CN105180322B - Store wet device and store the control method and air conditioner of wet device - Google Patents
Store wet device and store the control method and air conditioner of wet device Download PDFInfo
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- CN105180322B CN105180322B CN201510553315.3A CN201510553315A CN105180322B CN 105180322 B CN105180322 B CN 105180322B CN 201510553315 A CN201510553315 A CN 201510553315A CN 105180322 B CN105180322 B CN 105180322B
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- fan
- heat sink
- wet device
- cold end
- voltage
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F6/00—Air-humidification, e.g. cooling by humidification
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/54—Free-cooling systems
Abstract
Wet device and a kind of control method for storing wet device are stored the invention discloses a kind of.The wet device of storage includes heat exchange module, the first fan, harvester and controller.The heat exchange module includes multiple semiconductor chilling plates, cold end is heat sink and multiple second fans.The harvester is used to gather indoor temperature and indoor relative humidity.The controller is used for according to indoor temperature and indoor relative humidity control the first fan, semiconductor chilling plate, cold end is heat sink and the second fan work.In the above-mentioned wet device of storage, the vapor that controller can ensure to enter in the heat sink air of cold end is condensed into water on cold end is heat sink as much as possible, and the condensed water on cold end is heat sink can be collected by collection vessel, ensure that the cleanliness factor and moisture storage amount for the water for storing wet device.It is described to store wet device available for the humidification device of air conditioner to reach the effect of indoor humidification.Invention additionally discloses a kind of air conditioner.
Description
Technical field
The present invention relates to air conditioner technical field, more particularly to a kind of wet device of storage and a kind of control method for storing wet device
A kind of and air conditioner.
Background technology
Current air conditioner generally improves the water content of room air by being provided with water humidifier, but humidifier pair adds
The quality requirements of the water entered are harsh, otherwise easily cause humidifier to produce deposit, so as to reduce the performance of humidifier and life-span.
And deposit caused by humidifier needs artificial periodic cleaning, experience and the satisfaction of user are reduced.
The content of the invention
It is contemplated that at least solves one of technical problem present in prior art.Therefore, the present invention provides a kind of store
Wet device and a kind of control method for storing wet device and a kind of air conditioner.
The wet device of storage of embodiment of the present invention includes heat exchange module, the first fan, harvester and controller.It is described to change
Thermal modules include multiple semiconductor chilling plates, cold end is heat sink and multiple second fans.The semiconductor chilling plate includes opposite
Chill surface and heating face.The cold end is heat sink to be connected with the chill surface.Multiple second fans are arranged at the heating face
Side.First fan is arranged at the heat sink side of the cold end.The harvester is used to gather indoor temperature and indoor phase
To humidity.The controller connects with the semiconductor chilling plate, first fan, second fan and the harvester
Connect.The controller is used for the first electricity that first fan is calculated according to the indoor temperature and the indoor relative humidity
Pressure, and calculate the quantity of the semiconductor chilling plate and the quantity of second fan for needing work.The controller is used to control
Make first fan and the semiconductor chilling plate for needing work and second fan are run and opened by the first voltage.
In the above-mentioned wet device of storage, controller controls turning for the first fan by controlling the first voltage of the first fan
Speed, and then control and be sent into the heat sink air quantity of cold end；After unlatching needs the semiconductor chilling plate and the second fan of work, controller
The vapor that can ensure to enter in the heat sink air of cold end is condensed into water on cold end is heat sink as much as possible, on cold end is heat sink
Condensed water can be collected by collection vessel, ensure that the cleanliness factor and moisture storage amount for the water for storing wet device.The wet device of storage can
For the humidification device of air conditioner to reach the effect of indoor humidification.
In some embodiments, the wet device of storage also includes water collector, first fan and the water collector position
In the both sides that the cold end is heat sink, the water collector is used to collect from the heat sink water of the cold end.First fan and institute
State includes air inlet and air outlet between water collector formed with air channel, the air channel.The controller be preset with leaving air temp and
Air-out relative humidity, the controller are used for according to the indoor temperature, the indoor relative humidity, the leaving air temp and institute
The heat sink institute's required airflow of cold end described in air-out relative humidity calculation is stated, and then calculates the first voltage.
In some embodiments, the controller is used for the heat sink refrigeration of the cold end according to the required Wind Coverage Calculation
Amount, and then calculate the quantity of the semiconductor chilling plate and second fan that need work.
In some embodiments, the controller is additionally operable to, and the semiconductor chilling plate and the institute of work are needed in unlatching
After stating second the first preset time of fan, close the semiconductor chilling plate for needing work and second fan and heighten described
First voltage is to second voltage.The controller is additionally operable to control first fan to run second under the second voltage pre-
If after the time, first fan is controlled to be run by the first voltage and open the semiconductor chilling plate for needing work and institute
State the second fan.
