CN105180322A - Humidity storage device, control method of humidity storage device and air conditioner - Google Patents
Humidity storage device, control method of humidity storage device and air conditioner Download PDFInfo
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- CN105180322A CN105180322A CN201510553315.3A CN201510553315A CN105180322A CN 105180322 A CN105180322 A CN 105180322A CN 201510553315 A CN201510553315 A CN 201510553315A CN 105180322 A CN105180322 A CN 105180322A
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- fan
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- semiconductor chilling
- heat sink
- chilling plate
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F6/00—Air-humidification, e.g. cooling by humidification
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/54—Free-cooling systems
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Abstract
The invention discloses a humidity storage device and a control method of the humidity storage device. The humidity storage device comprises a heat exchange module, a first fan, a collection device and a controller, wherein the heat exchange module comprises a plurality of semiconductor chilling plates, cold side heat sinks and a plurality of second fans; the collection device is used for collecting the indoor temperature and the indoor relative humidity; and the controller is used for controlling the first fan, the semiconductor chilling plates, the cold side heat sinks and the second fans to work according to the indoor temperature and the indoor relative humidity. According to the humidity storage device, the controller enables vapour in air entering the cold side heat sinks to condensate on the cold side heat sinks to form water as much as possible; condensate water on the cold side heat sinks can be collected by a collection container, so that the cleanliness of water in the humidity storage device and the humidity storage amount can be ensured; the humidity storage device can be used for a humidification device of an air conditioner to reach the indoor humidification effect. The invention also discloses an air conditioner.
Description
Technical field
The present invention relates to air-conditioner technical field, particularly relate to and a kind ofly store wet device and a kind ofly store the control method of wet device and a kind of air-conditioner.
Background technology
Current air-conditioner improves the water content of room air usually by being provided with water humidifier, but humidifier is harsh to the quality requirements of the water added, otherwise easily causes humidifier to produce deposit, thus reduces performance and the life-span of humidifier.And the deposit that humidifier produces needs human at periodic intervals to clear up, and reduces experience and the satisfaction of user.
Summary of the invention
The present invention is intended at least to solve one of technical problem existed in prior art.For this reason, the invention provides and a kind ofly store wet device and a kind ofly store the control method of wet device and a kind of air-conditioner.
The wet device that stores of embodiment of the present invention comprises heat exchange module, the first fan, harvester and controller.Described heat exchange module comprises multiple semiconductor chilling plate, cold junction is heat sink and multiple second fan.Described semiconductor chilling plate comprises opposing chill surface and heats face.Described cold junction is heat sink to be connected with described chill surface.Side, face is heated described in multiple described second fan is arranged at.Described first fan is arranged at the heat sink side of described cold junction.Described harvester is for gathering indoor temperature and indoor relative humidity.Described controller is connected with described semiconductor chilling plate, described first fan, described second fan and described harvester.Described controller is used for the first voltage calculating described first fan according to described indoor temperature and described indoor relative humidity, and calculates the quantity needing the quantity of the described semiconductor chilling plate of work and described second fan.Described controller for control described first fan by described first voltage run and open need the described semiconductor chilling plate of work and described second fan.
Above-mentionedly store in wet device, controller is by the first voltage of control first fan thus control the rotating speed of the first fan, and then controls and send into the heat sink air quantity of cold junction; After opening the semiconductor chilling plate and the second fan needing work, controller can ensure that the steam entered in the heat sink air of cold junction is condensed into water as much as possible on cold junction is heat sink, condensed water on cold junction is heat sink is collected by collection container, ensure that cleanliness factor and the moisture storage amount of the water storing wet device.Describedly store wet device and can be used for the damping device of air-conditioner to reach the effect of indoor humidification.
In some embodiments, described in store wet device and also comprise water collector, described first fan and described water collector are positioned at the heat sink both sides of described cold junction, and described water collector is for collecting from the heat sink water of described cold junction.Be formed with air channel between described first fan and described water collector, described air channel comprises air inlet and air outlet.Described controller is preset with leaving air temp and air-out relative humidity, described controller is used for the Air Quantity Required that cold junction is heat sink according to described indoor temperature, described indoor relative humidity, described leaving air temp and described air-out relative humidity calculation, and then calculates described first voltage.
In some embodiments, described controller is used for calculating the heat sink refrigerating capacity of described cold junction according to described Air Quantity Required, and then calculates the quantity needing the described semiconductor chilling plate of work and described second fan.
In some embodiments, described controller also for, after unlatching needs the described semiconductor chilling plate of work and described second fan first Preset Time, close and need the described semiconductor chilling plate of work and described second fan and heighten described first voltage to the second voltage.Described controller, also for controlling after described first fan runs the second Preset Time under described second voltage, controlling described first fan and running by described first voltage and open and need the described semiconductor chilling plate of work and described second fan.
