CN105175997A - Preparation method for high-thermal-conductivity insulation composite material suitable for encapsulation - Google Patents
Preparation method for high-thermal-conductivity insulation composite material suitable for encapsulation Download PDFInfo
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- CN105175997A CN105175997A CN201510537986.0A CN201510537986A CN105175997A CN 105175997 A CN105175997 A CN 105175997A CN 201510537986 A CN201510537986 A CN 201510537986A CN 105175997 A CN105175997 A CN 105175997A
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Abstract
The present invention relates to a preparation method for high-thermal-conductivity insulation composite material suitable for encapsulation, and belongs to the field of high polymer materials. The high-thermal-conductivity insulation composite material suitable for encapsulation is prepared by mixing 40-50 parts of solid bisphenol A epoxy resin with 3-6 average degree of polymerization n with 0.5-1 part of an static agent, 1-2 parts of a flame retardant, 1-2 parts of glass fiber and 5-10 parts of filler aluminum nitride or aluminum oxide, and then carrying out melting and squeezing. The part refers to part by mass. The preparation method provided by the present invention has the benefits that the strength is increased by adding the glass fiber and selecting the solid bisphenol A epoxy resin with 3-6 average degree of polymerization n; the antistatic effect and the flame retardant effect are improved by adding the static agent and the flame retardant; and the thermal conductivity is improved by adding the filler aluminum nitride or an aluminum oxide and the glass fiber.
Description
Technical field
The present invention relates to a kind of preparation method being applicable to the high heat conductivity insulation composite of embedding, belong to polymeric material field.
Background technology
Embedding be exactly liquid mixture is poured into by mechanical or manual mode electronic component, circuit are housed device in, under normal temperature or heating condition, be solidified into the thermosetting polymer insulating material of excellent performance.The effect of embedding is the globality of strengthening electronic device, improves the resistibility to external shock, vibrations; Improve between inner member, circuit and insulate, be conducive to device miniaturization, lightweight; Avoid element, circuit directly exposes, improve the waterproof of device, humidity resistance, and improve use properties and steadiness parameter.The capacity of heat transmission of existing Embedding Material is strong not, and intensity and antistatic property inadequate.
Summary of the invention
For solving the deficiencies in the prior art, the object of the invention is to the defect overcoming prior art, a kind of preparation method being applicable to the high heat conductivity insulation composite of embedding improving heat conductivility and intensity and antistatic property is provided.
In order to realize above-mentioned target, the present invention adopts following technical scheme: the preparation method being applicable to the high heat conductivity insulation composite of embedding, it is characterized in that: employing mean polymerisation degree n melt extrudes formation after solid-state bisphenol A type epoxy resin 40-45 part of 3-6 mixes with static inhibitor 0.5-1 part, fire retardant 1-2 part, glass fibre 1-2 part, filler aluminium nitride or aluminum oxide 5-10 part, and described number refers to mass fraction.
The aforesaid preparation method being applicable to the high heat conductivity insulation composite of embedding, described glass fibre length is 1-2mm, and diameter is 5-10nm.
The aforesaid preparation method being applicable to the high heat conductivity insulation composite of embedding, adopts mean polymerisation degree n to be that solid-state bisphenol A type epoxy resin 40-45 part of 3-6 adopts high-shear dispersion machine when mixing with static inhibitor 0.5-1 part, fire retardant 1-2 part, glass fibre 1-2 part, filler aluminium nitride or aluminum oxide 5-10 part.
The aforesaid preparation method being applicable to the high heat conductivity insulation composite of embedding, the mean polymerisation degree of solid-state bisphenol A type epoxy resin is 5.
The aforesaid preparation method being applicable to the high heat conductivity insulation composite of embedding, the particle diameter of aluminium nitride or aluminum oxide is 5 μm-10 μm.
The aforesaid preparation method being applicable to the high heat conductivity insulation composite of embedding, adopts mean polymerisation degree n to be that solid-state bisphenol A type epoxy resin 40-45 part of 3-6 mixes with static inhibitor 0.5-1 part, fire retardant 1-2 part, glass fibre 1-2 part, filler aluminium nitride or aluminum oxide 5-10 part after post-heating also keeps heating 10-30 minute to 280 degrees Celsius and extrudes.