In some embodiments, the second voltage is the ceiling voltage of the first fan safe operation.
In some embodiments, second preset time is less than first preset time.
The control method of the wet device of storage of embodiment of the present invention, the wet device of storage include heat exchange module and the first wind
Fan, the heat exchange module includes multiple semiconductor chilling plates, cold end is heat sink and multiple second fans, the semiconductor chilling plate bag
Opposite chill surface and heating face are included, the cold end is heat sink to be connected with the chill surface, and the multiple second fan is located at described
Heating face side, first fan are located at the heat sink side of the cold end, and the control method for storing wet device includes following step
Suddenly：
S1, gather indoor temperature and indoor relative humidity；
S2, first voltage and the calculating of first fan are calculated according to the indoor temperature and the indoor relative humidity
Need the quantity of the semiconductor chilling plate of work and the quantity of second fan；And
S3, control first fan run and open by the first voltage semiconductor chilling plate that needs work and
Second fan.
In some embodiments, the wet device of storage also includes water collector, first fan and the water collector position
Include air intake formed with air channel, the air channel between the both sides that the cold end is heat sink, first fan and the water collector
Mouth and air outlet, the step S2 include：
S21 is relative according to the indoor temperature, the indoor relative humidity, default leaving air temp and default air-out
Humidity calculates the heat sink institute's required airflow of the cold end；And
S22, according to first voltage described in the required Wind Coverage Calculation.
In some embodiments, the step S2 also includes：
S23, according to the refrigerating capacity that cold end described in the required Wind Coverage Calculation is heat sink；And
S24, the quantity of the semiconductor chilling plate and second fan that need work is calculated according to the refrigerating capacity.
In some embodiments, the control method is further comprising the steps of：
S4, after unlatching needs the semiconductor chilling plate and the preset time of the second fan first of work, closing needs
Work the semiconductor chilling plate and second fan and heighten first fan first voltage improve to second electricity
Pressure, first fan runs the second preset time by the second voltage, afterwards into step S5；And
S5, first fan is controlled to be run by the first voltage and return to the step S4.
In some embodiments, the second voltage is the ceiling voltage of the second fan safe operation.
In some embodiments, second preset time is less than first preset time.
The air conditioner of embodiment of the present invention includes the above-described wet device of storage.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
Obtain substantially, or recognized by the practice of the present invention.
Brief description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the accompanying drawings below to embodiment by change
Obtain substantially and be readily appreciated that, wherein：
Fig. 1 is the module diagram of the wet device of storage of embodiment of the present invention.
Fig. 2 is the structural representation of the wet device of storage of embodiment of the present invention.
Fig. 3 is the distribution schematic diagram of the second fan of the wet device of storage of embodiment of the present invention.
Fig. 4 is the structural representation of the groove of the fin of the wet device of storage of embodiment of the present invention.
Fig. 5 is the flow chart of the control method of the wet device of storage of embodiment of the present invention.
Fig. 6 is the step S2 of the control method of the wet device of storage of embodiment of the present invention flow chart.
Embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning
Same or similar element is represented to same or similar label eventually or there is the element of same or like function.Below by ginseng
The embodiment for examining accompanying drawing description is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise " are based on orientation shown in the drawings or position relationship, are for only for ease of
Description is of the invention to be described with simplified, rather than the device or element of instruction or hint meaning must be with specific orientation, Yi Te
Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, and it is not intended that instruction or hint relative importance or the implicit quantity for indicating indicated technical characteristic.
Thus, " first " is defined, the feature of " second " can be expressed or implicitly includes one or more feature.
In description of the invention, " multiple " are meant that two or more, unless otherwise specifically defined.
In the description of the invention, it is necessary to illustrate, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected；Can
To be mechanical connection or electrical connection or can mutually communicate；Can be joined directly together, can also be by between intermediary
Connect connected, can be connection or the interaction relationship of two elements of two element internals.For the ordinary skill of this area
For personnel, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it " under "
Can directly it be contacted including the first and second features, it is not directly to contact but pass through it that can also include the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " to include first special
Sign is directly over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " fisrt feature that includes are directly over second feature and oblique upper, or be merely representative of
Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to
Simplify disclosure of the invention, hereinafter the part and setting of specific examples are described.Certainly, they are only example, and
And purpose does not lie in the limitation present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, between itself not indicating discussed various embodiments and/or setting
Relation.In addition, the invention provides various specific techniques and material examples, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
Refer to Fig. 1 and Fig. 2, the wet device 100 of storage of embodiment of the present invention include heat exchange module 10, the first fan 20,
Harvester 50 and controller 60.Heat exchange module 10 includes multiple semiconductor chilling plates 11, cold end is heat sink 12 and multiple second wind
Fan 14.Semiconductor chilling plate 11 includes opposite chill surface 11a and heating face 11b.Cold end is heat sink 12 to be connected with chill surface 11a.