In some embodiments, described second voltage is the ceiling voltage of described first fan safe operation.
In some embodiments, described second Preset Time is less than described first Preset Time.
The control method storing wet device of embodiment of the present invention, describedly store wet device and comprise heat exchange module and the first fan, described heat exchange module comprises multiple semiconductor chilling plate, cold junction is heat sink and multiple second fan, described semiconductor chilling plate comprises opposing chill surface and heats face, described cold junction is heat sink to be connected with described chill surface, described multiple second fan heats side, face described in being located at, the heat sink side of described cold junction is located at by described first fan, described in store wet device control method comprise the following steps:
S1, gathers indoor temperature and indoor relative humidity;
S2, calculates according to described indoor temperature and described indoor relative humidity the quantity that the first voltage of described first fan and calculating need the quantity of the described semiconductor chilling plate of work and described second fan; And
S3, control described first fan by described first voltage run and open need the described semiconductor chilling plate of work and described second fan.
In some embodiments, describedly store wet device and also comprise water collector, described first fan and described water collector are positioned at the heat sink both sides of described cold junction, are formed with air channel between described first fan and described water collector, described air channel comprises air inlet and air outlet, and described step S2 comprises:
S21, the Air Quantity Required that cold junction is heat sink according to described indoor temperature, described indoor relative humidity, default leaving air temp and default air-out relative humidity calculation; And
S22, calculates described first voltage according to described Air Quantity Required.
In some embodiments, described step S2 also comprises:
S23, calculates the heat sink refrigerating capacity of described cold junction according to described Air Quantity Required; And
S24, calculates the quantity needing the described semiconductor chilling plate of work and described second fan according to described refrigerating capacity.
In some embodiments, described control method is further comprising the steps of:
S4, after unlatching needs the described semiconductor chilling plate of work and described second fan first Preset Time, closing needs the described semiconductor chilling plate of work and described second fan and the first voltage heightening described first fan is increased to the second voltage, described first fan runs the second Preset Time by described second voltage, enters step S5 afterwards; And
S5, controls described first fan and runs by described first voltage and return described step S4.
In some embodiments, described second voltage is the ceiling voltage of described second fan safe operation.
In some embodiments, described second Preset Time is less than described first Preset Time.
The air-conditioner of embodiment of the present invention comprises and above-describedly stores wet device.
Additional aspect of the present invention and advantage will part provide in the following description, and part will become obvious from the following description, or be recognized by practice of the present invention.
Accompanying drawing explanation
Above-mentioned and/or additional aspect of the present invention and advantage will become obvious and easy understand from accompanying drawing below combining to the description of embodiment, wherein:
Fig. 1 is the module diagram storing wet device of embodiment of the present invention.
Fig. 2 is the structural representation storing wet device of embodiment of the present invention.
Fig. 3 is the distribution schematic diagram storing the second fan of wet device of embodiment of the present invention.
Fig. 4 is the structural representation storing the groove of the fin of wet device of embodiment of the present invention.
Fig. 5 is the flow chart storing the control method of wet device of embodiment of the present invention.
Fig. 6 is the flow chart storing the step S2 of the control method of wet device of embodiment of the present invention.
Detailed description of the invention
Be described below in detail embodiments of the present invention, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Being exemplary below by the embodiment be described with reference to the drawings, only for explaining the present invention, and can not limitation of the present invention being interpreted as.
In describing the invention, it will be appreciated that, term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end ", " interior ", " outward ", " clockwise ", orientation or the position relationship of the instruction such as " counterclockwise " are based on orientation shown in the drawings or position relationship, only the present invention for convenience of description and simplified characterization, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore limitation of the present invention can not be interpreted as.In addition, term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance or imply the quantity indicating indicated technical characteristic.Thus, be limited with " first ", the feature of " second " can express or impliedly comprise one or more described features.In describing the invention, the implication of " multiple " is two or more, unless otherwise expressly limited specifically.
In describing the invention, it should be noted that, unless otherwise clearly defined and limited, term " installation ", " being connected ", " connection " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or connect integratedly; Can be mechanical connection, also can be electrical connection or can communication mutually; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals or the interaction relationship of two elements.For the ordinary skill in the art, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or D score can comprise the first and second features and directly contact, also can comprise the first and second features and not be directly contact but by the other characterisation contact between them.And, fisrt feature second feature " on ", " top " and " above " comprise fisrt feature directly over second feature and oblique upper, or only represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " below " and " below " comprise fisrt feature directly over second feature and oblique upper, or only represent that fisrt feature level height is less than second feature.