Usefulness of the present invention is: by adding glass fibre and selecting mean polymerisation degree n to be the solid-state bisphenol A type epoxy resin of 3-6, add intensity; Add static inhibitor and fire retardant, improve antistatic effect and flame retardant effect; By adding filler aluminium nitride or aluminum oxide and glass fibre, improve thermal conductivity.
Embodiment
Embodiment 1
Be applicable to the preparation method of the high heat conductivity insulation composite of embedding, adopt mean polymerisation degree n be 5 solid-state bisphenol A type epoxy resin 40 parts adopt high-shear dispersion machine mixing post-heating also to keep heating 10-30 minute to 280 degrees Celsius with 0.5 part, static inhibitor, fire retardant 1 part, 1 part, glass fibre, filler aluminium nitride or 5 parts, aluminum oxide after extrude, described number refers to mass fraction.Described glass fibre length is 1-2mm, and diameter is 5-10nm.The particle diameter of aluminium nitride or aluminum oxide is 5 μm-10 μm.The tensile strength of obtained matrix material is 55MPa, and shock strength is 50MPa, thermal conductivity 2W/mK.Can tolerate the high temperature of 180 degrees Celsius, volume specific resistance is the 14 power ohm meters of 10.
Embodiment 2
Be applicable to the preparation method of the high heat conductivity insulation composite of embedding, adopt mean polymerisation degree n be 5 solid-state bisphenol A type epoxy resin 45 parts adopt high-shear dispersion machine mixing post-heating also to keep heating 10-30 minute to 280 degrees Celsius with 1 part, static inhibitor, fire retardant 1.5 parts, 1 part, glass fibre, filler aluminium nitride or 8 parts, aluminum oxide after extrude, described number refers to mass fraction.Described glass fibre length is 1-2mm, and diameter is 5-10nm.The particle diameter of aluminium nitride or aluminum oxide is 5 μm-10 μm.The tensile strength of obtained matrix material is 52MPa, and shock strength is 49MPa, thermal conductivity 1.8W/mK.Can tolerate the high temperature of 180 degrees Celsius, volume specific resistance is the 14 power ohm meters of 10.
Comparative example 1
Be applicable to the preparation method of the high heat conductivity insulation composite of embedding, adopt mean polymerisation degree n be 5 solid-state bisphenol A type epoxy resin 45 parts adopt high-shear dispersion machine mixing post-heating also to keep heating 10-30 minute to 280 degrees Celsius with 1 part, static inhibitor, fire retardant 1.5 parts, filler aluminium nitride or 8 parts, aluminum oxide after extrude, described number refers to mass fraction.The particle diameter of aluminium nitride or aluminum oxide is 5 μm-10 μm.The tensile strength of obtained matrix material is 48MPa, and shock strength is 45MPa, thermal conductivity 1W/mK.
More than show and describe ultimate principle of the present invention, principal character and advantage.The technician of the industry should understand, and above-described embodiment does not limit the present invention in any form, the technical scheme that the mode that all employings are equal to replacement or equivalent transformation obtains, and all drops in protection scope of the present invention.
Claims (6)
1. be applicable to the preparation method of the high heat conductivity insulation composite of embedding, it is characterized in that: employing mean polymerisation degree n melt extrudes formation after solid-state bisphenol A type epoxy resin 40-45 part of 3-6 mixes with static inhibitor 0.5-1 part, fire retardant 1-2 part, glass fibre 1-2 part, filler aluminium nitride or aluminum oxide 5-10 part, and described number refers to mass fraction.
2. the preparation method being applicable to the high heat conductivity insulation composite of embedding according to claim 1, is characterized in that: described glass fibre length is 1-2mm, and diameter is 5-10nm.