Multiple second fans 14 are arranged at heating face 11b sides.First fan 20 is arranged at heat sink 12 side of cold end.Harvester 50 is used
In collection indoor temperature T1 and indoor relative humidity RH1.
Controller 60 is connected with semiconductor chilling plate 11, the first fan 20, the second fan 14 and harvester 50.Controller
60 are used for the first voltage V1 according to indoor temperature T1 and indoor relative humidity RH1 the first fans 20 of calculating, and calculating needs work
The quantity of semiconductor chilling plate 11 and the quantity of the second fan 14.Controller 60 is used to control the first fan 20 to press first voltage
V1 runs and opened the fan 14 of semiconductor chilling plate 11 and second for needing work.
In the wet device 100 of storage of embodiment of the present invention, controller 60 pass through control the first fan 20 first voltage V1
So as to control the rotating speed of the first fan 20, and then control the air quantity for being sent into cold end heat sink 12；Partly leading for work is needed opening
After the fan 14 of body cooling piece 11 and second, controller 60 can ensure as more as possible into the vapor in the air of cold end heat sink 12
Ground is condensed into water in cold end heat sink 12, and the condensed water in cold end heat sink 12 can be collected by collection vessel, ensure that storage is wet
The cleanliness factor and moisture storage amount of the water of device 100.Wet device 100 is stored available for the humidification device of air conditioner to reach indoor humidification
Effect.
Specifically, also include hot junction heat sink 13 also referring to Fig. 2~4, heat exchange module 10, hot junction is heat sink 13 with heating face
11b connections.Second fan 14 is arranged at heat sink 13 side in hot junction.
Hot junction is heat sink 13 to include first substrate 131 and multiple first fin 132.Multiple first fin 132 are with partly leading
Body cooling piece 11 is connected on two opposite surfaces of first substrate 131.First substrate 131 is square, multiple edges of second fan 14
The diagonal of first substrate 131 is set.Multiple semiconductor chilling plates 11 are evenly distributed on cold end heat sink 12 and hot junction is heat sink
Between 13.
It should be understood that semiconductor chilling plate 11 can also be in ranks formal distribution, such as semiconductor chilling plate 11 is divided into
Two rows are arranged between hot junction heat sink 13 and cold end heat sink 12.Certainly, semiconductor chilling plate 11 can also circumferentially formal distribution
Between hot junction heat sink 13 and cold end heat sink 12.
When in the winter time using wet 100 water storage of device is stored, the heat of the second fan 14 discharge can be directly entered interior, so as to
Improve indoor temperature.Second fan 14 can also be connected with outdoor, and heat caused by hot junction heat sink 13 is exhausted directly into outdoor,
Avoid the local temperature for storing wet device 100 too high, influence to store the normal work of wet device 100.
First fan 20 from outdoor suction air when first fan 20 rotates, further, can store wet device outside communication chamber
100 are provided with air cleaner (not shown) to filter the air into cold end heat sink 12, such as the air is the first fan 20
From the air of outdoor suction.One aqueous vapor come in the air of the first fan 20 suction is condensed into aqueous water after cold end heat sink 12
Flow into collection vessel, two air to suck can be taken a breath with interior, so as to keep the freshness of room air.
Harvester 50 includes temperature sensor 51 and humidity sensor 52, and temperature sensor 51 is used to gather indoor temperature
T1 simultaneously sends indoor temperature T1 signals to controller 60, and humidity sensor 52 is used to gathering indoor relative humidity RH1 and by room
Interior relative humidity RH1 signals send controller 60 to.Controller 60 receives indoor temperature T1 signals and indoor relative humidity RH1 letters
Number and calculate the first fan 20 first voltage V1, and calculate need work semiconductor chilling plate 11 quantity and the second fan 14
Quantity.
In the present embodiment, storing wet device 100 also includes water collector 30, and the first fan 20 and water collector 30 are located at cold end
Heat sink 12 both sides, water collector 30 are used to collect the water from cold end heat sink 12.Formed between first fan 20 and water collector 30
There is air channel 40, air channel 40 includes air inlet and air outlet.Controller 60 is preset with leaving air temp T2 and air-out relative humidity RH2,
Controller 60 is used for cold according to indoor temperature T1, indoor relative humidity RH1, leaving air temp T2 and air-out relative humidity RH2 calculating
Heat sink 12 institute required airflow F is held, and then calculates first voltage V1.
In this way, controller 60 can accurately calculate the operating voltage of the first fan 20.For example, controller 60 prestores respectively
Enthalpy and water capacity corresponding to kind temperature and relative humidity, controller 60 are true according to indoor temperature T1 and indoor relative humidity RH1
Enthalpy corresponding to fixed is H1 and water capacity is D1.