Disclosing hereafter provides many different embodiments or example is used for realizing different structure of the present invention.Of the present invention open in order to simplify, hereinafter the parts of specific examples and setting are described.Certainly, they are only example, and object does not lie in restriction the present invention.In addition, the present invention can in different example repeat reference numerals and/or reference letter, this repetition is to simplify and clearly object, itself does not indicate the relation between discussed various embodiment and/or setting.In addition, the various specific technique that the invention provides and the example of material, but those of ordinary skill in the art can recognize the application of other technique and/or the use of other material.
Refer to Fig. 1 and Fig. 2, the wet device 100 that stores of embodiment of the present invention comprises heat exchange module 10, first fan 20, harvester 50 and controller 60.Heat exchange module 10 comprises multiple semiconductor chilling plate 11, cold junction is heat sink 12 and multiple second fan 14.Semiconductor chilling plate 11 comprises opposing chill surface 11a and heats face 11b.Cold junction is heat sink 12 to be connected with chill surface 11a.Multiple second fan 14 is arranged at and heats 11b side, face.First fan 20 is arranged at heat sink 12 sides of cold junction.Harvester 50 is for gathering indoor temperature T1 and indoor relative humidity RH1.
Controller 60 is connected with semiconductor chilling plate 11, first fan 20, second fan 14 and harvester 50.Controller 60 is for calculating the first voltage V1 of the first fan 20 according to indoor temperature T1 and indoor relative humidity RH1, and calculating needs the quantity of the semiconductor chilling plate 11 of work and the quantity of the second fan 14.Controller 60 runs by the first voltage V1 and opens need semiconductor chilling plate 11 and second fan 14 of work for controlling the first fan 20.
Embodiment of the present invention store in wet device 100, controller 60 is by the first voltage V1 of control first fan 20 thus control the rotating speed of the first fan 20, and then controls the air quantity sending into cold junction heat sink 12; After opening the semiconductor chilling plate 11 and the second fan 14 needing work, controller 60 can ensure that the steam entered in the air of cold junction heat sink 12 is condensed into water as much as possible on cold junction heat sink 12, condensed water on cold junction heat sink 12 is collected by collection container, ensure that cleanliness factor and the moisture storage amount of the water storing wet device 100.Store wet device 100 and can be used for the damping device of air-conditioner to reach the effect of indoor humidification.
Particularly, see also Fig. 2 ~ 4, heat exchange module 10 also comprises hot junction heat sink 13, and hot junction is heat sink 13 to be connected with the face 11b of heating.Second fan 14 is arranged at heat sink 13 sides, hot junction.
Hot junction is heat sink 13 comprises first substrate 131 and multiple first fin 132.Multiple first fin 132 and semiconductor chilling plate 11 be connected to first substrate 131 opposing two on the surface.First substrate 131 is square, and multiple second fan 14 is arranged along the diagonal of first substrate 131.Multiple semiconductor chilling plate 11 is evenly distributed between cold junction heat sink 12 and hot junction heat sink 13.
Understandable, semiconductor chilling plate 11 also can be ranks formal distribution, and such as semiconductor chilling plate 11 is divided into two lines and is arranged between hot junction heat sink 13 and cold junction heat sink 12.Certainly, semiconductor chilling plate 11 also can circumferentially formal distribution between hot junction heat sink 13 and cold junction heat sink 12.
When use stores wet device 100 retaining in the winter time, the heat that the second fan 14 is discharged directly can enter indoor, thus improves indoor temperature.Second fan 14 also can be communicated with outdoor, the heat that heat sink for hot junction 13 produce directly is discharged to outdoor, avoids the local temperature storing wet device 100 too high, and impact stores the normal work of wet device 100.
First fan 20 can outside communication chamber, first fan 20 sucks air outdoor when rotating, further, store wet device 100 and be provided with air cleaner (not shown) to filter the air entering cold junction heat sink 12, such as this air is the air that the first fan 20 sucks outdoor.One aqueous vapor come in the air of the first fan 20 suction is condensed into aqueous water and flows in collection container after cold junction heat sink 12, and two air sucked can be taken a breath with indoor, thus keep the freshness of room air.
Harvester 50 comprises temperature sensor 51 and humidity sensor 52, temperature sensor 51 is for gathering indoor temperature T1 and sending indoor temperature T1 signal to controller 60, and humidity sensor 52 is for gathering indoor relative humidity RH1 and sending indoor relative humidity RH1 signal to controller 60.Controller 60 receives indoor temperature T1 signal and indoor relative humidity RH1 signal and calculates the first voltage V1 of the first fan 20, and calculates and need the quantity of the semiconductor chilling plate 11 of work and the quantity of the second fan 14.
