CN105187027A - Matching-free packaging of surface acoustic wave filter - Google Patents
Matching-free packaging of surface acoustic wave filter Download PDFInfo
- Publication number
- CN105187027A CN105187027A CN201510497602.7A CN201510497602A CN105187027A CN 105187027 A CN105187027 A CN 105187027A CN 201510497602 A CN201510497602 A CN 201510497602A CN 105187027 A CN105187027 A CN 105187027A
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- acoustic wave
- wave filter
- surface acoustic
- pcb
- ltcc
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- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
The invention discloses matching-free packaging of a surface acoustic wave filter. A PCB (Printed Circuit Board) or an LTCC (Low Temperature Co-fired Ceramic) base is included; the surface acoustic wave filter is arranged on the PCB or the LTCC base; a strip line circuit for matching is arranged in the PCB or the LTCC base; the surface acoustic wave filter is a surface mounted device; the bottom of the surface acoustic wave filter is a bonding pad; a chip of the surface acoustic wave filter is loaded in the bonding pad; the PCB or the LTCC base is a multi-layer device; a bonding pad corresponding to the surface acoustic wave filter is arranged at the upper part of the PCB or the LTCC base; all strip lines for matching are strip line devices; and signal input, output and grounding bonding pads are arranged on the bottom surface of the PCB or the LTCC base. According to the invention, the chip technology of a surface acoustic wave filter design manufacturer is protected; the space use rate of single surface acoustic wave filter is increased; the use steps of users are simplified; and Free Matching and Plug and Play of the surface acoustic wave filter are realized.
Description
Technical field
The present invention relates to a kind of Surface Acoustic Wave Filter, what particularly relate to a kind of Surface Acoustic Wave Filter exempts from coupling encapsulation.
Background technology
Along with the development of radio-frequency technique, increasing field needs to utilize Surface Acoustic Wave Filter, and as radio-frequency devices, a lot of Surface Acoustic Wave Filter also needs to carry out outside coupling at present, and when user takes single the Surface Acoustic Wave Filter without coupling, they need to design as requested external matching circuit corresponding with it themselves, the self-designed external matching circuit of this user just inherently occupies the space of user's own module, virtually adds actual usable floor area and the volume of Surface Acoustic Wave Filter.Secondly, there is a lot of uncertainties in this user self-designed outside coupling, the accuracy of discrete device, signal conductor just cause the inconsistency of Surface Acoustic Wave Filter on this series of uncertainty of the impact of signal, the angle of welding and temperature, exterior temperature change etc., even damage Surface Acoustic Wave Filter.
Summary of the invention
The object of this invention is to provide a kind of do not need user oneself to design the Surface Acoustic Wave Filter of external matching circuit exempt from coupling encapsulation.
The object of the invention is to be achieved through the following technical solutions:
The coupling of exempting from of Surface Acoustic Wave Filter of the present invention encapsulates, and comprise PCB or LTCC base, described PCB or LTCC submounts is provided with Surface Acoustic Wave Filter, and described PCB or LTCC chassis interior is provided with the strip-line circuit of coupling.
As seen from the above technical solution provided by the invention, the coupling of exempting from of the Surface Acoustic Wave Filter that the embodiment of the present invention provides encapsulates, because PCB or LTCC submounts is provided with Surface Acoustic Wave Filter, described PCB or LTCC chassis interior is provided with the strip-line circuit of coupling, when Surface Acoustic Wave Filter needs outside coupling, just external matching circuit and Surface Acoustic Wave Filter can be integrated and only use as new Surface Mount list.And do not need user oneself to design external matching circuit, Surface Acoustic Wave Filter can be made to obtain the accreditation of more users in " exempting to mate " field.
Accompanying drawing explanation
The external structure schematic diagram of exempting from coupling encapsulation of the Surface Acoustic Wave Filter that Fig. 1 provides for the embodiment of the present invention.
The internal structure schematic diagram of exempting from coupling encapsulation of the Surface Acoustic Wave Filter that Fig. 2 provides for the embodiment of the present invention.
Embodiment
To be described in further detail the embodiment of the present invention below.
Surface Acoustic Wave Filter of the present invention exempt from coupling encapsulation, its preferably embodiment be:
Comprise PCB or LTCC base, described PCB or LTCC submounts is provided with Surface Acoustic Wave Filter, and described PCB or LTCC chassis interior is provided with the strip-line circuit of coupling.
