CN105185492A - Thermal protection piezoresistor - Google Patents
Thermal protection piezoresistor Download PDFInfo
- Publication number
- CN105185492A CN105185492A CN201510525067.1A CN201510525067A CN105185492A CN 105185492 A CN105185492 A CN 105185492A CN 201510525067 A CN201510525067 A CN 201510525067A CN 105185492 A CN105185492 A CN 105185492A
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- wire pin
- thermal protection
- piezoresistor
- pin
- electrode layer
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Abstract
The invention relates to a thermal protection piezoresistor. The thermal protection piezoresistor has the main functions of effectively and rapidly cutting off power supply and preventing fire catching before a piezoresistor generates high heat and is ignited after losing efficacy. The thermal protection piezoresistor comprises a pressure-sensitive chip, a spring plate, an encapsulated layer and an electrode lead, wherein one end of the lead is welded with a silver surface, or is welded with the silver surface through a fuse wire to form a welding spot; the spring plate is arranged on a base; elasticity is applied to the lead by one end of the spring plate; after the welding spot is fused, the lead is bounced off and is separated from the silver surface; and the spring plate and the pressure-sensitive chip are encapsulated into the encapsulated layer. Compared with the piezoresistor which is used in the current market, the thermal protection piezoresistor has the functions of cutting off the power supply when overheating, and preventing fire catching. Compared with the traditional universal piezoresistor assembled with a thermal fuse and a product temperature fuse, the thermal protection piezoresistor has higher feedback speed, is capable of more rapidly cutting off power supply and preventing fire catching, can be applied to the traditional thermal protection piezoresistor, can replace the traditional thermal protection piezoresistor, and is suitable for protection of various voltage circuits.
Description
Technical field
The present invention relates to a kind of piezo-resistance, especially a kind of Thermal protection type piezo-resistance.
Background technology
Varistor is according to its superior volt-ampere characteristic, low production cost, be widely used in electronic circuit overvoltage, surge protection, but circuit is because of overvoltage too much in electronic circuit exception, varistor is caused to take place frequently action, occur that performance reduces, lost efficacy, serious time occur that varistor self punctures, combustion phenomena, cause other resistor assembly of periphery to burn, cause larger loss;
The traditional finished product fuse of general employing and piezo-resistance cascaded structure on existing market, as mainly there is following several deficiency:
1, fuse failure, headspace is less, effectively cannot disconnect after the fusing of guarantee insurance silk;
2, temperature transmits feedback speed slowly, is unfavorable for that power supply disconnects in time;
3, product component assembling is complicated, is unfavorable for automation, large-scale production.
Summary of the invention
The technical problem to be solved in the present invention is: propose a kind of Thermal protection type piezo-resistance, can produce after pressure responsive resistor failure high heat on fire before, cut off the electricity supply more effectively and rapidly, prevent catching fire.
The technical solution adopted in the present invention is: a kind of Thermal protection type piezo-resistance, comprises base, the chip varistor be arranged on base, parcel base and the encapsulated layer of chip varistor and the wire pin that is connected with external electronic component; Described chip varistor surface-coated has silver electrode layer; One end of described wire is welded with silver electrode layer or is welded with silver electrode layer by fuse, forms solder joint; Described base is also provided with flick mechanism; Described flick mechanism is shell fragment or elater; One end of described flick mechanism contacts with wire pin, after solder joint fusing, make wire pin depart from silver electrode layer.Described solder joint is alloy solder joint.
Further, the number of wire pin of the present invention is two; Be respectively the first wire pin and the second wire pin; Described one end of the first wire pin is connected with the silver electrode layer of chip varistor side; The other end of the first wire pin extends to encapsulated layer outside; Described one end of the second wire pin is connected with the silver electrode layer of chip varistor opposite side, and contacts with flicking structure; The other end of the second wire pin extends to encapsulated layer outside.