In the present embodiment, store wet device 100 and also comprise water collector 30, the first fan 20 and water collector 30 are positioned at the both sides of cold junction heat sink 12, and water collector 30 is for collecting the water from cold junction heat sink 12.Be formed with air channel 40 between first fan 20 and water collector 30, air channel 40 comprises air inlet and air outlet.Controller 60 is preset with leaving air temp T2 and air-out relative humidity RH2, controller 60 for calculating the Air Quantity Required F of cold junction heat sink 12 according to indoor temperature T1, indoor relative humidity RH1, leaving air temp T2 and air-out relative humidity RH2, and then calculates the first voltage V1.
So, controller 60 can calculate the operating voltage of the first fan 20 more exactly.Such as, controller 60 prestores various temperature and enthalpy corresponding to relative humidity and water capacity, according to indoor temperature T1 and indoor relative humidity RH1, controller 60 determines that corresponding enthalpy be H1 and water capacity is D1.
Experimentally and experience, cold junction is heat sink 12 maximum moisture storage amount X can by following formulae discovery:
X＝D1/K1；
In formula, X is the maximum moisture storage amount of cold junction heat sink 12;
D1 is the water capacity that indoor temperature T1 and indoor relative humidity RH1 are corresponding;
K1 is design factor, and the scope of K1 is [0,1].
Experimentally gained, as K1=0.17, store wet device 100 to store wet effect better.
In one example in which, the predeterminable leaving air temp T2 of controller 60 is 0 DEG C, and air-out relative humidity RH2 is 100%, then controller 60 determines that corresponding enthalpy H2 is 9.43J/kg, and enthalpy D2 is 3.77g/kg.
Cold junction is heat sink 12 Air Quantity Required F according to following formulae discovery:
Air Quantity Required=maximum moisture storage amount/water capacity difference,
I.e. F=X/ (D1-D2)=X/ (D1-3.77);
In formula, F is the Air Quantity Required of cold junction heat sink 12;
X is the maximum moisture storage amount of cold junction heat sink 12;
D1 is the water capacity determined according to indoor temperature T1 and indoor relative humidity RH1;
D2 is the water capacity determined according to leaving air temp T2 and air-out relative humidity RH2.
Owing to being linear relationship between the air quantity F1 of the first fan 20 and voltage V, namely F1=K2*V, K2 are constant.Cold junction is heat sink 12 Air Quantity Required F equal the air quantity F1 of the first fan 20, namely can calculate the first voltage V1 determining the first fan 20 according to the Air Quantity Required F of cold junction heat sink 12.
In other embodiments, the first fan 20 can be multiple, and voltage when each first fan 20 works can remain unchanged, by increasing or reduce the quantity of the first fan 20 work thus making the air quantity sending into air channel 40 equal Air Quantity Required F.
It should be noted that, in present embodiment, the first fan 20 and water collector 30 are arranged at the opposing both sides of cold junction heat sink 12, and such as, incorporated by reference to Fig. 2, the first fan 20 is arranged at the upside of cold junction heat sink 12, and water collector 30 is arranged at the downside of cold junction heat sink 12.Certainly, in other embodiments, first fan 20 and water collector 30 also can be arranged at the both sides of the connection of cold junction heat sink 12, and such as the first fan 20 is arranged at the rear side (as shown in the figure to that side of paper) of cold junction heat sink 12 and water collector 30 is arranged at the downside of cold junction heat sink 12.
Particularly, incorporated by reference to Fig. 2 ~ 4, heat exchange module 10 comprises the first heat exchange group 10a and the second heat exchange group 10b, and the first heat exchange group 10a and the second heat exchange group 10b is positioned at the both sides in air channel 40.First heat exchange group 10a and the second heat exchange group 10b includes multiple semiconductor chilling plate 11.First heat exchange group 10a and the second heat exchange group 10b is roughly symmetrical arranged along air channel 40.
Cold junction is heat sink 12 comprises second substrate 121 and multiple second fin 122.Second substrate 121 comprises the first opposing side and the second side.Multiple second fin 122 is arranged on the first side, and the second side is connected with chill surface 11a.Second substrate 121 is vertically arranged, and multiple second fin 122 interval vertical is in second substrate 121.Second fin 122 can be one-body molded and be tabular or strip with second substrate 121.In other embodiments, multiple second fin 122 can be formed slopely certain angle to water collector 30 so that the water be condensate on the second fin 122 flows in water collector 30 smoothly.
