CN203967740U - Can guarantee the novel surge protective device of hot releasing mechanism action - Google Patents

Can guarantee the novel surge protective device of hot releasing mechanism action Download PDF

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Publication number
CN203967740U
CN203967740U CN201420077605.6U CN201420077605U CN203967740U CN 203967740 U CN203967740 U CN 203967740U CN 201420077605 U CN201420077605 U CN 201420077605U CN 203967740 U CN203967740 U CN 203967740U
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China
Prior art keywords
interior electrode
hot
releasing mechanism
protective device
electrode
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Expired - Fee Related
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CN201420077605.6U
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Chinese (zh)
Inventor
庞驰
费自豪
张雷
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GUIYANG HIGH-TECH YIGE ELECTRONICS CO LTD
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GUIYANG HIGH-TECH YIGE ELECTRONICS CO LTD
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Priority to CN201420077605.6U priority Critical patent/CN203967740U/en
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Abstract

The utility model discloses a kind of novel surge protective device of guaranteeing hot releasing mechanism action, comprise the piezo-resistance (2) that is positioned at module box body (1), two electrodes in piezo-resistance (2) are connected with respectively interior electrode A (3) and interior electrode B (4), be connected with heat and depart from shell fragment (5) on the hot dispersal point of interior electrode B (4); The thickness of interior electrode B (4) is 0.9-2mm or is provided with anti-burn through sheet metal (9) at the hot dispersal point of interior electrode B (4) and the junction of heat disengaging shell fragment (5).The utility model is by increasing the thickness of interior electrode B or increase anti-burn through sheet metal between interior electrode and heat disengaging electrode, making chip puncture the time that the short circuit current of formation need to be longer could be by anti-burn through sheet metal burn through, for the reaction of hot releasing mechanism, won the time, the reliability of mechanism is largely increased.