Further say, the number of wire pin of the present invention is three; Be respectively the first wire pin, the second wire pin and privates pin; The first described wire pin is connected with the silver electrode layer of chip varistor both sides respectively with one end of the second wire pin; The other end of the first wire pin and the second wire pin extends to encapsulated layer outside; One end of described privates pin is connected with the silver electrode layer of chip varistor side; Described privates pin contacts with flick mechanism, and the other end of privates pin extends to encapsulated layer outside.
The invention has the beneficial effects as follows: not only product with compact structure, fusible link reaction speed are fast, outward appearance shape rule; And be suitable for automation, large-scale production, Temperature protection shell fragment device can according to piezo-resistance needs, select different size shell fragment, see or not see conductive mechanism, flexible design, to be applicable to occasion extensive.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described.
Fig. 1 is the structural representation of prior art;
Fig. 2 is the structure side view of Fig. 1;
Fig. 3 is the structural representation of the present invention's three wire pins;
Fig. 4 be Fig. 3 flick effect schematic diagram;
Fig. 5 be the present invention's two wire pins flick effect schematic diagram;
In figure: 1, the assembly of base and chip varistor; 2, solder joint; 3, shell fragment or elater; 4, wire pin.
Embodiment
The present invention is further detailed explanation with preferred embodiment by reference to the accompanying drawings now.These accompanying drawings are the schematic diagram of simplification, only basic structure of the present invention are described in a schematic way, and therefore it only shows the formation relevant with the present invention.
Shown in Fig. 1,2 is the structure of the piezo-resistance of prior art; Its weak point as described in the background art, no longer repeated description herein.
Fig. 3 and Fig. 4 is the structural representation of the present invention's three wire pins, comprises base, the chip varistor be arranged on base, parcel base and the encapsulated layer of chip varistor and the wire pin that is connected with external electronic component; Described chip varistor surface-coated has silver electrode layer; One end of described wire is welded with silver electrode layer or is welded with silver electrode layer by fuse, forms solder joint; Described base is also provided with flick mechanism; Described flick mechanism is shell fragment or elater; One end of described flick mechanism contacts with wire pin, after solder joint fusing, make wire pin depart from silver electrode layer.
In Fig. 3, the number of wire pin is three; Be respectively the first wire pin, the second wire pin and privates pin; The first described wire pin is connected with the silver electrode layer of chip varistor both sides respectively with one end of the second wire pin; The other end of the first wire pin and the second wire pin extends to encapsulated layer outside; One end of described privates pin is connected with the silver electrode layer of chip varistor side; Described privates pin contacts with flick mechanism, and the other end of privates pin extends to encapsulated layer outside.Flick effect as shown in Figure 4.
Shown in Fig. 5 to be the number of wire pin be two flick effect; One end of first wire pin is connected with the silver electrode layer of chip varistor side; The other end of the first wire pin extends to encapsulated layer outside; Described one end of the second wire pin is connected with the silver electrode layer of chip varistor opposite side, and contacts with flicking structure; The other end of the second wire pin extends to encapsulated layer outside.
Surface structure of the present invention can be round, square, and encapsulating mode is that powder is coated with, liquid is coated with, embedding; The present invention adopts Modularization assembled structure, the assembling of voltage dependent resistor chip, base, and lead electrode welding assembly, shell fragment are assembled, application is epoxy resin enclosed or embedding operation, greatly improve automatic, large-scale production operation at performance guarantee simultaneously; The present invention can also according to customer demand, and solder joint selects different temperatures alloy scolding tin, coordinates, be widely used in various temperature, overvoltage protection occasion with piezo-resistance.
The just the specific embodiment of the present invention described in above specification, various illustrating is not construed as limiting flesh and blood of the present invention, person of an ordinary skill in the technical field after having read specification can to before described embodiment make an amendment or be out of shape, and do not deviate from the spirit and scope of the invention.