Second fin 122 is provided with groove 1221 away from one end of second substrate 121 and groove 1221 scribbles water wetted material.Water wetted material (such as polyacrylic acid) is the material with polar group in a kind of molecule, has very large affinity, be easily spontaneously wet out by water water.So, the water droplet that the little water-drop-shaped that water wetted material can condense surrounding becomes volume larger, under gravity, water droplet departs from the second fin 122 surface and drops onto in water collector 30, ensures that the condensed water on the second fin 122 flows in water collector 30 to greatest extent.
In the present embodiment, controller 60 is for calculating the refrigerating capacity Q of cold junction heat sink 12 according to Air Quantity Required F, and then calculating needs the semiconductor chilling plate 11 of work and the quantity of the second fan 14.
So, controller 60 can control to need the semiconductor chilling plate 11 of work and the quantity of the second fan 14 more exactly.Need the amount computing process of the semiconductor chilling plate 11 of work and the second fan 14 as follows:
Cold junction is heat sink 12 refrigerating capacity Q can by following formulae discovery:
Refrigerating capacity=Air Quantity Required × enthalpy is poor,
I.e. Q=F × (H1-H2);
In above formula, Q is the refrigerating capacity Q of cold junction heat sink 12;
F is Air Quantity Required;
H1 is the enthalpy determined according to indoor temperature T1 and indoor relative humidity RH1;
H2 is the enthalpy determined according to leaving air temp T2 and air-out relative humidity RH2.
Because the refrigerating capacity of each semiconductor chilling plate 11 is certain, therefore, the quantity of the semiconductor chilling plate 11 needing work can be determined according to the refrigerating capacity Q of cold junction heat sink 12.
Refrigerating capacity and the heating capacity of semiconductor chilling plate 11 are equal, and the heating capacity of semiconductor chilling plate 11 is discharged by the second fan 14, and the total blast volume of the second fan 14 can obtain according to following formulae discovery:
F2＝3600×3Q/(C×ρ×10)；
In formula, F2 is the total blast volume of the second fan 14;
Q is the refrigerating capacity of cold junction heat sink 12;
C is air ratio thermal capacitance;
ρ is atmospheric density.
Because the air quantity of each second fan 14 is certain, the quantity of the second fan 14 needing work can be calculated according to the total blast volume F2 of the second fan 14.
In other embodiments, by controlling the voltage of the second fan 14, thus control the air quantity of single second fan 14, and then control the rate of heat dispation of the second fan 14, ensure the refrigerating capacity of semiconductor chilling plate 11.
In the present embodiment, controller 60 also for, after opening the semiconductor chilling plate 11 and the second fan 14 first preset time t 1 needing work, close and need the semiconductor chilling plate 11 of work and the second fan 14 and heighten the first voltage V1 to the second voltage V2.Controller 60 also after the first fan 20 runs the second preset time t 2 under the second voltage V2 for controlling, controls the first fan 20 and runs by the first voltage V1 and open the semiconductor chilling plate 11 and the second fan 14 that need work.
Particularly, when semiconductor chilling plate 11 works, steam in air directly may change into frost knot on cold junction heat sink 12, when the frost layer on cold junction heat sink 12 thickeies, the poor refrigerating efficiency of semiconductor chilling plate 11 can be caused, cannot steam in time in condensation air, thus the water yield in water collector 30 can not be ensured.Therefore, after the semiconductor chilling plate 11 and the second fan 14 that need work run the first preset time t 1, controller 60 cuts out the semiconductor chilling plate 11 and the second fan 14 that need work, heighten the first voltage V1 of the first fan 20, in the second preset time t 2, be melted into water to enable the frost of knot on cold junction heat sink 12 and flow into water collector 30.Afterwards, controller 60 controls the first fan 20 and runs by the first voltage V1 and open the semiconductor chilling plate 11 and the second fan 14 that need work.So, the frost be conducive on cold junction heat sink 12 is melted into water in time and flows in water collector 30, thus ensures that the water yield in water collector 30 is sufficient.
In the present embodiment, preferably, the second voltage V2 of the first fan 20 is the ceiling voltage of the first fan 20 safe operation.Such as, the operating voltage range of the first fan 20 is 40V ~ 60V, and after determining that the first voltage V1 of the first fan 20 is 45V according to Air Quantity Required F, the second voltage V2 of the first fan 20 can be increased to 60V.After improving the operating voltage of the first fan 20, the first fan 20 is accelerated to rotate, thus accelerates the air flowing in air channel 40, and then accelerates to melt the frost be formed on cold junction heat sink 12.
In the present embodiment, preferably, the second preset time t 2 is less than the first preset time t 1.