3. the preparation method being applicable to the high heat conductivity insulation composite of embedding according to claim 1, is characterized in that: adopt mean polymerisation degree n to be that solid-state bisphenol A type epoxy resin 40-45 part of 3-6 adopts high-shear dispersion machine when mixing with static inhibitor 0.5-1 part, fire retardant 1-2 part, glass fibre 1-2 part, filler aluminium nitride or aluminum oxide 5-10 part.
4. the preparation method being applicable to the high heat conductivity insulation composite of embedding according to claim 1, is characterized in that: the mean polymerisation degree of solid-state bisphenol A type epoxy resin is 5.
5. the preparation method being applicable to the high heat conductivity insulation composite of embedding according to claim 1, is characterized in that: the particle diameter of aluminium nitride or aluminum oxide is 5 μm-10 μm.
6. the preparation method being applicable to the high heat conductivity insulation composite of embedding according to claim 1, is characterized in that: adopt mean polymerisation degree n to be that solid-state bisphenol A type epoxy resin 40-45 part of 3-6 mixes with static inhibitor 0.5-1 part, fire retardant 1-2 part, glass fibre 1-2 part, filler aluminium nitride or aluminum oxide 5-10 part after post-heating also keeps heating 10-30 minute to 280 degrees Celsius and extrudes.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510537986.0A CN105175997A (en) | 2015-08-28 | 2015-08-28 | Preparation method for high-thermal-conductivity insulation composite material suitable for encapsulation |
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| CN201510537986.0A CN105175997A (en) | 2015-08-28 | 2015-08-28 | Preparation method for high-thermal-conductivity insulation composite material suitable for encapsulation |
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| CN105175997A true CN105175997A (en) | 2015-12-23 |
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| CN201510537986.0A Pending CN105175997A (en) | 2015-08-28 | 2015-08-28 | Preparation method for high-thermal-conductivity insulation composite material suitable for encapsulation |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109535648A (en) * | 2018-10-01 | 2019-03-29 | 宁波中创焊接技术有限公司 | A kind of preparation method of the high heat conductivity insulation composite suitable for encapsulating |
| CN109880298A (en) * | 2019-03-06 | 2019-06-14 | 清华大学 | A kind of high insulating epoxy composite material of high thermal conductivity and its preparation and application |
| TWI690484B (en) * | 2018-06-06 | 2020-04-11 | 日商昭和電工股份有限公司 | Manufacturing method of glass-coated aluminum nitride particles and manufacturing method of exothermic resin composition containing glass-coated aluminum nitride particles |
Citations (2)
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| CN101343399A (en) * | 2008-09-02 | 2009-01-14 | 中南大学 | Immingled filling material filled polyurethane modified epoxy resin embedding material and preparation method |
| CN103497718A (en) * | 2013-09-27 | 2014-01-08 | 昆山市奋发绝缘材料有限公司 | Heat-conducting insulated adhesive |
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2015
- 2015-08-28 CN CN201510537986.0A patent/CN105175997A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101343399A (en) * | 2008-09-02 | 2009-01-14 | 中南大学 | Immingled filling material filled polyurethane modified epoxy resin embedding material and preparation method |
| CN103497718A (en) * | 2013-09-27 | 2014-01-08 | 昆山市奋发绝缘材料有限公司 | Heat-conducting insulated adhesive |
Non-Patent Citations (2)
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| 徐丽生主编: "《防空导弹制导雷达结构总体设计与制造工艺技术》", 31 August 2009, 中国宇航出版社 * |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI690484B (en) * | 2018-06-06 | 2020-04-11 | 日商昭和電工股份有限公司 | Manufacturing method of glass-coated aluminum nitride particles and manufacturing method of exothermic resin composition containing glass-coated aluminum nitride particles |
| CN109535648A (en) * | 2018-10-01 | 2019-03-29 | 宁波中创焊接技术有限公司 | A kind of preparation method of the high heat conductivity insulation composite suitable for encapsulating |
| CN109880298A (en) * | 2019-03-06 | 2019-06-14 | 清华大学 | A kind of high insulating epoxy composite material of high thermal conductivity and its preparation and application |
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Application publication date: 20151223 |
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