According to experiment and experience, cold end is heat sink, and 12 maximum moisture storage amount X can be calculated by below equation:
X=D1/K1；
In formula, X is the maximum moisture storage amount of cold end heat sink 12；
D1 is water capacity corresponding to indoor temperature T1 and indoor relative humidity RH1；
K1 is design factor, and K1 scope is [0,1].
According to experiment gained, as K1=0.17, the wet effect of storage for storing wet device 100 is preferable.
In one example, the predeterminable leaving air temp T2 of controller 60 is 0 DEG C, and air-out relative humidity RH2 is 100%, then
Enthalpy H2 corresponding to the determination of controller 60 is 9.43J/kg, and enthalpy D2 is 3.77g/kg.
Cold end is heat sink, and 12 institute required airflow F calculates according to below equation：
Institute's required airflow=maximum moisture storage amount/water capacity difference,
That is F=X/ (D1-D2)=X/ (D1-3.77)；
In formula, F for cold end heat sink 12 institute's required airflow；
X is the maximum moisture storage amount of cold end heat sink 12；
D1 is the water capacity determined according to indoor temperature T1 and indoor relative humidity RH1；
D2 is the water capacity determined according to leaving air temp T2 and air-out relative humidity RH2.
Due to being linear relationship, i.e. F1=K2*V between the air quantity F1 and voltage V of the first fan 20, K2 is constant.Cold end
Heat sink 12 institute required airflow F is equal to the air quantity F1 of the first fan 20, i.e., can calculate determination according to the institute required airflow F of cold end heat sink 12
The first voltage V1 of first fan 20.
In other embodiments, the first fan 20 can be multiple that voltage when each first fan 20 works can be kept
It is constant, by increasing or decreasing the quantity of the first fan 20 work so that the air quantity for being sent into air channel 40 is equal to institute required airflow F.
It should be noted that in present embodiment, the first fan 20 and water collector 30 are arranged at the opposite of cold end heat sink 12
Both sides, for example, incorporated by reference to Fig. 2, the first fan 20 is arranged at the upside of cold end heat sink 12, and water collector 30 is arranged at cold end heat
Heavy 12 downside.Certainly, in other embodiments, the first fan 20 and water collector 30 can also be arranged at cold end heat sink 12
The both sides of connection, for example, the first fan 20 be arranged at cold end heat sink 12 rear side (as shown in the figure to that side of paper) and water collector
30 are arranged at the downside of cold end heat sink 12.
Specifically, the first heat exchange group 10a and the second heat exchange group 10b is included incorporated by reference to Fig. 2~4, heat exchange module 10, first changes
Heat group 10a and the second heat exchange group 10b is located at the both sides in air channel 40.First heat exchange group 10a and the second heat exchange group 10b includes multiple
Semiconductor chilling plate 11.First heat exchange group 10a and the second heat exchange group 10b are symmetrical arranged approximately along air channel 40.
Cold end is heat sink 12 to include second substrate 121 and multiple second fin 122.Second substrate 121 includes opposite the
One side and second side.Multiple second fin 122 are arranged in first side, and second side is connected with chill surface 11a.The
Two substrates 121 are vertically arranged, and multiple interval verticals of second fin 122 are in second substrate 121.Second fin 122 can be with
Second substrate 121 is integrally formed and is tabular or strip.In other embodiments, multiple second fin 122 can be to collection
Hydrophone 30 is formed slopely certain angle so that the water being condensate on the second fin 122 is smoothly flowed in water collector 30.
Second one end of fin 122 away from second substrate 121 is provided with groove 1221 and groove 1221 scribbles water wetted material.
Water wetted material (such as polyacrylic acid) is the material that a kind of intramolecular carries polar group, has very big affinity to water, easily
It is spontaneously wet out by water.In this way, water wetted material can condense the small water-drop-shaped of surrounding into the larger water droplet of volume, under gravity,
Water droplet departs from the surface of the second fin 122 and dropped onto in water collector 30, and the condensed water on the second fin 122 of guarantee is to greatest extent
Ground is flowed in water collector 30.
In the present embodiment, controller 60 is used for the refrigerating capacity Q that cold end heat sink 12 is calculated according to institute required airflow F, and then
Calculate the quantity for the fan 14 of semiconductor chilling plate 11 and second for needing work.
In this way, controller 60 can accurately control the quantity for the fan 14 of semiconductor chilling plate 11 and second for needing work.
Need the amount computing process of the fan 14 of semiconductor chilling plate 11 and second of work as follows：
Cold end is heat sink, and 12 refrigerating capacity Q can be calculated by below equation：
Refrigerating capacity=institute's required airflow × enthalpy is poor,
That is Q=F × (H1-H2)；
In above formula, Q is the refrigerating capacity Q of cold end heat sink 12；
F is institute's required airflow；
H1 is the enthalpy determined according to indoor temperature T1 and indoor relative humidity RH1；
H2 is the enthalpy determined according to leaving air temp T2 and air-out relative humidity RH2.