Because the speed of 12 defrosts that the cold junction storing wet device 100 is heat sink is faster than the speed of frosting, so the defrost time (i.e. the second preset time t 2) that controller 60 controls cold junction heat sink 12 is less than heat pamp (i.e. the first preset time t 1), to be conducive to the process of the defrost of cold junction heat sink 12 continuous, thus ensure that the water yield flowed in water collector 30 is sufficient, in addition, also can avoid semiconductor chilling plate 11 and the second fan 14 frequent starting thus reduce self life-span.
Such as, when the first preset time t 1 is set to 30 ~ 120 minutes, when the second preset time t 2 is set to 3 ~ 5 minutes, stores wet device 100 and have and preferably store wet effect.That is, stop after needing the semiconductor chilling plate 11 of work and the second fan 14 to run 30 ~ 120 minutes, first fan 20 is adjusted to the second voltage V2 by the first voltage V1 and runs 3 ~ 5 minutes, then the first fan 20 is adjusted to the first voltage V1 work and opens the semiconductor chilling plate 11 and the second fan 14 that need work, circulation like this, ensures that the sufficient water yield flows in water collector 30.
Refer to Fig. 5, embodiment of the present invention provides a kind of control method storing wet device.The control method storing wet device of present embodiment can be realized by the wet device 100 that stores of above embodiment.This control method comprises the following steps:
S1, gathers indoor temperature T1 and indoor relative humidity RH1;
S2, calculates the first voltage V1 of the first fan 20 according to indoor temperature T1 and indoor relative humidity RH1 and calculating needs the quantity of the semiconductor chilling plate 11 of work and the quantity of the second fan 14; And
S3, controls the first fan 20 and runs by the first voltage V1 and open the semiconductor chilling plate 11 and the second fan 14 that need work.
In step sl, temperature sensor 51 gathers indoor temperature T1, and humidity sensor 52 gathers indoor relative humidity RH1.
In step s 2, the controller 60 storing wet device 100 prestores the voltage of calculating first fan 20 and needs the quantity of semiconductor chilling plate 11 and the algorithm of the second fan 14 quantity of work, controller 60 can calculate the first voltage V1 of corresponding first fan 20 after receiving the indoor temperature T1 of collection and the signal of indoor relative humidity RH1 and need the quantity of semiconductor chilling plate 11 and the quantity of the second fan 14 of work.
In step s3, it should be noted that, after determining to need the semiconductor chilling plate 11 of work and the quantity of the second fan 14, controller 60 can choose arbitrarily semiconductor chilling plate 11 and the second fan 14.Such as, the total quantity of semiconductor chilling plate 11 is 6, the total quantity of the second fan 14 is 8, and need the quantity of the semiconductor chilling plate 11 of work to be 3, the quantity needing the second fan 14 of work is 4, then controller 60 can control any 3 semiconductor chilling plates 11 and works from 6 semiconductor chilling plates 11, can control any 4 the second fans 14 and work from 8 the second fans 14.
Refer to Fig. 6, in the present embodiment, step S2 comprises:
S21, calculates the Air Quantity Required F of cold junction heat sink 12 according to indoor temperature T1, indoor relative humidity RH1, default leaving air temp T2 and default air-out relative humidity RH2; And
S22, calculates the first voltage V1 according to Air Quantity Required F.
In the step s 21, before unlatching stores wet device 100, first can set leaving air temp T2 and air-out relative humidity RH2;
The Air Quantity Required F of following process computation cold junction heat sink 12 can be utilized:
If indoor temperature is T1, indoor relative humidity is RH1, and leaving air temp is T2, and air-out relative humidity is RH2, then
X＝D1/K1；
In formula, X is the maximum moisture storage amount of cold junction heat sink 12;
D1 is the water capacity determined according to indoor temperature T1 and indoor relative humidity RH1;
K1 is design factor, and the scope of K1 is [0,1].
F＝X/(D1-D2),
In formula, F is the Air Quantity Required of cold junction heat sink 12;
X is the maximum moisture storage amount of cold junction heat sink 12;
D1 is the water capacity determined according to indoor temperature T1 and indoor relative humidity RH1;
D2 is the water capacity determined according to leaving air temp T2 and air-out relative humidity RH2.
In step S22, the rotating speed of the first fan 20 can be determined according to the Air Quantity Required F of cold junction heat sink 12, and then calculate the first voltage V1 determining the first fan 20.Owing to being linear relationship between the air quantity F1 of the first fan 20 and voltage V, namely F1=K2*V, K2 are constant.Cold junction is heat sink 12 Air Quantity Required F equal the air quantity F1 of the first fan 20, namely can calculate the first voltage V1 determining the first fan 20 according to the Air Quantity Required F of cold junction heat sink 12.