Claims (4)
1. a Thermal protection type piezo-resistance, is characterized in that: comprise base, the chip varistor be arranged on base, parcel base and the encapsulated layer of chip varistor and the wire pin that is connected with external electronic component; Described chip varistor surface-coated has silver electrode layer; One end of described wire is welded with silver electrode layer or is welded with silver electrode layer by fuse, forms solder joint; Described base is also provided with flick mechanism; Described flick mechanism is shell fragment or elater; One end of described flick mechanism contacts with wire pin, after solder joint fusing, make wire pin depart from silver electrode layer.
2. Thermal protection type piezo-resistance as claimed in claim 1, is characterized in that: the number of described wire pin is two; Be respectively the first wire pin and the second wire pin; Described one end of the first wire pin is connected with the silver electrode layer of chip varistor side; The other end of the first wire pin extends to encapsulated layer outside; Described one end of the second wire pin is connected with the silver electrode layer of chip varistor opposite side, and contacts with flicking structure; The other end of the second wire pin extends to encapsulated layer outside.
3. Thermal protection type piezo-resistance as claimed in claim 1, is characterized in that: the number of described wire pin is three; Be respectively the first wire pin, the second wire pin and privates pin; The first described wire pin is connected with the silver electrode layer of chip varistor both sides respectively with one end of the second wire pin; The other end of the first wire pin and the second wire pin extends to encapsulated layer outside; One end of described privates pin is connected with the silver electrode layer of chip varistor side; Described privates pin contacts with flick mechanism, and the other end of privates pin extends to encapsulated layer outside.
4. Thermal protection type piezo-resistance as claimed in claim 1, is characterized in that: described solder joint is alloy solder joint.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510525067.1A CN105185492A (en) | 2015-08-24 | 2015-08-24 | Thermal protection piezoresistor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510525067.1A CN105185492A (en) | 2015-08-24 | 2015-08-24 | Thermal protection piezoresistor |
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CN105185492A true CN105185492A (en) | 2015-12-23 |
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CN201510525067.1A Pending CN105185492A (en) | 2015-08-24 | 2015-08-24 | Thermal protection piezoresistor |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050200447A1 (en) * | 2004-03-15 | 2005-09-15 | Chandler Daniel A. | Surface mountable PPTC device with integral weld plate |
CN202584970U (en) * | 2012-03-12 | 2012-12-05 | 何朝霞 | Self-protective pressure-sensitive resistor |
CN202678007U (en) * | 2012-03-12 | 2013-01-16 | 何朝霞 | Varistor with self-protection function |
CN203673907U (en) * | 2014-01-09 | 2014-06-25 | 东莞令特电子有限公司 | Cut-off protection type varistor |
CN104517694A (en) * | 2014-12-17 | 2015-04-15 | 兴勤(常州)电子有限公司 | Thermally-protected pressure-sensitive resistor and production process thereof |
CN204884739U (en) * | 2015-08-24 | 2015-12-16 | 兴勤(常州)电子有限公司 | Hot protection type piezo -resistor |
-
2015
- 2015-08-24 CN CN201510525067.1A patent/CN105185492A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050200447A1 (en) * | 2004-03-15 | 2005-09-15 | Chandler Daniel A. | Surface mountable PPTC device with integral weld plate |
CN202584970U (en) * | 2012-03-12 | 2012-12-05 | 何朝霞 | Self-protective pressure-sensitive resistor |
CN202678007U (en) * | 2012-03-12 | 2013-01-16 | 何朝霞 | Varistor with self-protection function |
CN203673907U (en) * | 2014-01-09 | 2014-06-25 | 东莞令特电子有限公司 | Cut-off protection type varistor |
CN104517694A (en) * | 2014-12-17 | 2015-04-15 | 兴勤(常州)电子有限公司 | Thermally-protected pressure-sensitive resistor and production process thereof |
CN204884739U (en) * | 2015-08-24 | 2015-12-16 | 兴勤(常州)电子有限公司 | Hot protection type piezo -resistor |
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Application publication date: 20151223 |
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