Because the refrigerating capacity of each semiconductor chilling plate 11 is certain, therefore, can be determined according to the refrigerating capacity Q of cold end heat sink 12
Need the quantity of the semiconductor chilling plate 11 of work.
The refrigerating capacity and heating capacity of semiconductor chilling plate 11 are equal, and the heating capacity of semiconductor chilling plate 11 passes through the second wind
The discharge of fan 14, the total blast volume of the second fan 14 can be calculated according to below equation：
F2=3600 × 3Q/ (C × ρ × 10)；
In formula, F2 is the total blast volume of the second fan 14；
Q is the refrigerating capacity of cold end heat sink 12；
C is air specific heat capacity；
ρ is atmospheric density.
Because the air quantity of each second fan 14 is certain, can be calculated according to the total blast volume F2 of the second fan 14 needs work
The second fan 14 quantity.
In other embodiments, can be by the voltage of the second fan 14 of control, so as to control single second fan 14
Air quantity, and then the rate of heat dispation of the second fan 14 is controlled, ensure the refrigerating capacity of semiconductor chilling plate 11.
In the present embodiment, controller 60 is additionally operable to, and the fan of semiconductor chilling plate 11 and second of work is needed in unlatching
After 14 first preset time ts 1, close the fan 14 of semiconductor chilling plate 11 and second for needing work and heighten first voltage V1 to the
Two voltage V2.Controller 60 is additionally operable to after controlling the first fan 20 to run the second preset time t 2 under second voltage V2, control
First fan 20 is run and opened the fan 14 of semiconductor chilling plate 11 and second for needing work by first voltage V1.
Specifically, when semiconductor chilling plate 11 works, the vapor in air may directly be melted into frost knot in cold end heat
On heavy 12, when the frost layer in cold end heat sink 12 thickeies, the poor refrigerating efficiency of semiconductor chilling plate 11 can be caused, can not be cold in time
Vapor in solidifying air, so as to cannot be guaranteed the water in water collector 30.Therefore, need the semiconductor chilling plate 11 of work and
After second fan 14 runs the first preset time t 1, controller 60 closes the fan of semiconductor chilling plate 11 and second for needing work
14, the first voltage V1 of the first fan 20 is heightened, so that frost of the knot in cold end heat sink 12 can be in the second preset time t 2
It is melted into water and flows into water collector 30.Afterwards, controller 60, which controls the first fan 20 to be run and opened by first voltage V1, needs work
The fan 14 of semiconductor chilling plate 11 and second.In this way, the frost be advantageous in cold end heat sink 12 is melted into water and flows to collection in time
In hydrophone 30, so as to ensure the abundance of the water in water collector 30.
In the present embodiment, it is preferred that the second voltage V2 of the first fan 20 be the safe operation of the first fan 20 most
High voltage.For example, the operating voltage range of the first fan 20 is 40V~60V, the first fan 20 is determined according to institute required airflow F
After first voltage V1 is 45V, the second voltage V2 of the first fan 20 can be improved to 60V.Improve the operating voltage of the first fan 20
Afterwards, the first fan 20 is accelerated to rotate, and so as to accelerate the air flow in air channel 40, and then it is heat sink in cold end to accelerate thawing formation
Frost on 12.
In the present embodiment, it is preferred that the second preset time t 2 is less than the first preset time t 1.
Because the speed for 12 defrost that the cold end for storing wet device 100 is heat sink is faster than the speed of frosting, controller 60 controls
Cold end is heat sink 12 the defrost time (i.e. the second preset time t 2) be advantageous to less than heat pamp (i.e. the first preset time t 1) it is cold
Hold the process of heat sink 12 defrost continuous, so as to ensure to flow into the water abundance in water collector 30, in addition, can also avoid semiconductor
The frequent starting of 11 and second fan of cooling piece 14 is so as to reducing the life-span of itself.
It is set to 30~120 minutes for example, working as the first preset time t 1, when the second preset time t 2 is set to 3~5 minutes, stores
Wet device 100, which has, preferably stores wet effect.That is, the fan 14 of semiconductor chilling plate 11 and second of work is needed to run 30
Stop after~120 minutes, the first fan 20 is adjusted to second voltage V2 operations 3~5 minutes by first voltage V1, then the first fan
20, which are adjusted to first voltage V1, works and opens the fan 14 of semiconductor chilling plate 11 and second for needing work, so circulation, ensures
Sufficient water is flowed into water collector 30.