In the present embodiment, step S2 also comprises:
S23, calculates the refrigerating capacity Q of cold junction heat sink 12 according to Air Quantity Required F; And
S24, calculates according to refrigerating capacity Q and needs the semiconductor chilling plate 11 of work and the quantity of the second fan 14.
In step S23, cold junction is heat sink 12 refrigerating capacity Q can according to following formulae discovery:
Q＝F×(H1-H2)；
In formula, F is the Air Quantity Required of cold junction heat sink 12;
H1 is the enthalpy determined according to indoor temperature T1 and indoor relative humidity RH1;
H2 is the enthalpy determined according to leaving air temp T2 and air-out relative humidity RH2.
In step s 24 which, the refrigerating capacity of each semiconductor chilling plate 11 and the rate of heat dispation of each second fan 14 certain, therefore, can determine to be delivered to the heating capacity in refrigerating capacity on cold junction heat sink 12 and hot junction heat sink 13, thus can determine to need the semiconductor chilling plate 11 of work and the quantity of the second fan 14 according to the refrigerating capacity Q of cold junction heat sink 12.
Refer to Fig. 5, in the present embodiment, control method is further comprising the steps of:
S4, after opening the semiconductor chilling plate 11 and the second fan 14 first preset time t 1 needing work, closing needs the semiconductor chilling plate 11 of work and the second fan 14 and the first voltage V1 heightening the first fan 20 is increased to the second voltage V2, first fan 20 runs the second preset time t 2 by the second voltage V2, enters step S5 afterwards; And
S5, controls the first fan 20 and runs by the first voltage V1 and return step S4.
In step s 4 which, the frost on cold junction heat sink 12 can be melted into water and flow into water collector 30 in the second preset time t 2.
In step s 5, after the frost that cold junction is heat sink on 12 melts completely, the first fan 20 is adjusted to the first voltage V1 by the second voltage V2, stores wet device 100 repeated execution of steps S4 and S5, thus ensures that the water yield in water collector is sufficient.
Further, the second voltage V2 is the ceiling voltage of the second fan 14 safe operation.
So, the first fan 20 with the fastest rotational speed, thus accelerates the air flowing in air channel 40, and then accelerates to melt the frost be formed on cold junction heat sink 12.Preferably, the second preset time t 2 is less than the first preset time t 1.
So, the defrost process being conducive to cold junction heat sink 12 is continuous, thus ensures that the water yield flowed in water collector 30 is sufficient.
Other parts do not launched storing the control method of wet device of present embodiment can join the identical or similar part storing wet device 100 of above embodiment, do not repeat them here.
In sum, the control method storing wet device 100 of embodiment of the present invention can ensure to store quality and the moisture storage amount of the water that wet device 100 is collected, store wet device 100 for can ensure after the damping device of air-conditioner damping device have abundant water resources and quality good.
The air-conditioner of embodiment of the present invention comprises and above stores wet device 100.Therefore, air-conditioner can realize the effect of indoor air-humidification, thus improves indoor environment, improves user satisfaction.
In the description of this description, specific features, structure, material or feature that the description of reference term " embodiment ", " some embodiments ", " exemplary embodiment ", " example ", " concrete example " or " some examples " etc. means to describe in conjunction with described embodiment or example are contained at least one embodiment of the present invention or example.In this manual, identical embodiment or example are not necessarily referred to the schematic representation of above-mentioned term.And the specific features of description, structure, material or feature can combine in an appropriate manner in any one or more embodiment or example.
Although illustrate and describe embodiments of the present invention, those having ordinary skill in the art will appreciate that: can carry out multiple change, amendment, replacement and modification to these embodiments when not departing from principle of the present invention and aim, scope of the present invention is by claim and equivalents thereof.
Claims (13)
1. store a wet device, it is characterized in that, comprising:
First fan;
Heat exchange module, described heat exchange module comprises:
Multiple semiconductor chilling plate, described semiconductor chilling plate comprises opposing chill surface and heats face;
The cold junction be connected with described chill surface is heat sink, and the heat sink side of described cold junction is located at by described first fan; And
Multiple second fans of side, face are heated described in being located at;
Harvester, described harvester is for gathering indoor temperature and indoor relative humidity; And
The controller be connected with described semiconductor chilling plate, described first fan, described second fan and described harvester, described controller is used for the first voltage calculating described first fan according to described indoor temperature and described indoor relative humidity, and calculates the quantity needing the quantity of the described semiconductor chilling plate of work and described second fan;
Described controller for control described first fan by described first voltage run and open need the described semiconductor chilling plate of work and described second fan.