Described Surface Acoustic Wave Filter is surface mounting component, and the bottom of this Surface Acoustic Wave Filter is pad, and its inside is mounted with Surface Acoustic Wave Filter chip.
Described PCB or LTCC base is multilayer device, and its top is provided with the pad corresponding with described Surface Acoustic Wave Filter, and the size of the upper surface of this base is more than or equal to the size of described Surface Acoustic Wave Filter.
The strip line of described coupling is strip line components and parts.
The bottom surface of described PCB or LTCC base is provided with signal input, exports and ground pad.
The coupling of exempting from of Surface Acoustic Wave Filter of the present invention encapsulates; single Surface Acoustic Wave Filter is welded on a PCB or ltcc substrate; and the outside coupling originally needing user to carry out has been integrated in PCB or ltcc substrate in the mode of strip line; like this; not only protect the chip technology of SAW filter design manufacturer; and work the space utilization rate adding single Surface Acoustic Wave Filter; simplify the use step of user; user saves volume simultaneously, achieves Surface Acoustic Wave Filter " exempting from coupling " and " plug and play ".
Specific embodiment:
As shown in Figure 1 and Figure 2, comprising: Surface Acoustic Wave Filter 1; PCB or LTCC base 2; The strip-line circuit 3 of the coupling of PCB or LTCC base 2 inside; The bottom surface 4 of PCB or LTCC base.
Surface Acoustic Wave Filter 1 is surface mounting component, and this Surface Acoustic Wave Filter device needs outside to mate, and the bottom of this SAW (Surface Acoustic Wave) device is pad, the Surface Acoustic Wave Filter chip needed for inner loading.
PCB or LTCC base 2 is multilayer device, and its number of plies can be changed according to the complexity of the required coupling of its Surface Acoustic Wave Filter 1, and outside coupling is more complicated, then the number of plies is more.The upper strata of this substrate, with the part that Surface Acoustic Wave Filter 1 contacts, its pad and Surface Acoustic Wave Filter 1 corresponding, the size of this base is minimum should measure-alike with Surface Acoustic Wave Filter 1, and concrete size can also be modified according to actual needs.
The strip line of PCB or LTCC chassis interior is strip line components and parts, when material is determined, the size of its inductance value or capacitance changes with the size change of itself, when the component size designing matching internal is excessive, can improve by increasing the dielectric constant of PCB or LTCC base 2 material, such as, be that the size of internal circuit will significantly be reduced when doing base with LTCC.
The bottom surface 4 of PCB or LTCC base, as required at the input of floor design signal, output and ground pad, for ensuring signal quality, this bottom surface 4 is except the input of signal, output port, whole floor file is answered in other positions, in use, user can be welded direct to Surface Mount on oneself PCB or ceramic substrate and uses.
Outside coupling, base, Surface Acoustic Wave Filter, when Surface Acoustic Wave Filter needs outside coupling, integrate by the present invention, thus add reliability when user uses single Surface Acoustic Wave Filter device, and convenient for users.Exempt from coupling, namely weld namely use, reliability is high.
Application the present invention, after external matching circuit and Surface Acoustic Wave Filter single device are integrated, surface acoustic wave single device after integrated directly can be welded in other module and directly use by user, need not consider coupling, also need not be this single SAW filter design matched position more in addition.For user, the flow process of single Surface Acoustic Wave Filter is originally used to be: need first to obtain SAW (Surface Acoustic Wave) device, then the external matching circuit required for this Surface Acoustic Wave Filter to design the module placement of oneself; And become now: the layout that first can design oneself module, in layout, stay next fixing position in advance simultaneously, and then by Surface Acoustic Wave Filter producer by method production Surface Acoustic Wave Filter of the present invention.In this case, the user of Surface Acoustic Wave Filter will inevitably be made more convenient.
The inventive method is not limited to above-described embodiment, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to patent scope of the present invention.It should be pointed out that for the person of ordinary skill of the art, under the prerequisite not departing from inventional idea of the present invention, can also make some distortion and improvement, these all belong to the protection range of patent of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of claims.