Referring to Fig. 5, embodiment of the present invention provides a kind of control method for storing wet device.The wet dress of storage of present embodiment
The control method put can be realized by the wet device 100 of storage of embodiment of above.The control method comprises the following steps：
S1, gather indoor temperature T1 and indoor relative humidity RH1；
S2, the first voltage V1 of the first fan 20 is calculated according to indoor temperature T1 and indoor relative humidity RH1 and calculates need
The quantity of the quantity of the semiconductor chilling plate 11 of work and the second fan 14；And
S3, the first fan 20 of control are run and opened the wind of semiconductor chilling plate 11 and second for needing work by first voltage V1
Fan 14.
In step sl, temperature sensor 51 gathers indoor temperature T1, and humidity sensor 52 gathers indoor relative humidity
RH1。
In step s 2, the controller 60 for storing wet device 100 prestores the voltage for calculating the first fan 20 and needs work
The algorithm of the quantity of semiconductor chilling plate 11 and the quantity of the second fan 14, controller 60 receive indoor temperature T1 and the room of collection
The first voltage V1 of corresponding first fan 20 can be calculated after interior relative humidity RH1 signal and needs the semiconductor system of work
The quantity of the quantity of cold 11 and the second fan 14.
In step s3, it is necessary to illustrate, it is determined that needing the quantity of the fan 14 of semiconductor chilling plate 11 and second of work
Afterwards, controller 60 can arbitrarily choose the fan 14 of semiconductor chilling plate 11 and second.For example, the total quantity of semiconductor chilling plate 11 is
6, the total quantity of the second fan 14 is 8, and it is 3 to need the quantity of the semiconductor chilling plate 11 of work, needs the second of work
The quantity of fan 14 is 4, then controller 60 can control any 3 semiconductor chilling plates 11 from 6 semiconductor chilling plates 11
Work, can control any 4 the second fans 14 to work from 8 the second fans 14.
Referring to Fig. 6, in the present embodiment, step S2 includes：
S21 is relatively wet according to indoor temperature T1, indoor relative humidity RH1, default leaving air temp T2 and default air-out
Spend the institute required airflow F that RH2 calculates cold end heat sink 12；And
S22, first voltage V1 is calculated according to institute required airflow F.
In the step s 21, before the wet device 100 of storage is opened, leaving air temp T2 and air-out relative humidity RH2 can first be set；
The institute required airflow F of cold end heat sink 12 is calculated using procedure below：
If indoor temperature is T1, indoor relative humidity RH1, leaving air temp T2, air-out relative humidity is RH2, then
X=D1/K1；
In formula, X is the maximum moisture storage amount of cold end heat sink 12；
D1 is the water capacity determined according to indoor temperature T1 and indoor relative humidity RH1；
K1 is design factor, and K1 scope is [0,1].
F=X/ (D1-D2),
In formula, F for cold end heat sink 12 institute's required airflow；
X is the maximum moisture storage amount of cold end heat sink 12；
D1 is the water capacity determined according to indoor temperature T1 and indoor relative humidity RH1；
D2 is the water capacity determined according to leaving air temp T2 and air-out relative humidity RH2.
In step S22, the rotating speed of the first fan 20 can determine that according to the institute required airflow F of cold end heat sink 12, and then calculate
Determine the first voltage V1 of the first fan 20.Due to being linear relationship, i.e. F1=between the air quantity F1 and voltage V of the first fan 20
K2*V, K2 are constant.Cold end is heat sink 12 institute required airflow F be equal to the first fan 20 air quantity F1, i.e., according to cold end heat sink 12
Institute required airflow F can calculate the first voltage V1 for determining the first fan 20.
In the present embodiment, step S2 also includes：
S23, the refrigerating capacity Q of cold end heat sink 12 is calculated according to institute required airflow F；And
S24, the quantity for the fan 14 of semiconductor chilling plate 11 and second for needing work is calculated according to refrigerating capacity Q.
In step S23, cold end is heat sink, and 12 refrigerating capacity Q can calculate according to below equation：
Q=F × (H1-H2)；
In formula, F for cold end heat sink 12 institute's required airflow；
H1 is the enthalpy determined according to indoor temperature T1 and indoor relative humidity RH1；
H2 is the enthalpy determined according to leaving air temp T2 and air-out relative humidity RH2.
In step s 24, the refrigerating capacity of each semiconductor chilling plate 11 and the rate of heat dispation of each second fan 14 are certain,
Accordingly, it can be determined that the refrigerating capacity and the heating capacity in hot junction heat sink 13 that are delivered in cold end heat sink 12, so as to heat sink according to cold end
12 refrigerating capacity Q determines to need the quantity of the fan 14 of semiconductor chilling plate 11 and second of work.
Referring to Fig. 5, in the present embodiment, control method is further comprising the steps of：
S4, after unlatching needs the preset time t 1 of 11 and second fan of semiconductor chilling plate 14 first of work, closing needs work
The fan 14 of semiconductor chilling plate 11 and second of work and heighten the first voltage V1 of the first fan 20 and improve to second voltage V2,
One fan 20 runs the second preset time t 2 by second voltage V2, afterwards into step S5；And
S5, the first fan 20 of control is by first voltage V1 operations and return to step S4.