2. store wet device as claimed in claim 1, it is characterized in that, described in store wet device and also comprise water collector, described first fan and described water collector are positioned at the heat sink both sides of described cold junction, and described water collector is for collecting from the heat sink water of described cold junction;
Be formed with air channel between described first fan and described water collector, described air channel comprises air inlet and air outlet;
Described controller is preset with leaving air temp and air-out relative humidity, described controller is used for the Air Quantity Required that cold junction is heat sink according to described indoor temperature, described indoor relative humidity, described leaving air temp and described air-out relative humidity calculation, and then calculates described first voltage.
3. store wet device as claimed in claim 2, it is characterized in that, described controller is used for calculating the heat sink refrigerating capacity of described cold junction according to described Air Quantity Required, and then calculates the quantity needing the described semiconductor chilling plate of work and described second fan.
4. store wet device as claimed in claim 1, it is characterized in that, described controller also for, after unlatching needs the described semiconductor chilling plate of work and described second fan first Preset Time, close and need the described semiconductor chilling plate of work and described second fan and heighten described first voltage to the second voltage;
Described controller, also for controlling after described first fan runs the second Preset Time under described second voltage, controlling described first fan and running by described first voltage and open and need the described semiconductor chilling plate of work and described second fan.
5. store wet device as claimed in claim 4, it is characterized in that, described second voltage is the ceiling voltage of described first fan safe operation.
6. store wet device as claimed in claim 4, it is characterized in that, described second Preset Time is less than described first Preset Time.
7. one kind stores the control method of wet device, describedly store wet device and comprise heat exchange module and the first fan, described heat exchange module comprises multiple semiconductor chilling plate, cold junction is heat sink and multiple second fan, described semiconductor chilling plate comprises opposing chill surface and heats face, described cold junction is heat sink to be connected with described chill surface, described multiple second fan heats side, face described in being located at, the heat sink side of described cold junction is located at by described first fan, it is characterized in that, described in store wet device control method comprise the following steps:
S1, gathers indoor temperature and indoor relative humidity;
S2, calculates according to described indoor temperature and described indoor relative humidity the quantity that the first voltage of described first fan and calculating need the quantity of the described semiconductor chilling plate of work and described second fan; And
S3, control described first fan by described first voltage run and open need the described semiconductor chilling plate of work and described second fan.
8. store the control method of wet device as claimed in claim 7, it is characterized in that, describedly store wet device and also comprise water collector, described first fan and described water collector are positioned at the heat sink both sides of described cold junction, air channel is formed between described first fan and described water collector, described air channel comprises air inlet and air outlet, and described step S2 comprises:
S21, the Air Quantity Required that cold junction is heat sink according to described indoor temperature, described indoor relative humidity, default leaving air temp and default air-out relative humidity calculation; And
S22, calculates described first voltage according to described Air Quantity Required.
9. store the control method of wet device as claimed in claim 8, it is characterized in that, described step S2 also comprises:
S23, calculates the heat sink refrigerating capacity of described cold junction according to described Air Quantity Required; And
S24, calculates the quantity needing the described semiconductor chilling plate of work and described second fan according to described refrigerating capacity.
10. store the control method of wet device as claimed in claim 7, it is characterized in that, described in store the control method of wet device further comprising the steps of:
S4, after unlatching needs the described semiconductor chilling plate of work and described second fan first Preset Time, closing needs the described semiconductor chilling plate of work and described second fan and the first voltage heightening described first fan is increased to the second voltage, described first fan runs the second Preset Time by described second voltage, enters step S5 afterwards; And
S5, controls described first fan and runs by described first voltage and return described step S4.
11. control methods storing wet device as claimed in claim 10, it is characterized in that, described second voltage is the ceiling voltage of described first fan safe operation.
12. control methods storing wet device as claimed in claim 10, it is characterized in that, described second Preset Time is less than described first Preset Time.
13. 1 kinds of air-conditioners, is characterized in that, comprise storing wet device as described in any one of claim 1 ~ 6.
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| CN201510553315.3A CN105180322B (en) | 2015-08-31 | 2015-08-31 | Store wet device and store the control method and air conditioner of wet device |
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| CN201510553315.3A CN105180322B (en) | 2015-08-31 | 2015-08-31 | Store wet device and store the control method and air conditioner of wet device |
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| CN113432217A (en) * | 2021-06-25 | 2021-09-24 | 青岛海信日立空调系统有限公司 | Air purification device and air conditioner |
| CN115143547A (en) * | 2022-08-08 | 2022-10-04 | 珠海格力电器股份有限公司 | Dehumidifier and dehumidification method |
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|---|---|
| CN105180322B (en) | 2018-03-09 |
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