Claims (5)
1. the coupling of exempting from of a Surface Acoustic Wave Filter encapsulates, and it is characterized in that, comprise PCB or LTCC base, described PCB or LTCC submounts is provided with Surface Acoustic Wave Filter, and described PCB or LTCC chassis interior is provided with the strip-line circuit of coupling.
2. the coupling of exempting from of Surface Acoustic Wave Filter according to claim 1 encapsulates, and it is characterized in that, described Surface Acoustic Wave Filter is surface mounting component, and the bottom of this Surface Acoustic Wave Filter is pad, and its inside is mounted with Surface Acoustic Wave Filter chip.
3. the coupling of exempting from of Surface Acoustic Wave Filter according to claim 2 encapsulates, it is characterized in that, described PCB or LTCC base is multilayer device, its top is provided with the pad corresponding with described Surface Acoustic Wave Filter, and the size of the upper surface of this base is more than or equal to the size of described Surface Acoustic Wave Filter.
4. the coupling of exempting from of Surface Acoustic Wave Filter according to claim 3 encapsulates, and it is characterized in that, the strip line of described coupling is strip line components and parts.
5. the coupling of exempting from of the Surface Acoustic Wave Filter according to any one of Claims 1-4 encapsulates, and it is characterized in that, the bottom surface of described PCB or LTCC base is provided with signal input, exports and ground pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510497602.7A CN105187027A (en) | 2015-08-13 | 2015-08-13 | Matching-free packaging of surface acoustic wave filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510497602.7A CN105187027A (en) | 2015-08-13 | 2015-08-13 | Matching-free packaging of surface acoustic wave filter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105187027A true CN105187027A (en) | 2015-12-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510497602.7A Pending CN105187027A (en) | 2015-08-13 | 2015-08-13 | Matching-free packaging of surface acoustic wave filter |
Country Status (1)
| Country | Link |
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| CN (1) | CN105187027A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112164846A (en) * | 2020-09-10 | 2021-01-01 | 武汉凡谷电子技术股份有限公司 | Millimeter wave band-pass filter |
| CN112729595A (en) * | 2021-02-02 | 2021-04-30 | 上海航天电子有限公司 | Delay line type surface acoustic wave sensor and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000101388A (en) * | 1998-09-22 | 2000-04-07 | Oki Electric Ind Co Ltd | Surface acoustic wave filter package |
| CN101986563A (en) * | 2010-10-18 | 2011-03-16 | 华为技术有限公司 | Surface acoustic wave (SAW) filter and manufacturing method thereof |
| CN201947547U (en) * | 2010-12-09 | 2011-08-24 | 中兴通讯股份有限公司 | Printed circuit board (PCB) for radio-frequency circuit |
| CN103138709A (en) * | 2013-01-17 | 2013-06-05 | 天津大学 | Radio-frequency filter and radio-frequency multiplexer |
-
2015
- 2015-08-13 CN CN201510497602.7A patent/CN105187027A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000101388A (en) * | 1998-09-22 | 2000-04-07 | Oki Electric Ind Co Ltd | Surface acoustic wave filter package |
| CN101986563A (en) * | 2010-10-18 | 2011-03-16 | 华为技术有限公司 | Surface acoustic wave (SAW) filter and manufacturing method thereof |
| CN201947547U (en) * | 2010-12-09 | 2011-08-24 | 中兴通讯股份有限公司 | Printed circuit board (PCB) for radio-frequency circuit |
| CN103138709A (en) * | 2013-01-17 | 2013-06-05 | 天津大学 | Radio-frequency filter and radio-frequency multiplexer |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112164846A (en) * | 2020-09-10 | 2021-01-01 | 武汉凡谷电子技术股份有限公司 | Millimeter wave band-pass filter |
| CN112729595A (en) * | 2021-02-02 | 2021-04-30 | 上海航天电子有限公司 | Delay line type surface acoustic wave sensor and manufacturing method thereof |
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| CB03 | Change of inventor or designer information |
Inventor after: Zhang Enyu Inventor after: Wan Fei Inventor after: Yang Sichuan Inventor after: Chen Minghe Inventor after: Huang Xin Inventor before: Li Hong Inventor before: Wan Fei Inventor before: Yang Sichuan Inventor before: Chen Minghe Inventor before: Huang Xin |
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| CB03 | Change of inventor or designer information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151223 |
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| RJ01 | Rejection of invention patent application after publication |