In step s 4, the frost in cold end heat sink 12 can be melted into water in the second preset time t 2 and flow into water collector
30。
In step s 5, the first fan 20 is adjusted to the first electricity by second voltage V2 after the frost in cold end heat sink 12 melts completely
V1 is pressed, wet device 100 is stored and repeats step S4 and S5, so as to ensure the abundance of the water in water collector.
Further, second voltage V2 is the ceiling voltage of the safe operation of the second fan 14.
In this way, the first fan 20 so as to accelerate the air flow in air channel 40, and then is accelerated with most fast rotational speed
Melt the frost formed in cold end heat sink 12.It is preferred that the second preset time t 2 is less than the first preset time t 1.
In this way, the defrost process for being advantageous to cold end heat sink 12 is continuous, so as to ensure to flow into the water abundance in water collector 30.
Other not deployed parts of the control method of the wet device of storage of present embodiment can join the storage of embodiment of above
The same or like part of wet device 100, will not be repeated here.
In summary, the control method of the wet device 100 of storage of embodiment of the present invention can ensure that storing wet device 100 collects
Water quality and moisture storage amount, store wet device 100 be used for air conditioner humidification device after can ensure having abundant water resources for humidification device
And quality is good.
The air conditioner of embodiment of the present invention includes the wet device 100 of storage of the above.Therefore, air conditioner can realize Interior Space
The effect of gas humidification, so as to improve indoor environment, improve user satisfaction.
In the description of this specification, reference term " embodiment ", " some embodiments ", " schematically implementation
The description of mode ", " example ", " specific example " or " some examples " etc. means with reference to the embodiment or example description
Specific features, structure, material or feature are contained at least one embodiment or example of the present invention.In this specification
In, identical embodiment or example are not necessarily referring to the schematic representation of above-mentioned term.Moreover, the specific spy of description
Sign, structure, material or feature can combine in an appropriate manner in any one or more embodiments or example.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that：
These embodiments can be carried out with a variety of changes, modification in the case of not departing from the principle and objective of the present invention, replace and become
Type, the scope of the present invention are limited by claim and its equivalent.
Claims (13)
1. one kind stores wet device, including the first fan and heat exchange module, the heat exchange module include multiple semiconductor chilling plates and
Cold end is heat sink, and the semiconductor chilling plate includes opposite chill surface and heating face；The cold end is heat sink to be connected with the chill surface
Connect, first fan is located at the heat sink side of the cold end, it is characterised in that the heat exchange module includes being located at the heating face
Multiple second fans of side；
The wet device of storage includes：
Harvester, the harvester are used to gather indoor temperature and indoor relative humidity；And
The controller being connected with the semiconductor chilling plate, first fan, second fan and the harvester, institute
State the first voltage that controller is used to calculate first fan according to the indoor temperature and the indoor relative humidity, and meter
Calculating needs the quantity of the semiconductor chilling plate and the quantity of second fan of work；
The controller is for controlling first fan to be run by the first voltage and opening the semiconductor for needing work
Cooling piece and second fan.
2. wet device is stored as claimed in claim 1, it is characterised in that it is described to store wet device and also include water collector, described first
Fan and the water collector are located at the heat sink both sides of the cold end, and it is heat sink from the cold end that the water collector is used for collection
Water；
Include air inlet and air outlet formed with air channel, the air channel between first fan and the water collector；
The controller is preset with leaving air temp and air-out relative humidity, and the controller is used for according to the indoor temperature, institute
Indoor relative humidity, the leaving air temp and the heat sink institute's required airflow of cold end described in the air-out relative humidity calculation are stated, and then
Calculate the first voltage.
3. wet device is stored as claimed in claim 2, it is characterised in that the controller is used for according to the required Wind Coverage Calculation
The refrigerating capacity that the cold end is heat sink, and then calculate the quantity of the semiconductor chilling plate and second fan that need work.
4. wet device is stored as claimed in claim 1, it is characterised in that the controller is additionally operable to, and the institute of work is needed in unlatching
After stating semiconductor chilling plate and the preset time of the second fan first, closing needs the semiconductor chilling plate of work and described
Second fan simultaneously heightens the first voltage to second voltage；
The controller is additionally operable to after controlling first fan to run the second preset time under the second voltage, controls institute
State the first fan and the semiconductor chilling plate for needing work and second fan are run and opened by the first voltage.
5. wet device is stored as claimed in claim 4, it is characterised in that the second voltage is the first fan safe operation
Ceiling voltage.
6. wet device is stored as claimed in claim 4, it is characterised in that when second preset time is default less than described first
Between.
