic guarantor welds film 12 to be positioned at the one side A1 of connection sheet printed substrate and the reverse side copper face being coated with white reflecting layer 11 is positioned at the another side A2 of connection sheet printed substrate.
Described surface mount part pad is welded with LED chip.
Described plug-in unit pad is welded with plug-in element.
The base material of described wiring board monolithic is Double-sided copper clad laminate and specifically CME-3 base material.
Described white reflecting layer is white ink layer.

Claims (6)

1. the connection sheet printed circuit board structure for display led backboard, comprise interconnective multi-disc wiring board monolithic, it is characterized in that: wiring board monolithic described in every sheet all has two relative surfaces and is front copper face and reverse side copper face, described reverse side copper face is coated with white reflecting layer, described front copper face is coated with organic guarantor and welds film, described front copper face have plug-in unit pad and surface mount part pad, described sheet printed substrate has relative one side and another side, every sheet wiring board monolithic is all be coated with front copper face that organic guarantor welds film to be positioned at the one side of connection sheet printed substrate and the reverse side copper face being coated with white reflecting layer is positioned at the another side of connection sheet printed substrate.
2., as claimed in claim 1 for the connection sheet printed circuit board structure of display led backboard, it is characterized in that: described surface mount part pad is welded with LED chip.
3., as claimed in claim 1 for the connection sheet printed circuit board structure of display led backboard, it is characterized in that: described plug-in unit pad is welded with plug-in element.
4., as claimed in claim 1 for the connection sheet printed circuit board structure of display led backboard, it is characterized in that: the base material of described wiring board monolithic is Double-sided copper clad laminate.
5., as claimed in claim 4 for the connection sheet printed circuit board structure of display led backboard, it is characterized in that: the base material of described wiring board monolithic is CME-3 base material.
6., as claimed in claim 1 for the connection sheet printed circuit board structure of display led backboard, it is characterized in that: described white reflecting layer is white ink layer.
CN201510557097.0A 2015-09-02 2015-09-02 Connection piece printed circuit board structure for display led backboard Active CN105188262B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510557097.0A CN105188262B (en) 2015-09-02 2015-09-02 Connection piece printed circuit board structure for display led backboard

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510557097.0A CN105188262B (en) 2015-09-02 2015-09-02 Connection piece printed circuit board structure for display led backboard

Publications (2)

Publication Number Publication Date
CN105188262A true CN105188262A (en) 2015-12-23
CN105188262B CN105188262B (en) 2018-03-09

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510557097.0A Active CN105188262B (en) 2015-09-02 2015-09-02 Connection piece printed circuit board structure for display led backboard

Country Status (1)

Country Link
CN (1) CN105188262B (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0354889A (en) * 1989-07-24 1991-03-08 Fujitsu Ltd Both-side mounting printed wiring board
CN1578590A (en) * 2003-07-02 2005-02-09 株式会社东芝 Printed wiring board, electronic component mounting method, and electronic apparatus
CN204906859U (en) * 2015-09-02 2015-12-23 竞陆电子(昆山)有限公司 A ally oneself with piece printed circuit board structure for display LED backplate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0354889A (en) * 1989-07-24 1991-03-08 Fujitsu Ltd Both-side mounting printed wiring board
CN1578590A (en) * 2003-07-02 2005-02-09 株式会社东芝 Printed wiring board, electronic component mounting method, and electronic apparatus
CN204906859U (en) * 2015-09-02 2015-12-23 竞陆电子(昆山)有限公司 A ally oneself with piece printed circuit board structure for display LED backplate

Also Published As

Publication number Publication date
CN105188262B (en) 2018-03-09

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