Description

Can guarantee the novel surge protective device of hot releasing mechanism action
Technical field
The utility model relates to a kind of novel surge protective device of guaranteeing hot releasing mechanism action, belongs to votage limit type protection device technical field.
Background technology
Surge Protector is to take ZnO lightning-proof chip as main element; combined hot releasing mechanism etc.; there is good non-linear behaviour and large through-current capability, as lightning surge protection component, in electronic circuit and electric power system, be widely used, guaranteed the safe operation of equipment.But in actual applications,, Surge Protector bears for a long time lightning impulse and can cause the insulation impedance of its lightning-proof chip to reduce, and the tolerance of power-frequency overvoltage is also decreased; Running in the situations such as the large or earth fault of network system voltage fluctuation, very easily because lightning-proof chip is punctured flame initiation fire by power-frequency overvoltage, lead to serious consequence.In order to improve the fail safe of Surge Protector self; in the IEC61643-11:2011 of latest edition standard, increased the additional testing of simulation Surge Protector failure mode; Surge Protector inherently safe performance under failure mode is proposed to requirements at the higher level; at prospective short circuit current, be not less than under the condition of 100A, Surge Protector can be threaded off safely and catching fire not.This manufacture to Surge Protector has proposed very harsh requirement, does not also meet in the market the product of IEC61643-11:2011 standard.
The disengaging of conventional SPD device and connection, to rely on middle certain position of piezoresistive element tripping electrode sheet, strike out projecting surface or Zhe Wan Cheng ∟ type, during epoxy encapsulation, reserve tripping electrode sheet projecting surface or folding surface, an external electrode welds mutually by low-melting alloy and tripping electrode sheet projecting surface or folding surface.But electrode projecting surface or folding surface can not directly contact with piezo-resistance.Carry out heat conduction by the edge of projecting surface or folding surface, heat-conducting area is little like this, and the capacity of heat transmission is poor, and the time of conducting out of the high heat before pressure responsive resistor failure certainly will will be grown, and the heat disengaging response time also relatively lags behind; Tripping electrode sheet is thinner on the other hand, mostly at 0.4 ~ 0.5mm thickness, when chip punctures formation short circuit current, makes in a short period of time tripping electrode sheet burn through, forms flame.In the additional testing of IEC61643-11:2011 standard analog Surge Protector failure mode, short circuit current is not less than under the condition of 100A, and the electric current of 100A flows through SPD inside, has gathered a large amount of heats, causes flame burning.
Summary of the invention
For the above-mentioned defect existing in prior art, the technical problems to be solved in the utility model is to provide a kind of novel surge protective device of guaranteeing hot releasing mechanism action, can overcome the deficiencies in the prior art.
The utility model is by the following technical solutions: the novel surge protective device that can guarantee hot releasing mechanism action, comprise the piezo-resistance that is positioned at module box body, two electrodes in piezo-resistance are connected with respectively interior electrode A and interior electrode B, be connected with heat and depart from shell fragment on the hot dispersal point of interior electrode B; The thickness of interior electrode B is 0.5-1.5mm or is provided with anti-burn through sheet metal (9) at the hot dispersal point of interior electrode B and the junction of heat disengaging shell fragment.
Above-mentioned guarantee that the novel surge protective device of hot releasing mechanism action is, the thickness of anti-burn through sheet metal is 0.5-1.5mm, can select dystectic metal or the alloys such as metal molybdenum, tungsten or tungsten copper, and fusing point is greater than 2000 ℃.
The above-mentioned novel surge protective device of guaranteeing hot releasing mechanism action is; hot dispersal point joint area in interior electrode B has epoxy resin baffle plate; except epoxy resin baffle area, the interior electrode A of piezo-resistance and connection and the liquid-state epoxy resin embedding of interior electrode B.
The above-mentioned novel surge protective device of guaranteeing hot releasing mechanism action is; on module box body, be hinged with cut-out plate; the stage casing that cuts off plate between heat departs from shell fragment and interior electrode B, end with in extended state spring be connected, the other end of spring is fixed on module box body.
The aforesaid novel surge protective device of guaranteeing that hot releasing mechanism moves is that the hot dispersal point of interior electrode B is positioned at zone line.
The aforesaid novel surge protective device of guaranteeing that hot releasing mechanism moves is that the height of epoxy resin baffle plate is 1-3mm.
The reliability of threading off in order to improve SPD, a kind of thinking is that ceramic body is done more evenly, we can estimate the time of ceramic body its perforation destroy under the function of current of 100A left and right completely uniformly, we take pressure sensitive voltage 620V and estimate (zinc oxide specific heat 0.5J/g ℃ as example, 820 ℃ of the fusing points of bismuth oxide, lightning-proof chip quality is about 20g), above 100A power current acts on, the voltage loading is about 1000V, the energy absorbing when lightning-proof chip temperature is elevated to 820 ℃ is: 20g * 0.5J/g ℃ * 800 ℃=8000J, the time loading is 8000J ÷ 1000V ÷ 100A=0.08S.The 0.08S that this is short is too short for the time of conducting heat! Hot releasing mechanism has little time action and chip burn through at all.In order to adapt to the new demand of IEC standard, it is different from the inhomogeneity method of tradition raising ceramic body that this patent adopts, adopt patent of invention " ZL201110122032.5 " technology, do not pursue the uniformity of chip, but the conscious ability of chip edge tolerance power-frequency overvoltage that makes is better than chip middle part, under the effect that is subject to power-frequency overvoltage, the middle part burn through of chip, after chip burn through, electrode burn through could to be formed to flame, we increase the thickness of copper electrode or at the dystectic anti-burn through sheet metal of copper electrode outer setting, making chip puncture the time that the short circuit current of formation need to be longer could be by anti-burn through sheet metal burn through, for the time has been won in the action of hot releasing mechanism, the reliability of mechanism is largely increased.The hot dispersal point joint area epoxy resin baffle plate of interior electrode B, after being connected with interior electrode slice, two electrodes of piezo-resistance just can first with liquid-state epoxy resin embedding, make its insulation like this, the setting of epoxy resin baffle plate just can guarantee that hot dispersal point region can not flow into epoxy resin, be convenient to the connection that follow-up heat departs from shell fragment, thereby can improve packaging efficiency and product quality, and can guarantee that heat departs from the welding procedure of shell fragment.To in the power frequency breakdown point of piezoresistive element, move to the central area of piezoresistive element, hot dispersal point is overlapped with the power frequency breakdown point position of piezoresistive element, can conduct distance by shortening heat like this, improve the response speed that piezo-resistance heat departs from.In heat, depart between electrode and piezo-resistance and adopted the cut-out plate of holding with spring, when low temperature melts soldering tin, cut off plate and can cut off rapidly issuable electric arc link circuit under the effect of spring, further improved the reliability of hot disengaging.Because heat departs from electrode, there is larger surface area, when product overload operation or product quality decline and can quick heat-collector while causing temperaturing lifting abnormality, shortened low temperature scolding tin fusing time, effectively eliminated the hidden danger of short circuit breaking out of fire.Owing to being provided with sensitive switch shifting block and showing window, therefore not only realized remote alarms, but also can onsite alarming, thereby can repair or replace in time by reminding user, reach the object of stopping lightning protection device catching fire.
accompanying drawing explanation:
Accompanying drawing 1 is the state diagram of each part installation site of Surge Protector.
In figure, 1 module box body; 2 piezo-resistances; 3 interior electrode A; 4 interior electrode B; 5 heat depart from shell fragment; 6 epoxy resin baffle plates; 7 cut off plate; 8 extension springs; 9 anti-burn through sheet metals, 10 electrode lead-out pins, 11 external electrodes.
embodiment:
Embodiment 1, as illustrated in fig. 1 and 2, the present embodiment core piezo-resistance 2 is the square chip of 34 * 34mm, the pressure sensitive voltage of pressure sensitive voltage 2 is 620V, its power frequency breakdown point is at chip middle part, two electrodes of piezo-resistance 2 connect respectively interior electrode A 3 and interior electrode B 4, hot dispersal point joint area in interior electrode B 4 has epoxy resin baffle plate 6, the height that removes epoxy resin baffle plate 6 is 1-3mm, like this when making its insulation with liquid-state epoxy resin embedding, be subject to stopping except epoxy resin baffle plate 6, except epoxy resin baffle plate 6 regions, piezo-resistance 2 and the interior electrode A 3 and 4 all the other regions liquid-state epoxy resin embeddings of interior electrode B that connect, form main protection device, an electrode of piezo-resistance 2 is connected on heat disengaging shell fragment 5 with low temperature scolding tin by the hot dispersal point at interior electrode B 4 middle parts, the fusing point of low temperature scolding tin is 110 ℃-150 ℃, for extending chip, puncture the time that forms short circuit current, in the reaction time of guaranteeing hot releasing mechanism, applicant has adopted following two kinds of square technological means, and a is 0.9-2mm by the thickness of interior electrode B (4), b departs from the hot dispersal point of interior electrode B (4) and heat the anti-burn through sheet metal that the junction throat thickness of shell fragment (5) is 0.5 ~ 1.5mm.Heat departs from shell fragment 5 and links together by spot welding with electrode lead-out pins 10.In another of piezo-resistance 2, electrode A 3 is connected with external electrode 11 by scolding tin, and external electrode 11 connects by connector in the circuit of outside required protection.On module box body 1, be hinged with and cut off plate 7, the stage casing that cuts off plate 7 departs between shell fragment 5 and interior electrode B 4 in heat, end with in extended state spring 8 be connected, the other end of spring 8 is fixed on module box body 1, for a long time, under the high power frequency function of current, low temperature melts soldering tin, heat departs from shell fragment 5 and departs from hot dispersal point, cut off plate 7 moves downward under spring 8 pulling force effects, intercepted the electrical connection of electrode lead-out pins 9 with interior electrode B 4 completely, having cut off issuable electric arc connects, sensitive switch action simultaneously, the red colour code that cuts off plate 7 other ends blocks and shows window, remote alarms and onsite alarming are provided.
The above refers to that embodiment is only preferred embodiment of the present utility model; not with this, limit practical range of the present utility model; therefore the equivalence that all shapes according to the utility model, structure and principle are done changes, and all should be covered by protection range of the present utility model.