7. a kind of control method for storing wet device, the wet device of storage includes heat exchange module and the first fan, the heat exchange module
Including multiple semiconductor chilling plates, cold end is heat sink and multiple second fans, and the semiconductor chilling plate includes opposite chill surface
And heating face, the cold end is heat sink to be connected with the chill surface, and the multiple second fan is located at the heating face side, described
First fan is located at the heat sink side of the cold end, it is characterised in that the control method for storing wet device comprises the following steps：
S1, gather indoor temperature and indoor relative humidity；
S2, calculating the first voltage of first fan and calculating according to the indoor temperature and the indoor relative humidity needs work
The quantity of the semiconductor chilling plate and the quantity of second fan made；And
S3, control first fan that the semiconductor chilling plate that needs work and described is run and opened by the first voltage
Second fan.
8. the control method of wet device is stored as claimed in claim 7, it is characterised in that described to store wet device also including catchmenting
Device, first fan and the water collector are located at the heat sink both sides of the cold end, first fan and the water collector it
Between formed with air channel, the air channel include air inlet and air outlet, the step S2 includes：
S21, according to the indoor temperature, the indoor relative humidity, default leaving air temp and default air-out relative humidity
Calculate the heat sink institute's required airflow of the cold end；And
S22, according to first voltage described in the required Wind Coverage Calculation.
9. the control method of wet device is stored as claimed in claim 8, it is characterised in that the step S2 also includes：
S23, according to the refrigerating capacity that cold end described in the required Wind Coverage Calculation is heat sink；And
S24, the quantity of the semiconductor chilling plate and second fan that need work is calculated according to the refrigerating capacity.
10. the control method of wet device is stored as claimed in claim 7, it is characterised in that the control method for storing wet device
It is further comprising the steps of：
S4, after unlatching needs the semiconductor chilling plate and the preset time of the second fan first of work, closing needs work
The semiconductor chilling plate and second fan and heighten the first voltage of first fan and improve to second voltage, institute
State the first fan and run the second preset time by the second voltage, afterwards into step S5；And
S5, first fan is controlled to be run by the first voltage and return to the step S4.
11. the control method of wet device is stored as claimed in claim 10, it is characterised in that the second voltage is described first
The ceiling voltage of fan safe operation.
12. the control method of wet device is stored as claimed in claim 10, it is characterised in that second preset time is less than institute
State the first preset time.
13. a kind of air conditioner, it is characterised in that including the wet device of storage as described in any one of claim 1~6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510553315.3A CN105180322B (en) | 2015-08-31 | 2015-08-31 | Store wet device and store the control method and air conditioner of wet device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510553315.3A CN105180322B (en) | 2015-08-31 | 2015-08-31 | Store wet device and store the control method and air conditioner of wet device |
Publications (2)
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| CN105180322A CN105180322A (en) | 2015-12-23 |
| CN105180322B true CN105180322B (en) | 2018-03-09 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6099112B1 (en) * | 2016-09-12 | 2017-03-22 | 株式会社 テクノミライ | Digital smart energy saving system, method and program |
| CN113432217B (en) * | 2021-06-25 | 2022-11-11 | 青岛海信日立空调系统有限公司 | Air purification device and air conditioner |
| CN115143547A (en) * | 2022-08-08 | 2022-10-04 | 珠海格力电器股份有限公司 | Dehumidifier and dehumidification method |
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|---|---|---|---|---|
| US6101815A (en) * | 1998-11-09 | 2000-08-15 | General Electric Company | Thermo-electrical dehumidifier |
| CN102692113A (en) * | 2012-06-29 | 2012-09-26 | 广东富信电子科技有限公司 | Humidity adjusting method and device for semiconductor refrigeration box |
| KR101205301B1 (en) * | 2012-04-26 | 2012-11-28 | (주)예네 | dehumidification device using thermoelectric element |
| CN203147938U (en) * | 2013-03-15 | 2013-08-21 | 苏州卫生职业技术学院 | Semiconductor dehumidifier |
| CN104848446A (en) * | 2014-02-19 | 2015-08-19 | 美的集团股份有限公司 | Humidifying device and air conditioner applying same |
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2015
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6101815A (en) * | 1998-11-09 | 2000-08-15 | General Electric Company | Thermo-electrical dehumidifier |
| KR101205301B1 (en) * | 2012-04-26 | 2012-11-28 | (주)예네 | dehumidification device using thermoelectric element |
| CN102692113A (en) * | 2012-06-29 | 2012-09-26 | 广东富信电子科技有限公司 | Humidity adjusting method and device for semiconductor refrigeration box |
| CN203147938U (en) * | 2013-03-15 | 2013-08-21 | 苏州卫生职业技术学院 | Semiconductor dehumidifier |
| CN104848446A (en) * | 2014-02-19 | 2015-08-19 | 美的集团股份有限公司 | Humidifying device and air conditioner applying same |
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| CN105180322A (en) | 2015-12-23 |
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