Claims (6)

1. the novel surge protective device that can guarantee the action of hot releasing mechanism, comprise the piezo-resistance (2) that is positioned at module box body (1), two electrodes in piezo-resistance (2) are connected with respectively interior electrode A (3) and interior electrode B (4), be connected with heat and depart from shell fragment (5) on the hot dispersal point of interior electrode B (4); It is characterized in that: the thickness of interior electrode B (4) is 0.9-2mm or is provided with anti-burn through sheet metal (9) at the hot dispersal point of interior electrode B (4) and the junction of heat disengaging shell fragment (5).
2. the novel surge protective device of guaranteeing hot releasing mechanism action according to claim 1, is characterized in that: the thickness of anti-burn through sheet metal (9) is 0.5-1.5mm.
3. the novel surge protective device of guaranteeing the action of hot releasing mechanism according to claim 2; it is characterized in that: the hot dispersal point joint area in interior electrode B (4) has epoxy resin baffle plate (6); except epoxy resin baffle plate (6) region, piezo-resistance (2) and the interior electrode A (3) and the interior electrode B (4) that connect are used liquid-state epoxy resin embedding.
4. the novel surge protective device of guaranteeing the action of hot releasing mechanism according to claim 3; it is characterized in that: on module box body (1), be hinged with and cut off plate (7); the stage casing that cuts off plate (7) is positioned at that heat departs between shell fragment (5) and electrode B (4), end with in extended state spring (8) be connected, the other end of spring (8) is fixed on module box body (1).
5. the novel surge protective device of guaranteeing hot releasing mechanism action according to claim 3, is characterized in that: the hot dispersal point of interior electrode B (4) is positioned at zone line.
6. the novel surge protective device of guaranteeing hot releasing mechanism action according to claim 5, is characterized in that: the height of epoxy resin baffle plate (6) is 1-3mm.
CN201420077605.6U 2014-02-24 2014-02-24 Can guarantee the novel surge protective device of hot releasing mechanism action Expired - Fee Related CN203967740U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103904632A (en) * 2014-02-24 2014-07-02 贵阳高新益舸电子有限公司 Novel High-reliability surge protector
CN110492463A (en) * 2019-09-29 2019-11-22 厦门赛尔特电子有限公司 A kind of surge protection device with high breaking capacity

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103904632A (en) * 2014-02-24 2014-07-02 贵阳高新益舸电子有限公司 Novel High-reliability surge protector
CN110492463A (en) * 2019-09-29 2019-11-22 厦门赛尔特电子有限公司 A kind of surge protection device with high breaking capacity

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Granted publication date: 20141126